SKYPER32PROR_0701 [SEMIKRON]
IGBT Driver Core; IGBT驱动器的核心
| 型号： | SKYPER32PROR_0701 |
| 厂家： | 
SEMIKRON INTERNATIONAL |
| 描述： | IGBT Driver Core |
| 文件： | 总18页 (文件大小：636K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SKYPER 32PRO R ...
Absolute Maximum Ratings
Symbol Conditions
Values
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This technical information specifies semiconductor devices but promises no
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1
19-01-2007 MHW
© by SEMIKRON
SKYPER™ 32PRO R
Technical Explanations
Revision
03
Status:
preliminary
Prepared by:
Markus Hermwille
This Technical Explanation is valid for the following parts:
Related Documents:
part number:
date code (YYWW):
L6100202
≥ 0705
title:
version:
Data Sheet SKYPER 32PRO R
2007-01-19
SKYPER™ 32PRO R
Content
Application and Handling Instructions ...................................................................................................................................... 3
Further application support....................................................................................................................................................... 3
General Description.................................................................................................................................................................. 3
Features of SKYPER™ 32PRO ............................................................................................................................................... 3
Block diagram........................................................................................................................................................................... 4
Dimensions............................................................................................................................................................................... 4
PIN Array – Primary Side ......................................................................................................................................................... 5
PIN Array – Secondary Side..................................................................................................................................................... 6
Driver Performance .................................................................................................................................................................. 7
Insulation.................................................................................................................................................................................. 7
Isolation Test Voltage............................................................................................................................................................... 8
Auxiliary Power Supply............................................................................................................................................................. 8
Under Voltage Reset (UVR) ..................................................................................................................................................... 9
Under Voltage Protection (UVP) primary.................................................................................................................................. 9
Under Voltage Protection secondary........................................................................................................................................ 9
Input Signals............................................................................................................................................................................. 9
Short Pulse Suppression (SPS) ............................................................................................................................................. 10
Failure Management............................................................................................................................................................... 10
Halt Logic Signal (HLS).......................................................................................................................................................... 11
Dead Time generation (Interlock TOP / BOT) adjustable (DT)............................................................................................... 11
Dynamic Short Circuit Protection by VCEsat monitoring / de-saturation monitoring (DSCP)..................................................... 12
Adjustment of DSCP............................................................................................................................................................... 13
High Voltage Diode for DSCP ................................................................................................................................................ 14
Gate resistors......................................................................................................................................................................... 14
Soft Turn-Off (STO)................................................................................................................................................................ 15
External Error Input (EEI) ....................................................................................................................................................... 15
Application Example............................................................................................................................................................... 16
Mounting Notes ...................................................................................................................................................................... 16
Environmental Conditions....................................................................................................................................................... 17
Marking................................................................................................................................................................................... 18
2
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Please note:
Unless otherwise specified, all values in this technical explanation are typical values. Typical values are the average values expected in
large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating
parameters should be validated by user’s technical experts for each application.
Application and Handling Instructions
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-
snubbers between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy
these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.
Further application support
Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application
Manual Power Modules available at http://www.semikron.com.
General Description
The SKYPER™ 32PRO core constitutes an interface between IGBT modules and the controller. This core is a half bridge
driver. Functions for driving, potential separation and protection are integrated in the driver. Thus it can be used to build up a
driver solution for IGBT modules.
Features of SKYPER™ 32PRO
Two output channels
SKYPER™ 32PRO
Integrated potential free power supply for secondary side
Short Pulse Suppression (SPS)
Under Voltage Protection (UVP) primary & secondary
Under Voltage Reset (UVR)
Drive interlock (dead time) top / bottom (DT) adjustable
Dynamic Short Circuit Protection (DSCP) by VCE monitoring and direct
switch off
Soft Turn-Off (STO)
Halt Logic Signal (HLS)
Failure Management
External Error Input
DC bus voltage up to 1200V
Coated with varnish
3
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Block diagram
Block diagram
Dimensions
Dimensions in mm (bottom view)
(top view)
±0,2mm unless otherwise noted
4
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
PIN Array – Primary Side
Connectors
Connector X10 / X11 (RM2,54, 10pin)
SQ 0,64
2,54
±0,25mm unless otherwise noted
PIN
Signal
Function
Specification
Inverted 15 V logic; 100kOhm impedance;
LOW = hold;
HIGH = normal operation
Under Voltage Reset (supervisor reset to be
driven by an external circuitry)
X10:01
X10:02
X10:03
PRIM_nPWRFAIL_IN
reserved
Digital 15 V logic; max. 2mA;
LOW = ready to operate;
HIGH = not ready to operate
PRIM_HALT_OUT
Driver core status output
Driver core status input
Digital 15 V logic; 100kOhm impedance;
LOW = enable driver;
X10:04
PRIM_HALT_IN
HIGH = disable driver
GND for power supply and GND for digital
signals
X10:05
X10:06
PRIM_PWR_GND
PRIM_PWR_GND
GND for power supply and GND for digital
signals
Digital 15 V logic; 100kOhm impedance;
LOW = TOP switch off;
HIGH = TOP switch on
X10:07
X10:08
PRIM_TOP_IN
PRIM_BOT_IN
Switching signal input (TOP switch)
Digital 15 V logic; 100kOhm impedance;
LOW = BOT switch off;
Switching signal input (BOTTOM switch)
HIGH = BOT switch on
X10:09
X10:10
PRIM_PWR_15P
PRIM_PWR_15P
Drive core power supply
Drive core power supply
Stabilised +15V ±4%
Stabilised +15V ±4%
X11:01
X11:02
reserved
reserved
GND for power supply and GND for digital
signals
X11:03
X11:04
PRIM_PWR_GND
PRIM_PWR_GND
GND for power supply and GND for digital
signals
X11:05
X11:06
X11:07
X11:08
PRIM_CFG_TDT2_IN
PRIM_CFG_SELECT_IN
PRIM_CFG_TDT3_IN
PRIM_CFG_TDT1_IN
Digital adjustment of locking time
Signal for neutralizing locking function
Digital adjustment of locking time
Digital adjustment of locking time
Dead time bit #2
Dead time bit #3
Dead time bit #1
GND for power supply and GND for digital
signals
X11:09
X11:10
PRIM_PWR_GND
PRIM_PWR_GND
GND for power supply and GND for digital
signals
5
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
PIN Array – Secondary Side
Connectors
Connector X100 / X200 (RM2,54, 10pin)
SQ 0,64
2,54
±0,25mm unless otherwise noted
PIN
Signal
Function
Specification
X100:01
X100:02
X100:03
SEC_TOP_VCE_CFG
SEC_TOP_VCE_IN
SEC_TOP_15P
Input reference voltage adjustment
Input VCE monitoring
Output power supply
Stabilised +15V / max. 10mA 1)
Voltage input; 6,6kOhm impedance;
LOW = ERROR
X100:04
SEC_TOP_ERR_IN
External error input
X100:05
X100:06
SEC_TOP_IGBT_ON
SEC_TOP_IGBT_OFF
Switch on signal TOP IGBT
Switch off signal TOP IGBT
GND for power supply and GND for digital
signals
X100:07
X100:08
SEC_TOP_GND
SEC_TOP_GND
GND for power supply and GND for digital
signals
X100:09
X100:10
SEC_TOP_IGBT_SOFTOFF Control input for setting soft turn-off TOP IGBT
SEC_TOP_8N
Output power supply
Stabilised -7V / max. 10mA 1)
Stabilised +15V / max. 10mA 1)
X200:01
X200:02
X200:03
SEC_BOT_VCE_CFG
SEC_ BOT_VCE_IN
SEC_ BOT_15P
Input reference voltage adjustment
Input VCE monitoring
Output power supply
Voltage input; 6,6kOhm impedance;
LOW = ERROR
X200:04
SEC_ BOT_ERR_IN
External error input
X200:05
X200:06
SEC_ BOT_IGBT_ON
SEC_ BOT_IGBT_OFF
Switch on signal BOT IGBT
Switch off signal BOT IGBT
GND for power supply and GND for digital
signals
X200:07
X200:08
SEC_ BOT_GND
SEC_ BOT_GND
GND for power supply and GND for digital
signals
X200:09
X200:10
SEC_BOT_IGBT_SOFTOFF Control input for setting soft turn-off BOT IGBT
SEC_BOT_8N Output power supply
Stabilised -7V / max. 10mA 1)
1) The average output current of the driver will be reduced accordingly.
6
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Driver Performance
The driver is designed for application with half bridges or single modules and a maximum gate charge per pulse
< 6,3µC. The charge necessary to switch the IGBT is mainly depending on the IGBT’s chip size, the DC-link voltage and the
gate voltage. This correlation is shown in module datasheets. It should, however, be considered that the driver is turned on
at +15V and turned off at -7V. Therefore, the gate voltage will change by 22V during each switching procedure.
Unfortunately, many datasheets do not show negative gate voltages. In order to determine the required charge, the upper
leg of the charge curve may be prolonged to +22V for determination of approximate charge per switch.
The medium output current of the driver is determined by the switching frequency and the gate charge. The maximum
switching frequency may be calculated with the shown equations and is limited by the average current of the driver power
supply and the power dissipation of driver components.
Calculation Switching Frequency
Maximum Switching Frequency @ different Gate Charges @ Tamb=25°C
60 kHz
50 kHz
40 kHz
30 kHz
20 kHz
10 kHz
0 kHz
IoutAVmax
fmax
=
QGE
fmax
IoutAVmax
QGE
:
Maximum switching frequency *
Maximum output average current
Gate charge of the driven IGBT
:
:
*@ Tamb=25°C
0 µC
1 µC
2 µC
3 µC
4 µC
5 µC
6 µC
7 µC
gate charge
Calculation Average Output Current
Average Output Current as a Function of the Ambient Temperature
60 mA
50 mA
40 mA
30 mA
20 mA
10 mA
0 mA
IoutAV = fsw × QGE
IoutAV
:
Average output current
Switching frequency
fsw:
QGE
:
Gate charge of the driven IGBT
0 °C
10 °C
20 °C
30 °C
40 °C
50 °C
60 °C
70 °C
80 °C
90 °C
ambient temperature
Please note:
The maximum value of the switching frequency is limited to 50kHz due to switching reasons.
Insulation
Magnetic transformers are used for insulation between gate driver primary and secondary side. The transformer set consists
of pulse transformers which are used bidirectional for turn-on and turn-off signals of the IGBT and the error feedback
between secondary and primary side, and a DC/DC converter. This converter provides a potential separation (galvanic
separation) and power supply for the two secondary (TOP and BOT) sides of the driver. Thus, external transformers for
power supply are not required.
Creepage and Clearance Distance in mm
Primary to secondary
Min. 12,2
7
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Isolation Test Voltage
The isolation test voltage represents a measure of immunity to transient voltages. The maximum test voltage and time
applied once between input and output, and once between output 1 and output 2 are indicated in the absolute maximum
ratings. The high-voltage isolation tests and repeated tests of an isolation barrier can degrade isolation capability due to
partial discharge. Repeated isolation voltage tests should be performed with reduced voltage. The test voltage must be
reduced by 20% for each repeated test.
The isolation of the isolation barrier (transformer) is checked in the part. With exception of the isolation barrier, no active
parts, which could break through are used. An isolation test is not performed as a series test. Therefore, the user can
perform once the isolation test with voltage and time indicated in the absolute maximum ratings.
Please note:
An isolation test is not performed at SEMIKRON as a series test.
Auxiliary Power Supply
A few basic rules should be followed when dimensioning the customer side power supply for the driver. The following table
shows the required features of an appropriate power supply.
Requirements of the auxiliary power supply
Regulated power supply
+15V ±4%
50ms
Please note:
Maximum rise time of auxiliary power supply
Minimum peak current of auxiliary supply
Power on reset completed after
Do not apply switching
signals during power on
reset.
1A
150ms
The supplying switched mode power supply may not be turned-off for a short time as consequence of its current limitation.
Its output characteristic needs to be considered. Switched mode power supplies with fold-back characteristic or hiccup-mode
can create problems if no sufficient over current margin is available. The voltage has to rise continuously and without any
plateau formation as shown in the following diagram.
Rising slope of the power supply voltage
If the power supply is able to provide a higher current, a peak current will flow in the first instant to charge up the input
capacitances on the driver. Its peak current value will be limited by the power supply and the effective impedances (e.g.
distribution lines), only.
It is recommended to avoid the paralleling of several customer side power supply units. Their different set current limitations
may lead to dips in the supply voltage.
The driver is ready for operation typically 150ms after turning on the supply voltage. The driver error signal
PRIM_HOLD_OUT and PRIM_HOLD_IN are operational after this time. Without any error present, the PRIM_HOLD_OUT
signal will be reset.
To assure a high level of system safety the TOP and BOT signal inputs should stay in a defined state (OFF state, LOW)
during driver turn-on time. Only after the end of the power-on-reset, IGBT switching operation shall be permitted.
8
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Under Voltage Reset (UVR)
The Under Voltage Reset circuit configures the driver core to hold in a reset state during power on and power off. UVR can
be thought of as a supplement function to the build in power-on-reset by the user. While in reset, the driver is held in its initial
condition until PRIM_nPWRFAIL_IN is forced into HIGH state. Once the system reset sequence completes, the driver core
is ready to operate.
UVR input
Application Hints
A capacitor is connected to the input to obtain high noise
immunity.
Disabling of the Under Voltage Reset function
(PRIM_nPWRFAIL_IN) can be achieved by no connection or
connection to +15V.
Please note:
Do not use PRIM_nPWRFAIL_IN to place the driver core into halt mode during operation.
Under Voltage Protection (UVP) primary
The internally detected supply voltage of the driver has an under voltage protection. The table below gives an overview of
the trip level.
Supply voltage
UVP level
Regulated +15V ±4%
13,5V
If the internally detected supply voltage of the driver falls below this level, the IGBTs will be switched off (IGBT driving
signals set to LOW). The input side switching signals of the driver will be ignored. The error memory will be set, and the
output PRIM_HOLD_OUT changes to the HIGH state.
Under Voltage Protection secondary
This function monitors the rectified voltage on the secondary side. If the voltage drops, the IGBTs will be switched off (IGBT
driving signal set to LOW). The input side switching signals of the driver will be ignored. No failure message will be
generated.
Output voltage
UVP level
Regulated +15V
12V
Input Signals
The signal transfer to each IGBT is made with pulse transformers, used for switching on and switching off of the IGBT. The
inputs have a Schmitt Trigger characteristic and a positive / active high logic (input HIGH = IGBT on; input LOW = IGBT off).
It is mandatory to use circuits which switch active to +15V and 0V. Pull up and open collector output stages must not be
used for TOP / BOT control signals. It is recommended choosing the line drivers according to the demanded length of the
signal wires.
Please note:
It is not permitted to apply switching pulses shorter than 1µs.
9
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
TOP / BOT Input
A capacitor is connected to the input to obtain high noise
immunity. This capacitor can cause for current limited line drivers
a little delay of few ns, which can be neglected. The capacitors
have to be placed as close as possible to the driver interface.
Short Pulse Suppression (SPS)
This circuit suppresses short turn-on and off-pulses of incoming signals. This way the IGBTs are protected against spurious
noise as they can occur due to bursts on the signal lines. Pulses shorter than 625ns are suppressed and all pulses longer
than 750ns get through for 100% probability. Pulses with a length in-between 625ns and 750ns can be either suppressed or
get through.
Pulse pattern – SPS
Failure Management
A failure caused by PRIM_nPWRFAIL_IN, under voltage protection, dynamic short circuit detection or external error input
will force PRIM_HALT_OUT into HIGH state (not ready to operate). The IGBTs will be switched off (IGBT driving signals set
to LOW) and switching pulses from the controller will be not transferred to the output stage. Connected and switched off
IGBTs remain turned off. At the same time an internal timer with a time constant of 3s is started. If no failure, caused by
PRIM_nPWRFAIL_IN or under voltage protection is present anymore, a time of 3s after failure detection is passed and also
TOP and BOT input signals are set to the LOW level for a period of minimum tpERRRESET > 9µs, the driver core is ready to
operate and switching pulses are transferred to the output stage. If PRIM_HALT_OUT is HIGH state, the external error input
is not monitored. A present failure signal at external error input during PRIM_HALT_OUT in HIGH state is again detected
after a reset signal and first transfer of TOP and BOT switching pulses to the output stage.
Pulse Pattern Failure Management
Propagation delay of the driver, interlock dead time
and switching time of the IGBT chip has to be taken
into account (not shown in the pulse pattern).
10
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Halt Logic Signal (HLS)
The Halt Logic Signals PRIM_HALT_IN and PRIM_HALT_OUT show and control the drive core status. The driver core is
placed into halt mode by setting PRIM_HALT_IN into HIGH state (disable driver). This signal can gather disable signals of
other hardware components for stopping operation and switching off the IGBT. A HIGH signal will set the driver core into
HOLD and switching pulses from the controller will be not transferred to the output stage. The input and output have Schmitt
Trigger characteristic. Pull up and open collector output stages must not be used.
Please note:
PRIM_HALT_OUT must be always connected with PRIM_HALT_IN. PRIM_HALT_OUT is not short circuit proof.
Connection PRIM_HALT_OUT and PRIM_HALT_IN
Connection PRIM_HALT_OUT (PRIM_HALT_IN not used)
Please note:
A HIGH signal @ PRIM_HALT_IN does not generate a HIGH signal @ PRIM_HALT_OUT. After LOW signal @ PRIM_HALT_IN the
gate driver is enable do operate.
Dead Time generation (Interlock TOP / BOT) adjustable (DT)
The DT circuit prevents, that TOP and BOT IGBT of one half bridge are switched on at the same time (shoot through). The
dead time is not added to a dead time given by the controller. Thus the total dead time is the maximum of "built in dead time"
and "controller dead time". It is possible to control the driver with one switching signal and its inverted signal.
Pulse pattern – DT
The total propagation delay of the driver is the sum of interlock
dead time (tTD) and driver input output signal propagation delay
(td(on;off)IO) as shown in the pulse pattern. Moreover the switching
time of the IGBT chip has to be taken into account (not shown in
the pulse pattern).
In case both channel inputs (PRIM_TOP_IN and
PRIM_BOT_IN) are at high level, the IGBTs will be turned off.
If only one channel is switching, there will be no interlock dead
time.
Please note:
No error message will be generated when overlap of switching signals occurs.
The dead time can be adjusted and the locking function may be neutralized as shown in the following table.
11
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Adjustment of Dead time / Neutralizing Locking Functions
Interlock time
PRIM_CFG_TDT1_IN
PRIM_CFG_TDT2_IN
PRIM_CDG_TDT3_IN
PRIM_CFG_SELECT_IN
[µs]
1
GND
GND
GND
GND
open
open
open
open
open
GND
GND
open
open
GND
GND
open
open
open
open
GND
open
GND
open
GND
open
GND
open
open
open
open
open
open
open
open
open
GND
1,3
2
2,3
3
3,3
4 *
4,3
no interlock
* Factory setting
Please note:
The dead time has to be longer than the turn-off delay time of the IGBT in any case. This is to avoid that one IGBT
is turned on before the other one is not completely discharged. If the dead time is too short, the heat generated by
the short circuit current may destroy the module in the event of a short circuit in top or bottom arm.
The average output current is available at each output channel. It is not possible to interconnect the output
channels to achieve a higher average output current by neutralizing the locking function.
Dynamic Short Circuit Protection by VCEsat monitoring / de-saturation monitoring (DSCP)
The DSCP circuit is responsible for short circuit sensing. It monitors the collector-emitter voltage VCE of the IGBT during its
on-state. Due to the direct measurement of VCEsat on the IGBT's collector, the DSCP circuit switches off the IGBTs and an
error is indicated.
The reference voltage VCEref may dynamically be adapted to the IGBTs switching behaviour. Immediately after turn-on of the
IGBT, a higher value is effective than in steady state. This value will, however, be reset, when the IGBT is turned off. VCEstat
is the steady-state value of VCEref and is adjusted to the required maximum value for each IGBT by an external resistor RCE
.
It may not exceed 10V. The time constant for the delay (exponential shape) of VCEref may be controlled by an external
capacitor CCE, which is connected in parallel to RCE. It controls the blanking time tbl which passes after turn-on of the IGBT
before the VCEsat monitoring is activated. This makes an adaptation to any IGBT switching behaviour possible.
Reference Voltage (VCEref) Characteristic
After tbl has passed, the VCE monitoring will be triggered as soon as VCEsat > VCEref and will turn off the IGBT. The error
memory will be set, and the output PRIM_HOLD_OUT changes to the HIGH state. Possible failure modes are shows in the
following pictures.
12
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Short circuit during operation
Turn on of IGBT too slow *
Short circuit during turn on
* or adjusted blanking time too short
Adjustment of DSCP
The external components RCE and CCE are applied for adjusting the steady-state threshold the blanking time.
Connection RCE and CCE Dimensioning of RCE and CCE
V
⎛
⎜
⎞
⎟
VCEstat + RVCE
⋅
kΩ
⎜
⎟
RCE
[
kΩ
]
= −15,5kΩ ⋅ln 1−
⎜
⎜
⎝
8V
⎟
⎟
⎠
µs
Ω
tbl
[
µs
]
− 2,1µs − 0,11 ⋅RCE
CCE
[
pF =
]
µs
0,00323
pF
VCEstat
tblx
:
Collector-emitter threshold static monitoring voltage
Blanking time
:
V
CEstat_max = 8V (RVCE = 0Ω)
VCEstat_max = 7V (RVCE = 1kΩ)
Please Note:
The equations are calculated considering the use of high voltage diode
BY203/20S. The calculated values VCEstat and tbl are typical values at room
temperature can and do vary in the application (e.g. tolerances of used high
voltage diode, resistor RCE, capacitor CCE).
The DSCP function is not recommended for over current protection.
Application hints
If the DSCP function is not used, for example during the experimental phase, SEC_TOP_VCE_IN must be connected with
SEC_TOP_GND for disabling SCP @ TOP side and SEC_BOT_VCE_IN must be connected with SEC_BOT_GND for disabling SCP @
BOT side.
13
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
High Voltage Diode for DSCP
The high voltage diode blocks the high voltage during IGBT off state. The connection of this diode between driver and IGBT
is shows in the following schematic.
Connection High Voltage Diode
Characteristics
Reverse blocking voltage of the diode shall be higher than the
used IGBT.
Reverse recovery time of the fast diode shall be lower than VCE
rising of the used IGBT.
Forward voltage of the diode: 1,5V @ 2mA forward current
(Tj=25°C).
A collector series resistance RVCE (1kΩ / 0,4W) must be
connected for 1700V IGBT operation.
Gate resistors
The output transistors of the driver are MOSFETs. The sources of the MOSFETs are separately connected to external
terminals in order to provide setting of the turn-on and turn-off speed of each IGBT by the external resistors RGon and RGoff
.
As an IGBT has input capacitance (varying during switching time) which must be charged and discharged, both resistors will
dictate what time must be taken to do this. The final value of the resistance is difficult to predict, because it depends on
many parameters as DC link voltage, stray inductance of the circuit, switching frequency and type of IGBT.
Connection RGon, RGoff
Application Hints
User Side
The gate resistor influences the switching time, switching losses, dv/dt
behaviour, etc. and has to be selected very carefully. Due to this
RGon
TOP
influence
a general value for the gate resistors cannot be
SEC_TOP_IGBT_ON
SEC_TOP_IGBT_OFF
recommended. The gate resistor has to be optimized according to
switching behaviour and over voltage peaks within the specific
circuitry.
RGE
10K
RGoff
SEC_TOP_GND
SEC_TOP_GND
Load
BOT
By increasing RGon the turn-on speed will decrease. The reverse peak
current of the free-wheeling diode will diminish.
RGon
By increasing RGoff the turn-off speed of the IGBT will decrease. The
inductive peak over voltage during turn-off will diminish.
SEC_BOT_IGBT_ON
SEC_BOT_IGBT_OFF
RGE
10K
RGoff
In order to ensure locking of the IGBT even when the driver supply
voltage is turned off, a resistance (RGE) has to be integrated.
SEC_BOT_GND
SEC_BOT_GND
Please note:
Do not connect the terminals SEC_TOP_IGBT_ON with SEC_TOP_IGBT_OFF and SEC_BOT_IGBT_ON
with SEC_BOT_IGBT_OFF, respectively.
14
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Soft Turn-Off (STO)
In case of short circuit, the STO circuit increases the resistance in series with RGoff and turns-off the IGBT at lower speed.
This produces smaller voltage spike above the collector emitter of the IGBT by reducing the di/dt value. Because in short-
circuit conditions the IGBT's peak current increases and some stray inductance is always present in power circuits, it must
fall to zero in a longer time than at normal operation. The soft turn-off time can be adjusted by connection an external
resistor RGoff_SC
.
Connection RGoff_SC
Application Hints
The turn-off behaviour and over voltage peaks depends on DC link
voltage, stray inductance of the power circuits, type of IGBT, etc. and
has to be selected according the specific application. Due to this
influence a general value for RGoff_SC cannot be recommended. The
resistor has to be selected according to the behaviour of the specific
circuitry.
The soft turn-off time is limited to 10µs. After this time the output stage
turn-off with used RGoff
.
Disabling of Soft Turn-Off can be achieved by RGoff_SC = 0Ω or wire
bridge.
Please note:
The soft turn-off function is no complete protection from induced over voltage in the event of short-circuit turn-off.
A HIGH signal at PRIM_HALT_IN does not activate a soft turn-off.
External Error Input (EEI)
The external error inputs on the secondary side (high potential) of the gate driver can be used for external fault signals from
e. g. an over current protection circuit or over temperature protection circuit to place the gate driver into halt mode.
Disabling of this function can be achieved by no connection or connection to +15V (e. g. SEC_TOP_15P, SEC_BOT_15P to
SEC_TOP_ERR_IN and SEC_BOT_ERR_IN). It is possible to use only one error input.
Connection EEI
Connection example with using an external transistor in switch mode.
15
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Application Example
Connection Schematic
EXTERNAL ERROR SIGNAL
DC+
SKYPERTM 32PRO
SEC_TOP_VCE_CFG
BY203/20S
330pF
SEC_TOP_VCE_IN
SEC_TOP_15P
18k
50V
PRIM_nPWRFAIL_IN
SEC_TOP_ERR_IN
SEC_TOP_IGBT_ON
SEC_TOP_IGBT_OFF
Ron
STATUS OUTPUT
PRIM_HALT_OUT
PRIM_HALT_IN
PRIM_PWR_GND
_
>1
x1
y
STATUS INPUT
x2
Roff
10k
SEC_TOP_GND
SEC_TOP_GND
PRIM_PWR_GND
PRIM_TOP_IN
INPUT TOP
INPUT BOT
SEC_TOP_IGBT_SOFTOFF
SEC_TOP_8N
PRIM_BOT_IN
Roff_sc
PRIM_PWR_15P
PRIM_PWR_15P
PRIM_PWR_GND
load
+15V
SEC_BOT_VCE_CFG
SEC_BOT_VCE_IN
SEC_BOT_15P
BY203/20S
PRIM_PWR_GND
330pF
50V
18k
PRIM_CFG_TDT2_IN
SEC_BOT_ERR_IN
SEC_BOT_IGBT_ON
SEC_BOT_IGBT_OFF
PRIM_CFG_SELECT_IN
PRIM_CFG_TDT_3_IN
Ron
1nF
1nF
1nF
1nF
1nF
100V
220µF
35V
PRIM_CFG_TDT1_IN
PRIM_PWR_GND
PRIM_PWR_GND
100V
100V
100V
Roff
100V
10k
SEC_BOT_GND
SEC_BOT_GND
SEC_BOT_IGBT_SOFTOFF
SEC_BOT_8N
Roff_sc
DC-
-
-
-
-
application example for 1200V IGBT
dead time: 3µs
UVR disable
-
-
-
-
tbl = 5,1µs
EEI TOP enable (using external transistor in switch mode)
EEI BOT disable
STO
VCEref = 5,5V
Mounting Notes
Soldering Hints
Drill Hole & Pad Size in mm
The temperature of the solder must not exceed 260°C, and solder time must
not exceed 10 seconds.
The ambient temperature must not exceed the specified maximum storage
temperature of the driver.
The solder joints should be in accordance to IPC A 610 Revision D (or later) -
Class 3 (Acceptability of Electronic Assemblies) to ensure an optimal
connection between driver core and printed circuit board.
Please note:
The driver is not suited for hot air reflow or infrared reflow processes.
16
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
The connection between driver core and printed circuit board should be mechanical reinforced by using support posts.
Use of Support Posts
Product information of suitable support posts and
distributor contact information is available at e.g.
http://www.richco-inc.com (e.g. series DLMSPM,
LCBST).
Please note:
The use of agressive materials in cleaning process of driver core may be detrimental for the device parameters.
Environmental Conditions
The driver core is type tested under the environmental conditions below.
Conditions
Values (max.)
Vibration
Sinusoidal sweep 20Hz … 500Hz, 5g, 26 sweeps per axis (x, y, z)
-
-
Tested acc. IEC 68-2-6
Connection between driver core and printed circuit board mechanical reinforced by using support posts.
Shock
Half-sinusoidal pulse, 5g, shock width 18ms, 3 shocks in each direction (±x, ±y, ±z), 18 shocks in total
-
-
Tested acc. IEC 68-2-27
Connection between driver core and printed circuit board mechanical reinforced by using support posts.
The characteristics and further environmental conditions are indicated in the data sheet.
17
2007-01-19 – Rev03
© by SEMIKRON
SKYPER™ 32PRO R
Marking
Every driver core is marked. The marking contains the following items.
Part Marking Information
The Data Matrix Code is described as follows:
Type:
EEC 200
Standard:
Cell size:
Dimension:
ICO / IEC 16022
0,254 - 0,3 mm
5 × 5 mm
The following data is coded:
n
o
p
q
r
XXXXXXXXYY
ZZZZ
VVVV
n
8 digits
2 digits
part number
version number
1. SEMIKRON part number (8 digits) + version number (2 digits)
2. Date code (4 digits): YYWW
o
p
q
r
1 digit
4 digits
1 digit
4 digits
blank
date code
blank
3. Continuous number referred to date coce (4 digits)
4. Data matrix code
continuous number
DISCLAIMER
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design.
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume
any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical
information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed
or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information
previously supplied and may be supersede by updates without further notice.
SEMIKRON products are not authorized for use in life support appliances and systems without the express written
approval by SEMIKRON.
www.SEMIKRON.com
18
2007-01-19 – Rev03
© by SEMIKRON
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