BU8254GUW-E2 [ROHM]
Line Driver,;型号: | BU8254GUW-E2 |
厂家: | ROHM |
描述: | Line Driver, 驱动 接口集成电路 |
文件: | 总20页 (文件大小:440K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LVDS Interface ICs
35bit LVDS Transmitter
35:5 Serializer
BU8254GUW
No.13057EBT10
●Description
LVDS Interface IC of ROHM "Serializer" "Deserializer" operate from 8MHz to 150MHz wide clock range, and number of bits
range is from 35 to 70. Data is transmitted seven times (7X) stream and reduce cable number by 3(1/3) or less. The
ROHM's LVDS has low swing mode to be able to expect further low EMI.
●Features
1) 35bits data of parallel LVCMOS level inputs are converted to five channels of LVDS data stream.
2) 30bits of RGB data and 5bits of timing and control data(HSYNC,VSYNC,DE,CNTL1,CNTL2) are
transmitted up to 784Mbps effective rate per LVDS channel.
3) Support clock frequency from 8MHz up to 112MHz.
4) Support consumer video format including 480i, 480P, 720P and 1080i as well.
5) Clock edge selectable
6) Power down mode
7) Support spread spectrum clock generator.
8) Support reduced swing LVDS for low EMI.
9) 30bit LVDS receiver is recommended to use BU90R104.
●Applications
Flat Panel Display
●Precaution
■This chip is not designed to protect from radioactivity.
■The chip is made strictly for the specific application or equipment.
Then it is necessary that the unit is measured as need.
■This document may be used as strategic technical data which subjects to COCOM regulations.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
1/17
Technical Note
BU8254GUW
●Block Diagram
Data Clocks
+
-
CLKIIN
(8~112MHz)
TCLK P/N
(8~112MHz)
PLL
7
+
-
TA P/N
TA6-TA0
Parallel to Serial
Parallel to Serial
7
7
7
7
+
-
TB P/N
TB6-TB0
TC6-TC0
TD6-TD0
TE6-TE0
+
-
TC P/N
Parallel to Serial
Parallel to Serial
Parallel to Serial
+
-
TD P/N
+
-
TE P/N
RS
RF
XRST
Fig.1 Block Diagram
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
2/17
Technical Note
BU8254GUW
●VBGA099W060 Package Outline and Specification
1 P I N
M A R K
6 . 0 ± 0 . 1
8254G UW
L o t N o .
S
0 . 0 8 S
P = 0 . 5 × 9
0 . 7 5 ± 0 . 1
A
0 . 5
9 9 -
φ
0 . 2 9 5 ± 0 . 0 5
0 . 0 5 M S AB
K
J
H
G
F
E
D
C
B
A
1
2
3
4
5
6
7
8
9
1 0
( U N I T : m m )
n u m b e r o f b a l l s
: 9 9
Fig.2 VBGA099W060 Package Outline and Specification
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
3/17
Technical Note
BU8254GUW
●Pin configuration
1
2
3
4
5
6
7
8
9
10
A
B
C
D
E
F
(NC)
(NC)
(1PIN)
TA5
TAN
TAP
TBP
TCN
TCLKN
TDN
TEN
(NC)
(NC)
(NC)
(NC)
TA1
TA4
TB1
(NC)
(NC)
TB6
TC0
TBN
LVDSVDD
TCP
(NC)
(NC)
TA6
(NC)
(NC)
TC4
GND
TC5
TCLKP
(NC)
(NC)
(NC)
TE3
TDP
LVDSGND
TE6
TEP
(NC)
(NC)
TE5
TE1
(NC)
(NC)
TD2
TD3
(NC)
(NC)
LVDSGND LVDSGND
PLLVDD PLLGND
TA0
TA3
RS
TA2
GND
TB3
TB5
(NC)
TC2
TC3
(NC)
GND
TE2
(NC)
CLK_IN
TE4
TB0
XRST
VDD
TB2
G
H
J
TB4
GND
(NC)
VDD
TC1
(NC)
(NC)
TC6
TE0
GND
(NC)
TD4
(NC)
TD6
(NC)
(NC)
(NC)
(NC)
TD5
RF
(NC)
(NC)
K
TD0
TD1
Fig.3 Pin Diagram (Top View)
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
4/17
Technical Note
BU8254GUW
●Pin Description
Table 1 : Pin Description
Pin Name
Pin No.
A3,A2
A4,B3
B5,A5
B7,A7
B8,A8
B6,A6
Type
LVDS OUT
LVDS OUT
LVDS OUT
LVDS OUT
LVDS OUT
LVDS OUT
IN
Descriptions
LVDS data out.
LVDS clock out.
Pixel data inputs.
TAP, TAN
TBP, TBN
TCP, TCN
TDP, TDN
TEP, TEN
TCLKP, TCLKN
TA0~TA6
TB0~TB6
TC0~TC6
TD0~TD6
TE0~TE6
XRST
D3,D2,D4,E3,E2,D1,E5
E1,F2,F1,F4,G1,G4,J2
K2,K3,J4,K4,H5,K5,J6
K6,K7,J8,K8,J9,H10,G10
G7,F8,F9,F6,F10,E8,D7
E7
IN
IN
IN
IN
H : Normal operation,
L : Power down (all outputs are Hi-Z)
LVDS swing mode, VREF *1select.
IN
LVDS
Swing
Small Swing
Input Support
RS
VDD
0.6~1.4V
GND
350mV
350mV
200mV
N/A
RS
F3
IN
RS-VREF
N/A
*1 VREF is Input Reference Voltage.
Input clock triggering edge select.
H : Rising edge, L : Falling edge.
RF
J7
F7,J3
IN
VDD
Power
IN
Power supply pins for LVCMOS inputs and digital core.
Clock input.
CLKIN
E10
GND
E4,E9,G3,G9,J5
B4
Ground
Power
Ground
Power
Ground
Ground pins for LVCMOS inputs and digital core.
Power supply pins for LVDS outputs.
Ground pins for LVDS outputs.
LVDS VDD
LVDS GND
PLLVDD
PLLGND
C3,C4,C7
C9
Power supply pin for PLL core.
C10
Ground pins for PLL core.
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
5/17
Technical Note
BU8254GUW
●Electrical characteristics
■Rating
Table 2 : Absolute Maximum Rating
Parameter
Rating
Symbol
Units
Min
-0.3
Max
4.0
Supply Voltage
VDD
VIN
V
V
Input Voltage
-0.3
-0.3
-55
VDD+0.3
VDD+0.3
125
Output Voltage
VOUT
Tstg
V
Storage Temperature Range
℃
Table 3 : Package Power
PACKAGE
Power Dissipation (mW)
De-rating (mW/℃) *1
380
3.8
VBGA099W060
880*2
8.8*2
*1:
*2:
At temperature Ta >25℃
Package power when mounting on the PCB board.
The size of PCB board
:70×70×1.6(mm3)
The material of PCB board :The FR4 glass epoxy board.(3% or less copper foil area)
(It is recommended to apply the above package power requirement to PCB board
when the small swing input mode is used)
Table 4 : Recommended Operating Conditions
Rating
Typ
Parameter
Supply Voltage
Symbol
VDD
Units
Conditions
Min
3.0
Max
3.6
3.3
V
VDD,LVDSVDD,PLLVDD
Clock frequency from 8MHz up to
90MHz
-20
0
-
-
85
70
℃
℃
Operating Temperature Range
Topr
Cock frequency from 90MHz up
to 112MHz
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
6/17
Technical Note
BU8254GUW
■DC characteristics
Table 5 : LVCMOS DC Specifications(VDD=3.0V~3.6V, Ta=-20℃~85℃)
Rating
Parameter
Symbol
Units
Conditions
Min
Typ
-
Max
VDD
High Level Input Voltage
Low Level Input Voltage
High Level Input Voltage
Low Level Input Voltage
Small Swing Voltage
VIH
VIL
V
V
DD×0.8
V
V
exclude RS pin
GND
DD×0.8
GND
1.2
-
V
DD×0.2
VIHRS
VILRS
-
VDD
0.2
2.8
-
RS pin
-
*1
VDDQ
-
V
-
Input Reference Voltage
VREF
-
VDDQ/2
Small Swing(RS=VDDQ/2)
VREF=VDDQ/2
Small Swing High Level
Input Voltage
VDDQ/2
+200mV
*2
VSH
-
-
-
-
V
Small Swing Low Level
Input Voltage
VDDQ/2
-200mV
*2
VSL
-
V
VREF=VDDQ/2
Input Current
IINC
-10
+10
ꢀA
0V≤ VIN≤ VDD
*1: VDDQ voltage defines max voltage of small swing input. It is not an actual input voltage.
*2: Small swing signal is applied to TA[6:0], TB[6:0], TC[6:0], TD[6:0] TE[6:0], CLKIN.
Table 6 : LVDS Transmitter DC Specifications(VDD=3.0V~3.6V, Ta=-20℃~85℃)
Rating
Parameter
Symbol
Units
Conditions
Min
250
Min
350
Min
450
Normal swing
mV
mV
mV
V
RS=VDD
Differential Output Voltage
VOD
RL=100Ω
Reduced swing
100
200
300
35
RS=GND
Change in VOD between
complementary output states
ΔVOD
VOC
-
-
Common Mode Voltage
1.125
1.25
1.375
35
RL=100Ω
Change in VOC between
complementary output states
ΔVOC
IOS
-
-
-
-
-
mV
mA
ꢀA
Output Short Circuit Current
Output TRI-STATE Current
-24
VOUT=0V, RL=100Ω
IOZ
-10
+10
XRST=0V, VOUT=0V to VDD
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
7/17
Technical Note
BU8254GUW
■Supply Current
Table 7 : Supply Current
Parameter
Rating
Typ
Symbol
Units
mA
Conditions
Min
-
Max
-
RL=100Ω,CL=5pF
VDD=3.3V,RS=VDD
Gray Scale Pattern
57
42
f=85MHz
f=85MHz
Transmitter Supply
Current
ITCCG
RL=100Ω,CL=5pF
VDD=3.3V,RS=GND
Gray Scale Pattern
-
-
-
-
-
-
mA
mA
mA
ꢀA
RL=100Ω,CL=5pF
VDD=3.3V,RS=VDD
Worst Case pattern
62
45
-
f=85MHz
f=85MHz
Transmitter Supply
Current
ITCCW
RL=100Ω,CL=5pF
VDD=3.3V,RS=GND
Worst Case pattern
-
Transmitter Power Down
Supply Current
ITCCS
10
XRST=L
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
8/17
Technical Note
BU8254GUW
Gray Scale Pattern
CLKOUT
Rx0
Rx1
Rx2
Rx3
Rx4
Rx5
Rx6
X=A,B,C,D,E
Fig.4 Gray scale pattern
Worst Case Pattern (Maximum Power condition)
CLKOUT
Rx0
Rx1
Rx2
Rx3
Rx4
Rx5
Rx6
X=A,B,C,D,E
Fig.5 Worst Case Pattern
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
9/17
Technical Note
BU8254GUW
■AC characteristics
Table 8 : Switching Characteristics
Parameter
Symbol
tTCIT
tTCP
tTCH
tTCL
Min
Typ
Max
Units
ns
CLK IN Transition time
CLK IN Period
-
-
5.0
8.93
-
0.5tTCP
0.5tTCP
tTCP
-
125.0
ns
CLK IN High Time
0.35tTCP
0.65tTCP
ns
CLK IN Low Time
0.35tTCP
0.65tTCP
ns
CLK IN to TCLK+/-Delay
LVSMOS Data Set up to CLK IN
LVCMOS Data Hold from CLK IN
LVDS Transition Time
Output Data Position 0
Output Data Position 1
tTCD
tTS
-
2.5
0
-
-
ns
ns
tTH
-
-
ns
tLVT
-
0.6
1.5
+0.2
ns
tTOP1
tTOP0
-0.2
0.0
ns
TCP -0.2
TCP +0.2
t
t
TCP
t
ns
7
7
7
t
t
TCP
7
t
2
3
4
5
6
TCP -0.2
2
3
4
5
6
2
3
4
5
6
TCP +0.2
Output Data Position 2
Output Data Position 3
Output Data Position 4
Output Data Position 5
Output Data Position 6
Phase Locked Loop Set Time
tTOP6
tTOP5
tTOP4
tTOP3
tTOP2
tTPLL
ns
ns
ns
ns
ns
ms
7
7
t
t
t
t
t
TCP
7
t
TCP -0.2
TCP +0.2
7
7
t
TCP
7
t
TCP -0.2
TCP +0.2
7
7
TCP -0.2
TCP +0.2
t
TCP
7
t
7
7
t
TCP
7
t
TCP -0.2
TCP +0.2
7
7
-
-
10.0
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
10/17
Technical Note
BU8254GUW
●AC Timing
■AC Timing Diagrams
LVCMOS Input
90%
90%
10%
CLKIN
10%
tTCIT
tTCIT
LVCMOS Output
LVDS Output
Vdiff=(TAP)-(TAN)
TAP
80%
20%
80%
20%
Vdiff
RL
TAN
tLVT
LVDS Output Load
tLVT
LVCMOS Input
tTCP
tTCH
RF=L
RF=H
CLKIN
VDD/2
VDD/2
VDD/2
tTCL
tTH
tTS
VDD/2
VDD/2
Tx0-Tx6
tTCD
TCLKP
TCLKN
VOC
Fig.6 AC Timing Diagrams
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
11/17
Technical Note
BU8254GUW
■Small Swing Inputs
tTCP
tTCH
RF=L
RF=H
CLKIN
VDDQ/2
V
DDQ/2
VDDQ/2
VREF
tTCL
tTH
tTS
VDDQ
VDDQ/2
VDDQ/2
VREF
GND
Tx0-Tx6
tTCD
TCLKP
TCLKN
VOC
Fig.7 Small Swing Inputs
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
12/17
Technical Note
BU8254GUW
■AC Timing Diagrams
LVDS Output
TCLK OUT
(Differential)
TAP/N
TBP/N
TCP/N
TDP/N
TEP/N
TA6
TB6
TC6
TD6
TE6
TA5
TB5
TC5
TD5
TE5
TA4
TB4
TC4
TD4
TE4
TA3
TB3
TC3
TD3
TE3
TA2
TB2
TC2
TD2
TE2
TA1
TB1
TC1
TD1
TE1
TA0
TB0
TC0
TD0
TE0
Previous Cycle
tTOP1
tTOP0
tTOP6
tTOP5
tTOP4
tTOP3
tTOP2
Fig.8 AC Timing Diagrams
■Phase Locked Loop Set Time
2.0V
3.0V
XRST
3.6V
tTPLL
VDD
CLKIN
Vdiff=0V
TCLKP/N
Fig.9 Phase Locked Loop Set Time
13/17
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
Technical Note
BU8254GUW
●System Timing Requirement
System Timing Requirement is mandatory by following two methods.
①The method of using CR circuit.( In the case that CLK does not stop after power supply)
②
The method of using external specific IC. (In the case that CLK turns on/off after power supply)
It is recommend to do enough examination for target application.
① The method of using CR circuit.( In the case that CLK does not stop after power supply)
PVDD
V DD
V DD
schottky barrier diode
LVDD
VDD
10KΩ
220Ω
Recommend
after VDD up
XRS
Be careful of temperature of
the capacitor especially over
and again.
2.2μF
XRST
CLK
Recommend
after VDD up and before XRST release
If unused connect to GND
B characteristic ceramics and
polymer aluminum
are recommended.
td is apporoximately equal to 20ms when the left RC coleus applied
Fig.10 The method of using CR circuit
②The method of using external specific IC. (In the case that CLK turns on/off after power supply)
VDD
PVDD
VDD
external specific
IC
LVDD
VDD
XRST
CLK
VOUT
Recommend
after CLK input
Recommend
after VDD up
VIN
XRST
CLK
Recommend
before XRST release
Recommend
after VDD up and before XRST release
GND
(CLK monitor and RST signal generation)
Fig.11 The method of using external specific IC.
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
14/17
Technical Note
BU8254GUW
●10bit LVCMOS Level Input
Example:
BU8254GUW : LVCMOS level input/Falling edge/Normal swing
BU90R104 : Falling edge
VDD
VDD
*1
*1
F.Bead
F.Bead
VDD
GND
VDD
GND
LVDS VDD
LVDD
LGND
0.1uF
0.01uF
0.1uF
0.01uF
0.1uF
0.1uF
0.01uF
0.01uF
CLKIN
R4
CLKIN
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
TE0
TE1
TE2
TE3
TE4
TE5
TE6
CLKOUT
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RD0
RD1
RD2
RD3
RD4
RD5
RD6
RE0
RE1
RE2
RE3
RE4
RE5
RE6
CLKOUT
R4
LVDS GND
R5
R6
R7
R8
R9
G4
G5
G6
G7
G8
G9
B4
B5
B6
R5
R6
R7
R8
R9
G4
G5
G6
G7
G8
G9
B4
B5
B6
PLL VDD
PLL GND
PVDD
PGND
0.1uF
0.01uF
0.1uF
0.01uF
TAN
TAP
RA-
100Ω
100Ω
100Ω
100Ω
100Ω
100Ω
RA+
TBN
RB-
B7
B7
TBP
RB+
B8
B8
B9
B9
TCN
RC-
HSYNC
VSYNC
DE
HSYNC
VSYNC
DE
TCP
RC+
R2
R3
G2
G3
B2
B3
R2
R3
G2
G3
B2
B3
TCLKN
RCLK-
RCLK+
RD-
BU8254GUW
BU90R104
TCLKP
TDN
OPEN
R0
TDP
RD+
R0
R1
G0
G1
B0
B1
R1
TEN
RE-
G0
G1
TEP
RE+
B0
B1
OPEN
XRST
XRST
PD
OE
PD
OE
100Ωtwist
pair Cable
or
VDD
RS
*2
PCB trace
0.1uF
DK
R/F
R/F
PCB(Transmitter)
PCB(Receiver)
*1 :
Recommended Parts:
F.Bead : BLM18A-Series (Murata Manufacturing)
If RS pin is tied to VDD, LVDS swing is 350m V.
If RS pin is tied to GND, LVDS swing is 200m V.
*2 :
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© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
15/17
Technical Note
BU8254GUW
●10bit Small Swing Input
Example:
BU8254GUW : LVCMOS level input/Falling edge/Normal swing
BU90R104 : Falling edge
VCC
VDD
F.Bead
F.Bead
VCC
GND
VDD
LVDS VDD
LVDS VCC
0.1uF
0.01uF
0.1uF
0.01uF
GND
0.1uF
0.01uF
0.1uF
0.01uF
CLKOUT
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RC0
CLKIN
R4
CLKIN
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
TE0
TE1
TE2
TE3
TE4
TE5
TE6
CLKOUT
R4
LVDS GND
LVDS GND
R5
R5
R6
R6
R7
R7
PLL VDD
PLL GND
PLL VCC
PLL GND
R8
R8
R9
R9
G4
G4
0.1uF
0.01uF
0.1uF
0.01uF
G5
G5
G6
G6
G7
G7
TAN
TAP
TBN
RA-
G8
G8
100Ω
100Ω
100Ω
100Ω
100Ω
100Ω
G9
G9
RA+
B4
B4
B5
B5
RB-
B6
B6
BU8254GUW
BU90R104
B7
RC1
RC2
RC3
RC4
RC5
RC6
RD0
RD1
RD2
RD3
B7
TBP
TCN
RB+
B8
B8
B9
B9
RC-
RC+
RCLK-
RCLK+
RD-
RD+
RE-
HSYNC
VSYNC
DE
HSYNC
VSYNC
DE
TCP
R2
R2
TCLKN
TCLKP
TDN
R3
R3
G2
G2
G3
G3
B2
B3
RD4
B2
B3
RD5
RD6
RE0
RE1
RE2
RE3
RE4
RE5
RE6
OPEN
R0
TDP
R0
R1
G0
G1
B0
B1
R1
TEN
G0
G1
TEP
RE+
B0
B1
OPEN
XRST
XRST
XRST
OE
XRST
OE
100Ωtwist
pair Cable
or
*2
RS
*1
PCB trace
TEST
R/F
R/F
PCB(Transmitter)
PCB(Receiver)
*3 : Recommended Parts:
F.Bead : BLM18A-Series (Murata Manufacturing)
*4 : RS pin acts as VREF input pin when input voltage is set to half of high level signal input.
We recommend to locate by-pass condenser near the RS pin.
VDD
R1
R2 5.6k
15k
RS pin
C1=0.1uF
Fig.12 Example for LVCMOS(1.8V input)(R1,R2)=(1.5kꢁ,5.6kꢁ)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
16/17
Technical Note
BU8254GUW
●Ordering Part Number
B U
8 2 5 4
G U W
Part No.
Part No.
Package
GUW: VBGA099W060
Packaging and forming specification
None:Tray
VBGA099W060
<Tape and Reel information>
1PIN MARK
6.0±0.1
Tape
Embossed carrier tape (with dry pack)
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
S
(
)
0.08
99- 0.295±0.05
S
P=0.5×9
0.5
0.75±0.1
φ
A
φ
0.05
M
S AB
K
J
B
H
G
F
E
D
C
B
A
12345678910
Direction of feed
1pin
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
2013.06 - Rev.B
17/17
Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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