RB095B-30TL [ROHM]
Rectifier Diode, Schottky, 6A, 35V V(RRM),;
| 型号： | RB095B-30TL |
| 厂家： | 
ROHM |
| 描述： | Rectifier Diode, Schottky, 6A, 35V V(RRM), 二极管 |
| 文件： | 总6页 (文件大小：479K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet
Schottky barrier Diode
RB095B-30
Applications
Dimensions(Unit : mm)
Land size figure(Unit : mm)
6.0
General rectification
Features
1)Power mold type.(CPD)
2)Low VF
1.6
3)High reliability
CPD
2.3 2.
Construction
Silicon epitaxial planar
Structure
2)
(1) (3)
Taping diensions(Unit : mm)
Absolute mimum ratings (T5
Parameter
Limits
Symbol
VRM
VR
Unit
V
Reerse e (repetitive peak)
Reve voltage (DC)
35
30
V
errectified forward current(*1)
Fward current surge peak (60Hz・1cyc)(*1)
Junction temperature
6
35
Io
A
IFSM
Tj
A
150
C
C
Storage temperature
40 to 150
Tstg
(*1)Business frequencies, Rating of R-load, 1/2 Io per diode, Ta=125C
Electrical characteristic (Ta=25C)
Parameter
Conditions
Symbol
VF
Min.
Typ.
Max.
0.425
200
Unit
V
Forward voltage
Reverse current
-
-
-
-
-
-
IF=3.0A
VR=30V
junction to case
IR
μA
Thermal impedance
6.0
jc
C/W
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2011.04 - Rev.F
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1/3
Data Sheet
RB095B-30
ꢀ
Ta=150C
Ta=125C
10000
1000
100
10
1000000
100000
10000
1000
100
Ta=150C
f=1MHz
Ta=125C
Ta=75C
Ta=25C
Ta=-25C
Ta=75C
1
Ta=25C
Ta=-25C
10
0.1
1
0.1
0.01
10
0.01
0
100
200
300
400
500
600
700
0
5
10
20
25
30
0
5
10
15
20
25
30
REVERSE VOLTAGE : VR(V)
VR-IR CHARACTERISTICS
FORWARD VOLTAGE : VF(mV)
VF-IF CHARACTERISTICS
EVERSE VOLTA: VR(V)
t CHARACTERISTICS
440
430
420
410
400
390
200
180
160
140
120
100
80
2000
19
19
850
1750
1700
1650
1600
1550
15
Ta=25C
IF=3A
Ta=25C
f=1MHz
VR=0V
Ta=25C
VR=30V
n=30pcs
n=30pcs
n=10pcs
AVE:402.0mV
AVE:41.0A
E:17.3pF
60
40
20
0
Ct DISPERSION MAP
V
F DISPERSION MAP
IR DION MAP
300
250
200
150
100
50
30
25
15
10
5
1000
100
10
C
0.5
1cyc
Ifsm
Ifsm
IR=
I0.25*IR
n=10pcs
8.3ms 8.3ms
1cyc
8.3ms
AV
AVE:63.0A
0
0
1
10
100
trr DISPERSION MAP
I
FSM RSAP
NUMBER OF CYCLES
I
FSM-CYCLE CHARACTERISTICS
5
4
3
2
1
0
100
10
1
1000
00
10
Rth(j-a)
Rth(j-c)
D=1/2
DC
Ifsm
t
Sin(=180)
Mounted on epoxy board
IM=100mA
IF=3A
1ms
time
10
300s
0.1
0.001
0.01
0.1
1
100
1000
1
10
100
0
5
10
15
TIME : t(ms)
FSM-t CHARACTERISTICS
TIME : t(s)
Rth-t CHARACTERISTICS
AVERAGE RECTIFIED
FORWARD CURRENT : Io(A)
Io-Pf CHARACTERISTICS
I
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© 2011 ROHM Co., Ltd. All rights reserved.
2/3
2011.04 - Rev.F
Data Sheet
RB095B-30
ꢀ
20
15
10
5
20
15
10
5
10
8
Io
Io
0A
0V
0A
0V
VR
VR
Sin(=180)
t
t
D=t/T
D=t/T
VR=15V
Tj=150C
VR=15V
T
DC
6
T
Tj=150C
DC
D=1/2
D=1/2
4
D=1/2
DC
2
Sin(180)
Sin(=180)
0
0
0
0
10
20
30
0
25
50
75
125
150
0
25
50
75
100
125
150
AMBIENT TEMPERATURE : Ta(C)
REVERSE VOLTAGE : VR(V)
VR-PR CHARACTERISTICS
CASE TEMPURE : Tc(C)
Derating Curve"(Io-Ta)
Derating CuIo-Tc)
30
25
20
15
10
5
No break at 30kV
No break at 30kV
0
C=200pF
C=100pF
R=0
R=1.5k
ESD DISPERSION MAP
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© 2011 ROHM Co., Ltd. All rights reserved.
3/3
2011.04 - Rev.F
Daattaasshheeeett
Notice
Precaution on using ROHM Products
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(Note1) Medical Equipment Classification of the Specific Applications
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product performance, reliability, etc, prior to use, mst necessary:
[a] Use of our Products in any types of liquid, iluding water, oils, chemals, and organic solvents
[b] Use of our Products outdoors or in pcwhere the Producae xposed to direct sunlight or dust
[c] Use of our Products in places whthe Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places whethe Products are oed to static electricity or electromagnetic waves
[e] Use of our Products in proto heat-prodmponents, plastic cords, or other flammable items
[f] Sealing or coating our Prowith resin or ing materials
[g] Use of our Products without cleaning residue o(even if you use no-clean type fluxes, cleaning residue of
flux is recommende; or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Prcts in places subjecdw condensation
4. The Producnot subject to radiation-proof design.
5. Please verify aconfirm chacteris f the final or mounted products in using the Products.
6. In pular, if a transienarge amount of load applied in a short period of time, such as pulse. is applied,
confirman of performance haracteristics after on-board mounting is strongly recommended. Avoid applying power
ding normal rated powerexceeding the power rating under steady-state loading condition may negatively affect
ct performance and reliability.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.001
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1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
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Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. e take proper
caution in your manufacturing process and storage so that voltage exceeding the Products mimung will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body uipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stn the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability oducts out of recommened storage time period
may be degraded. It is strongly recommended to confirm solderlity fore using Produts owhich storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is icaed on a carton with symbol. Otherwise bent leads
may occur due to excessive stress applied when droppof a carton.
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Notice-PGA-E
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General Precaution
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concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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