SKHI21H4 [SEMIKRON]

Buffer/Inverter Based Peripheral Driver, 3.3A, Hybrid;
SKHI21H4
型号: SKHI21H4
厂家: SEMIKRON INTERNATIONAL    SEMIKRON INTERNATIONAL
描述:

Buffer/Inverter Based Peripheral Driver, 3.3A, Hybrid

驱动 接口集成电路
文件: 总9页 (文件大小:353K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMIDRIVER  
Absolute Maximum Ratings  
Symbol Term  
Value  
18  
Unit  
V
Hybrid Double IGBT and  
MOSFET Driver  
SKHI 21, SKHI 21 H4  
SKHI 22, SKHI 22 H4  
VS  
Supply voltage prim.  
ViH  
IiH  
IGon  
IGoff  
Input signal voltage (HIGH) max.  
Input signal current (HIGH)  
Output current (peak) max.  
Output current (peak) max.  
VS + 0,3  
0,34  
3,3  
V
mA  
A
3,3  
A
mA  
IoutAVmax Output average current SKHI21/SKHI22 + 406)/+ 206)  
VCE  
Collector-emitter voltage sense  
across the IGBTSKHI21/SKHI22  
1200 / 1700  
25 1)  
V
dv/dt  
Visol IO  
Visol12  
Rate of rise and fall of voltage  
secondary to primary side  
kV/µs  
Isolation test volt. IN-OUT (RMS; 1min.)  
input-output Version “H4": (1min.)  
Isolation test voltage  
2500  
4000  
V
V
output 1-output 2 (RMS; 1min.)  
1500  
V
Top  
Tstg  
Operating temperature  
Storage temperature  
– 40 ... + 85  
– 40 ... + 85  
°C  
°C  
Features  
Electrical Characteristics  
Value  
SKHI 21/ 22  
Double driver for half bridge mo-  
dules  
Symbol Term  
Unit  
V
SKHI 22 H4 is for 1700 V-IGBT  
Drives MOSFETs VDS(on) < 10 V  
CMOS compatible inputs  
Short circuit protection by VCE  
monitoring and switch off  
Drive interlock top/bottom  
Isolation by transformers  
Supply undervoltage protection  
(13 V)  
VS  
Supply voltage primary side  
15 ± 0,6  
160  
typ.75/typ.110  
12,9  
IS  
Iso  
ViT+  
Supply current primary side max  
Supply current primary side no load  
Input threshold voltage (HIGH) min.  
Input threshold voltage (LOW) max.  
Turn-on gate voltage output  
Turn-off gate voltage SKHI 21/SKHI 22  
Operating frequency IGBT/MOS  
Coupling capacitances  
Input-output turn-on propagation time  
Input-output turn-off propagation time  
Error input-output propagation time  
Reference voltage for VCE monitoring 5) typ. 6; max. 9  
mA  
mA  
V
ViT–  
VG(on)  
VG(off)  
f
2,1  
15  
0/– 15  
V
V
V
page B14-28  
see fig. 3  
typ. 1 + tTD  
typ. 1  
Error latch/output  
Cps..  
td(on) io  
td(off) io  
td(err)  
VCEstat  
pF  
µs  
µs  
µs  
V
Typical Applications  
Driver for IGBT and MOSFET  
modules in bridge circuits in  
choppers, inverter drives, UPS  
and welding inverters  
typ. 1  
DC bus voltage up to 1000 V.  
External Components see fig. 1 and fig. 4  
1)  
Component  
Function  
Recommended  
value  
Primary/OUT2 =  
10kV/µs +900 V  
RTD  
Dead time of interlock:  
0 2)  
2)  
3)  
Short circuit for tTD = 2,7 µs  
Higher resistance reduces free-  
wheeling diode peak recovery  
current, increases IGBT turn-on  
time. RON should be chosen so  
that the turn-on delay time td(on)  
does not exceed 1 µs. See also  
Fig. 10  
Higher resistance reduces turn-  
off voltage spike, increases turn-  
off time and turn-off power  
dissipation. See also Fig. 10.  
adjustable by RCE  
t
TD s) = 2,7 + 0,13  
Reference voltage for VCE monitoring:  
CE (kΩ) 25  
10 + RCE (kΩ)  
R
TD (kΩ)  
RTD max.=100 kΩ  
RCE  
RCE = 24 kΩ  
min. 10 kΩ  
9
R
V
CEstat (V) =  
(1) VCEstat = 5,6 V  
max. 9 V  
CCE  
Inhibit time for VCE monitoring:  
CCE = 0,33 nF  
4)  
max. 2,7 nF  
tmin = 1,75 µs  
max. 10 µs  
15VCEstat (V)  
t
min = τCE In  
(2)  
(3)  
10 VCEstat (V)  
10 RCE (kΩ)  
10 + RCE (kΩ)  
5)  
6)  
τ
CE s) = CCE (nF)  
τCE = 2,3 µs  
double when using half driver  
RON  
ROFF  
Turn-on speed of the IGBT 3)  
Turn-off speed of the IGBT 4)  
min. 3,3 Ω  
min. 3,3 Ω  
© by SEMIKRON  
0896  
B 14 – 21  
© by SEMIKRON  
0896  
B 14 – 23  
SEMIDRIVER SKHI 21 and SKHI 22  
Hybrid Double IGBT and MOSFET Driver  
Technical Explanations  
The following explanations apply to the use of the hybrid  
driver for power MOSFETs as well as for IGBTs. For the  
reason of brevity, in the following the IGBTs are mentioned  
only. Also the designations “collector” and “emitter” apply  
to IGBTs. For the MOSFETs “drain” and “source” are to be  
read instead.  
9. The nominal voltage of the power supply VS is +15 V.  
Its band of variation is from 14,4 to 15,6 V. The current  
required is lower than 160 mA (conditions: 85 °C  
temperature, VS = 15 V. Any undervoltage below +13  
V is monitored, and the IGBTs are turned off. An error  
signal is released. Overvoltage is not monitored. (See  
page B 14 – 28).  
A. Properties and Functions of the Hybrid Driver  
10. The switching signals are transmitted by isolating pulse  
transformers. The isolation test voltages are Visol IO and  
Visol12, abs. max. ratings see page 1. Versions “H4"  
1. The hybrid driver comprises the pulse generator as well  
as short circuit protection for two IGBTs in half bridge  
(pair of arms) connection. If a single IGBT or MOSFET  
is driven, output 1 is to be used, and the terminal VCE2  
(S1) of output 2 is to be connected to terminal E2 (S9).  
have Visol IO = 4,0 kVRMS  
.
The max. dv/dt rating between primary and secondary  
side is 25 kV/µs (Primary/OUT 1) and 10 kV/µs + 900 V  
(Primary/OUT 2).  
2. It may also be used for two power MOSFETs in half  
bridge connection, provided the drain-source voltage in  
the on-state does not exceed 10 V.  
11. The input and output signals are CMOS compatible.  
The inputs have a Schmitt trigger characteristic to  
suppress spurious pulses. Turn-on and turn-off pulses  
shorter than 0,5 µs are not transmitted. The thresholds  
of the inputs are  
3. Short circuit protection is provided by measuring the  
collector-emitter voltage, turns “error” (pin P10) to “Low”  
< 0,7 V (I sink < 4 mA).  
4. The heatsink temperature may be monitored by a  
bimetal thermal trip connected between P10 “error” and  
“GND”. It turns on, when the rated temperature is  
exceeded. Carefully regard the isolation voltage of the  
bimetal trip contacts and the different ground potentials  
of heatsink and pcb’s.  
+
VT- = min. 12,9 V  
VT = max. 2,1 V  
12. The maximum pulse frequency is 100 kHz (for MOS)  
13. The operating temperature range is – 40 ... + 85 °C.  
5. The IGBTs are turned on by applying a positive  
gate-emitter voltage of 15 V, and turned off by  
connecting (SKHI 21)the gate with the emitter or (SKHI  
22) with – 15 V against the emitter (pin S12 resp. S9).  
The gate is low-ohmic connected with the emitter as  
long as the IGBT has to remain in the off-state and as  
long as the supply voltage is present. In case of a failure  
of the supply voltage the gate-emitter connection is  
provided by a 22 kresistor.  
14. The typical delay times and propagation times for  
signals are  
Turn-on:  
Turn-off:  
Error:  
1 µs + tTD  
1 µs  
1 µs  
input to output  
input to output  
error input to error signal  
output  
15. In order to optimize the turn-on and turn-off speeds  
external resistors may be connected according to the  
conditions of the given application.  
6. The hybrid driver comprises the auxiliary power  
supplies for the two boosters which are isolated by  
DC/DC converters.  
16. The collectors of the IGBTs are connected to the hybrid  
driver for monitoring the collector-emitter voltage VCE  
.
17. The required inhibit time tmin of the VCE monitoring is to  
be matched to the turn-on speed of the IGBT. The  
standard setting with the recommended external  
7. The two IGBTs of the half bridge are interlocked in order  
to prevent them from being in the on-state  
simultaneously. The locking time between the turn-off  
signal for one IGBT and the release of the turn-on signal  
for the other one is typically 2,7 µs (> tdoff). It may be  
components RCE = 24 kand CCE = 330 pF is τCE  
=
2,3 µs. It may be increased by an external capacitor.  
The threshold voltage may be set by the external  
resistor RCE up to maximum < 10 V.  
prolonged by external resistors: RTD  
.
8. In the case of a short circuit both IGBTs are turned off  
immediately. An error memory prevents the IGBTs  
from being turned on again. The status of this memory  
may be fed back to the control circuit (error signal). The  
error memory is reset only when both input signals are  
zero. The error signal is provided by an open collector  
stage at pin 10 with an internal pull-up resistor of 10 kΩ  
to Vs. Parallel connection of error signal outputs is  
possible.  
B. Description of the Circuit Block Diagram  
The circuit block diagram (Fig. 1) shows the input on the  
left and the output on the right.  
The input side comprises the following components:  
1. Input Schmitt trigger, CMOS compatible  
B 14 – 24  
0896  
© by SEMIKRON  
2. Interlock circuit  
9. Pulse transformer  
The interlock circuit prevents the IGBT to turn on before  
the gate charge of the other IGBT is completely  
discharged. It is to be set to a delay time longer than  
the turn-off time of the IGBT by two external resistors  
RTD (maximum permissible value 100 k) connected to  
the terminals RTD and VS. The delay time tTD is typically:  
It transmits the turn-on and turn-off signals for the IGBT.  
In the reverse direction the error signal from the VCE  
monitoring is transmitted via the same transformer.  
10. Power supply transformer for the DC/DC converter  
11. Rectifier for the auxiliary power supply  
12. Flip-flop  
.
tTD (µs) = 2,7 + 0,13 RTD (k)  
See also Fig. 5.  
(4)  
The flip-flop is pulse width triggered and is insensitive  
to spurious pulses and high dv/dt values.  
3. Short pulse suppression  
13. Drivers  
With very short turn-on or turn-off pulses the pulse  
transformer would be not completely re-magnetized,  
and the coupling capacitor at the input of the pulse  
transformer would be not completely re-charged. As a  
result, the flip-flop at the output of the driver would  
remain in the wrong state due to the unsufficient trigger  
pulse. The short pulse suppression makes sure that  
only adequate trigger pulses are transmitted to the  
output flip-flop.  
The output transistors of the power drivers are  
MOSFETs.  
The sources of these MOSFETs are connected to  
external terminals in order to provide the setting of the  
turn-on and turn-off speed by the external resistors RON  
and ROFF. Do not connect the terminals S7 with S8,  
respectively S13 with S14, and use both, Ron and Roff  
to avoid spurious switch-on effects.  
,
4. Error monitoring  
14. Reverse drivers for the pulse transformers  
This circuit monitors pulses fed backwards via the pulse  
transformers.  
They transmit the signals from the VCE monitoring to the  
pulse transformers.  
5. Inhibit pulse generator  
15. VCE monitoring  
In the error monitoring circuit, an inhibit pulse generator  
discriminates between switching and error signals.  
After any positive switching pulse edge the error  
monitoring function is enabled. This is required since  
the pulse transformer causes a negative peak voltage  
on its primary during re-magnetization. This peak  
voltage would trigger the error monitoring without the  
inhibit pulse.  
It monitors the collector-emitter voltage VCE of the IGBT  
during its on-state. VCE is limited internally to 10 V (see  
fig. 4).  
If the reference voltage VCEref is exceeded, the output  
signal switches to zero. VCEref is dynamic. Immediately  
after turn-on of the IGBT a higher value is effective than  
in the steady state. When the IGBT is turned off, VCEref  
is set to this higher value by the signal “reset”. The  
steady-state value VCEstat of VCEref is set for each IGBT  
by an external resistor RCE (connected to the terminals  
CCE and E) to the required maximum value (which may  
not exceed 10 V).  
6. Error memory  
The error memory is triggered by the error monitoring  
circuit. The error memory blocks the turn-on pulses to  
both IGBTs simultaneously. Resetting is only possible  
when no pulses from the error monitoring are present  
and both inputs (on/off) are zero. The output signal is  
fed to a terminal which is to be connected to the control  
circuit.  
VCEstat as a function of RCE is approximately:  
9
R
CE (kΩ) 25  
VCEstat (V) =  
(1)  
10  
+ RCE (kΩ)  
7. 1 MHz Oscillator  
The time constant for the delay of VCEref may be  
increased by an external capacitor CCE, which is  
connected in parallel to RCE. It controls the time tmin  
which passes after turn-on of the IGBT before the VCE  
monitoring is activated. After tmin the VCE monitoring  
functions immediately when VCEref is exceeded.  
It is the primary side control of the DC/DC converter for  
transmitting the control power to the IGBTs.  
8. Power supply monitoring  
The supply voltage VS is monitored for its minimum  
value of 13 V. If it falls below this value an error is  
monitored and the turn-on pulses for the IGBTs are  
blocked.  
At initial switch-on (VS) the input pulses may only be  
released more than 4 µs after the instant when VS has  
reached its nominal value of 15 V.  
The standard setting with the external components RCE  
= 24 kand CCE = 330 pF is tmin = 1,75 µs.  
15 –  
10 – VCEstat  
V
CEstat(V)  
tmin = τCE ln  
(2)  
(3)  
(V)  
10  
RCE (kΩ)  
τ
CE s) = CCE (nF)  
10 + RCE (kΩ)  
V
CEstat is the value given by equation (1).  
The output comprises two drivers with the following com-  
ponents:  
© by SEMIKRON  
0896  
B 14 – 25  
B 14 – 26  
0896  
© by SEMIKRON  
© by SEMIKRON  
0896  
B 14 – 27  
B 14 – 28  
0896  
© by SEMIKRON  
SEMIDRIVER SKHI 22 on PCB SKPC 2006  
B 14 – 20  
0896  
© by SEMIKRON  

相关型号:

SKHI22

Buffer/Inverter Based Peripheral Driver, 3.3A, Hybrid
SEMIKRON

SKHI22A

Hybrid Dual IGBT Driver
SEMIKRON

SKHI22A-B

Hybrid Dual IGBT Driver
SEMIKRON

SKHI22A/B

Hybrid Dual MOSFET Driver
SEMIKRON

SKHI22A/BH4

Hybrid Dual IGBT Driver
SEMIKRON

SKHI22A/BH4R

Half Bridge Based MOSFET Driver
SEMIKRON

SKHI22A/BR

Half Bridge Based MOSFET Driver
SEMIKRON

SKHI22AH4

Half Bridge Based Peripheral Driver,
SEMIKRON

SKHI22AH4R

Half Bridge Based Peripheral Driver, Hybrid,
SEMIKRON

SKHI22AR

Half Bridge Based Peripheral Driver, Hybrid,
SEMIKRON

SKHI22A_05

Hybrid Dual MOSFET Driver
SEMIKRON

SKHI22A_06

Hybrid Dual IGBT Driver
SEMIKRON