SGM42633 [SGMICRO]
Dual H-Bridge Motor Driver;
| 型号： | SGM42633 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Dual H-Bridge Motor Driver |
| 文件： | 总15页 (文件大小：642K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM42633
Dual H-Bridge Motor Driver
GENERAL DESCRIPTION
FEATURES
The SGM42633 is a motor driver device with two
integrated H-bridges that can run a bipolar stepper
motor. The device can operate over a wide input
voltage range of 2.5V to 12V, and each H-bridge of the
SGM42633 can deliver up to 700mA RMS (or DC)
continuously (at VCC = 5V, TJ = +25℃).
● Power Supply Voltage Range: 2.5V to 12V
● Dual H-Bridge Motor Driver
● Low Quiescent Current: 150μA (TYP)
● Sleep Mode Supply Current: 0.32μA (TYP)
● xINx (PWM) Interface
● Output Current Capability (at VCC = 5V, +25℃)
TSSOP Package:
Internal over-current and over-temperature circuits
prevent the device from being in over-stress condition,
while a fault output simplifies stalling sensing, which is
a useful feature for most applications. Aiming for
battery-powered applications, it can go into low-power
mode for increased battery life.
0.7A RMS, 1A Peak per H-Bridge
1.4A RMS in Parallel Mode
TQFN Package:
0.6A RMS, 1A Peak per H-Bridge
1.2A RMS in Parallel Mode
● UVLO for VCC Voltage
The device is available in Green TQFN-3×3-16L and
TSSOP-16 (Exposed Pad) packages.
● Over-Current Protection (OCP)
● Thermal Shutdown (TSD)
● Fault Indication Pin (nFAULT)
● Available in Green TSSOP-16 (Exposed Pad) and
TQFN-3×3-16L Packages
APPLICATIONS
Robotics
Point-of-Sale Printers
Portable Printers
Toys
Video Security Cameras
SG Micro Corp
AUGUST2022–REV. A.3
www.sg-micro.com
SGM42633
Dual H-Bridge Motor Driver
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM42633
XPTS16
XXXXX
TSSOP-16
(Exposed Pad)
SGM42633XPTS16G/TR
Tape and Reel, 4000
Tape and Reel, 4000
-40℃ to +125℃
-40℃ to +125℃
SGM42633
42633TQ
XXXXX
TQFN-3×3-16L
SGM42633XTQ16G/TR
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage Range, VCC ................. -0.3V to 13.2V
Control Pins
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
(AIN1, AIN2, BIN1, BIN2, nSLEEP, nFAULT) to GND...........
............................................................................. -0.3V to 6V
Package Thermal Resistance
TSSOP-16 (Exposed Pad), θJA ................................. 41℃/W
TQFN-3×3-16L, θJA................................................... 47℃/W
Operating Junction Temperature.................................+150℃
Storage Temperature Range........................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................6000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Power Supply Voltage Range, VCC ......................2.5V to 12V
Motor RMS Current, IRMS
TSSOP-16 (Exposed Pad) Package......................0A to 0.7A
TQFN-3×3-16L Package........................................0A to 0.6A
Applied PWM Signal to AIN1, AIN2, BIN1, or BIN2, fPWM ......
...................................................................... 0kHz to 200kHz
Operating Ambient Temperature Range......-40℃ to +125℃
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
AUGUST 2022
2
SGM42633
Dual H-Bridge Motor Driver
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
16
15
14
13
nSLEEP
AOUT1
AISEN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
AIN1
AIN2
NC
AISEN
AOUT2
BOUT2
BISEN
1
2
3
4
12
11
10
9
NC
GND
VCC
NC
AOUT2
BOUT2
BISEN
GND
VCC
NC
GND
(PPAD)
GND
(PPAD)
BOUT1
nFAULT
BIN2
BIN1
5
6
7
8
TSSOP-16 (Exposed Pad)
TQFN-3×3-16L
FUNCTION
PIN DESCRIPTION
PIN
NAME
TYPE
TSSOP-16
TQFN-3×3-16L
(Exposed Pad)
2
4
16
2
AOUT1
AOUT2
BOUT1
BOUT2
AIN1
O
O
I
Bridge A Nodes.
7
5
Bridge B Nodes.
5
3
16
15
9
14
13
7
H-Bridge A PWM Inputs. Control the state of AOUT1 and AOUT2.
Internal pull-down.
AIN2
BIN1
H-Bridge B PWM Inputs. Control the state of BOUT1 and BOUT2.
Internal pull-down.
I
10
8
BIN2
Sleep Mode Input. Apply logic high to enable device, and apply
logic low to enter into the low power sleep mode. Internal pull-down.
Fault Indication Pin. The logic is pulled low with a fault condition.
Open-drain output requires an external pull-up.
1
8
15
6
nSLEEP
nFAULT
I
OD
3
6
1
4
AISEN
BISEN
I/O
I/O
Bridge A Ground or ICHOP
.
.
Bridge B Ground or ICHOP
Device Power Supply. Connect to motor supply. A 10μF (MIN)
ceramic bypass capacitor to GND is recommended.
12
10
VCC
P
13
11
GND
NC
G
-
Ground.
11, 14
9, 12
No Connection.
Exposed Pad. Exposed pad is internally connected to GND. Connect it
to a large ground plane to maximize thermal performance. It is not
intended as an electrical connection point.
Exposed
Pad
Exposed
Pad
GND
(PPAD)
G
NOTE: I = input, O = output, I/O = input or output, OD = open-drain output, G = ground, P = power for the circuit.
SG Micro Corp
www.sg-micro.com
AUGUST 2022
3
SGM42633
Dual H-Bridge Motor Driver
ELECTRICAL CHARACTERISTICS
(VCC = 5V, Full = -40℃ to +125℃. Typical values are at TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Power Supplies (VCC)
Power Supply Voltage
Power Supply Current
VCC
IVCC
Full
+25℃
Full
2.5
12
220
230
0.6
5
V
150
xINx low, nSLEEP high
nSLEEP low
μA
0.32
+25℃
Full
Sleep Mode Supply Current
IVCCQ
μA
Time to Enter Sleep Mode
Wake-Up Time
tSLEEP
tWAKE
tON
nSLEEP low to sleep mode
10
100
30
µs
μs
μs
+25℃
+25℃
+25℃
nSLEEP high to output transition
VCC > VUVLO to output transition
Turn-On Time
Control Inputs (AIN1, AIN2, BIN1, BIN2 and nSLEEP)
xINx
Full
Full
0
0.5
0.5
5.5
5.5
Input Logic Low Voltage
VIL
V
nSLEEP
xINx
0
Full
1.5
1.5
Input Logic High Voltage
Input Logic Hysteresis
Input Logic Low Current
VIH
VHYS
IIL
V
nSLEEP
Full
200
mV
μA
+25℃
+25℃
Full
-0.5
-1
0.01
0.5
1
VIN = 0V
33
10
45
+25℃
Full
xINx, VIN = 5V
nSLEEP, VIN = 5V
xINx
52
Input Logic High Current
Pull-Down Resistance
IIH
μA
kΩ
14
+25℃
Full
17
110
80
150
500
190
220
620
730
+25℃
Full
RPD
380
280
+25℃
Full
nSLEEP
Input Deglitch Time
tDEG
610
800
ns
ns
+25℃
+25℃
Propagation Delay INx to OUTx
Control Output (nFAULT)
tPROP
0.22
0.01
0.3
0.35
1
+25℃
Full
Output Logic Low Voltage
VOL
IO = 5mA
V
-1
-2
+25℃
Full
Output Logic High Leakage Current
IOH
RPULLUP = 1kΩ to 5V
μA
2
SG Micro Corp
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AUGUST 2022
4
SGM42633
Dual H-Bridge Motor Driver
ELECTRICAL CHARACTERISTICS (continued)
(VCC = 5V, Full = -40℃ to +125℃. Typical values are at TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
1120
1480
490
MAX
UNITS
Motor Driver Outputs (AOUT1, AOUT2, BOUT1 and BOUT2)
1450
2000
1850
2460
610
+25℃
Full
V
CC = 5V, I = 0.2A
High-side FET On-Resistance
RDSON_H
mΩ
+25℃
Full
VCC = 2.5V, I = 0.2A
+25℃
Full
V
CC = 5V, I = -0.2A
820
Low-side FET On-Resistance
Off-State Leakage Current
RDSON_L
mΩ
μA
655
900
+25℃
Full
VCC = 2.5V, I = -0.2A
1150
0.5
-0.5
-1.5
0.01
+25℃
Full
IOFF
1.5
Output Rise Time
Output Fall Time
Output Dead Time
tRISE
tFALL
tDEAD
RL = 16Ω to GND
RL = 16Ω to VCC
Internal dead time
70
60
90
ns
ns
ns
+25℃
+25℃
+25℃
PWM Current Controls (AISEN and BISEN)
185
180
202
25
219
224
+25℃
Full
xISEN Trip Voltage
VTRIP
tOFF
mV
Current Control Constant Off-Time
Internal PWM constant off-time
μs
+25℃
Protection Circuits
2.02
2
2.1
2.3
+25℃
Full
V
CC falling, UVLO report
VCC Under-Voltage Lockout
VUVLO
V
2.42
2.45
+25℃
Full
VCC rising, UVLO recovery
VCC Under-Voltage Hysteresis
Over-Current Protection Trip Level
Over-Current Deglitch Time
VUVLO_HYS Rising to falling threshold
200
1.5
2.6
2.3
160
20
mV
A
+25℃
+25℃
+25℃
+25℃
IOCP
tDEG
tOCP
TTSD
THYS
1.01
μs
ms
℃
℃
Over-Current Protection Period
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
SG Micro Corp
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AUGUST 2022
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SGM42633
Dual H-Bridge Motor Driver
TYPICAL PERFORMANCE CHARACTERISTICS
Power Supply Current vs. Power Supply Voltage
Sleep Mode Supply Current vs. Power Supply Voltage
170
160
150
140
130
120
2.5
+25℃
2
+125℃
1.5
1
-40℃
+125℃
0.5
0
+25℃
-40℃
2
4
6
8
10
12
2
4
6
8
10
12
Power Supply Voltage (V)
Power Supply Voltage (V)
High-side FET On-Resistance vs. Power Supply Voltage
2200
Low-side FET On-Resistance vs. Power Supply Voltage
900
I = 0.2A
I = -0.2A
800
700
600
500
400
300
1900
1600
1300
1000
700
+125℃
+125℃
+25℃
-40℃
+25℃
-40℃
2
4
6
8
10
12
2
4
6
8
10
12
Power Supply Voltage (V)
Power Supply Voltage (V)
SG Micro Corp
www.sg-micro.com
AUGUST 2022
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SGM42633
Dual H-Bridge Motor Driver
FUNCTIONAL BLOCK DIAGRAM
VCC
VCC
Internal Reference,
Regulator and UVLO
10μF
VCC
AOUT1
Gate
Drive
&
AIN1
AIN2
BIN1
BIN2
DCM
VCC
Stepper
Motor
OCP
AOUT2
AISEN
Current
Sense
Control
Logic
VCC
nSLEEP
nFAULT
BOUT1
Gate
Drive
&
DCM
VCC
OCP
BOUT2
Thermal
Shutdown
BISEN
Current
Sense
PPAD
GND
Figure 1. SGM42633 Block Diagram
SG Micro Corp
www.sg-micro.com
AUGUST 2022
7
SGM42633
Dual H-Bridge Motor Driver
DETAILED DESCRIPTION
the device supports fast and slow decay modes, as
shown in Table 2.
The SGM42633 is a dual H-bridge motor driver with
current regulation circuitry. Each output driver block
consists of NMOS and PMOS configured as full
H-bridges which can operate over a supply voltage
range of 2.5V to 12V. The SGM42633 can provide
output current up to 700mA.
Table 2. PWM Control of Motor Speed
xIN1
PWM
1
xIN2
0
Function
Forward PWM, Fast Decay
Forward PWM, Slow Decay
Reverse PWM, Fast Decay
Reverse PWM, Slow Decay
PWM
PWM
1
The output current can be regulated by PWM from
xIN1/xIN2 input or internal current limit.
0
PWM
Protection features include under-voltage lockout,
over-current protection and thermal shutdown. It has
low power sleep mode which is provided to save power
dissipation.
If connecting a sense resistor from xISEN pin to GND,
the internal current limit is always enabled. To disable
this function, please short the xISEN pin to GND
directly. Please refer to Figure 3 for the current path of
the drive and the decay modes.
PWM Motor Drivers
Please refer to the following motor control block
diagram of SGM42633:
VCC
VCC
OCP
VCC
S1
xOUT1
S1: Forward Driver
S2: Fast Decay
S0: Slow Decay
xOUT2
xOUT1
Pre-
Drive
S2
S0
DCM
xIN1
xOUT2
PWM
xIN2
OCP
-
xISEN
FORWARD
VCC
+
Optional
REF (202mV)
Figure 2. H-Bridge and Current Chopping Circuitry
S1
S1: Reverse Driver
S2: Fast Decay
S0: Slow Decay
Bridge Control and Decay Modes
Please refer to xIN1/xIN2 input logic in Table 1 below:
xOUT1
xOUT2
S2
S0
Table 1. H-Bridge Logic
xIN1
xIN2
xOUT1
xOUT2
Function
Coast/Fast Decay
Reverse
0
0
1
1
0
1
0
1
Z
L
Z
H
L
H
L
Forward
REVERSE
L
Brake/Slow Decay
Figure 3. Drive and Decay Modes
The SGM42633 also supports PWM mode input to
control the motor speed.
According to the PWM input signals on xIN1 and xIN2,
SG Micro Corp
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AUGUST 2022
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SGM42633
Dual H-Bridge Motor Driver
DETAILED DESCRIPTION (continued)
Current Control
Parallel Mode
The SGM42633 can be connected in parallel for higher
current applications. Figure 5 shows this configuration.
When the output is enabled, the motor current rises up
depending on the power supply and motor inductance,
and the xISEN pin voltage is ignored for a fixed blanking
time of about 3.2μs. After that, if the xISEN voltage
reaches the internal reference voltage (VTRIP) of typically
202mV, the high-side MOSFETs may be turned off, and
both low-side MOSFETs may be turned on for a fixed time
of 25μs.
VCC
+
10μF
VCC
NC
IN1
IN2
AIN1
AOUT1
AOUT2
AIN2
BIN1
DCM
SGM42633
BOUT1
BOUT2
Please refer to the following calculation in Equation 1.
202mV
BIN2
nSLEEP
nFAULT
nSLEEP
nFAULT
AISEN
BISEN
(1)
ICHOP
=
RxISEN
GND
For example, if the sense resistor is 0.5Ω, then
according to the calculation, the current limit point is
about 404mA. To disable the current limit function,
short the xISEN pin to GND directly.
Figure 5. Parallel Mode Schematic
Protection Circuits
The SGM42633 intergrates over-current, over-temperature
and under-voltage protections.
Decay Mode
After any drive phase, when a phase current reaches
the current limit setting point, the device may go to slow
decay mode (two low-side MOSFETs on) for 25μs.
Over-Current Protection (OCP)
Each MOSFET is protected by its own over-current
protection circuit. In case of an over-current (any
direction), the whole bridge will be disabled (shutdown)
and the nFAULT pin will be driven low. The outputs may
retry after OCP protection period (tOCP). An over-current
will occur due to a short between a switching node and
ground or to the VCC supply line, or to the other node
of the bridge (a winding short).
xIN1
xIN2
Low
xOUT1
ICHOP
The OCP protection circuit works even if the xISEN pin
is shorted to GND.
Drive Current (A)
Drive
Brake/Slow Decay
tOFF
Drive
Brake/Slow Decay
tOFF
Thermal Shutdown (TSD)
All bridges and drivers are shutdown if a junction
over-temperature occurs in the device and the nFAULT
pin will be driven low. Once the temperature goes back
to the safe level, the device resumes its operation.
Figure 4. Current Chopping Operation
Sleep Mode
The nSLEEP is an active low input that puts the device
into low power (sleep mode) state. In sleep mode, all
bridges are disabled. All logic inputs are ignored. When
waking up from sleep mode, time delay (tWAKE) is
needed before outputs operate.
Under-Voltage Lockout (UVLO)
If the voltages on VCC pin fall below their under-voltage
lockout thresholds, the device will be disabled and
internal logic will be reset. Device resumes operation
when all of them go back above their UVLO thresholds.
The UVLO event is not reported on the nFAULT pin.
SG Micro Corp
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AUGUST 2022
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SGM42633
Dual H-Bridge Motor Driver
DETAILED DESCRIPTION (continued)
Table 3. Device Protection
Fault
Condition
VCC < 2.1V
IOUT > IOCP
TJ > TTSD
Error Report
None
H-Bridge
Disabled
Disabled
Disabled
Internal Circuits
Disabled
Recovery
VCC > 2.3V
OCP
VCC Under-Voltage Lockout (UVLO)
Over-Current Protection (OCP)
Thermal Shutdown (TSD)
nFAULT
nFAULT
Operating
Operating
TJ < TTSD - THYS
Table 4. Modes of Operation
Fault
Operating
Condition
H-Bridge
Operating
Disabled
Disabled
Internal Circuits
nSLEEP pin high
nSLEEP pin low
Operating
Disabled
Sleep Mode
Fault Encountered
Any fault condition met
See Table 3
APPLICATION INFORMATION
Power Supply Recommendations
Motor datasheets generally specify the capacitance
value, however, it is recommended to do a system level
test to size the bypass capacitors properly.
The SGM42633’s working voltage range is from 2.5V to
12V. It is recommended to connect at least one 10μF
ceramic capacitor between VCC and GND, as close as
possible to the VCC pin of the device.
Power Supply
Inductance
VCC
Parasitic Wire
Inductance
Bypass
Capacitor
Motor
Driver
+
-
GND
Power Supply
Motor Driver System
Figure 6. Setup of Motor Drive System with External Power Supply
SG Micro Corp
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AUGUST 2022
10
SGM42633
Dual H-Bridge Motor Driver
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
AUGUST 2022 ‒ REV.A.2 to REV.A.3
Page
Updated Detailed Description section................................................................................................................................................................All
AUGUST 2021 ‒ REV.A.1 to REV.A.2
Page
Updated Electrical Characteristics section...........................................................................................................................................................5
JULY 2021 ‒ REV.A to REV.A.1
Page
Updated Electrical Characteristics section.......................................................................................................................................................4, 5
Changes from Original (DECEMBER 2019) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
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AUGUST 2022
11
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-16 (Exposed Pad)
3.0
D
D1
2.3
E1
E
E2
5.94
1.78
0.42
e
b
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
H
c
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.043
0.006
0.039
0.012
0.008
0.201
0.122
0.177
0.258
0.094
A
A1
A2
b
1.100
0.150
1.000
0.300
0.200
5.100
3.100
4.500
6.550
2.400
0.050
0.800
0.190
0.090
4.900
2.900
4.300
6.250
2.200
0.002
0.031
0.007
0.004
0.193
0.114
0.169
0.246
0.087
c
D
D1
E
E1
E2
e
0.650 BSC
0.25 TYP
0.026 BSC
0.01 TYP
L
0.500
1°
0.700
7°
0.02
1°
0.028
7°
H
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00024.000
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TQFN-3×3-16L
D
e
N16
N1
L
D1
E
E1
k
N5
b
BOTTOM VIEW
TOP VIEW
1.7
0.7
A
3.6 2.2 1.7
A1
A2
SIDE VIEW
0.5
0.24
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
2.900
1.600
2.900
1.600
3.100
1.800
3.100
1.800
0.114
0.063
0.114
0.063
0.122
0.071
0.122
0.071
D1
E
E1
k
0.200 MIN
0.500 TYP
0.008 MIN
0.020 TYP
b
0.180
0.300
0.300
0.500
0.007
0.012
0.012
0.020
e
L
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00081.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TSSOP-16
(Exposed Pad)
13″
13″
12.4
12.4
6.90
3.35
5.60
3.35
1.50
1.13
4.0
4.0
8.0
8.0
2.0
2.0
12.0
12.0
Q1
Q2
TQFN-3×3-16L
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
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