SGM61220 [SGMICRO]
4.5V to 28V Input, 2A Output, Synchronous Buck Converter;
| 型号： | SGM61220 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 4.5V to 28V Input, 2A Output, Synchronous Buck Converter |
| 文件： | 总17页 (文件大小：1386K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM61220
4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
GENERAL DESCRIPTION
FEATURES
● Wide 4.5V to 28V Input Voltage Range
● 2A Continuous Output Current
● Integrated 66mΩ/36mΩ Power MOSFETs
● Low Quiescent Current: 25μA (TYP)
● Shutdown Current: 2μA (TYP)
The SGM61220 is a synchronous Buck converter with a
wide input voltage range of 4.5V to 28V. This device can
deliver up to 3A to the output over a wide input voltage.
It is an easy-to-use device with power switches and peak
current mode control compensation all integrated in a
small 6-pin package. A typical 5ms soft-start ramp is also
included to minimize the inrush current.
● 5ms Internal Soft-Start Time
● Fixed 410kHz Switching Frequency
● Pulse Skip Mode and PWM Mode
● Peak Current Mode Control
This device employs cycle-by-cycle peak current limit,
output over-voltage protection and thermal shutdown
with auto recovery. The current limit is implemented for
both switches and has foldback feature to prevent
overheating (and thermal shutdown) when an output short
is detected. Auto recovery after over-current, output short,
overheating or over-voltage fault maintains the system
operational with no shutdown.
● Internal Loop Compensation
● Over-Current Protection for Both MOSFETs
● Output Over-Voltage Protection
● Adjustable Input Under-Voltage Lockout
● Thermal Shutdown with Auto Recovery
● Available in a Green TSOT-23-6 Package
This converter has a fixed 410kHz switching frequency
that minimizes the EMI noise problems. However the
actual frequency drops during PSM (pulse skip mode)
to maximize efficiency at light load. It also drops in
some fault conditions.
APPLICATIONS
12V Distributed Power Supply Buses
Industrial and Consumer Applications
White Goods
Audio Equipment
The SGM61220 is available in a Green TSOT-23-6
package.
Set Top Boxes
Digital Television Printers
TYPICAL APPLICATION
BOOT
VIN
VIN
CBOOT
VOUT
CIN
SW
L
SGM61220
COUT
RFB1
EN
FB
GND
RFB2
Figure 1. Typical Application Circuit
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM61220
TSOT-23-6
SGM61220XTN6G/TR
R47XX
Tape and Reel, 3000
-40℃ to +125℃
MARKING INFORMATION
NOTE: XX = Date Code.
YYY X X
Date Code - Week
Date Code - Year
Serial Number
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Input Voltage Range.......................................... -0.3V to 30V
EN and BOOT-SW Voltages................................ -0.3V to 6V
SW Voltage........................................................ -0.3V to 30V
SW (20ns transient) Voltage................................. -5V to 30V
FB Voltage........................................................ -0.3V to 3.5V
Package Thermal Resistance
TSOT-23-6, θJA ........................................................ 123℃/W
RθJC(TOP) ................................................................... 45℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
HBM.............................................................................2000V
CDM ............................................................................1500V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range............................................4.5V to 28V
EN and BOOT-SW Voltages............................. -0.1V to 5.5V
SW Voltage........................................................ -0.1V to 28V
FB Voltage........................................................... -0.1V to 3V
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
PIN CONFIGURATION
(TOP VIEW)
GND
SW
1
2
3
6
5
4
BOOT
EN
VIN
FB
TSOT-23-6
PIN DESCRIPTION
PIN
NAME
TYPE
DESCRIPTION
1
GND
–
Device Ground Reference Pin.
Switching Node. Connection point of the internal converter lower and upper power MOSFETs.
Connect this pin to the output inductor and the bootstrap capacitor.
2
3
SW
VIN
O
–
Input Supply Voltage Pin. VIN powers the internal control circuitry and the power converter.
Decouple this pin for very high frequency and high di/dt transitions, with small and high
frequency ceramic capacitors placed as close as possible between VIN and GND pins. Input
under-voltage is protected by a UVLO comparator.
Feedback (Sense) Pin for Output Voltage and Programming. It is normally regulated at
0.603V. Tap an output feedback resistor divider to this pin.
4
5
FB
EN
I
I
Device Enable Pin. Device will operate if EN voltage is high and will shut down if it is low.
Device will be enabled if this pin is left float. EN pin can be used to increase the UVLO
thresholds.
Bootstrap Pin. Place a 0.1µF capacitor (CBOOT) between BOOT and SW pins close to the
device to provide the required drive voltage for the high-side switch. Do not place any series
6
BOOT
O
resistor with CBOOT
.
NOTE: O = Output, I = Input.
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
ELECTRICAL CHARACTERISTICS
(TJ = -40℃ to +125℃, VIN = 4.5V to 28V, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
V
Input Voltage Range
VIN
IQ
4.5
28
Non-Switching Quiescent Current
Shutdown Supply Current
VEN = 5V, VFB = 1V
EN = GND
Rising
25
2
µA
ISD
VIH
VIL
IIL
µA
1.19
1.10
0.45
1.44
1.33
EN Terminal Input Threshold
EN Terminal Leakage Current
V
Falling
0.93
VEN = 0.5V
VEN = 1.5V
μA
IIH
Feedback and Error Amplifier
Feedback Voltage
VFB
0.585
0.603
0.620
V
VIN = 12V, TJ = +25℃
Power Stage
High-side FET On-Resistance
Low-side FET On-Resistance
Current Limit
RDSON_HS VBOOT - VSW = 5V
RDSON_LS VIN = 12V
66
36
116
63
mΩ
mΩ
High-side Current Limit
Low-side Current Limit
Input Under-Voltage Lockout
ILIM_HS
ILIM_LS
3.2
3.4
3.8
2.2
4.5
4.5
A
A
Maximum inductor peak current, TJ = +25℃
Maximum inductor valley current, TJ = +25℃
Rising VIN
Falling VIN
4.1
3.7
400
UVLO Threshold Voltage
VUVLO
V
UVLO Hysteresis
VUVLO_HYS
mV
Over-Temperature Protection
Thermal Shutdown
TSHDN
THYS
Rising temperature
165
10
℃
℃
Thermal Shutdown Hysteresis
Oscillator
Switching Frequency
Timing Requirements
Soft-Start Time
fSW
340
410
5
480
kHz
ms
tSS
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
TYPICAL PERFORMANCE CHARACTERISTICS
TJ = +25℃, VIN = 4.5V to 28V, unless otherwise noted.
Quiescent Current vs. Junction Temperature
VIN = 12V
Shutdown Current vs. Junction Temperature
VIN = 12V
60
50
40
30
20
10
0
6
5
4
3
2
1
0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Junction Temperature (℃)
Junction Temperature (℃)
RDSON_HS vs. Junction Temperature
VIN = 12V
RDSON_LS vs. Junction Temperature
VIN = 12V
140
120
100
80
140
120
100
80
60
60
40
40
20
20
0
0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Junction Temperature (℃)
Junction Temperature (℃)
Efficiency vs. Output Current
Feedback Voltage Production Distribution
100
90
80
70
60
50
40
30
20
10
0
25
20
15
10
5
12660 Samples
1 Production Lot
VIN = 12V
V
IN = 24V
VOUT = 5.0V
0.001 0.01
0
0.1
1
10
Output Current (A)
VFB (V)
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TJ = +25℃, VIN = 4.5V to 28V, unless otherwise noted.
Line Regulation
Load Regulation
0.5
0.4
0.5
0.4
0.3
0.3
0.2
0.2
0.1
0.1
0.0
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.1
-0.2
-0.3
-0.4
-0.5
VIN = 12V
IN = 24V
V
6
8
10 12 14 16 18 20 22 24 26 28
0.0
0.5
1.0
1.5
2.0
Input Voltage (V)
Output Current (A)
Switching Frequency vs. Ambient Temperature
VIN = 12V
Feedback Voltage vs. Ambient Temperature
VIN = 12V
440
430
420
410
400
390
380
0.608
0.606
0.604
0.602
0.600
0.598
0.596
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature (℃)
Ambient Temperature (℃)
UVLO Threshold Voltage vs. Junction Temperature
EN Terminal Input Threshold vs. Junction Temperature
VIN = 28V
4.4
4.3
4.2
4.1
4.0
3.9
3.8
3.7
3.6
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
Rising VIN
VIH
VIL
Falling VIN
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Junction Temperature (℃)
Junction Temperature (℃)
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TJ = +25℃, VIN = 24V, VOUT = 5V, CIN = 10μF, COUT = 2 × 22μF, unless otherwise noted.
Power On
Power Off
RLOAD = 500Ω
RLOAD = 500Ω
VIN
VIN
VOUT
VOUT
Time (5ms/div)
Turn On
Time (50ms/div)
Turn Off
RLOAD = 500Ω
RLOAD = 500Ω
VIN
VIN
EN
EN
VOUT
VOUT
Time (2ms/div)
Time (10ms/div)
Load Transient Response
Load Transient Response
IOUT = 0.1A to 1.0A, 0.25A/μs
IOUT = 0.75A to 1.75A, 0.25A/μs
AC Coupled
AC Coupled
VOUT
VOUT
IOUT
IOUT
Time (200μs/div)
Time (200μs/div)
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TJ = +25℃, VIN = 24V, VOUT = 5V, CIN = 10μF, COUT = 2 × 22μF, unless otherwise noted.
Input Voltage Ripple
Output Voltage Ripple
EN = Floating, IOUT = 600mA
EN = Floating, IOUT = 0mA
AC Coupled
AC Coupled
VIN
VOUT
VSW
VSW
Time (2μs/div)
Time (4ms/div)
Output Voltage Ripple
Output Voltage Ripple
EN = Floating, IOUT = 10mA
EN = Floating, IOUT = 100mA
AC Coupled
AC Coupled
VOUT
VOUT
VSW
VSW
Time (40μs/div)
Time (4μs/div)
Output Voltage Ripple
EN = Floating, IOUT = 1.5A
AC Coupled
VOUT
VSW
Time (2μs/div)
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
FUNCTIONAL BLOCK DIAGRAM
VIN
HS Current
Sensor
OV
Voltage
UVLO
Thermal
Sensor
Boot Regulator
HS Driver
BOOT
Reference
HS Current
Comparator and
Limit
+
-
FB
Slope
Compensation
Control Logic
SW
Soft-Start
Oscillator
LS Driver
EN
LS Current Limit
SGM61220
GND
Figure 2. Block Diagram
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
DETAILED DESCRIPTION
maximize power and limit the maximum peak current in
high-side and valley current in low-side, the device
keeps in cycle-by-cycle limit to obtain the system’s
power request. The SGM61220 does not shut down
until the device heats and then goes to thermal
shutdown. The load increase, the output voltage goes
low, if the output voltage drops to 20%, the device will
go into short protection. It reduces current limit
threshold and the switching frequency goes down due
to reduce power dissipation and device goes into
thermal shutdown. When the output current is low
enough, the device goes into PFM mode.
Overview
The SGM61220 is a 28V/2A synchronous Buck
converter with over-current, short-circuit and thermal
shutdown with auto recovery. Figure 2 shows the
simplified block diagram of the SGM61220. The two
integrated MOSFET switches of the power stage
(66mΩ high-side and 36mΩ low-side) can provide up to
2A of continuous current with high efficiency.
The device is powered up when VIN exceeds the UVLO
threshold (4.1V TYP). At no load and with no switching,
the typical operating current is 25μA and when the
device is disabled by EN pin, it is only 2µA (TYP). The
internal loop compensation minimizes the BOM cost and
simplifies the design. The inrush current is also limited
by an internal 5ms soft-start ramp.
Pulse Skip Mode (PSM) and PWM Mode
In light load, OVP does not occur and the device can
operate in the normal PWM mode, but to improve light
load efficiency, the device is designed to skip some
pulses by entering to the PSM mode. When the peak
current is lower than 500mA typically, the device enters
PSM. In PSM, when the output voltage is detected to
be above the internal voltage reference level of the
error amplifier, the high-side MOSFET is kept off for a
few cycles (skipping clock pulses) by clamping current
reference until the output voltages are discharged
below the internal voltage reference level. Note that the
integrated current comparator operates based on the
peak inductor current and the average load current may
vary depending on the output filters and load type.
Operating Principle
Peak current mode (PCM) control is used in the
SGM61220 to regulate the output voltage. VOUT is
sensed by the external resistor divider on the FB pin
and compared to the internal 0.603V reference voltage
by a trans-conductance error amplifier. The error
amplifier (EA) output (current) is fed to the internal
compensation components between the EA output and
GND to generate a voltage that is used as the peak
current reference for comparing with the sensed
high-side switch current. The output of this comparator
(COMP) can reset the flipflop that controls the switches.
This flipflop receives fixed frequency clock pulses from
the internal 410kHz oscillator. In the normal operation
the high-side switch is turned on in the beginning of
each switching cycle. The current in the high-side
switch starts to rise until the peak current reference is
reached that resets the flipflop. This will turn off the
high-side switch and turn on the low-side switch. The
low-side switch stays on until the end of the cycle.
Enable Pin and UVLO Adjustment
The EN pin can be used to turn the device on and off or
to change the UVLO thresholds. The device is enabled
when the EN pin voltage exceeds its high threshold. A
low EN voltage disables the device brings it to the
low-quiescent (IQ) state.
The EN pin is internally pulled up by a small current
source (IP) so the device is enabled if EN pin is floated.
An open drain or open collector output can be used to
control the EN pin.
Slope Compensation
Peak current mode-controlled devices in general are
subject to sub-harmonic oscillation instability at higher
duty cycles (typically > 50%). To avoid this instability a
compensating ramp signal is used. The ramp starts
from zero in the beginning of each cycle with a specific
slop and is added to the sensed high-side switch
current before it is compared to the peak current
reference.
VIN is monitored by the internal under-voltage lockout
circuit and if it is below UVLO threshold, the device is
disabled. The internal UVLO has a 400mV hysteresis. If
higher thresholds are needed, EN pin can be used as
shown in Figure 3.
The EN pull-up current is used to set the hysteresis.
The pull-up current is increased by IIH - IIL when the EN
pin exceeds its high threshold. Use Equations 1 and 2
to calculate the R1 and R2 values for the desired UVLO
low (VUV_L) and high (VUV_H) thresholds.
Anti-High-Overload Mode
The SGM61220 supports overload mode. When the
output current continues overload while the system
power up or in turbo mode, the SGM61220 exports the
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
DETAILED DESCRIPTION (continued)
VUV _H × V − VUV _L × V
voltage begins to rise from near 0V to slightly above
0.603V with a ramp time of 5ms. The lower of VREF and
this ramp is used as reference for the error amplifier,
therefore during startup the ramp provides a soft-start
for the output. The soft-start is needed to avoid high
inrush currents caused by rapid increase of output
voltage across output capacitors and the load. Without
a soft-start the current limiting protections could trigger
that interrupts the monotonic rising of the load voltage
that may result in instability or improper system
initialization.
IL
IH
(1)
R1 =
I × V −I × V
IH
IH
IL
IL
R1 × V
IL
(2)
R2 =
VUV _L − V + R1 ×I
IL
IH
where:
IIL = 0.45μA (TYP)
IIH= 1.44μA (TYP)
VIL = 1.10V (TYP)
VIH = 1.19V (TYP)
VIN
Bootstrap Voltage (BOOT)
SGM61220
IH = IIH - IIL
To power the upper switch gate driver, a voltage higher
than VIN is needed. Bootstrapping technique is used to
provide this voltage from the switching node by using a
0.1µF bootstrap capacitor between SW and BOOT pins
along with an internal bootstrap diode. The voltage is
internally regulated for driving the high-side switch. An
X5R or X7R ceramic capacitor is recommended for
CBOOT to have stable capacitance against temperature
and voltage variations. To improve drop out, the device
is designed to operate at 100% duty cycle.
R1
IIL
EN
R2
Output Short-Circuit Protection
When the output voltage down to 20% of set value, the
device goes into short-circuit mode, and a foldback
mode will limit the current output. The high-side peak
current limit to 2.4A (TYP) and the valley current limit to
1.4A (TYP), then it avoids the device thermal shutdown
by the power dissipation.
Figure 3. Adjustable VIN Under-Voltage Lockout
Output Voltage Programming
The output voltage is set by a resistor divider between
VOUT and GND that is tapped to the FB pin. It is
recommended to use resistors with 1% tolerance or
better because it directly affects the output accuracy.
Use Equation 3 and Figure 1 to calculate the output
voltage. To improve efficiency at light load consider
larger resistors. Start with 100kΩ for the upper resistor
(RFB1). Note that if RFB1||RFB2 is too high, the FB pin
leakage current and other noises can easily affect the
accuracy and performance of the regulator.
A short-circuit is detected when VFB falls below 0.12V
(TYP). In this condition the current limits of both
switches are internally reduced to less than half of the
normal value (foldback). This will reduce the constant
output current during an output short and prevents
overheating. During the soft-start period there is no
foldback and the current limits are normal.
Output Over-Voltage Protection (OVP)
An over-voltage protection is included in the device to
minimize the output voltage overshoots that may occur
after recovery from an output fault or a large unloading
transient. The FB pin voltage is compared with the OVP
thresholds. If the VFB exceeds 108% of the VREF, the
high-side switch is forced to turn off. When the VFB falls
below 104%, the high-side switch is allowed to turn on
again.
RFB1
RFB2
(3)
VOUT = VFB
×
+1
Internal Voltage Reference and Soft-Start
The SGM61220 device has an internal 0.603V
reference (VREF) to program the output at the desired
level. The output voltage is determined by the
reference voltage seen by the error amplifier. When the
converter starts (or is enabled), an internal ramp
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
DETAILED DESCRIPTION (continued)
low-side current-limit (ILIM_LS). If the inductor valley
current exceeds the low-side current limit, the high-side
MOSFET will not turn on in the next cycle and the
low-side MOSFET continues to conduct (cycle skipped).
The high-side switch turns on again when the valley
current falls below ILIM_LS at the start of another cycle.
Over-Current Protection (OCP)
The device is protected from over-current conditions by
cycle-by-cycle current limiting on both high-side and
low-side MOSFETs.
High-side MOSFET Over-Current Protection
The internal peak current mode controller provides an
inherent current limiting capability for the high-side
switch on a cycle-by-cycle basis. When high-side
switch current exceeds peak current limit threshold,
high-side switch is turned off, until the next cycle.
During an over-current fault, the above limits cause
cycle skipping that slows down the switching frequency
and reduces the output voltage (due to reduced duty
cycle).
Thermal Shutdown
Low-side MOSFET Over-Current Protection
The low-side MOSFET current is also monitored for
over-current protection. Normally this MOSFET
sources current to the load (source to drain direction)
while the inductor current is decreasing. At the end of
each cycle, this current is compared to the preset
If the junction temperature exceeds +165℃ (TYP), the
device is forced to stop switching. It will recover
automatically when TJ falls below the recovery threshold.
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4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
APPLICATION INFORMATION
BOOT
CBOOT
0.1μF
SGM61220
L
V
IN = 24V
VOUT = 5V, 2A
VIN
SW
10μH
R1
500kΩ
C1
10μF
C2
0.1μF
C3
22μF
C4
22μF
RFB1
100kΩ
EN
FB
R2
RFB2
100kΩ
GND
13.3kΩ
Figure 4. A Reference Design for 5V, 2A Application
Design Requirements
A 10pF feedforward capacitor is optioned to improve the response.
When the output is shorted, a large input capacitor is required to ensure that the output voltage ripple is lower than
1V, otherwise the device may not be stable.
To reduce the output ripple and keep the device stable, the output capacitor must be large. The recommended
value should not be lower than 22μF + 22μF, and a 100μF output capacitor will be very helpful for reducing ripple.
0.1% RFB1, RFB2 will be chosen to improve the output voltage precision, if it is needed.
In order to obtain a small VOUT ripple, it is recommended that the VIN is higher than 7V when the VOUT is 5V, and the
VIN is lower than 20V when the VOUT is 1.8V.
Layout Guide
Layout guide schematic for PCB Layout.
J1
VIN
TP1
VIN
8V~28V
3
5
4
6
2
1
VIN
BOOT
SW
C4
0.1μF
C1
10μF
C2
0.1μF
R4
510kΩ
100μF/35V
J3
VOUT
Optional
TP2
VOUT
SGM61220
EN
L
10μH 5A
J2
GND
C5
22μF
C6
22μF
C7
NC
TP3
SW
5V/2A
EN
FB
GND
2
1
TP4
GND
TP5
GND
R2 100kΩ
J4
GND
JP1
R1 49.9Ω
R5
105kΩ
R3
13.3kΩ
C3
10pF
Figure 5. Schematic for PCB Layout
SG Micro Corp
www.sg-micro.com
APRIL 2022
13
4.5V to 28V Input, 2A Output,
Synchronous Buck Converter
SGM61220
APPLICATION INFORMATION (continued)
Figure 6. PCB Top Layer
Figure 7. PCB Bottom Layer
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
APRIL 2022 ‒ REV.A to REV.A.1
Page
Updated the Absolute Maximum Ratings and Layout Guide sections............................................................................................................. 2, 13
Changes from Original (NOVEMBER 2020) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
APRIL 2022
14
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSOT-23-6
0.69
0.95
D
e
2.59
E1
E
0.99
b
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
θ
0.25
A1
c
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.043
0.004
0.039
0.020
0.008
0.116
0.065
0.116
A
A1
A2
b
1.000
0.100
0.900
0.500
0.200
2.950
1.650
2.950
0.000
0.700
0.300
0.080
2.850
1.550
2.650
0.000
0.028
0.012
0.003
0.112
0.061
0.104
c
D
E
E1
e
0.950 BSC
0.037 BSC
L
0.300
0°
0.600
8°
0.012
0°
0.024
8°
θ
SG Micro Corp
www.sg-micro.com
TX00038.001
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TSOT-23-6
7″
9.5
3.20
3.10
1.10
4.0
4.0
2.0
8.0
Q3
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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