BV1HL045EFJ-C_技术文档

Datasheet

Automotive IPD Series

Built-in Output Diagnosis

1ch High Side Switch

BV1HL045EFJ-C

General Description

Key Specifications

BV1HL045EFJ-C is a 1ch high side switch for automotive

application. It has a built-in overcurrent limit function,

thermal shutdown protection function, open load

detection function, low power output-OFF function and

short-to-VCC detection function. It is equipped with

diagnostic output function for abnormality detection.

◼

Power Supply Operating Range

ON-Resistance (Tj=25°C)

Overcurrent Limit

Standby Current (Tj=25°C)

Active Clamp Tolerance (Tj=25°C)

6 V to 28 V

45 mΩ(Typ)

2.5 A(Min)

0.5 µA(Max)

120mJ

Package

HTSOP-J8

W (Typ) x D (Typ) x H(Max)

4.9mm x 6.0mm x 1.0mm

Features

◼

Built-in Dual TSD^{(Note 1)}

AEC-Q100 Qualified^(Note2)

Built-in Overcurrent Protection Function (OCP)

Built-in Thermal Shutdown Protection

Function(TSD)

◼

Built-in Open Load Detection Function

Built-in Short-to-VBB Detection Function

Built-in Low Voltage Output OFF Function (UVLO)

Built-in Reverse Battery Connection Protection

Built-in Diagnostic Output

Low On-Resistance Single Nch MOSFET Switch

Monolithic power management IC with control unit

(CMOS)and power MOSFET mounted on a single

chip

(Note 1) Two type of built-in temperature protection:

Junction temperature, and ΔTj protection that detects sudden temperature rise

of the Power-MOS

(Note 2) Grade 1

Application

◼

Resistance load, inductance load and capacitance

load for automotive application

Typical Application Circuit

R_ST1PU

R_ST2PU

VBB

C_VBB

RIN

IN

R_ST1

ST1

ST2

MCU

OUT

BV1HL045EFJ-C

R_L

R_ST2

GND

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

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BV1HL045EFJ-C

Contents

General Description......................................................................................................................................................................1

Features.........................................................................................................................................................................................1

Application ....................................................................................................................................................................................1

Key Specifications........................................................................................................................................................................1

Package .........................................................................................................................................................................................1

Typical Application Circuit...........................................................................................................................................................1

Contents ........................................................................................................................................................................................2

Pin Configuration..........................................................................................................................................................................3

Pin Description .............................................................................................................................................................................3

Block Diagram...............................................................................................................................................................................3

Definition .......................................................................................................................................................................................4

Absolute Maximum Ratings.........................................................................................................................................................5

Recommended Operating Conditions.........................................................................................................................................5

Thermal Resistance......................................................................................................................................................................6

Electrical Characteristics...........................................................................................................................................................10

Typical Performance Curves......................................................................................................................................................11

Measurement Circuit ..................................................................................................................................................................16

Switching Time Measurement Condition...........................................................................................................................18

Timing Chart................................................................................................................................................................................19

Function Description..................................................................................................................................................................20

Application Circuit Diagram.......................................................................................................................................................25

I/O Equivalence Circuits.............................................................................................................................................................26

Operational Notes.......................................................................................................................................................................27

Ordering Information..................................................................................................................................................................29

Marking Diagram.........................................................................................................................................................................29

Physical Dimension and Packing Information .........................................................................................................................30

Revision History .........................................................................................................................................................................31

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Pin Configuration

(TOP VIEW)

1

8

IN

GND

ST1

ST2

OUT

7

6

5

2

3

4

OUT

EXP-PAD = VBB

Pin Description

Pin No.

Pin Name

IN

Function

Input pin. Pull-down resistor is connected internally.

Active High to turn on the switch.

Ground pin

1

2

GND

ST1

ST2

3

4

Self–diagnostic output pin 1

Self-diagnostic output pin 2

Switch output pin

5

OUT

VBB

6

Switch output pin

7

8

Switch output pin

EXP-PAD

Power input pin, switch input pin

Block Diagram

VBB

lnternal

supply

UVLO

clamp

charge

pump

IN

Gate Driver

Over current

detction

Control

Logic

Power

limitation

thermal

shut down

ST1

ST2

Open load

detection

Battery short

detection

OUT

Reverse

Battery

GND

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Definition

IBB

VBB

VDS VBB

IOUT

OUT

IIN

IN

VOUT

IST

ST1,ST2

VST

GND

IGND

Figure 1. Voltage and Current Definition

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Absolute Maximum Ratings

Parameter

Symbol

Rating

Unit

VBB - OUT Voltage

V_DS

V_BB

V_IN

-0.3 to Internal clamp^{(Note 1)}

-0.3 to +40

V

Power Supply Voltage

Input Voltage

-0.3 to +7.0

- 0.3 to +7.0

Internal limit^{(Note 2)}

10

V

Diagnostic Output Voltage

Output Current

V_ST

I_OUT

I_ST

V

A

Diagnostic Output Current

Junction Temperature Width

Storage Temperature Range

Maximum Junction Temperature

mA

°C

Tj

-40 to +150

-55 to +150

+150

Tstg

Tjmax

Active Clamp Energy (Single Pulse)

Tj_(START)= 25 °C, I_OUT= 2 A^{(Note 3)(Note 4)}

E_{AS (25 °C)}

E_{AS (150 °C)}

V_BBLIM

120

60

mJ

V

Active Clamp Energy (Single Pulse)

Tj_(START)= 150 °C, I_OUT= 2 A^{(Note 3)(Note 4)}

Supply Voltage

28

for Short Circuit Protection^{(Note 5)}

Supply Voltage

for Reverse-Battery Connection Protection

V_RBPLIM

18

V

(Note 1) Internally limited by output clamp voltage.

(Note 2) Internally limited by fixed over current limit.

(Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 2 A and VBB = 14 V.

(Note 4) Not 100% tested.

(Note 5) Maximum power supply voltage that can detect short circuit protection.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Caution 3: When IC turns off with an inductive load, reverse energy is generated. This energy can be calculated by the following equation:

1

푉_퐵퐵

2

퐸_퐿= × 퐿 × 퐼_{푂푈푇 푆푇퐴푅푇}× ꢀ1 −

ꢁ

(

)

2

푉_퐵퐵− 푉_퐷푆

Where:

L is the inductance of the inductive load.

I_OUT(START)is the output current at the time of turning off.

The BV1HL045EFJ-C integrates the active clamp function to internally absorb the reverse energy E_Lwhich is generated when the inductive load is

turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy E_Lis active

clamp tolerance E_AS(refer to Figure 24. Active Clamp Energy vs Output Current) or under when inductive load is used.

Recommended Operating Conditions

Min

Typ

Max

Parameter

Symbol

Unit

Power Supply Voltage Operating Range

Operating Temperature

V_BB

Topr

f_IN

6

-40

-

14

-

28

+150

1

V

°C

Input Frequency

-

kHz

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Thermal Resistance^{(Note 1)}

Parameter

Symbol

Typ

Unit

Condition

HTSOP-J8

(Note 2)

130.3

36.8

25.9

20

°C / W

1s

2s

Between Junction and Surroundings Temperature

(Note 3)

(Note 4)

(Note 2)

(Note 3)

(Note 4)

θ_JA

Thermal Resistance

2s2p

1s

Between Junction and the top center

of the outside surface of the component package

Thermal Characterization Parameter ^{(Note 5)}

Ψ_JT

8

2s

6

2s2p

(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HL045EFJ-C

(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)

(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)

(Note 3)JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)

(Top copper foil: ROHM recommended Footprint + wiring to measure/

Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,

copper (top & reverse side) 2 oz.)

(Note 4) JESD51-5/- 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)

(Top copper foil: ROHM recommended Footprint + wiring to measure/

2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,

copper (top & reverse side/inner layers) 2 oz./1 oz.)

(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

■

PCB Layout 1 layer (1s)

Footprint

100 mm²

600 mm²

1200 mm²

Figure 2. PCB Layout 1 Layer (1s)

Dimension

Value

Board Finish Thickness

Board Dimension

1.57 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top Layer)

Copper Foil Area Dimension

0.070 mm (Cu:2 oz)

Footprint / 100 mm²/ 600 mm²/ 1200 mm²

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Thermal Resistance – continued

■

PCB Layout 2 layers (2s)

Top Layer

Bottom Layer

Top Layer

Bottom Layer

Via

Isolation Clearance Diameter : ≥0.6 mm

Cross Section

Figure 3. PCB Layout 2 Layers (2s)

Dimension

Board Finish Thickness

Board Dimension

Value

1.60 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top/Bottom Layers)

Thermal Vias Separation/Diameter

0.070 mm (Cu +Plating)

1.2 mm / 0.3 mm

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Thermal Resistance – continued

■

PCB Layout 4 layers (2s2p)

TOP Layer

2nd/Bottom Layers

3rd Layer

Top Layer

2nd Layer

3rd Layer

Bottom Layer

Via

Isolation Clearance Diameter : ≥0.6 mm

Cross Section

Figure 4. PCB Layout 4 Layers (2s2p)

Dimension

Board Finish Thickness

Value

1.60 mm ± 10 %

Board Dimension

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top/Bottom Layers)

Copper Thickness (Inner Layers)

Thermal Vias Separation/Diameter

0.070 mm (Cu +Plating)

0.035 mm

1.2 mm / 0.3 mm

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Thermal Resistance – continued

■

Transient Thermal Resistance (Single Pulse)

Figure 5. Transient Thermal Resistance

■

Thermal Resistance (θ_JAvs Copper foil area- 1s)

Figure 6. Thermal Resistance

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Electrical Characteristics (unless otherwise specified V_BB= 6V to 28V, T_j= -40°C to 150°C)

Limit

Parameter

Power Supply

Symbol

Unit

Condition

Min

Typ

Max

V_BB= 14 V, V_IN= 0 V,

V_OUT= 0 V, Tj = 25 °C

I_BBL1

I_BBL2

-

0.5

20

µA

Standby current

V_BB= 14 V, V_IN= 0 V,

V_OUT= 0 V, Tj = 150 °C

Operating Current

I_BBH

-

2.0

3.5

5.0

1.0

mA

V

V_BB= 14 V, V_IN= 5 V, V_OUT= open

UVLO Detection Voltage

UVLO Hysteresis Voltage

Input

V_UVLO

V_UVHYS

-

V

High Level Input Voltage

Low Level Input Voltage

Input Hysteresis Voltage

High Level Input Current

Low Level Input Current

Power MOS Output

V_INH

V_INL

V_HYS

I_INH

2.1

-

V

-

0.9

-

0.3

50

-

V

-

150

+10

µA

V_IN= 5 V

V_IN= 0 V

I_INL

-10

R_ON1

R_ON2

-

45

-

60

90

75

0.5

10

1

mΩ

μA

V_BB= 8 V to 28 V, Tj = 25 °C

V_BB= 8 V to 28 V, Tj = 150 °C

V_BB= 6 V, Tj = 25 °C

Output ON Resistance

R_ON3

-

I_OUTL1

I_OUTL2

SR_ON

SR_OFF

t_OUTON

t_OUTOFF

V_DS

-

V_IN= 0 V, V_OUT= 0 V, Tj = 25 °C

V_IN= 0 V, V_OUT= 0 V, Tj = 150 °C

V_BB= 14 V, R_L= 6.5 Ω

Output Leak Current

-

μA

Output Slew Rate when ON

Output Slew Rate when OFF

Propagation Delay when ON

Propagation Delay when OFF

Output Clamp Voltage

-

0.3

60

50

V/µs

µs

-

1

V_BB= 14 V, R_L= 6.5 Ω

-

120

55

V_BB= 14 V, R_L= 6.5 Ω

-

µs

V_BB= 14 V, R_L= 6.5 Ω

45

V

V_IN= 0 V, I_OUT= 10 mA

Diagnostics

Diagnostic Output L Voltage

Diagnostic Output Leak Current

V_STL

I_STL

-

0.5

10

V

I_ST= 1 mA

V_ST= 5 V

µA

Propagation Delay Time when

Diagnostic Output is ON

t_STON

-

120

50

240

100

µs

V_BB= 14 V, R_L= 6.5 Ω

Propagation Delay Time when

Diagnostic Output is OFF

t_STOFF

Protection Circuit

Overcurrent Limit Value

I_LIM

I_OCD1

I_OCD2

V_SHV

V_OLD

I_OLD

2.5

4.0

5.5

10

A

V_DS= 5 V

Overcurrent Detect Value 1 ^{(Note 1)}

Overcurrent Detect Value 2 ^{(Note 1)}

Short-to-VCC Detection Voltage

Load Open Detection Voltage

Load Open Detection Sink Current

Thermal Shutdown ^{(Note 2)}

-

Tj = -40 °C

Tj = 150 °C

V_IN= 0 V

5.8

A

V_BB-1.8 V_BB-1.2 V_BB-0.5

V

2.0

3.0

10

4.0

30

200

-

V

V_IN= 0 V

-

µA

°C

V_IN= 0 V, V_OUT= 5 V

T_TSD

150

175

15

Thermal Shutdown Hysteresis ^{(Note 2)}

∆Tj Protection Temperature ^{(Note 2)}

T_TSDHYS

T_DTJ

-

120

-

(Note 1) Max value is not 100% tested.

(Note 2) Not 100% tested.

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Typical Performance Curves

(Unless otherwise specified V_BB= 14 V, IN = 5 V, Tj = 25 °C)

0.5

0.4

0.3

0.2

0.1

0

20

15

10

5

0

5

10 15 20 25 30 35 40

Power Supply Voltage : V_BB[V]

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 7. Standby Current vs Power Supply Voltage

Figure 8. Standby Current vs Junction Temperature

4.5

4

4.5

4

3.5

3

3.5

3

2.5

2

2.5

2

1.5

1

1.5

1

0.5

0

0.5

0

5

10 15 20 25 30 35 40

Power Supply Voltage : V_BB[V]

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 9. Circuit Current vs Power Supply Voltage

Figure 10. Circuit Current vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, IN = 5 V, Tj = 25 °C)

6

5

4

3

2

1

0

2.5

2.0

1.5

1.0

0.5

0.0

V_INH

V_INL

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Junction Temperature: Tj [°C]

Figure 11. UVLO Detection Voltage vs Junction Temperature

Figure 12. Input Voltage vs Junction Temperature

100

90

80

70

60

50

40

30

20

10

0

90

80

70

60

50

40

30

20

10

0

-50

0

50

100

150

0

5

10 15 20 25 30 35 40

Power Supply Voltage : V_BB[V]

Junction Temperature: Tj [ºC]

Figure 13. Input Current vs Junction Temperature

Figure 14. Output ON Resistance vs Supply Voltage

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, IN = 5 V, Tj = 25 °C)

90

80

70

60

50

40

30

20

10

0

10

8

6

4

2

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Junction Temperature: Tj [°C]

Figure 15. Output ON Resistance vs Junction Temperature

Figure 16. Output leak Current vs Junction Temperature

1.2

1.0

0.8

0.6

175

150

125

100

t_OUTON

75

t_OUTOFF

0.4

SR_OFF

50

25

0

0.2

SR_ON

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 17. Output Slew Rate vs Junction Temperature

Figure 18. Output ON, OFF Propagation Delay Time

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, IN = 5 V, Tj = 25 °C)

55

53

51

49

47

45

43

41

0.5

0.4

0.3

0.2

0.1

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 19. Output Clamp Voltage vs

Junction Temperature

Figure 20. Diagnostic Output Low Voltage

vs Junction Temperature

250

200

150

100

50

5

4

3

2

1

0

t_STON

t_STOFF

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 21. Diagnostic Output ON, OFF

Propagation Delay Time vs Junction Temperature

Figure 22. Open Load Detection Voltage

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, IN = 5 V, Tj = 25 °C)

15

10

5

Tj_(start)= 25 ºC

1000

100

10

Tj_(start)= 150 ºC

0

0.1

1.0

10.0

-50

0

50

100

150

Output Current: I_OUT[A]

Junction Temperature: Tj [ºC]

Figure 24. Active Clamp Energy vs Output Current

Figure 23. Current Detect Value vs Junction Temperature

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Measurement Circuit

V_BB

VBB

ST1, ST2

VBB

ST1, ST2

IN1

V_IN

OUT

GND

Figure 25. Standby Current

Low-Level Input Current

Figure 26. Operating Current

Output Leak Current

Diagnostic Output Leak Current

V_BB

VBB

IN1

IN

ST1, ST2

V_IN

OUT

GND

1 kΩ

Figure 27. UVLO Detection Voltage

UVLO Hysteresis Voltage

High Level Input Voltage

Low Level Input Voltage

Input Hysteresis Voltage

High Level Input Current

Thermal Shutdown

Figure 28. Output ON Resistance

Output Clamp Voltage

Thermal Shutdown Hysteresis

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Measurement Circuit - continued

V_BB

VBB

ST1, ST2

VBB

IN

10 kΩ

ST1, ST2

Monitor

I_ST

V_IN

OUT

Monitor

GND

1 kΩ

GND

6.5 Ω

Figure 29. Output ON Slew Rate

Output OFF Slew Rate

Figure 30. Diagnostic Output Low Voltage

Output ON Propagation Delay Time

Output OFF Propagation Delay Time

Diagnostic Output ON Propagation Delay Time

Diagnostic Output OFF Propagation Delay Time

V_BB

VBB

IN

10 kΩ

ST1, ST2

OUT

GND

Figure 31. Open Load Detection Voltage

Open Load Detection Sink Current

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Switching Time Measurement Condition

VBB

V_INL

V_INH

SR_ON

VBB

OUT

IN

t_OUTOF

80 %

5V

IN

80 %

20 %

OUT

10kΩ

6.5Ω

t_OUTON

SR_OF

ST1

ST2

GND

ST1

ST2

t_STON

t_STOFF

Figure 32. Switching Time Measurement Diagram

Figure 33. Switching Time Measurement Waveform

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Timing Chart

VBB

IN

V_INH

V_INL

tOUTOFF

SR_ON

20%

80%

20%

OUT

tOUTON

SROFF

ST1

ST2

t_STON

tSTOFF

Figure 34. Timing Chart

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Function Description

1. Protection Function

Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output

Mode

Conditions

IN

ST1

ST2

Standby

Operating

-

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Normal

Condition

-

Detect V_OUT≥ 3.0 V (Typ)

Release V_OUT≤ 2.4 V (Typ)

Detect V_OUT> VBB-1.2 V (Typ)

Release V_OUT< VBB-2.0V(Typ)

Detect V_BB≤ 5.0 V (Max)

Release V_BB≥ 6.0 V (Max)

Detect Tj ≥ 175 °C (Typ)

Release Tj ≤ 160 °C (Typ)

Detect ΔTj ≥ 120 °C (Typ)

Release ΔTj ≤ 80 °C (Typ)

Detect I_OUT≥ 4.0 A (Typ)

Release I_OUT< 4.0 A (Typ)

Open Load Detect (OLD)

Short to VBB Detection

Low

High

Low Voltage Output OFF

(UVLO)

Thermal Shutdown

(TSD)^{(Note 1)}

ΔTj Protection^{(Note 2)}

Over Current Protection

(OCP)

(Note 1) Thermal shutdown is automatically restored to normal operation.

(Note 2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit.

This IC has a built-in protection detection function as mentioned above and outputs the abnormal condition

with ST1 and ST2 pins.

ST1 is output for output detect and each protect function.

ST1 change from High to Low when OUT rise by near VBB during normal operation.

And change from Low to High when detect each protection or OUT is less than VBB-1.2V(Typ).

ST2 is output for open load detection and Short to VBB detection during IN = Low.

It is self-rest and operation becomes normal when each protection releases after detecting.

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Function Description - continued

2. Overcurrent Protection

This IC has a built-in overcurrent protection function. When overcurrent flows in the output, the output current is limited

to 4.0 A (Typ) and self-diagnostic output 1 (ST1) becomes High.

3. Thermal Shutdown and ΔTj Protection Detection

3.1 Thermal Shutdown Protection

This IC has a built-in thermal shutdown protection function. When the IC chip temperature exceeds175 °C (Typ), the

output is turned OFF and self-diagnostic output 1 (ST1) becomes High. When the temperature goes below 160 °C

(Typ), output will self-reset and operation becomes normal.

3.2 ΔTj Protection

This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (T_DTJ

)

between the POWER-MOS unit (T_POWER-MOS) and the control unit (T_AMB) in the IC is 120 °C (Typ) or more. ΔTj

protection also has a built-in hysteresis (T_DTJHYS) that returns the output to normal state when the temperature

difference becomes 80 °C (Typ) or less.

Figure 35 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND fault.

IN

I_LIMH

I_OUT

TTSD

T_POWER-MOS

T_TSDHYS

T_AMB

T_DTJHYS

T_DTJ

TSD

Operation

ΔTj Protection Operation

ST1

TSD Detect

TSD Release

(Note 1)

Figure 35. Thermal Shutdown Protection and ΔTj Protection Timing Chart

(Note 1) When output voltage falls to output ON detection voltage (V_SHV) or less at the output to GND is shorted or rare short, IC is judged that the output

voltage is abnormal. Hence, ST1, ST2 may not be able to turn low.

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Function Description - continued

4. Open Load Detection

VBB

5V

VBB

SOLD

R_OLD

OUT

IN

Internal

supply

SW1

RL

ST1

ST2

R1

R2

logic

R

PD

VOLD

Figure 36. Open Load Detection Block Diagram

Open load can be detected by connecting an external resistance R_OLDbetween power supply V_BBand output.

When output load is disconnected during input is low, diagnostic output the ST1 pin is turned to low to indicate abnormality.

To reduce the standby current of the system, an open load resistance switch S_OLDis recommended.

When the SW1 is OFF, voltage of the OUT does not fall to GND level. Because, when the IN pin is low, the voltage of the

OUT pin does not become under or equal to the Output ON Detection Voltage (V_DSDET). To pulled down the OUT pin, pulled

down resistance R_PDis recommended. The resistance R_PDis 4.3 kΩ or less for outflow current from the OUT pin.

4.1 When the OUT is pulled down by the load (Normal function)

The value of external resistance R_OLDis decided based on used minimum power supply voltage (V_BB), internal

resistance R₁and R₂and open detection voltage V_OLD.External resistance R_PDis unnecessary.

The equation for calculating the R_OLDvalue is shown below.

^ꢋ− ꢇ 푅_{ꢏ(ꢐꢑꢒ)}ꢓ 푅_{ꢔ(ꢐꢑꢒ)}ꢋ [Ω]

ꢅ

ꢆꢆ

×ꢇ ꢈ

+ꢈ

ꢉ(푀푖푛)

ꢊ(푀푖푛)

푅_ꢂꢃꢄ

<

ꢅ

ꢌꢍꢎ(Max)

The above formula is summarized as follows.

푅_ꢂꢃꢄ< 푉_ꢕꢕ× 75 × 10³− ꢖ00 × 10³[Ω]

R_OLDvalue is fell below the above calculated result.

4.2 If the SW is OFF, the output is no longer pulled down by the load

The value of external resistance R_OLDis decided based on used minimum power supply voltage (V_BB), external

resistance R_PDand open detection voltage V_OLD

.

The equation for calculating the R_OLDvalue is shown below.

ꢅ

×ꢈ

푃ꢎ

ꢆꢆ

푅_ꢂꢃꢄ

<

− 푅_ꢗꢄ[Ω]

ꢅ

ꢌꢍꢎ(Max)

When R_PDis 4.3 kΩ, the above formula is summarized as follows.

푅_ꢂꢃꢄ< 푉_ꢕꢕ× 1.075 × 10³− 4.ꢖ × 10³[Ω]

R_OLDvalue is fell below the above calculated result

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Function Description - continued

5. Other Detection

5.1 GND open protection

5V

VBB

Clamp

IN

Internal

supply

ST1

ST2

Control

logic

OUT

GND

Figure 37. GND Open Detection Block Diagram

When GND of the IC is open, the output is switched OFF regardless of the input voltage.

However, self-diagnostic output (ST1, ST2) is not flagged. When an inductive load is connected,

the active clamp operates when the GND pin is open

5.2 Reverse-Battery Connection Protection

VBB

clamp

DRV

OUT

Reverse

Battery

VBAT

GND

Figure 38. Reverse-Battery Connection Block Diagram

When the battery connection is reversed, an excessive amount of current will flow to internal part of IC

and this may sometimes lead to IC destruction.

As a countermeasure, this IC has a built-in reverse battery connection protection function without external

components such as resistors and diodes.

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Function Description - continued

5.3 MCU I/O Protection

VBB

5V

Internal

supply

Clamp

IN

ST1

ST2

Control

logic

OUT

MCU

GND

Figure 39. MCU I/O Protection

Negative surge voltage to the IN pin, the ST1 pin and the ST2 pin may cause damage to the MCU's I/O pins. In order to

prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU.

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Application Circuit Diagram

R_ST1PU

R_ST2PU

VBB

C_VBB

RIN

IN

R_OLD

OUT

R_ST1

ST1

ST2

MCU

BV1HL045EFJ-C

R_PD

R_L

R_ST2

GND

Figure 40. Application Circuit Diagram

Symbol

Value

Purpose

R_IN

4.7 kΩ

10 kΩ

1 µF

Limit resistance for negative surge

R_ST1, R_ST2

R_ST1PU, R_ST2PU

C_VBB

Pull up ST1 / ST2 pin to MCU power supply, these pins are open drain output

For battery line voltage spike filter

R_PD

4.3 kΩ

2 kΩ

For output pulled down

R_OLD

For open load detection

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I/O Equivalence Circuits

IN

ST1, ST2

10 kΩ

150 Ω

ST1

ST2

IN

100 kΩ

VBB

OUT

VBB

OUT

227 kΩ

273 kΩ

VBB

Resistance values shown in the diagrams above are typical values

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a

voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

10. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

11. Thermal Shutdown Function (TSD)

This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from

heat damage.

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Operational Notes – continued

12. Over Current Protection Function (OCP)

This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This

protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection function.

13. Active Clamp Operation

The IC integrates the active clamp function to internally absorb the reverse energy E_Lwhich is generated when the

inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a

load so that the reverse energy E_Lis active clamp tolerance E_AS(refer to Figure 24. Active Clamp Energy vs Output

Current) or under when inductive load is used.

14. Open Power Supply Pin

When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of

input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the

same potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ).

15. Open GND Pin

When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an

inductive load is connected, the active clamp operates when the GND pin is open.

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Ordering Information

B V 1 H L

0

4

5 E F

J

-

CE 2

V1: 1ch

H: High side switch

Package

EFJ: HTSOP-J8

Product Rank

C: Automotive product

Packaging and Forming Specification

E2: Embossed tape and reel

Marking Diagram

HTSOP-J8 (TOP VIEW)

Part Number Marking

LOT Number

1 H L 0 4 5

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

HTSOP-J8

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Revision History

Date

Revision

Changes

24.Mar.2020

001

New Release

P.6 Thermal Resistance

Between Junction and Surroundings Temperature Thermal Resistance (θ_JA) value is

changed.

Between Junction and the top center of the outside surface of the component package

Thermal Characterization Parameter (Ψ_JT) is added.

P.10 Electrical Characteristics

Condition of Overcurrent Limit Value (I_LIM) is added.

Parameter names and symbols of Overcurrent Detect Value are changed.

22.May.2020

002

Overcurrent Detect Value (I_OCDL) → Overcurrent Detect Value 1 (I_OCD1)

Overcurrent Detect Value (I_OCDH) → Overcurrent Detect Value 2 (I_OCD2

MIN values of Overcurrent Detect Value 1, 2 (I_OCD1, I_OCD2) are added.

Notes of Overcurrent Detect Value 1, 2 (I_OCD1, I_OCD2) are changed.

Max value of Overcurrent Detect Value 2 (I_OCD2) is changed.

P.20 Function Description

)

Diagnostic Output in OLD detection and release is changed.

P.26 I/O Equivalence Circuits

Equivalence Circuits figures are changed.

P.4 Definition

Figure of Voltage and Current Definition is changed.

P.5 Absolute Maximum Ratings

Supply Voltage for Reverse-Battery Connection Protection is added.

About active clamp tolerance, note is changed and caution is added.

P.10 Electrical Characteristics

19.Oct.2020

003

Condition of Output Clamp Voltage is changed.

P.27 and P.28 Operational Notes

Description of Ground Voltage, Thermal Shutdown Function (TSD), Active Clamp

Operation, Open Power Supply Pin and Open GND Pin is changed.

P.5 Absolute Maximum Ratings

Change the condition of E_ASfrom I_OUT= 4 A to I_OUT= 2 A.

P.6 Thermal Resistance

Figure 2 - Change the size of PCB layout.

09.Feb.2023

004

P.15 Typical Performance Curves

Figure 24 - Change the graph of E_AS

.

P.28 Operational Notes

14. Open Power Supply Pin

Change the value of output clamp voltage.

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BV1HL045EFJ-C
厂家：	ROHM
描述：	BV1HL045EFJ-C是车载用1ch高边开关。内置输出异常模式，即地线短接检测（过电流限制功能）、电源短接检测功能、负载开路检测功能，以及过热保护功能、低电压时输出OFF功能，具有异常检出时诊断输出功能。过电流限制值为2.5A~5.5A。还备有过电流限制值为5.0A~12.0A的BV1HJ045EFJ-C。开关
文件：	总34页 (文件大小：1515K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BV1HL045EFJ-C [ROHM]

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