SGM2529 [SGMICRO]

5A, 5V Electronic Fuse (eFuse) with Thermal Shutdown;
SGM2529
型号: SGM2529
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

5A, 5V Electronic Fuse (eFuse) with Thermal Shutdown

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中文:  中文翻译
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SGM2529  
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
GENERAL DESCRIPTION  
FEATURES  
The SGM2529 is a compact electronic fuse (eFuse)  
with a complete set of protection functions. The  
SGM2529 provides excellent accuracy, making it very  
suitable for many system protection applications.  
5V Electronic Fuse with Surge up to 30V  
Extremely Low RDS(ON) for the Integrated  
Protection Switch: 26mΩ (TYP)  
3-State ENABLE/FAULT Pin, Bidirectional Interface  
Programmable Soft-Start Time  
It provides accurate over-voltage (OV) and under-  
voltage lockout (UVLO) protections, which ensure tight  
supervision of bus voltages and eliminate the need for  
supervisor circuits. The over-voltage (OV) protection  
will clamp the eFuse output at a fixed level during input  
voltage surges. During the input voltage transient, the  
internal FET remains on, which allows the load to  
continue to operate. If the transient duration remains  
long, the accumulated heat will cause the eFuse  
thermal shutdown. Once in thermal shutdown, latch-off  
and auto-retry thermal options are available.  
Programmable Current Limit up to 5A  
Thermal Shutdown Options:  
SGM2529A: Thermal Latch-Off with VCLAMP  
SGM2529B: Thermal Auto-Retry with VCLAMP  
SGM2529C: Thermal Latch-Off without VCLAMP  
Fault Output for Thermal Shutdown  
Accurate Under-Voltage Lockout  
Accurate Over-Voltage Clamp (SGM2529A and  
SGM2529B)  
Available in a Green TDFN-3×3-10L Package  
The SGM2529 is available in a Green TDFN-3×3-10L  
package.  
APPLICATIONS  
Hard Drives  
PCIE SSD  
Motherboard Power Management  
SG Micro Corp  
OCTOMBER 2020 – REV. A  
www.sg-micro.com  
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
SGM2529  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SGM  
2529AD  
XXXXX  
SGM  
2529BD  
XXXXX  
SGM  
SGM2529A  
SGM2529B  
SGM2529C  
TDFN-3×3-10L  
TDFN-3×3-10L  
TDFN-3×3-10L  
SGM2529AXTD10G/TR  
Tape and Reel, 4000  
Tape and Reel, 4000  
Tape and Reel, 4000  
-40to +125℃  
-40to +125℃  
-40to +125℃  
SGM2529BXTD10G/TR  
SGM2529CXTD10G/TR  
2529CD  
XXXXX  
MARKING INFORMATION  
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.  
X X X X X  
Vendor Code  
Trace Code  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
OVERSTRESS CAUTION  
ABSOLUTE MAXIMUM RATINGS  
Operating Input Voltage Range (VCC to GND) (1)  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
Steady-State .................................................. -0.3V to 18V  
Transient (100ms).......................................... -0.6V to 25V  
V
CC, SOURCE, ILIMIT to GND.............................. -0.3V to 25V  
dV/dt, ENABLE/FAULT to GND........................ -0.3V to 5.5V  
Package Thermal Resistance  
TDFN-3×3-10L, θJA.................................................... 90/W  
TDFN-3×3-10L, θJB.................................................... 54/W  
TDFN-3×3-10L, θJC.................................................... 52/W  
Junction Temperature.................................................+150℃  
Storage Temperature Range.......................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
ESD SENSITIVITY CAUTION  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
HBM.............................................................................2000V  
CDM ............................................................................1000V  
NOTE: 1. Negative voltage will not damage device provided  
that the power dissipation is limited to the rated allowable  
power for the package.  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
RECOMMENDED OPERATING CONDITIONS  
circuit design, or specifications without prior notice.  
Operating Junction Temperature Range......-40to +125℃  
SG Micro Corp  
www.sg-micro.com  
OCTOMBER 2020  
2
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
SGM2529  
PIN CONFIGURATION  
(TOP VIEW)  
1
2
3
4
5
10  
9
GND  
dV/dt  
SOURCE  
SOURCE  
SOURCE  
SOURCE  
SOURCE  
VCC  
8
ENABLE/FAULT  
7
ILIMIT  
NC  
6
TDFN-3×3-10L  
PIN DESCRIPTION  
PIN  
NAME  
FUNCTION  
1
GND  
Ground.  
Internal dV/dt Circuit. Leaving this pin open will allow the device to ramp up in 1.4ms. An  
external capacitor between this pin and GND will set the slew rate according to the  
application requirements.  
Enable or Fault Pin. This pin is a 3-state, bidirectional interface. Asserting ENABLE/FAULT  
pin high enables the device. When the thermal shutdown occurs, the device sinks current  
from ENABLE/FAULT, and pulls the pin low to alert the host (this pin is used as output  
port).  
2
3
dV/dt  
ENABLE/  
FAULT  
Current Limit Pin. This pin is used to set the overload and short-circuit current limit levels by  
placing a resistor.  
4
5
ILIMIT  
NC  
No Connection.  
6 - 10  
SOURCE  
VCC  
Power Output Pins.  
Exposed  
Pad  
Power Input Pin. Power input and supply voltage of the device.  
SG Micro Corp  
www.sg-micro.com  
OCTOMBER 2020  
3
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
SGM2529  
ELECTRICAL CHARACTERISTICS  
(TJ = +25, VCC = 5V and dV/dt pin is open, unless otherwise noted.)  
PARAMETER  
Power FET  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Delay Time  
tDLY  
Enabling of chip to ID = 100mA with 1A resistive load  
TJ = +25  
352  
26  
40  
20  
5
µs  
21  
31  
Kelvin On-Resistance  
RDS(ON)  
mΩ  
TJ = +135℃  
Off-State Output Voltage  
Continuous Current  
Thermal Latch  
VOFF  
ID  
VCC = 10V, VGS = 0V, RL = ∞  
200  
mV  
A
Shutdown Temperature  
TSD  
158  
22  
Decrease in die temperature for turn-on; does not  
apply to latch-off options.  
Thermal Hysteresis  
THYST  
Under/Over-Voltage Protection  
Output Clamping Voltage  
Under-Voltage Lockout  
UVLO Hysteresis  
VCLAMP  
VUVLO  
VHYST  
Over-voltage protection, VCC = 10V  
Turn on, voltage going high  
6.2  
3.5  
6.55  
3.7  
6.9  
3.9  
V
V
V
0.2  
Current Limit  
Kelvin Short-Circuit Current Limit  
Kelvin Overload Current Limit  
dV/dt Circuit  
ILIM-SC  
ILIM-OL  
RLIMIT = 77Ω  
RLIMIT = 77Ω  
0.5  
0.9  
0.95  
3.3  
1.4  
A
A
Output Voltage Ramp Time  
Maximum Capacitor Voltage  
ENABLE/FAULT Pin  
Logic Level Low  
tSLEW  
VMAX  
Enable to VOUT = 4.7V  
1.4  
1.9  
5.3  
ms  
V
VIN-LOW  
VIN-MID  
Output disabled  
0.43  
1.32  
1.94  
4.9  
0.53  
1.42  
2.04  
5.1  
0.63  
1.52  
2.14  
5.3  
V
V
Logic Level Mid  
Thermal fault, output disabled  
Logic Level High  
VIN-HIGH Output enabled  
VIN-MAX  
V
High State Maximum Voltage  
Logic Low Sink Current  
Power Supply  
V
IIN-LOW  
VENABLE = 0V  
-13  
-19  
µA  
Operating  
Shutdown  
102  
47  
130  
Quiescent Current  
IQ  
µA  
SG Micro Corp  
www.sg-micro.com  
OCTOMBER 2020  
4
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
SGM2529  
TYPICAL PERFORMANCE CHARACTERISTICS  
TJ = +25, unless otherwise noted.  
UVLO Turn-On Voltage vs. Temperature  
UVLO Hysteresis vs. Temperature  
3.74  
3.72  
3.70  
3.68  
3.66  
3.64  
3.62  
0.22  
0.21  
0.20  
0.19  
0.18  
0.17  
0.16  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature ()  
Temperature ()  
Current Limit vs. RLIMIT for Direct Current Sensing  
Current Limit vs. RLIMIT for Kelvin Current Sensing  
10  
10  
OL  
SC  
OL  
SC  
1
1
0.1  
0.1  
10  
100  
10  
100  
RLIMIT for Kelvin Current Sensing (Ω)  
RLIMIT for Direct Current Sensing (Ω)  
On-Resistance vs. Supply Voltage  
Output Voltage dV/dt Rate vs. Temperature  
31  
30  
29  
28  
27  
26  
25  
1.44  
1.42  
1.40  
1.38  
1.36  
1.34  
1.32  
ILOAD = 0.5A  
3
3.5  
4
4.5  
5
5.5  
6
-50 -25  
0
25  
50  
75 100 125 150  
Temperature ()  
Supply Voltage (V)  
SG Micro Corp  
www.sg-micro.com  
OCTOMBER 2020  
5
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
SGM2529  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
TJ = +25, unless otherwise noted.  
Output Clamping Voltage vs. Temperature  
Output Clamping Voltage vs. Temperature  
6.60  
6.59  
6.58  
6.57  
6.56  
6.55  
6.54  
6.54  
6.53  
6.52  
6.51  
6.50  
6.49  
6.48  
SGM2529A and SGM2529B  
ILOAD = 0.1A  
SGM2529A and SGM2529B  
ILOAD = 0A  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature ()  
Temperature ()  
Output Clamping Voltage vs. Temperature  
Direct Current Sensing Levels vs. Temperature  
6.51  
6.50  
6.49  
6.48  
6.47  
6.46  
6.45  
6
SGM2529A and SGM2529B  
ILOAD = 0.5A  
5
4
3
2
1
0
OL  
SC  
RLIMIT = 27Ω  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature ()  
Temperature ()  
Kelvin Current Sensing Levels vs. Temperature  
Kelvin Current Sensing Levels vs. Temperature  
6
6
5
4
3
2
1
0
5
4
3
2
1
0
OL  
SC  
OL  
SC  
RLIMIT = 15Ω  
RLIMIT = 33Ω  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature ()  
Temperature ()  
SG Micro Corp  
www.sg-micro.com  
OCTOMBER 2020  
6
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
SGM2529  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
TJ = +25, unless otherwise noted.  
Body Diode Forward Characteristics  
Input Transient Response  
800  
700  
600  
500  
400  
300  
200  
100  
0
VCC = 5V to 10V  
ILOAD = 0.1A  
VCC  
VLOAD  
0.5  
0.55  
0.6  
0.65  
0.7  
0.75  
0.8  
Time (500μs/div)  
Forward Voltage (V)  
SG Micro Corp  
www.sg-micro.com  
OCTOMBER 2020  
7
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
SGM2529  
TYPICAL APPLICATION CIRCUITS  
6, 7, 8, 9, 10  
11  
VCC  
SOURCE  
+5V  
SGM2529  
RLIMIT  
4
ILIMIT  
3
ENABLE/  
FAULT  
2
dV/dt  
Load  
GND  
1
ENABLE  
GND  
Figure 1. Application Circuit with Direct Current Sensing  
7, 8, 9, 10  
6
11  
3
VCC  
+5V  
SOURCE  
SGM2529  
RLIMIT  
4
ILIMIT  
ENABLE/  
FAULT  
2
Load  
dV/dt  
GND  
ENABLE  
1
GND  
Figure 2. Application Circuit with Kelvin Current Sensing  
VCC  
VCC  
SOURCE  
SOURCE  
RLIMIT  
RLIMIT  
SGM2529  
SGM2529  
ENABLE/  
FAULT  
ENABLE/  
FAULT  
ILIMIT  
ILIMIT  
dV/dt  
dV/dt  
Load  
Load  
GND  
GND  
ENABLE  
Figure 3. Common Thermal Shutdown  
SG Micro Corp  
www.sg-micro.com  
OCTOMBER 2020  
8
5A, 5V Electronic Fuse (eFuse)  
with Thermal Shutdown  
SGM2529  
FUNCTIONAL BLOCK DIAGRAM  
VCC  
Charge  
Pump  
UVLO  
Voltage  
SOURCE  
Clamp  
IIN_LOW  
ENABLE/  
Enable  
Logic  
Control  
Current  
Limit  
ILIMIT  
FAULT  
dV/dt  
dV/dt  
Thermal  
Shutdown  
Control  
SGM2529  
GND  
NOTE 1: SGM2529A and SGM2529B versions.  
Figure 4. Block Diagram  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Original (OCTOMBER 2020) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
OCTOMBER 2020  
9
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TDFN-3×3-10L  
D
e
N10  
D1  
k
E
E1  
N5  
N1  
b
L
BOTTOM VIEW  
TOP VIEW  
2.4  
1.7 2.8  
A
A1  
A2  
0.6  
SIDE VIEW  
0.24  
0.5  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
0.800  
0.050  
MIN  
0.028  
0.000  
MAX  
0.031  
0.002  
A
A1  
A2  
D
0.700  
0.000  
0.203 REF  
0.008 REF  
2.900  
2.300  
2.900  
1.500  
3.100  
2.600  
3.100  
1.800  
0.114  
0.091  
0.114  
0.059  
0.122  
0.103  
0.122  
0.071  
D1  
E
E1  
k
0.200 MIN  
0.500 TYP  
0.008 MIN  
0.020 TYP  
b
0.180  
0.300  
0.300  
0.500  
0.007  
0.012  
0.012  
0.020  
e
L
SG Micro Corp  
TX00060.000  
www.sg-micro.com  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
TDFN-3×3-10L  
13″  
12.4  
3.35  
3.35  
1.13  
4.0  
8.0  
2.0  
12.0  
Q1  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
13″  
386  
280  
370  
5
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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