RCLAMP3324T.TCT [SEMTECH]
Trans Voltage Suppressor Diode, 75W, 3.3V V(RWM), Unidirectional, 1 Element, Silicon, SLP1710P4T, 6 PIN;
| 型号： | RCLAMP3324T.TCT |
| 厂家： | 
SEMTECH CORPORATION |
| 描述： | Trans Voltage Suppressor Diode, 75W, 3.3V V(RWM), Unidirectional, 1 Element, Silicon, SLP1710P4T, 6 PIN 局域网 光电二极管 |
| 文件： | 总10页 (文件大小：237K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RClamp3324T
Low Voltage RailClamp®
4-Line ESD Protection
PROTECTION PRODUCTS - RailClamp®
Features
Description
The RClamp®3324T provides ESD protection for
USB3.0, HDMI1.3/1.4, and other high-speed ports. It
features a high maximum ESD withstand voltage of
±25kV contact and ±30kV air discharge per IEC
61000-4-2. RClamp3324T is designed to minimize
both the ESD peak clamping and the TLP clamping.
Peak ESD clamping voltage is extremely low and
approximately the same at each pin. The dynamic
resistance is among the industry’s lowest at 0.35
Ohms (typical). Typical capacitance on each line to
ground is approximately 0.40pF. This allows the
RClamp3324T to be used in applications operating in
excess of 5GHz without signal attenuation. These
devices are manufactured using Semtech’s proprietary
low voltage EPD technology for superior characteritics
at operating voltages up to 3.3 volts. Each device will
protect up to four lines (two high-speed pairs).
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Flow-Through design
Protects four high-speed lines
Low capacitance: 0.40pF typical (I/O to ground)
Low ESD clamping voltage
Extremely low dynamic resistance: 0.35 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP1710P4T 6L package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.0 x 0.40 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + date code
Packaging : Tape and Reel
The RClamp3324T is in a 6-pin SLP1710P4T package. It
measures 1.7 x 1.0mm with a nominal height of 0.40mm.
The leads have a nominal pin-to-pin pitch of 0.40mm.
The flow- through package design simplifies PCB layout
and maintains signal integrity on high-speed lines.
Applications
USB 3.0
HDMI 1.3/1.4
V-By-One
Display Port
MHL
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device provides the highest level of ESD protection for
applications such as USB 3.0, HDMI and V-By-One inter-
faces.
LVDS Interfaces
eSATA Interfaces
Circuit Diagram
Pin Configuration (Top View)
I/O 1
I/O 2
I/O 3
I/O 4
1
GND
GND
Pin 1
Pin 2
Pin 3
Pin 4
5, 6
www.semtech.com
Revision 11/28/2012
1
RClamp3324T
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Ppk
Value
Units
Watts
A
Peak Pulse Power (tp = 8/20μs)
Peak Pulse Current (tp = 8/20μs)
75
5
IPP
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
+/- 30
+/- 25
kV
Operating Temperature
Storage Temperature
TJ
-40 to +125
-55 to +150
°C
°C
TSTG
Electrical Characteristics (T=25oC Unless Otherwise Specified)
Parameter
Reverse Stand-Off Voltage
Punch-Through Voltage
Symbol
VRWM
Conditions
Minimum
Typical
Maximum
3.3
Units
Any I/O to GND
V
V
VPT
IPT = 2μA
3.8
4.8
5.5
Any I/O to GND
Reverse Leakage Current
Clamping Voltage
IR
VC
VC
Cj
VRWM = 3.3V
Any I/O to GND
0.005
0.100
7
μA
V
IPP = 1A, tp = 8/20μs
Any I/O to GND
Clamping Voltage
IPP = 5A, tp = 8/20μs
10.5
0.65
0.4
V
Any I/O to GND
Junction Capacitance
VR = 0V, f = 1MHz,
Any I/O to GND
0.40
0.30
pF
pF
VR = 0V, f = 1MHz,
Between I/O pins
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© 2012 Semtech Corporation
2
RClamp3324T
PROTECTION PRODUCTS
Electrical Characteristics (T=25oC Unless Otherwise Noted)
ESD Ratings (Each Pin)
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
25
Units
kV
ESD Withstand Voltage1
Contact discharge per
IEC 61000-4-2
ESD Withstand Voltage1
Air discharge per IEC
61000-4-2
30
kV
ESD Peak Voltage1
ESD Peak Voltage1
ESD Clamping Voltage2
Vpk
Vpk
Vtlp
+8kV per IEC 61000-4-2
-8kV per IEC 61000-4-2
55
-60
V
V
V
IPP = 16A,
11.5
tlp = 0.2/100ns
ESD Clamping Voltage2
Vtlp
IPP = -16A,
11
V
tlp = 0.2/100ns
Dynamic Resistance (Positive)2, 3
Dynamic Resistance (Negative)2, 3
RDyn
RDyn
tp = 100ns
tp = 100ns
0.35
0.50
Ohms
Ohms
Notes
1)ESD peak voltage measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD
gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
www.semtech.com
© 2012 Semtech Corporation
3
RClamp3324T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
DR040412-75
120
100
80
60
40
20
0
1
0.1
DR040512:25:125:150
0.01
0
25
50
75
100
125
150
0.1
1
10
100
1000
Ambient Temperature - TA (OC)
Pulse Duration - tp (µs)
Clamping Voltage vs. Peak Pulse Current
Capacitance vs. Reverse Voltage
1.0
9
8
7
6
5
4
3
2
1
0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Waveform
Parameters:
tr = 8µs
td = 20µs
f = 1 MHz
3
0
1
2
3
4
5
6
0
0.5
1
1.5
2
2.5
Reverse Voltage - VR (V)
Peak Pulse Current - IPP (A)
TLP Characteristic (Positive Pulse)
TLP Characteristic (Negative Pulse)
30
0
-5
25
20
15
10
5
RDYN = 0.35
-10
-15
-20
-25
-30
RDYN= 0.50
Transmission Line Pulse Test
(TLP) Settings:
Transmission Line Pulse Test
(TLP) Settings:
p = 100ns, tr = 0.2ns,
t
p = 100ns, tr = 0.2ns,
t
I
TLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
0
0
5
10
15
20
-20
-15
-10
-5
0
Voltage (V)
Voltage (V)
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© 2012 Semtech Corporation
4
RClamp3324T
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping at Each Pin
(+8kV Contact per IEC 61000-4-2)
ESD Clamping at Each Pin
(-8kV Contact per IEC 61000-4-2)
60
50
40
30
20
10
0
0
-10
-20
-30
-40
-50
-60
-70
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
ESD Clamping vs. Positive Discharge Voltage
(Contact Discharge per IEC 61000-4-2)
ESD Clamping vs. Negative Discharge Voltage
(Contact Discharge per IEC 61000-4-2)
60
10
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
+8kV
Vpk=54.6V
50
40
30
20
10
0
+6kV
VPK=41.8V
-10
+4kV
Vpk=34.1V
-20
+2kV
Vpk=22.5V
-2kV
Vpk= -19.20V
-30
-4kV
Vpk= -35.36V
-40
-50
-60
-70
-6kV
Vpk= -48.00V
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
-8kV
Vpk= -60.20V
-10
-10
0
10
20
30
Time (ns)
40
50
60
-10
0
10
20
30
Time (ns)
40
50
60
Typical Insertion Loss S21 (5GhZ)
Analog Crosstalk
0
-20
-3
-9
-40
-60
-80
-100
-120
-140
Data includes loss due to SMA connector
-15
1.00E+07
1.00E+08
1.00E+09
1.00E+10
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
Frequency (Hz)
Frequency (Hz)
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© 2012 Semtech Corporation
5
RClamp3324T
PROTECTION PRODUCTS
Applications Information
Layout Guidelines
RClamp3324T is designed to protect 2 high speed
differential pairs. The PCB traces enter and exit each
I/O pin. Ground is connected at pins 5 and 6. Figure 2
is an example of how to route the high speed
differential traces through the RClamp3324T. The
differential impedance of each pair can be controlled
for high-speed interfaces such as HDMI (100 Ohms +/-
15%) and USB 3.0 (85 Ohms +/-15%) while
maintaining a minimum trace-to-trace and trace-to-pad
spacing of 0.125mm when using 0.100mm wide
traces. These are only guidelines. Individual PCB
design constraints may necessitate different spacing or
trace width. Both ground pads should be connected for
optimal performance. Ground connection is made
using 0.254mm diameter filled via-in-pad. The via
should be filled with a conductive paste. This
technique saves board space and eliminates the
capillary effect of a non filled via.
I/O 1
I/O 2
I/O 3
I/O 4
1
GND
GND
Figure 1 - Pin Configuration
Figure 2 - Example Flow-Through Layout
www.semtech.com
© 2012 Semtech Corporation
6
RClamp3324T
PROTECTION PRODUCTS
Applications Information
USB 3.0 - Type A
Host Connector
SSRX-
GND
D+
RClamp3324T
RClamp3324T
SSRX+
GND
D-
SSTX-
VBus
SSTX+
uClamp0541T
Land Pad
Trace
Via
Device Outline
Figure 3 - USB 3.0 Layout (Type A Host Connector)
USB 3.0 - Type B
Device Connector
SSTX-
RClamp3324T
SSTX+
D+
D-
GND
SSRX-
GND
RClamp3324T
VBus
uClamp0541T
Via Device Outline
SSRX+
Land Pad
Trace
Figure 4 - USB 3.0 Layout (Type B Device Connector)
www.semtech.com
© 2012 Semtech Corporation
7
RClamp3324T
PROTECTION PRODUCTS
Applications Information
HDMI Connector
HPD
5V
SDA
SCL
HEC_DAT
CEC
RClamp7528T
RClamp3324T
CLK
CLK+
D0
D0+
D1
D1+
D2
D2+
Land Pad
Via
Trace
RClamp3324T
Device Outline
Figure 5 - HDMI 1.4 Layout
Recommended Assembly Parameters
Stencil Opening
Land Pad ( Follow drawing )
Assembly Parameter
Recommendation
.25
Solder Stencil Design
Laser cut, Electro-polished
Rectangular with rounded
corners
Aperture shape
.75
Solder Stencil Thickness
Solder Paste Type
0.100 mm (0.004")
Type 3 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
1.00
.20
.50
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
.17
.23
1.70
All Dimensions are in mm.
Land Pad. Stencil opening
Note that these are only recommendations and should serve only as a
starting point for design. The exact manufacturing parameters will
require some experimentation to get the desired solder application.
Component
Recommended Mounting Pattern
www.semtech.com
© 2012 Semtech Corporation
8
RClamp3324T
PROTECTION PRODUCTS
Outline Drawing - SLP1710P4T
B
E
DIMENSIONS
MILLIMETERS
A
D
DIM
MIN NOM MAX
PIN 1
INDICATOR
A
0.37 0.40 0.43
A1 0.00 0.02 0.05
(LASER MARK)
(0.13)
A2
b
0.15 0.20 0.25
1.65 1.70 1.78
0.95 1.00 1.08
0.40 BSC
D
E
e
e1
L
1.00 BSC
A
SEATING
PLANE
0.20 0.25 0.30
aaa C
A2
L1 0.45 0.50 0.55
C
N
4
0.08
0.10
A1
aaa
bbb
e
e/2
1
N
LxN
e1/2
E/2
L1x2
e1
bx6
bbb
C A B
D/2
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
2.
Land Pattern - SLP1710P4T
P1
P1/2
DIMENSIONS
DIM MILLIMETERS
Y1
C
G
P
(0.825)
0.25
0.40
1.00
0.20
0.45
0.70
1.40
Z
(C)
G
P1
X
Y
Y
P/2
Y1
Z
P
X
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com
© 2012 Semtech Corporation
9
RClamp3324T
PROTECTION PRODUCTS
Marking Codes
Ordering Information
Qty per
Reel
Part Number
Reel Size
3324T
YYWW
RClamp3324T.TCT
3,000
7 Inch
RailClamp and RClamp are trademarks of Semtech Corporation.
YYWW = Alphanumeric character Date Code
Carrier Tape Specification
Pin 1 Location (Towards Sprocket Holes)
User Direction of feed
Device Orientation in Tape
A0
B0
K0
1.18 +/-0.05 mm
1.88 +/-0.05 mm
0.53 +/-0.05 mm
Tape
K
(MAX)
B, (Max)
Width
D
D1
E
F
P
P0
P2
T(MAX)
W
8.0 mm
+ 0.3 mm
- 0.1 mm
0.5 mm
±0.05
1.750±.10
mm
1.5 + 0.1 mm
- 0.0 mm )
3.5±0.05
mm
4.0±0.1
mm
4.0±0.1
mm
2.0±0.05
mm
8 mm
4.2 mm
2.4 mm
0.4 mm
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
© 2012 Semtech Corporation
10
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