SGM6611C [SGMICRO]
12.6V, 7A Fully-Integrated Synchronous Boost Converter;
| 型号： | SGM6611C |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 12.6V, 7A Fully-Integrated Synchronous Boost Converter |
| 文件： | 总20页 (文件大小：973K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM6611C
12.6V, 7A Fully-Integrated
Synchronous Boost Converter
GENERAL DESCRIPTION
FEATURES
The SGM6611C is a fully-integrated synchronous Boost
converter. The 2.7V to 12V operating input voltage is
suitable for single-cell or two-cell Li-Ion/Polymer
batteries. This device is capable of providing 7A
continuous switch current and an output voltage range
of 4.5V to 12.6V.
● 2.7V to 12V Input Voltage Range
● 4.5V to 12.6V Output Voltage Range
● Up to 90% Efficiency
(VIN = 3.3V, VOUT = 9V and IOUT = 1.5A)
● Adjustable Peak Current Limit up to 9.5A for
High Pulse Current
The SGM6611C has two operation modes, the pulse
width modulation (PWM) mode and pulse frequency
modulation (PFM). The PWM mode is applied at
moderate to heavy load. The PFM mode is applied at
light load to improve the efficiency. The protection
features include output over-voltage protection at 13.2V,
cycle-by-cycle over-current protection and thermal
shutdown. The device also involves the functions of
4ms built-in soft-start and adjustable switch peak
current limit.
● 1.1MHz Fixed Switching Frequency (PWM Mode)
● 4ms Built-in Soft-Start
● PFM Operation Mode at Light Load
● 13.2V Internal Output Over-Voltage Protection
● Cycle-by-Cycle Over-Current Protection
● Thermal Shutdown
● Available in a Green TQFN-2×2.5-11L Package
APPLICATIONS
The SGM6611C is available in a Green TQFN-2×2.5-
11L package.
Portable POS Machine
Bluetooth Speaker
E-Cigarette
Fast-Charging Power Bank
TYPICAL APPLICATION
C4
BOOT
L
VIN
VOUT
VOUT
GND
SW
C1
(CIN)
C2
(COUT
)
VIN
EN
R1
R2
SGM6611C
ON
OFF
C6
FB
COMP
VCC
ILIM
R5
C5
R4
(RILIM
C3
)
Figure 1. Typical Application Circuit
SG Micro Corp
www.sg-micro.com
DECEMBER2022–REV. B.2
12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
6611C
XXXXX
SGM6611C
TQFN-2×2.5-11L
SGM6611CYTQV11G/TR
Tape and Reel, 3000
-40℃ to +85℃
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
BOOT Voltage ........................................... -0.3V to VSW + 6V
VIN, SW, VOUT Voltages................................ -0.3V to 14.5V
EN, VCC, COMP, ILIM, FB Voltages.................... -0.3V to 6V
SW Node (Transient: 10ns) ............................... -2V to 16.5V
Package Thermal Resistance
TQFN-2×2.5-11L, θJA ................................................. 60℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range........................-65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................1500V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range ............................................2.7V to 12V
Output Voltage Range ......................................4.5V to 12.6V
Inductance, Effective Value, L...................... 0.47μH to 2.2μH
Input Capacitance, Effective Value, CIN ............... 10μF (MIN)
Output Capacitance, Effective Value, COUT ...10μF to 1000μF
Operating Junction Temperature Range......-40℃ to +125℃
Operating Ambient Temperature Range.........-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
2
12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
PIN CONFIGURATION
(TOP VIEW)
SW
NC
1
2
3
4
10
9
BOOT
VIN
11
VCC
FB
8
ILIM
EN
5
6
COMP
7
GND
VOUT
TQFN-2×2.5-11L
PIN DESCRIPTION
PIN
1
NAME
NC
I/O
I
FUNCTION
No Connection.
Output of the Internal Regulator. The VCC pin connects a ceramic capacitor (> 1.0μF) to
ground.
2
VCC
FB
O
I
3
Feedback Output Pin.
Output of the Internal Error Amplifier. Connect a loop compensation network between COMP
pin and the GND pin.
4
COMP
GND
VOUT
EN
O
-
5
Ground.
6
O
I
Boost Converter Output.
Enable Logic Input. Logic high makes the circuit enabled, and logic low makes it disabled
and the device enters shutdown mode.
7
Adjustable Switch Peak Current Limit. Connect an external resistor between ILIM pin and the
GND pin.
8
ILIM
VIN
O
I
9
IC Power Supply Input.
Power Supply for High-side MOSFET Gate Driver. Connect a capacitor between the BOOT
pin and the SW pin.
10
11
BOOT
SW
O
I
Switching Node Pin. Drain connection of low-side power MOSFET and source connection of
the high-side power MOSFET.
NOTE: I = input, O = output.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
3
12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
ELECTRICAL CHARACTERISTICS
(VIN = 2.7V to 5.5V, VOUT = 9V. Full = -40℃ to +85℃, typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Power Supply
Input Voltage Range
VIN
Full
+25℃
Full
2.7
12
2.62
2.7
V
V
2.5
2.5
2.4
100
5
VIN rising
VIN falling
VIN Under-Voltage Lockout Threshold
VIN_UVLO
+25℃
+25℃
+25℃
+25℃
+25℃
Full
VIN Under-Voltage Lockout Hysteresis
VCC Regulation
VIN_HYS
VCC
VCC_UVLO VCC falling
mV
V
ICC = 5mA, VIN = 8V
VCC Under-Voltage Lockout Threshold
2.1
0.23
0.23
90
V
0.4
0.5
130
160
1.1
1.5
VIN Pin
IC enabled, no load, VFB = 1.3V,
OUT = 12V
Operating Quiescent Current
IQ
μA
μA
V
+25℃
Full
VOUT Pin
90
0.6
0.6
+25℃
Full
Shutdown Current into the VIN Pin
ISHDN
VIN = 3.6V, IC disabled
Output
Output Voltage Range
VOUT
VREF
Full
Full
4.5
12.6
V
V
PWM mode
PFM mode
VFB = 1.2V
VOUT rising
1.181
1.205
1.207
10
1.229
Reference Voltage at the FB Pin
+25℃
+25℃
Full
Leakage Current into the FB Pin
IFB_LKG
VOVP
100
nA
V
Output Over-Voltage Protection Threshold
Output Over-Voltage Protection Hysteresis
Soft Startup Time
12.95
13.2
0.15
4
13.55
VOVP_HYS VOUT falling below VOVP
V
+25℃
+25℃
tSS
COUT (effective) = 47μF, IOUT = 0A
ms
Error Amplifier
COMP Pin Sink Current
ISINK
ISOURCE
VCCLPH
VCCLPL
GEA
VFB = VREF + 100mV, VCOMP = 1.2V
VFB = VREF - 100mV, VCOMP = 1.2V
VFB = 1.1V, RILIM = 127kΩ
VFB = 1.3V, RILIM = 127kΩ
VCOMP = 1.2V
120
15
μA
μA
V
+25℃
+25℃
+25℃
+25℃
+25℃
COMP Pin Source Current
High Clamp Voltage at the COMP Pin
Low Clamp Voltage at the COMP Pin
Error Amplifier Transconductance
Power Switch
2
0.4
135
V
μS
27
27
15
15
34
44
20
26
+25℃
Full
High-side MOSFET On-Resistance
V
CC = 5V
mΩ
mΩ
RDS(ON)
+25℃
Full
Low-side MOSFET On-Resistance
Switching Frequency
VCC = 5V
980
930
1100
1100
120
1270
1320
+25℃
Full
Switching Frequency
fSW
kHz
ns
Minimum On-Time
tON_MIN
VCC = 5V
+25℃
Current Limit
Switch Peak Current Limit
Reference Voltage at the ILIM Pin
ILIM
RILIM = 127kΩ
8.5
9.5
10.8
A
V
+25℃
+25℃
VILIM
1.205
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 2.7V to 5.5V, VOUT = 9V. Full = -40℃ to +85℃, typical values are at TJ = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
EN Logic Input
EN Logic High Threshold
EN Logic Low Threshold
EN Pull-Down Resistor
VENH
VENL
REN
Full
Full
1.2
V
V
0.4
800
kΩ
+25℃
Thermal Shutdown
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
TSD
TJ rising
TJ falling below TSD
160
20
℃
℃
TSD_HYS
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS
At TJ = +25℃, VIN = 3.6V, VOUT = 9V, unless otherwise noted.
Efficiency vs. Output Current
Efficiency vs. Output Current
VOUT = 9V
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
VIN = 3.6V
VIN = 3V
VOUT = 5V
V
V
IN = 3.6V
IN = 4.2V
V
V
OUT = 9V
OUT = 12V
0.0001
0.001
0.01
0.1
1
10
0.0001
0.001
0.01
0.1
1
10
Output Current (A)
Output Current (A)
Current Limit vs. Setting Resistance
Reference Voltage vs. Temperature
12
10
8
1.220
1.215
1.210
1.205
1.200
1.195
1.190
1.185
1.180
6
4
2
120 160 200 240 280 320 360 400
-40 -20
0
20 40 60 80 100 120 140
Resistance (kΩ)
Temperature (℃)
Shutdown Current vs. Temperature
Quiescent Current vs. Temperature
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (℃)
Temperature (℃)
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TJ = +25℃, VIN = 3.6V, VOUT = 9V, unless otherwise noted.
Switching Waveforms in DCM
Switching Waveforms in CCM
AC Coupled
AC Coupled
VOUT
VOUT
IL
IL
VSW
VSW
VIN = 3.6V, VOUT = 9V, IOUT = 2A
VIN = 3.6V, VOUT = 9V, IOUT = 200mA
Time (500ns/div)
Time (500ns/div)
Load Transient Response
Line Transient Response
IOUT
VIN
AC Coupled
AC Coupled
VOUT
VOUT
VIN = 3.6V, VOUT = 9V, IOUT = 1A to 2A
VIN = 3.3V to 4V, VOUT = 9V, IOUT = 1A
Time (500μs/div)
Time (500μs/div)
Startup Waveforms
Shutdown Waveforms
VEN
VEN
VOUT
VOUT
IL
IL
Time (1ms/div)
Time (200μs/div)
SG Micro Corp
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TJ = +25℃, VIN = 3.6V, VOUT = 9V, unless otherwise noted.
Switching Waveforms in PFM Mode
Maximum Output Current vs. Input Voltage
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
AC Coupled
VOUT = 5V
V
V
OUT = 9V
OUT = 12V
VOUT
IL
VSW
VIN = 3.6V, VOUT = 9V, IOUT = 20mA
Time (5μs/div)
2.5
3.0
3.5
4.0
4.5
Input Voltage (V)
SG Micro Corp
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
FUNCTIONAL BLOCK DIAGRAM
L
CBOOT
SW
BST
VIN
VOUT
CIN
VREF
VIN
COUT
Gate
Drivers
VCC
VCC
CL
Regulator
VOUT
ILIM
CVCC
R4
(RILIM
)
CL
PWM
Control
R1
CLOCK
ON
Logic,
FB
Thermal Shutdown,
OCP, OVP
EN
OFF
R2
VREF
Soft-Start
COMP
RCOMP
CCOMP
GND
Figure 2. Block Diagram
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
9
12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
DETAILED DESCRIPTION
The SGM6611C is a synchronous Boost converter with
two integrated power FETs and is capable of delivering
up to 9.5A (TYP) switch current. The device adopts the
1.1MHz fixed frequency peak current mode control
architecture to regulate the output voltage. The
SGM6611C automatically operates in pulse frequency
modulation (PFM) mode at light load to improve the
efficiency. As the load current increases, the device
enters PWM operation to provide a fixed switching
frequency. The device can offer excellent line and load
transient responses, in addition, the compensation
network is configured externally which brings flexibility
to applications with different output capacitor and
inductor selections. The device also implements
various protection features such as cycle-by-cycle
current limit for abnormal load conditions, output
over-voltage protection and thermal shutdown.
pin and ground, and ILIM is the peak current limit.
When ILIM is 9.5A (TYP), the value of the resistor is
127kΩ.
Soft-Start
The SGM6611C implements internal soft-start function
of 4ms (TYP). When enabled, the device slowly ramps
the reference voltage to prevent large inrush current
during startup.
Over-Voltage Protection (OVP)
The device implements over-voltage protection to
prevent the device from damage and protect the device
connected to the output of SGM6611C. When the
voltage present on the VOUT pin exceeds 13.2V (TYP),
the device stops switching immediately to prevent the
output voltage from rising. As the output voltage drops
below 150mV (TYP) of hysteresis voltage that is lower
than the OVP threshold, the device resumes operation.
Enable and Disable
The input voltage applied to SGM6611C needs to be
higher than the maximum UVLO threshold of 2.5V and
the EN pin voltage is higher than 1.2V to enable the
device. Pulling the EN pin below 0.4V disables the
device, where all internal blocks are turned off, and no
voltage is present on VCC pin. While disabled, the
device stops switching and enters shutdown mode with
less than 1.1μA current consumed. VIN and VOUT are
connected through the body diode of the high-side
rectifier FET in the shutdown mode.
Under-Voltage Lockout (UVLO)
An under-voltage lockout (UVLO) circuit prevents the
device from malfunctioning at low input voltage and the
battery from excessive discharge. The SGM6611C has
both VIN UVLO function and VCC UVLO function. It
disables the device from switching when the falling
voltage at the VIN pin trips the UVLO threshold VIN_UVLO
which is typically 2.4V. The input UVLO function
implements a 100mV hysteresis to prevent the false
turn-on due to line voltage variations, where the device
cannot be turned on until the input voltage increases to
2.5V or higher. When the falling voltage at the VCC pin
trips the UVLO threshold VCC_UVLO, typically 2.1V, the
device is also disabled.
,
Adjustable Peak Current Limit
The peak current mode control provides inherent
over-current protection as the device monitors the
changes of inductor current. As the peak current
reaches 9.5A (TYP), the device stops switching and
turning off the low-side FET to stop inductor current to
rise. The peak current limit threshold is programmable
via a resistor connected on ILIM pin to ground. Use
Equation below to calculate the desired current limit
threshold.
Thermal Shutdown
A thermal shutdown function is implemented to prevent
damage caused by excessive heat and power
dissipation. Once a junction temperature of +160℃
(TYP) is exceeded, the device is shut down. The device
is released from shutdown automatically when the
1.2×106
RILIM
(1)
ILIM
=
junction temperature decreases by 20℃.
where RILIM is the resistor connected between the ILIM
SG Micro Corp
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
DETAILED DESCRIPTION (continued)
amplifier reaches a voltage that is corresponds to
Device Functional Modes
I
LIM/10. The output of the error amplifier is clamped at
this value and no longer decreases. The SGM6611C
automatically adjusts the off-time in PFM mode to meet
the load demand, and lower load current results in
longer off-time. The output voltage is regulated to 0.2%
higher than the nominal programmed output voltage at
PFM mode. The SGM6611C is capable of achieving
above 70% efficiency when the load current is less than
1mA. Output voltage ripple is also lower in PFM mode
since the peak inductor current is lower.
Operation
The SGM6611C adopts the fixed frequency pulse width
modulation (PWM) mode in moderate to heavy load
condition. At the start of each clock cycle, the low-side
power FET is turned on to ramp up the inductor current
until the inductor current reaches the level determined
by the output of the internal error amplifier. When the
current is reached, LS FET is turned off, and a dead
time is issued which is used to prevent shoot-through.
During the dead time, the inductor current flows
through the body diode of the high-side FET. As the
dead time ends, the high-side FET is turned on to ramp
down the inductor current to replenish the output
capacitor and deliver current to the load. This cycle
repeats with a 1.1MHz switching frequency.
VOUT
PFM Mode at Light Load
1.002 × VOUT_NOM
PFM Mode
In order to improve the light load efficiency, the
SGM6611C implements PFM operation at light load. At
light load, the internal error amplifier’s output decreases
to lower the inductor current. As the current reaches
zero during the low-side off-time, the high-side FET
turns off till the next switching cycle starts. As the load
current decreases further, the output of the error
VOUT_NOM
PWM Mode at Heavy Load
Figure 3. Output Voltage in PWM Mode and PFM Mode
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
APPLICATION INFORMATION
The SGM6611C is capable of supporting up to 12.6V
output voltage, while providing 9.5A (TYP) continuous
switch current. The device automatically operates in
PFM mode in light load. At medium to heavy load, the
device switches to PWM operation. PFM mode
provides high light load efficiency while PWM mode
provides constant switching frequency. The fixed
frequency peak current mode control offers excellent
line and load transient responses. The external loop
compensation enables design flexibility with various
inductor and output capacitor combinations.
Setting Peak Current Limit
The peak current limit is programmed via an external
resistor on ILIM pin. The resistor value can be
calculated by Equation 2:
1.2×106
RILIM
(2)
ILIM
=
where RILIM is the resistor connected between the ILIM
pin and ground, and ILIM is the switching peak current
limit.
A standard 127kΩ provides the 9.5A typical current
limit. Considering variation due to tolerance and
temperature, the worst-case required peak current
should be lower than the minimal current limit rating to
ensure that the SGM6611C can regulate the output
voltage. For Boost converter, the worst case occurs at
the lowest VIN and the highest load current.
Table 1. Design Parameters
Design Parameters
Input Voltage Range
Output Voltage
Example Values
3.0V to 4.35V
9V
Output Voltage Ripple
Output Current Rating
Operating Frequency
Operation Mode at Light Load
100mV peak-to-peak
1.5A
1.1MHz
PFM (SGM6611C)
C4
0.1μF
L
1μH
BOOT
SW
VOUT
GND
FB
VOUT = 9V
VIN = 3V to 4.35V
C1 (CIN)
22μF
C2 (COUT
3 × 22μF
)
VIN
EN
R1
681kΩ
ON
SGM6611C
OFF
R2
107kΩ
COMP
VCC
R5
30kΩ
ILIM
C6
C5
4.7nF
C3
2.2μF
R4 (RILIM
127kΩ
)
Figure 4. SGM6611C Single-Cell Li-Ion Battery to 9V/1.5A Output Converter
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
APPLICATION INFORMATION (continued)
efficiency.
Setting Output Voltage
The output voltage of SGM6611C is programmed by a
resistive divider connected to FB pin. Use Equation
below to program the output voltage. R1 is the top
feedback resistor and R2 is the bottom feedback
resistor. The recommended value for R2 should be less
than 120kΩ.
For Boost converter, the average inductor current is the
average input current, Equation 4 is used to calculate
the average inductor current:
VOUT ×IOUT
(4)
IDC
=
V ×η
IN
(VOUT - VREF )×R2
where VOUT is the output voltage, IOUT is the output
current, VIN is the input voltage, and η is the power
conversion efficiency.
(3)
R1 =
VREF
Inductor Selection
Use Equation 5 below to set the inductor current
peak-to-peak ripple.
Inductor is an essential element for DC/DC switch
mode power supplies regardless of topology. Inductor
serves as the energy storage element for power
conversion. Inductance and inductor’s saturation
current are the two most important criterions for
inductor selection. For general rule of thumb, the
selected inductance should provide a peak-to-peak
ripple current that is around 30% of the average
inductor current at full load and nominal input voltage.
The average inductor current for a Boost converter is
the input current. The SGM6611C is optimized to
operate with inductor values between 0.47μH and
2.2μH. Lower inductance part generally has smaller
size while providing sufficient saturation current rating,
and larger inductance provides lower peak-to-peak
ripple current, which helps to maximize the output
current delivery.
1
IPP
=
(5)
1
1
L×(
+
)× fSW
VOUT - V
V
IN
IN
where IPP is the inductor peak-to-peak ripple, L is the
inductor value, fSW is the switching frequency, VOUT is
the output voltage, and VIN is the input voltage.
The peak inductor current is the sum of average current
plus half of the peak-to-peak inductor current shown in
Equation 6:
IPP
(6)
ILPEAK = IDC
+
2
The selected inductor should have the saturation
current rating higher than the calculated peak current,
and the calculated peak current should be lower than
the peak current limit of SGM6611C.
Equations 4 to 6 show the calculated key parameters
for selecting the inductor. The selected inductor should
meet the worst case that occurs at minimum input
voltage and maximal load current. Margin should be
added to cover inductance de-rating and conversion
Inductor’s DCR, material type, DC/DC’s power FET
resistance and switching speed affect the overall
efficiency of the converter, therefore, careful inductor
selection is critical to ensure good performance.
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
APPLICATION INFORMATION (continued)
Table 2 lists the recommended inductors for SGM6611C.
Table 2. Recommended Inductors
L
(µH)
DCR MAX
(mΩ)
Saturation Current/
Heat Rating Current (A)
Size MAX
(L mm × W mm × H mm)
Part Number
Manufacturer
HTTH25201T-1R0MSR
74439344010
1.0
1.0
1.5
1.8
1.8
2.2
2.2
2.2
29
5.5
5.0/5.0
2.5 × 2.0 × 1.0
6.65 × 6.45 × 3.0
7.3 × 7.2 × 4.0
9.5 × 8.7 × 3.0
10.5 × 10.2 × 4.7
7.3 × 7.2 × 4.0
11.2 × 10.3 × 3.0
7.4 × 6.8 × 5.0
Cyntec
Wurth-Elektronik
Wurth-Elektronik
Sumida
27.5/12
14.0/11.0
9.4/9.3
18/14
744311150
7.2
CDMC8D28NP-1R8MC
744325180
12.6
3.5
Wurth-Elektronik
Wurth-Elektronik
Cyntec
744311220
12.5
9.0
13.0/9.0
16/13
PIMB103T-2R2MS
PIMB065T-2R2MS
12.5
12/10.5
Cyntec
output voltage ripple and load transient response.
Equation 7 is used to estimate the necessary
capacitance to achieve the desired output voltage
ripple, where ΔV is the maximum allowed ripple. Three
22μF ceramic output capacitors are recommended for
SGM6611C. Due to the DC de-rating effect of the
ceramic capacitor, margin should be considered, where
higher capacitance improves the transient response.
Input Capacitor Selection
Boost converter’s input capacitor has continuous
current throughout the entire switching cycle. A 10µF
ceramic capacitor is recommended to place between
the VIN pin and GND pin of SGM6611C as close as
possible. For the applications where the SGM6611C is
located far away from the input source, a 47µF or
higher capacitance capacitor is recommended to damp
the wiring harness’s inductance.
(VOUT - VIN_MIN )×IOUT
VRIPPLE _DIS
=
(7)
The VCC pin is the output of the internal regulator, a
1µF ceramic capacitor is recommended to place on the
VCC pin.
VOUT × fSW ×COUT
ESR of the output capacitor affects the output ripple.
Use Equation 8 to set the output ripple caused by ESR.
Output Capacitor Selection
The output capacitors of Boost converter dictate the
VRIPPLE _ESR = ILPEAK ×RESR
(8)
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
APPLICATION INFORMATION (continued)
S
Loop Stability
The compensation network of SGM6611C is completed
externally to improve design flexibility. The SGM6611C
implements a transconductance error amplifier, where
(1+
)
GEA ×REA × VREF
2× π× fCOMZ
(14)
GC(S) =
×
S
S
VOUT
(1+
)(1+
)
2× π× fCOMP1
2× π× fCOMP2
where GEA is the amplifier’s transconductance, REA is
the amplifier’s output resistance, VREF is the reference
the COMP pin is the output of the internal error
amplifier. A Type-II compensation network consisting of
R5, C5 and C6 connected on COMP pin is used to
configure the loop response of SGM6611C.
voltage at the FB pin, VOUT is the output voltage, fCOMP1
,
fCOMP2 are the pole's frequency of the compensation
network, and fCOMZ is the zero's frequency of the
compensation network.
The power stage small signal loop response for peak
current control can be shown by Equation 9.
Once the error amplifier and power stage’s poles and
zeros are determined, the compensation network’s
component value can be designed. The designed loop
crossover frequency fC should be within 1/5 of the
RHPZ frequency (fRHPZ) or 1/10 of the switching
frequency. Higher crossover frequency could improve
the transient response. However, the crossover
frequency should be designed to avoid instability.
S
S
(1+
)(1-
)
RO ×(1- D)
2×RSENSE
2 × π× fESRZ
2× π× fRHPZ
GPS(S) =
×
(9)
S
1+
2× π× fP
where D is the switching duty cycle, RO is the output
load resistance, RSENSE is the equivalent internal
current sense resistor, which is 0.08Ω. fP is the pole's
frequency, fESRZ is the zero's frequency, and fRHPZ is the
right-half-plane-zero's frequency.
With a selected fC, Equation 15 can be used to
calculate the required R5.
The D, fP, fESRZ and fRHPZ can be set by following
equations.
2π× VOUT ×RSENSE × fC ×COUT
(15)
(16)
(17)
R5 =
(1- D)× VREF ×GEA
V ×η
IN
(10)
D = 1-
Use Equation 16 to calculate the value of C5.
VOUT
RO ×COUT
where η is the power conversion efficiency.
C5 =
2R5
2
fP =
(11)
Use Equation 17 to calculate the value of C6.
2π×RO ×COUT
RESR ×COUT
where COUT is effective capacitance of the output
C6 =
R5
capacitor.
For application with only ceramic capacitor, or if the
calculated value of C6 is less than 10pF, C6 is not
needed.
1
2π×RESR ×COUT
fESRZ
=
(12)
where RESR is the equivalent series resistance of the
output capacitor.
To measure good loop compensation design, greater
than 45° of phase margin and greater than 10dB gain
margin could provide good loop stability and avoid
output voltage ringing during load and line transient.
RO ×(1- D)2
(13)
fRHPZ
=
2π×L
Equation 14 shows the small signal transfer function of
the compensation network.
SG Micro Corp
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
APPLICATION INFORMATION (continued)
For Boost converter, the output capacitor’s current loop
from VOUT pin back to the GND pin of the device
should be as small as possible. Use small traces and
small copper area of all traces connected to the SW
node to minimize SW node vias and to prevent
radiation of high-frequency noise. It is also
recommended to place a ground plane below the
DC/DC to minimize inter plane coupling.
Layout Guidelines
In addition to component selection, layout is a critical
step to ensure the performance of any switch mode
power supplies. Poor layout could result in system
instability, EMI failure, and device damage. Thus, place
the inductor, input and output capacitors as close to the
IC as possible, and use wide and short traces for
current carrying traces to minimize PCB inductance.
Figure 5. Layout Example
SG Micro Corp
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DECEMBER 2022
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12.6V, 7A Fully-Integrated
SGM6611C
Synchronous Boost Converter
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DECEMBER 2022 ‒ REV.B.1 to REV.B.2
Page
Updated Maximum Output Current vs. Input Voltage in Typical Performance Characteristics section..................................................................8
JULY 2022 ‒ REV.B to REV.B.1
Page
Added SW Node in Absolute Maximum Ratings ................................................................................................................................................2
Updated Detailed Description and Application Information sections............................................................................................10, 11, 12, 13, 14
OCTOBER 2021 ‒ REV.A.4 to REV.B
Page
Updated the Enable and Disable section ...........................................................................................................................................................10
Added the Figure 1. Layout Example.................................................................................................................................................................16
APRIL 2021 ‒ REV.A.3 to REV.A.4
Page
Updated Loop Stability section ..........................................................................................................................................................................15
MARCH 2021 ‒ REV.A.2 to REV.A.3
Page
Updated Package Outline Dimensions section ..................................................................................................................................................17
FEBRUARY 2021 ‒ REV.A.1 to REV.A.2
Page
Updated Marking Information section...................................................................................................................................................................2
NOVEMBER 2019 ‒ REV.A to REV.A.1
Page
Updated the curve of Output Current vs. Input Voltage........................................................................................................................................8
Changes from Original (AUGUST 2019) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
17
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TQFN-2×2.5-11L
E
L1
L1
N10
N7
L
N6
N5
e1
N11
b2
D
b1
b
(0.18)
N4
N1
PIN 1#
b
1/2 e
e
BOTTOM VIEW
TOP VIEW
2.40
0.40
1.00
1.00
2.90
0.38
A
1.00
0.25
0.70
1.80
0.35
A1
A2
0.55
SIDE VIEW
0.50
0.25
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions In Millimeters
Symbol
MIN
0.700
0.000
MOD
0.750
MAX
0.800
0.050
A
A1
A2
D
0.020
0.203 REF
2.500
2.400
1.900
2.600
2.100
E
2.000
e
0.500 BSC
0.700 BSC
0.250
e1
b
0.200
0.300
0.950
0.300
0.750
0.300
0.400
1.050
0.400
0.850
b1
b2
L
0.350
1.000
0.350
L1
0.800
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00150.001
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TQFN-2×2.5-11L
7″
9.5
2.20
2.70
0.95
4.0
4.0
2.0
8.0
Q2
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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