BV1LC300FJ-C_技术文档

Datasheet

Automotive IPD 1ch/2ch Low Side Switch

BV1LC300FJ-C BM2LC300FJ-C

Features

Key Specifications

■

AEC-Q100 Qualified^{(Note 1)}

On-state Resistance (Tj = 25 °C, Typ)

Over Current Detection Current

(Tj = 25 °C, Typ)

350 mΩ

Built-in Over Current Protection Function(OCP)

Built-in Thermal Shutdown Function (TSD)

Built-in Active Clamp Function

2.7 A

Output Clamp Voltage (Min)

Active Clamp Energy (Tj_(START)= 25 °C)

42 V

Built-in Diagnostic Function

300 mJ

Direct Control Enabled from CMOS Logic IC, etc.

On Resistance R_DS(ON)= 350 mΩ(Typ)

(when V_IN= 5 V, I_OUT= 0.5 A, Tj = 25 C)

Monolithic Power Management IC with the Control

Block (CMOS) and Power MOS FET Mounted on a

Single Chip

■

Package

SOP-J8

W (Typ) x D (Typ) x H (Max)

4.90mm x 6.00mm x 1.65mm

(Note 1) Grade1

General Description

The BV1LC300FJ-C is 1ch, BM2LC300FJ-C is 2ch

automotive low side switch IC, which has built-in OCP,

TSD, active clamp function.

Also, diagnostic function can diagnose OCP, TSD, open

load detection function (OLD).

Application

■

Driving Resistive, Inductive and Capacitive Load

Block Diagram^{(Note 1)}

IN

OUT

Active Clamp

Circuit

ST

TSD

OCP

OLD

GND

Figure 1. Block Diagram

(Note 1) BV1LC300FJ-C and BM2LC300FJ-C use same block diagram. BM2LC300FJ-C just double it.

Product structure: Silicon monolithic integrated circuit

www.rohm.com

TSZ22111 • 14 • 001

This product is not designed to protect it from radiation.

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

1/26

BV1LC300FJ-C BM2LC300FJ-C

Contents

Features..........................................................................................................................................................................................1

General Description........................................................................................................................................................................1

Application ......................................................................................................................................................................................1

Key Specifications...........................................................................................................................................................................1

Package..........................................................................................................................................................................................1

Block Diagram ................................................................................................................................................................................1

Pin Configuration ............................................................................................................................................................................3

Pin Description................................................................................................................................................................................3

Term................................................................................................................................................................................................4

Absolute Maximum Ratings ............................................................................................................................................................4

Recommended Operating Conditions.............................................................................................................................................4

Thermal Resistance........................................................................................................................................................................5

Electrical Characteristics.................................................................................................................................................................9

Typical Performance Curves.........................................................................................................................................................11

Measurement Circuit for Typical Performance Curves..................................................................................................................18

I/O Pin Truth Table........................................................................................................................................................................20

Timing Chart .................................................................................................................................................................................20

Operational Notes.........................................................................................................................................................................22

Ordering Information.....................................................................................................................................................................24

Marking Diagram ..........................................................................................................................................................................24

Physical Dimension and Packing Information...............................................................................................................................25

Revision History............................................................................................................................................................................26

www.rohm.com

TSZ02201-0GBG1G400050-1-2

2/26

22.Mar.2018 Rev.001

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Pin Configuration

SOP-J8

(TOP VIEW)

GND

1

2

8

7

IN1

1

2

8

7

OUT1

GND1

OUT

ST1

BV1LC300FJ-C

BM2LC300FJ-C

ST

IN

3

6

IN2

3

6

OUT2

GND2

4

5

4

5

ST2

Figure 2. Pin Configuration

Pin Description

■

BV1LC300FJ-C

Pin No.

Pin Name

GND

ST

Function

1

2

GND pin.

3

Self-diagnostic output pin.

.

4

5

IN

Input pin, with internal pull-down resistor.

Output pin. When output pin shorted to battery and output current exceeding

the over current detection value, output current will be limited to protect IC.

Output pin. When output pin shorted to battery and output current exceeding

the over current detection value, output current will be limited to protect IC.

Output pin. When output pin shorted to battery and output current exceeding

the over current detection value, output current will be limited to protect IC.

Output pin. When output pin shorted to battery and output current exceeding

the over current detection value, output current will be limited to protect IC.

OUT

6

7

8

■

BM2LC300FJ-C

Pin No.

Pin Name^{(Note 1)}

Function

Input pin 1, with internal pull-down resistor.

Self-diagnostic output pin 1.

1

2

3

4

5

IN1

ST1

IN2

Input pin 2, with internal pull-down resistor.

Self-diagnostic output pin 2.

ST2

GND2

GND pin 2.

Output pin 2, when output pin shorted to battery and output current exceeding

the over current detection value, output current will be limited to protect IC.

6

7

8

OUT2

GND1

OUT1

GND pin 1.

Output pin 1. When output pin shorted to battery and output current exceeding

the over current detection value, output current will be limited to protect IC.

(Note 1) The number in Pin Name is the channel number.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

3/26

BV1LC300FJ-C BM2LC300FJ-C

Term

VBAT

RL, ZL

IOUT

I_ST

OUT

V_MCUR_ST

ST

VOUT

V

ST

I_IN

IN GND

V

IN

C_ST

V

IN

GND

Figure 3. Term

Absolute Maximum Ratings(Tj = 25°C)

Parameter

Output Voltage

Symbol

V_OUT

V_IN

Ratings

-0.3 to +42

-0.3 to +7

Unit

V

Input Voltage

V

Output Current

I_OUT(OCP)

V_ST

1.7 (inside limited)^{(Note 1)}

A

Diagnostic Output Voltage

Diagnostic Output Current

-0.3 to +7

10

V

I_ST

mA

Active Clamp Energy (Single Pulse)

Tj_(START)= 25 °C^{(Note 2)}

E_{AS(25 °C)}

300

60

mJ

Active Clamp Energy (Single Pulse)

Tj_(START)= 150 °C^{(Note 2) (Note 3)}

E_{AS(150 °C)}

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

Tj

-40 to +150

-55 to +150

150

°C

Tstg

Tjmax

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open

circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case

the IC is operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of

the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into

consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Internally limited by over current protection function.

(Note 2) Active clamp energy (Single Pulse), at the condition I_OUT(START)= 0.5 A, V_BAT= 16 V.

1

V_BAT

E_AS

=

LI_OUT(START)²× ( 1 -

)

2

V_BAT- V_OUT(CL)

(Note 3) Not 100 % tested.

Recommended Operating Conditions

Parameter

Input Voltage

Symbol

V_IN

Min

3.0

-40

Typ

5.0

Max

5.5

Unit

V

Operating Temperature

Tj

+25

+150

°C

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

4/26

BV1LC300FJ-C BM2LC300FJ-C

Thermal Resistance^{(Note 1)}

Parameter

Symbol

Typ

Unit

Condition

BV1LC300FJ-C

(Note 2)

143.7

86.9

67.5

°C/W

1s

2s

Between Junction and Surroundings Temperature

Thermal Resistance

(Note 3)

(Note 4)

θ_JA

2s2p

Parameter

Symbol

Typ

Unit

Condition

BM2LC300FJ-C (1ch ON)

(Note 2)

(Note 3)

(Note 4)

173.3

112.5

91.2

°C/W

1s

2s

Between Junction and Surroundings Temperature

Thermal Resistance

θ_JA

2s2p

Parameter

Symbol

Typ

Unit

Condition

BM2LC300FJ-C (All ch ON)

(Note 2)

(Note 3)

(Note 4)

146.2

88.5

71.4

°C/W

1s

2s

Between Junction and Surroundings Temperature

Thermal Resistance

θ_JA

2s2p

(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. They are used the chip of BV1LC300FJ-C and the chip of BM2LC300FJ-C.

(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)

(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)

(Note 3)JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)

(Top copper foil: ROHM recommended Footprint + wiring to measure/

Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,

copper (top & reverse side) 2 oz.)

(Note 4) JESD51-5/-7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)

(Top copper foil: ROHM recommended Footprint + wiring to measure/

2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,

copper (top & reverse side/inner layers) 2 oz./1 oz.)

■

PCB Layout 1 layer (1s)

Footprint

Figure 4. PCB Layout 1 layer (1s)

Dimension

Value

Board Finish Thickness

Board Dimension

1.57 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top Layer)

0.070 mm (Cu:2 oz)

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

5/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Thermal Resistance – continued

■

PCB Layout 2 layers (2s)

Top Layer

Bottom Layer

Top Layer

Bottom Layer

Cross Section

Figure 5. PCB Layout 2 layers (2s)

Dimension

Value

1.60 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Finish Thickness

Board Dimension

Board Material

Copper Thickness (Top/Bottom Layers)

0.070 mm (Cu + Plating)

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

6/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Thermal Resistance – continued

■

PCB Layout 4 layers (2s2p)

Top Layer

2nd/3rd/Bottom Layers

Top Layer

2nd Layer

3rd Layer

Bottom Layer

Cross Section

Figure 6. PCB Layout 4 layers (2s2p)

Dimension

Value

1.60 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Finish Thickness

Board Dimension

Board Material

Copper Thickness (Top/Bottom Layers)

Copper Thickness (Inner Layers)

0.070 mm (Cu + Plating)

0.035 mm

■

BV1LC300FJ-C Transient Thermal Resistance (Single Pulse)

1000

100

10

1

footprint

2s

2s2p

0

0.0001 0.001

0.01

0.1

1

10

100

1000

Pulse time[s]

Figure 7. Transient Thermal Resistance

7/26

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

BV1LC300FJ-C BM2LC300FJ-C

Thermal Resistance – continued

■

BM2LC300FJ-C Transient Thermal Resistance (Single Pulse) 1ch ON

1000

100

10

1

footprint

2s

2s2p

0

0.0001 0.001

0.01

0.1

1

10

100

1000

Pulse time[s]

Figure 8. Transient Thermal Resistance

■

BM2LC300FJ-C Transient Thermal Resistance (Single Pulse) All ch ON

1000

100

10

1

footprint

2s

2s2p

0

0.0001 0.001

0.01

0.1

1

10

100

1000

Pulse time[s]

Figure 9. Transient Thermal Resistance

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

8/26

BV1LC300FJ-C BM2LC300FJ-C

Electrical Characteristics (Unless otherwise specified, 40 C ≤ Tj ≤ 150 C)

Limit

Parameter

Symbol

Unit

Conditions

Min

42

Typ

48

Max

54

Output Clamp Voltage

V_OUT(CL)

R_DS(ON)

I_OUT(L)

t_ON

V

mΩ

μA

μs

V_IN= 0 V, I_OUT= 1 mA

On-state Resistance

(V_IN= 5 V, Tj = 25 °C)

-

350

660

460

845

60

85

-

435

850

595

1100

80

V_IN= 5 V, I_OUT= 0.5 A,Tj = 25 °C

V_IN= 5 V, I_OUT= 0.5 A,Tj = 150 °C

V_IN= 3 V, I_OUT= 0.5 A,Tj = 25 °C

V_IN= 3 V, I_OUT= 0.5 A,Tj = 150 °C

V_IN= 0 V, V_OUT= 18 V,Tj = 25 °C

V_IN= 0 V, V_OUT= 18 V,Tj = 150 °C

On-state Resistance

(V_IN= 5 V, Tj = 150 °C)

-

On-state Resistance

(V_IN= 3 V, Tj = 25 °C)

-

On-state Resistance

(V_IN= 3 V, Tj = 150 °C)

Leak Current (Tj = 25 °C)

Leak Current (Tj = 150 °C)

Turn-ON TIME

40

50

-

200

40

V_IN= 0 V to 5 V, R_L= 15 Ω,

V_BAT= 12 V, Tj = 25 °C

V_IN= 5 V to 0 V, R_L= 15 Ω,

V_BAT= 12 V, Tj = 25 °C

Turn-OFF TIME

t_OFF

-

40

μs

V_IN= 0 V to 5 V, R_L= 15 Ω,

V_BAT= 12 V, Tj = 25 °C

Slew Rate On

SR_ON

SR_OFF

V_IN(TH)

I_IN(H1)

I_IN(H2)

I_IN(L)

1.5

3.0

-

V/μs

V

-

3.0

6.0

2.7

220

500

+10

3.7

-

V_IN= 5 V to 0 V, R_L= 15 Ω,

V_BAT= 12 V, Tj = 25 °C

Slew Rate Off

-

Input Threshold Voltage

1.5

-

R_L= 15 Ω, V_BAT= 12 V

V_IN= 5 V

High-level Input Current1

(in Normal Operation)

110

-

μA

A

High-level Input Current2

V_IN= 5 V

-

(in Abnormal Operation)^{(Note 1)}

Low-level Input Current

0

V_IN= 0 V

-10

1.7

150

135

-

Over Current Detection Current

I_OUT(OCP)

Tjo

2.7

175

-

V_IN= 5 V, V_BAT= 12 V, Tj = 25 °C

V_IN= 5 V

Thermal Shutdown Operated

Temperature^{(Note 2)}

°C

Thermal Shutdown Released

Temperature^{(Note 2)}

Tjr

-

°C

V_IN= 5 V

Thermal Shutdown Hysteresis

Tj_ΔHYS

15

-

°C

V_IN= 5 V

(Note 2)

(Note 1) When thermal shutdown function or over current protection function is ON.

(Note 2) Not 100 % tested.

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

9/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Electrical Characteristics (Unless otherwise specified, 40 C ≤ Tj ≤ 150 C) – continued

Limit

Parameter

Symbol

Unit

Conditions

Min

1.5

Typ

-

Max

4.5

Open Load Detection Voltage

ST Output On Voltage1

V_OPEN

V_ST(ON1)

V_ST(ON2)

I_ST(L1)

V

V_IN= 0 V

0.2

-

0.5

20

30

V_IN= 5 V, I_ST= 1 mA

-

V_IN= 0 V, V_OUT= 4.5 V,

I_ST= 0.5 mA

ST Output On Voltage2

V

ST Output Leak Current1

ST Output Leak Current2

ST Output Delay Time Detect

ST Output Delay Time Release

μA

μs

V_IN= 5 V, V_ST= 5 V

V_IN= 0 V, V_OUT= 1.5 V,

V_ST= 5 V

I_ST(L2)

-

V_IN= 0 V, V_OUT= 5 V to 1 V,

V_MCU= 5 V, R_ST= 10 kΩ, C_ST= 10 pF

t_STDET

1

V_IN= 0 V, V_OUT= 1 V to 5 V,

V_MCU= 5 V, R_ST= 10 kΩ, C_ST= 10 pF

t_STREL

1

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

10/26

BV1LC300FJ-C BM2LC300FJ-C

Typical Performance Curves(Unless otherwise specified, Tj = 25 °C, V_IN= 5.0 V)

600

550

500

450

400

350

300

250

54

52

50

48

46

44

42

-40

0

40

80

120

150

3

4

5

6

7

Input Voltage: V_IN[V]

Junction Temperature: Tj[℃]

Figure 10. Output Clamp Voltage

vs Junction Temperature

Figure 11. On-state Resistance vs Input Voltage

200

180

160

140

120

100

80

1200

1000

800

600

400

200

0

VIN = 3 V

VIN = 5 V

60

40

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 12. On-state Resistance

vs Junction Temperature

Figure 13. Leak Current vs Junction Temperature

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

11/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, V_IN= 5.0 V) – continued

40

35

30

25

20

15

10

5

40

35

30

25

20

15

10

5

0

3

4

5

6

7

3

4

5

6

7

Input Voltage: V_IN[V]

Figure 14. Turn-ON TIME vs Input Voltage

Figure 15. Turn-OFF TIME vs Input Voltage

40

35

30

25

20

15

10

5

40

35

30

25

20

15

10

5

0

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 16. Turn-ON TIME vs Junction Temperature

Figure 17. Turn-OFF TIME vs Junction Temperature

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

12/26

BV1LC300FJ-C BM2LC300FJ-C

Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, V_IN= 5.0 V) – continued

3.0

2.5

2.0

1.5

1.0

0.5

0.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

3

4

5

6

7

3

4

5

6

7

Input Voltage: V_IN[V]

Figure 19. Slew Rate Off vs Input Voltage

Figure 18. Slew Rate On vs Input Voltage

3.0

2.5

2.0

1.5

1.0

0.5

0.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

150

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 21. Slew Rate off vs Junction Temperature

Figure 20. Slew Rate On vs Junction Temperature

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

13/26

BV1LC300FJ-C BM2LC300FJ-C

Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, V_IN= 5.0 V) – continued

2.7

2.3

1.9

1.5

1.1

200

150

100

50

VIN(TH) High

VIN(TH) Low

0

-40

0

40

80

120

3

4

5

6

7

150

Input Voltage: V_IN[V]

Junction Temperature: Tj[℃]

Figure 23. High-level Input Current1 (In Normal

Operation) vs Input Voltage

Figure 22. Input Threshold Voltage

vs Junction Temperature

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

250

200

150

100

50

VIN = 3 V

VIN = 4 V

VIN = 5 V

VIN = 6 V

VIN = 7 V

0

2

4

6

8

10

12

-40

0

40

80

120

150

Output Voltage: V_OUT[V]

Junction Temperature: Tj[℃]

Figure 25. Over Current Detection Current

vs Output Voltage

Figure 24. High-level Input Current1 (in Normal

Operation) vs Junction Temperature

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

14/26

BV1LC300FJ-C BM2LC300FJ-C

Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, V_IN= 5.0 V) – continued

4.0

3.5

3.0

2.5

2.0

1.5

5

4

3

2

1

0

150

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 26. Over Current Detection Current

vs Junction Temperature

Figure 27. Open Load Detection Voltage

vs Junction Temperature

0.5

0.4

0.3

0.2

0.1

0.0

0.5

0.4

0.3

0.2

0.1

0.0

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 28. ST Output On Voltage1

vs Junction Temperature

Figure 29. ST Output On Voltage2

vs Junction Temperature

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

15/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, V_IN= 5.0 V) – continued

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.30

0.25

0.20

0.15

0.10

0.05

0.00

150

-40

0

40

80

120

-40

0

40

80

120

Junction Temperature: Tj[℃]

Figure 31. ST Output Leak Current2

vs Junction Temperature

Figure 30. ST Output Leak Current1

vs Junction Temperature

5

4

3

2

1

0

5

4

3

2

1

0

-40

0

40

80

120

150

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 32. ST Output Delay Time Detect

vs Junction Temperature

Figure 33. ST Output Delay Time Release

vs Junction Temperature

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

16/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, V_IN= 5.0 V) – continued

1000

Tj(START) = 25 °C

Tj(START) = 150 °C

100

10

1

0.5

0.7

0.9

1.1

1.3

1.5

Output Current (Start):I_OUT(START)[A]

Figure 34. Active Clamp Energy (Single Pulse)

vs Output Current (Start)

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

17/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Measurement Circuit for Typical Performance Curves

R_DS(ON)

= V_OUT/I_OUT

I_OUT= 0.5 A

I_OUT= 1 mA

OUT

ST

IN

ST

V

IN

GND

V_IN

Measurement Circuit for

Figure 10

Measurement Circuit for

Figure 11,12

A

R_L= 15Ω

V_OUT= 18 V

V_BAT= 12 V

OUT

ST

Monitor

IN

GND

0 V to 5 V

Monitor

or

5 V to 0 V

Measurement Circuit for

Figure 14,15,16,17,18,19,20,21

Measurement Circuit for

Figure 13

V_BAT= 12 V

R_L= 15 Ω

V_BAT= 12 V

R_L= 15 Ω

OUT

ST

V

IN

A

IN

GND

V

V_IN

Measurement Circuit for

Figure 22

Measurement Circuit for

Figure 23,24

A

V_OUT

OUT

10 kΩ

ST

IN

V

5 V

V

IN

GND

V_IN

Measurement Circuit for

Figure 25,26

Measurement Circuit for

Figure 27

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

18/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Measurement Circuit for Typical Performance Curves – continued

V_OUT= 4.5 V

OUT

GND

ST

IN

I_ST= 1 mA

I_ST= 0.5 ｍA

V

IN

GND

V_IN

Measurement Circuit for

Figure 28

Measurement Circuit for

Figure 29

V_OUT= 1.5 V

OUT

A

ST

IN

ST

V_ST= 5 V

IN

GND

V_IN

Measurement Circuit for

Figure 30

Measurement Circuit for

Figure 31

1 V to 5 V

or

5 V to 1 V

OUT

10 kΩ

ST

5 V

Monitor

10pF

IN

GND

Measurement Circuit for

Figure 32,33

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

19/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

I/O Pin Truth Table

■

Output Function

Input Signal

Operating Status

Standby

Output Status

OFF

L

H

Normal

ON

Over Current

Over Temperature

Current Limiting

OFF

■

Diagnostic Function of Abnormal Status

Diagnoses the presence or absence of an abnormal condition. By combining High and Low of the input signal and the ST

pin, it is possible to grasp overcurrent, heating state, load open state.

Input Signal

ST Signal

Diagnosis Result

No Abnormality

Load Open

L

H

Over Current

or

Over Temperature

H

L

H

No Abnormality

Timing Chart

V_IN[V]

V_IN

V_IN(TH)

0

t

V_OUT[V]

V_OUT(CL)

V_OUT

V_BAT

I_OUTx R_DS(ON)

0

t

I_OUT[A]

V_BAT

Z_L+ R_DS(ON)

I_OUT

0

t

Figure 35. Inductive Load Operation

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

20/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Timing Chart – continued

V_IN[V]

tr ≤ 0.1[μs]

tf ≤ 0.1[μs]

5 V

90 %

10 %

V_IN

0

ｔ

V_OUT[V]

t_ON[μs]

t_OFF[μs]

≈ 12 V

≈ 0 V

80 %

70 %

V_OUT

30 %

20 %

0

ｔ

SR_OFF[V/μs]

SR_ON[V/μs]

Figure 36. Switching Time

V_IN[V]

V_IN

V_IN= 0 V

0

t

V_OUT[V]

5 V

1 V

5 V

1 V

4.5 V

V_OUT

1.5 V

0

t

V_ST[V]

t_STDET

t_STREL

≈ 5 V

≈ 0 V

≈ 5 V

≈ 0 V

V_ST

2.5 V

0

t

Figure 37. ST Output Delay Time

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

21/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Operational Notes

1.

2.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately

but connected to a single ground at the reference point of the application board to avoid fluctuations in the

small-signal ground caused by large currents. Also ensure that the ground traces of external components do not

cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line

impedance.

3.

4.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

5.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

6.

7.

Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

Thermal Shutdown Function (TSD)

This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should

always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued

period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins.

When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under

no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC

from heat damage.

8.

9.

Over Current Protection Function (OCP)

This IC incorporates an integrated over current protection function that is activated when the load is shorted. This

protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC

should not be used in applications characterized by continuous operation or transitioning of the protection function.

Active Clamp Operation

The IC integrates the active clamp function to internally absorb the reverse energy which is generated when the

inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Please do

not exceed active clamp endurance when inductive load is used.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

22/26

BV1LC300FJ-C BM2LC300FJ-C

Operational Notes – continued

10. Negative Current of Output

When supply a negative current from the OUT(DRAIN) pin in the state that supplied the voltage to the IN pin. The

current pass from the IN pin to the OUT(DRAIN) pin through a parasitic transistor and voltage of the IN pin descend

as shown in Figure 38 and Figure 39.

As shown in Figure 38 power MOS is turned on, set the OUT(DRAIN) pin is -0.3 V or higher. Because a negative

current may be passed to the OUT(DRAIN) pin from a power supply of the connection of the IN pin (MCU, and so

on).

As shown in Figure 39 power MOS is turned off, add a restriction resistance 330 Ω or higher to the IN pin. Because a

negative current may be passed to the OUT(DRAIN) pin from GND of the connection of the IN pin.

The restriction resistance value, set up in consideration of the voltage descent caused by the IN pin current.

MCU

GND

(SOURCE)

N+

330Ω

IN

N+

P+

P-

Parasitic Element

N-epi

N+sub

OUT

(DRAIN)

Figure 38. Negative current path (when power MOS is turned on)

MCU

GND

(SOURCE)

N+

330Ω

IN

N+

P+

P-

Parasitic Element

N-epi

N+sub

OUT

(DRAIN)

Figure 39. Negative current path (when power MOS is turned off)

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

23/26

TSZ22111 • 15 • 001

BV1LC300FJ-C BM2LC300FJ-C

Ordering Information

B x x L C 3 0 0 F J

C E 2

Package

Product Grade

V1:1ch、M2:2ch

L ：Low Side SW

FJ：SOP-J8

C: For Automotive

Packaging and Forming Specification

E2: Embossed Tape and Reel

Marking Diagram

■

BV1LC300FJ-C

SOP-J8(TOP VIEW)

Part Number Marking

1 L C 3 0

LOT Number

Pin 1 Mark

■

BM2LC300FJ-C

SOP-J8(TOP VIEW)

Part Number Marking

LOT Number

2 L C 3 0

Pin 1 Mark

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

24/26

BV1LC300FJ-C BM2LC300FJ-C

Physical Dimension and Packing Information

Package Name

SOP-J8

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

25/26

BV1LC300FJ-C BM2LC300FJ-C

Revision History

Date

Revision

001

Changes

22.Mar.2018

New Release

www.rohm.com

TSZ02201-0GBG1G400050-1-2

22.Mar.2018 Rev.001

26/26

TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.003


型号：	BV1LC300FJ-C
厂家：	ROHM
描述：	本产品是1ch的车载用低边开关。内置OCP、TSD、有源钳位功能。还可通过诊断功能，进行OCP、TSD、负载开路(OLD)的诊断。开关
文件：	总29页 (文件大小：2097K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BV1LC300FJ-C [ROHM]

相关型号：

BV1LD040EFJ-C (开发中)

BV1LD080EFJ-C (开发中)

BV1LE040EFJ-C

BV1LE080EFJ-C

BV1LE160EFJ-C

BV1LE250EFJ-C

BV1LF080EFJ-C

BV2

BV201D06003A

BV201D06005

BV201D06006

BV201D09003A