SKCD47C170IHD_10

更新时间:2024-10-29 10:18:20
品牌:SEMIKRON
描述:CAL-DIODE

SKCD47C170IHD_10 概述

CAL-DIODE CAL二极管

SKCD47C170IHD_10 数据手册

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SKCD 47 C 170 I HD  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
Tj = 25 °C, IR = 0.1 mA  
Ts = 80 °C, Tj = 150 °C  
VRRM  
IF(AV)  
IFSM  
1700  
50  
V
A
Tj = 25 °C  
Tj = 150 °C  
680  
650  
150  
A
10 ms  
sin 180°  
A
Tjmax  
°C  
Electrical Characteristics  
Symbol Conditions  
CAL-DIODE  
min.  
typ.  
max.  
Unit  
IF = 75 A  
i2t  
IR  
2100  
0.10  
A2s  
mA  
mA  
V
Tj = 150 °C, 10 ms, sin 180°  
Tj = 25 °C, VRRM = 1700 V  
VRRM = 1700 V  
Size: 6,8 mm x 6,8 mm  
Tj = 125 °C, VRRM = 1700 V  
Tj = 25 °C, IF = 75 A  
Tj = 125 °C, IF = 75 A  
Tj = 125 °C  
VF  
1.73  
1.78  
1.03  
10.1  
2.02  
2.05  
V
V(TO)  
rT  
V
SKCD 47 C 170 I HD  
Tj = 125 °C  
m  
Dynamic Characteristics  
Symbol Conditions  
Features  
• high current density  
min.  
typ.  
max.  
Unit  
• easy paralleling due to a small forward  
voltage spread  
• positive temperature coefficient  
• very soft recovery behavior  
• small switching losses  
• high ruggedness  
• compatible to thick wire bonding  
• compatible to standard solder  
processes  
Tj = 25 °C, 50 A, 1200 V, 800 A/µs  
trr  
µs  
ns  
µC  
µC  
A
Tj = 125 °C, 50 A, 1200 V, 800 A/µs  
Tj = 25 °C, 50 A, 1200 V, 800 A/µs  
Tj = 125 °C, 50 A, 1200 V, 800 A/µs  
Tj = 25 °C, 50 A, 1200 V, 800 A/µs  
Tj = 125 °C, 50 A, 1200 V, 800 A/µs  
trr  
Qrr  
Qrr  
Irrm  
Irrm  
19  
55  
A
Thermal Characteristics  
Symbol Conditions  
Typical Applications*  
min.  
typ.  
max.  
Unit  
• freewheeling diode for IGBT  
• particularly suitable for frequencies < 8  
kHz  
Tj  
-40  
-40  
150  
150  
250  
320  
°C  
°C  
°C  
°C  
Tstg  
Tsolder  
Tsolder  
10 min.  
5 min.  
sold. on 0,38 mm DCB, reference point  
on copper heatsink close to the chip  
Rth(j-s)  
0.7  
K/W  
Mechanical Characteristics  
Symbol Conditions  
Values  
Unit  
Raster  
size  
6.8 x 6.8  
mm2  
mm2  
Area total  
Anode  
47  
bondable (Al)  
Cathode  
Wire bond  
Package  
solderable (Ag/Ni)  
Al, diameter 500 µm  
wafer frame  
Chips /  
Package  
208 (5" Wafer)  
pcs  
SKCD  
© by SEMIKRON  
Rev. 1 – 18.02.2010  
1
SKCD 47 C 170 I HD  
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX  
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested  
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is  
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.  
2
Rev. 1 – 18.02.2010  
© by SEMIKRON  

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