SCT3030KLHR [ROHM]
沟槽栅极结构的SiC-MOSFET。平面型SiC-MOSFET相比,同一芯片尺寸的导通电阻可降低50%,这将大幅降低太阳能发电用功率调节器和工业设备用电源、工业用逆变器等所有相关设备的功率损耗。;型号: | SCT3030KLHR |
厂家: | ROHM |
描述: | 沟槽栅极结构的SiC-MOSFET。平面型SiC-MOSFET相比,同一芯片尺寸的导通电阻可降低50%,这将大幅降低太阳能发电用功率调节器和工业设备用电源、工业用逆变器等所有相关设备的功率损耗。 栅 栅极 调节器 |
文件: | 总17页 (文件大小:1330K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SCT3030KLHR
Datasheet
Automotive Grade N-channel SiC power MOSFET
lOutline
TO-247N
VDSS
1200V
30mΩ
72A
RDS(on) (Typ.)
*1
ID
PD
(3)
339W
(2)
(1)
lInner circuit
lFeatures
(1) Gate
(2) Drain
(3) Source
1) Qualified to AEC-Q101
2) Low on-resistance
3) Fast switching speed
4) Fast reverse recovery
5) Easy to parallel
*Body Diode
Please note Driver Source and Power Source are
not exchangeable. Their exchange might lead to
malfunction.
6) Simple to drive
7) Pb-free lead plating ; RoHS compliant
lPackaging specifications
Tube
Packing
lApplication
・Automobile
Reel size (mm)
Tape width (mm)
Basic ordering unit (pcs)
Taping code
-
・Switch mode power supplies
-
30
Type
C11
Marking
SCT3030KL
lAbsolute maximum ratings (Tvj = 25°C unless otherwise specified)
Parameter
Drain - Source Voltage
Symbol
VDSS
Value
1200
Unit
V
*1
Tc = 25°C
72
A
ID
Continuous Drain current
*1
Tc = 100°C
51
A
ID
*2
Pulsed Drain current (Tc = 25°C)
Gate - Source voltage (DC)
180
A
ID,pulse
VGSS
-4 to +22
-4 to +26
0 / +18
175
V
*3
Gate - Source surge voltage (tsurge < 300nsec)
Recommended drive voltage
V
VGSS_surge
*4
V
VGS_op
Tvj
Virtual Junction temperature
°C
Tstg
Range of storage temperature
-55 to +175
°C
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Datasheet
lElectrical characteristics (Tvj = 25°C unless otherwise specified)
Values
Typ.
Parameter
Symbol
Conditions
Unit
V
Min.
Max.
VGS = 0V, ID = 1mA
Drain - Source breakdown
voltage
V(BR)DSS Tvj = 25°C
Tvj = -55°C
1200
1200
-
-
-
-
VGS = 0V, VDS
IDSS Tvj = 25°C
Tvj = 150°C
=1200V
Zero Gate voltage
Drain current
-
-
1
2
-
10
-
μA
IGSS+ VGS
IGSS- VGS
=
=
, VDS = 0V
, VDS = 0V
Gate - Source leakage current
Gate - Source leakage current
Gate threshold voltage
+22V
-4V
-
100
-100
5.6
nA
nA
V
-
-
VGS (th) VDS = 10V, I =
13.3mA
27A
2.7
-
D
VGS = 18V, I =
D
Static Drain - Source
on - state resistance
*5
Tvj = 25°C
RDS(on)
-
-
-
30
51
5
39
-
mΩ
Ω
Tvj = 150°C
RG
Gate input resistance
f = 1MHz, open drain
-
lThermal resistance
Values
Typ.
Parameter
Symbol
RthJC
Unit
K/W
Min.
-
Max.
0.44
Thermal resistance, junction - case
0.34
lTypical Transient Thermal Characteristics
Symbol
Rth1
Value
Unit
Symbol
Value
Unit
Cth1
Cth2
Cth3
4.83E-03
1.73E-01
1.63E-01
1.40E-03
1.13E-02
6.02E-02
Rth2
K/W
Ws/K
Rth3
Rth,n
Rth1
Tj
Tc
PD
Cth1
Cth2
Cth,n
Ta
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SCT3030KLHR
Datasheet
lElectrical characteristics (Tvj = 25°C unless otherwise specified)
Values
Typ.
10.8
2222
180
Parameter
Symbol
Conditions
VDS = 10V, I =
Unit
S
Min.
Max.
*5
Transconductance
27A
-
-
-
-
-
-
-
-
gfs
D
Ciss VGS = 0V
Coss VDS
Input capacitance
=
Output capacitance
Reverse transfer capacitance
800V
pF
pF
Crss
f = 1MHz
VGS = 0V
72
Effective output capacitance,
energy related
Co(er)
-
157
-
VDS
VDS
=
=
0V to 600V
600V
27A
*5
Total Gate charge
Gate - Source charge
Gate - Drain charge
Turn - on delay time
Rise time
-
-
-
-
-
-
-
131
22
69
24
42
61
29
-
-
-
-
-
-
-
Qg
ID =
*5
nC
Qgs
VGS = 18V
See Fig. 1-1.
*5
Qgd
VDS
=
400V
18A
*5
td(on)
ID =
*5
tr
VGS
=
0V/+18V
0Ω
ns
RG =
RL =
*5
Turn - off delay time
Fall time
td(off)
22Ω
*5
tf
See Fig. 1-1, 1-2.
VDS
VGS=0V/18V, ID =
=
600V
*5
Turn - on switching loss
Turn - off switching loss
27A
0Ω, L = 250μH
-
-
468
204
-
-
Eon
RG =
μJ
Eon includes diode
reverse recovery
Lσ = 50nH, Cσ = 200pF
See Fig. 2-1, 2-2.
*5
Eoff
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SCT3030KLHR
Datasheet
lBody diode electrical characteristics (Source-Drain) (Tvj = 25°C unless otherwise specified)
Values
Parameter
Symbol
Conditions
Unit
A
Min.
-
Typ.
-
Max.
72
Body diode continuous,
forward current
*1
IS
Tc = 25°C
Body diode direct current,
pulsed
*2
-
-
-
-
180
A
V
ISM
*5
VGS = 0V, IS
Forward voltage
= 27A
3.2
27
-
-
VSD
IF =
27A
*5
Reverse recovery time
ns
trr
VR =
600V
*5
Reverse recovery charge
-
-
135
10
-
-
nC
A
Qrr
di/dt = 1100A/μs
Lσ = 50nH, Cσ = 200pF
See Fig. 3-1, 3-2.
*5
Peak reverse recovery current
Irrm
*1 Limited by maximum Tvj and for Max. RthJC
.
*2 PW 10μs, Duty cycle 1%
*3 Example of acceptable VGS waveform
Please note especially when using driver source that VGSS_surge must be in the range of
absolute maximum rating.
*4 Please be advised not to use SiC-MOSFETs with VGS below 13V as doing so may cause
thermal runaway.
*5 Pulsed
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Datasheet
lElectrical characteristic curves
Fig.2 Maximum Safe Operating Area
Fig.1 Power Dissipation Derating Curve
400
350
300
250
200
150
100
50
1000
Operation in this area is limited by RDS(on)
PW = 100ns*
100
10
1
PW = 1μs*
PW = 10μs*
PW = 100μs
PW = 1ms
PW = 10ms
Tc = 25ºC
Single Pulse
*Calculation(PW10μs)
0
0.1
25
75
125
175
0.1
1
10
100 1000 10000
Case Temperature : TC [°C]
Drain - Source Voltage : VDS [V]
Fig.3 Typical Transient Thermal
Resistance vs. Pulse Width
1
0.1
0.01
0.001
Tc = 25ºC
Single Pulse
0.0001
1E-6 1E-5 1E-4 1E-3 1E-2 1E-1 1E+0 1E+1
Pulse Width : PW [s]
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Datasheet
lElectrical characteristic curves
Fig.4 Typical Output Characteristics(I)
Fig.5 Typical Output Characteristics(II)
35
70
20V
20V
14V
30
25
20
15
10
5
18V
16V
60
50
40
30
20
10
0
18V
16V
Tvj = 25ºC
Pulsed
12V
14V
12V
Tvj = 25ºC
Pulsed
10V
10V
VGS= 8V
VGS= 8V
0
0
1
2
3
4
5
0
2
4
6
8
10
Drain - Source Voltage : VDS [V]
Drain - Source Voltage : VDS [V]
Fig.6 Tvj = 25ºC 3rd Quadrant Characteristics
0
Tvj = 25ºC
Pulsed
-10
VGS = -4V
VGS = -2V
VGS = 0V
-20
VGS = 18V
-30
-40
-50
-60
-70
-10
-8
-6
-4
-2
0
Drain - Source Voltage : VDS [V]
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Datasheet
lElectrical characteristic curves
Fig.7 Tvj = 150ºC Typical Output
Characteristics(I)
Fig.8 Tvj = 150ºC Typical Output
Characteristics(II)
35
70
20V
30
20V
60
18V
16V
14V
12V
10V
18V
14V
10V
25
20
15
10
5
50
40
30
20
10
0
16V
12V
VGS= 8V
VGS= 8V
Tvj = 150ºC
Pulsed
Tvj = 150ºC
Pulsed
0
0
2
4
6
8
10
0
1
2
3
4
5
Drain - Source Voltage : VDS [V]
Drain - Source Voltage : VDS [V]
Fig.9 Tvj = 150ºC 3rd Quadrant
Characteristics
Fig.10 Body Diode Forward Voltage
ꢀꢀꢀ vs. Gate - Source Voltage
0
6
Tvj = 150ºC
Pulsed
ID=27A
-10
5
4
3
2
1
0
VGS = -4V
VGS = -2V
VGS = 0V
VGS = 18V
-20
-30
-40
-50
-60
-70
Tvj= 150ºC
Tvj= 25ºC
-4
0
4
8
12
16
20
-10
-8
-6
-4
-2
0
Drain - Source Voltage : VDS [V]
Gate - Source Voltage : VGS [V]
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Datasheet
lElectrical characteristic curves
Fig.11 Typical Transfer Characteristics (I)
100
Fig.12 Typical Transfer Characteristics (II)
70
60
50
40
30
20
10
0
VDS = 10V
Pulsed
VDS = 10V
Pulsed
10
Tvj= 150ºC
Tvj= 150ºC
Tvj= 75ºC
Tvj= 25ºC
Tvj= -25ºC
Tvj= 75ºC
Tvj= 25ºC
1
Tvj= -25ºC
0.1
0.01
0
2
4
6
8 10 12 14 16 18 20
0
2
4
6
8 10 12 14 16 18 20
Gate - Source Voltage : VGS [V]
Gate - Source Voltage : VGS [V]
Fig.13 Gate Threshold Voltage
vs. Junction Temperature
Fig.14 Transconductance vs. Drain Current
10
6
VDS = 10V
ID = 13.3mA
VDS = 10V
Pulsed
5
4
3
2
1
0
1
Tvj = 150ºC
Tvj = 75ºC
Tvj = 25ºC
Tvj = -25ºC
0.1
0.1
1
10
-50
0
50
100
150
200
Junction Temperature : Tvj [ºC]
Drain Current : ID [A]
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Datasheet
lElectrical characteristic curves
Fig.15 Static Drain - Source On - State
Resistance vs. Gate - Source Voltage
Fig.16 Static Drain - Source On - State
Resistance vs. Junction Temperature
0.12
0.08
0.06
0.04
0.02
0.00
VGS = 18V
Pulsed
Tvj = 25ºC
Pulsed
0.10
ID= 48A
0.08
ID= 48A
ID= 27A
ID= 27A
0.06
0.04
0.02
0.00
ID= -27A
ID= -27A
8
10 12 14 16 18 20 22
Gate - Source Voltage : VGS [V]
-50
0
50
100
150
200
Junction Temperature : Tvj [ºC]
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current
Fig.18 Normalized Drain - Source Breakdown
Voltage vs. Junction Temperature
0.1
1.04
1.03
1.02
1.01
1.00
0.99
0.98
Tvj = 150ºC
Tvj = 125ºC
Tvj = 75ºC
Tvj = 25ºC
Tvj = -25ºC
VGS = 18V
Pulsed
0.01
-50
0
50
100
150
200
1
10
Drain Current : ID [A]
100
Junction Temperature : Tvj [ºC]
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Datasheet
lElectrical characteristic curves
Fig.19 Typical Capacitance
ꢀꢀꢀꢀꢀvs. Drain - Source Voltage
Fig.20 Coss Stored Energy
50
10000
Tvj = 25ºC
Ciss
45
40
35
30
25
20
15
10
5
1000
Coss
100
Crss
10
Tvj = 25ºC
f = 1MHz
VGS = 0V
0
1
0
200
400
600
800
0.1
1
10
100
1000
Drain - Source Voltage : VDS [V]
Drain - Source Voltage : VDS [V]
Fig.21 Dynamic Input Characteristics
20
*Gate Charge Waveform
Tvj = 25ºC
VDD = 600V
ID = 27A
Pulsed
15
10
5
0
0
20 40 60 80 100 120 140
Total Gate Charge : Qg [nC]
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Datasheet
lElectrical characteristic curves
Fig.19 Typical Switching Time
Fig.20 Typical Switching Loss
ꢀꢀꢀꢀꢀvs. Drain Current
ꢀꢀꢀꢀꢀvs. Drain - Source Voltage
10000
800
Tvj = 25°C
ID = 27A
VGS= +18V/0V
RG = 0Ω
Tvj = 25°C
VDD= 400V
VGS= +18V/0V
RG = 0Ω
700
1000
100
10
600
L = 250μH
tf
Eon
500
400
300
200
100
0
td(off)
tr
td(on)
Eoff
1
200
400
600
800
1000
0.1
1
10
100
Drain Current : ID [A]
Drain - Source Voltage : VDS [V]
Fig.21 Typical Switching Loss
Fig.22 Typical Switching Loss
ꢀꢀꢀꢀꢀvs. Drain Current
ꢀꢀꢀꢀꢀvs. External Gate Resistance
3000
3000
Tvj = 25°C
ID = 27A
Tvj = 25°C
VDD= 600V
VDD= 600V
2500
2500
2000
1500
1000
500
VGS= +18V/0V
RG = 0Ω
VGS= +18V/0V
L = 250μH
2000
L = 250μH
1500
Eon
Eon
1000
Eoff
500
0
Eoff
0
0
5
10
15
20
25
30
0
10 20 30 40 50 60 70
Drain Current : ID [A]
External Gate Resistance : RG [Ω]
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Datasheet
lMeasurement circuits and waveforms
Fig.1-1 Gate Charge and Switching Time Measurement Circuit
Fig.1-2 Waveforms for Switching Time
Fig.2-1 Switching Energy Measurement Circuit
Fig.2-2 Waveforms for Switching Energy Loss
Eon
=
I ∙ VDS dt
Eoff
=
ID ∙ VDS dt
D
Vsurge
Irr
VDS
ID
Fig.3-2 Reverse Recovery Waveform
Fig.3-1 Reverse Recovery Time Measurement Circuit
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Datasheet
lPackage Dimensions
Unit: mm
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SCT3030KLHR
Datasheet
Unit: mm
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Datasheet
lDie Bonding Layout
: Die position
・Front view of the packaging.
・Dimensions are design values.
・If the heat sink is to be installed, it should be in contact with the die bonding point.
Unit: mm
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Notice
N o t e s
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifica-
tions.
3) Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products specified in this document are not designed to be radiation tolerant.
7) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, and power transmission systems.
8) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
9) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
10) ROHM has used reasonable care to ensure the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
11) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
12) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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R1107
S
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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沟槽栅极结构的SiC-MOSFET。平面型SiC-MOSFET相比,同一芯片尺寸的导通电阻可降低50%,这将大幅降低太阳能发电用功率调节器和工业设备用电源、工业用逆变器等所有相关设备的功率损耗。
ROHM
SCT3040KR
SCT3040KR是非常适用于要求高效率的服务器用电源、太阳能逆变器及电动汽车充电站等的沟槽栅结构SiC MOSFET。采用电源源极引脚和驱动器源极引脚分离的4引脚封装,能够充分地发挥出高速开关性能。尤其是可以显著改善导通损耗。与以往的3引脚封装(TO-247N)相比,导通损耗和关断损耗合起来预计可降低约35%的损耗。
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SCT3040KRHR (新产品)
AEC-Q101 qualified automotive grade product. SCT3040KRHR is an SiC (Silicon Carbide) trench MOSFET. Features include high voltage resistance, low ON resistance, and fast switching speed.
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SCT3040KW7
SCT3040KW7是1200V 56A的Nch SiC功率MOSFET。采用沟槽结构,降低了导通电阻。 SiC支持页面评估板、文件 应用实例介绍罗姆制SiC元器件 何谓SiC功率元器件?电子小知
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SCT3060ALHR
沟槽栅极结构的SiC-MOSFET。平面型SiC-MOSFET相比,同一芯片尺寸的导通电阻可降低50%,这将大幅降低太阳能发电用功率调节器和工业设备用电源、工业用逆变器等所有相关设备的功率损耗。
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SCT3060AR
SCT3060AR是非常适用于要求高效率的服务器用电源、太阳能逆变器及电动汽车充电站等的沟槽栅结构SiC MOSFET。采用电源源极引脚和驱动器源极引脚分离的4引脚封装,能够充分地发挥出高速开关性能。尤其是可以显著改善导通损耗。与以往的3引脚封装(TO-247N)相比,导通损耗和关断损耗合起来预计可降低约35%的损耗。
ROHM
SCT3060ARHR (新产品)
AEC-Q101 qualified automotive grade product. SCT3060ARHR is an SiC (Silicon Carbide) trench MOSFET. Features include high voltage resistance, low ON resistance, and fast switching speed.
ROHM
SCT3060AW7
SCT3060AW7是650V 38A的Nch SiC功率MOSFET。采用沟槽结构,降低了导通电阻。 SiC支持页面评估板、文件 应用实例介绍罗姆制SiC元器件 何谓SiC功率元器件?电子小知识
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