SGM7226 [SGMICRO]
VBUS Directly Powered, High Speed USB 2.0 (480Mbps) DPDT Analog Switch;
| 型号： | SGM7226 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | VBUS Directly Powered, High Speed USB 2.0 (480Mbps) DPDT Analog Switch 光电二极管 |
| 文件： | 总11页 (文件大小：546K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM7226
VBUS Directly Powered, High Speed
USB 2.0 (480Mbps) DPDT Analog Switch
GENERAL DESCRIPTION
FEATURES
The SGM7226 is a DPDT (double-pole/double-throw)
analog switch. It operates from a 1.8V to 5.5V single
● Supply Voltage Range: 1.8V to 5.5V
● VBUS Directly Power
power supply and can be powered directly by VBUS
.
● On-Resistance: 5Ω (TYP)
Each switch of the SGM7226 is bidirectional, which can
ensure that the high speed signals have little or no
attenuation at the outputs.
● High Off-Isolation: -35dB (RL = 50Ω, f = 250MHz)
● Low Crosstalk: -30dB (RL = 50Ω, f = 250MHz)
● -3dB Bandwidth: 550MHz
● Fast Switching Times at VCC = 5V:
The SGM7226 features high speed, low power and
wide bandwidth. The high performances make it very
suitable for multiple applications, such as cellular
phones and computer peripherals, etc.
t
t
ON = 15ns (TYP)
OFF = 20ns (TYP)
● Break-Before-Make Switching
● Power-Off and Power-On Protections
● -40℃ to +85℃ Operating Temperature Range
● Available in a Green TQFN-2.6×1.8-16L Package
The SGM7226 has a power-off protection. It can
prevent accidental signal leakage and ensure system
reliability under power-down and over-voltage
conditions. In addition, the device is capable of
withstanding a VBUS short to D+ or D- when the device
is either powered on or powered off due to the special
circuitry on the D+/D- pins.
APPLICATIONS
Cellular Phones
Digital Cameras
Portable Equipment
The SGM7226 is available in a Green TQFN-2.6×1.8-16L
package. It operates over an ambient temperature
range of -40℃ to +85℃.
Computer Peripherals
Battery-Powered Systems
Routes Signals for USB 2.0 Full-Speed
SG Micro Corp
MAY 2016 – REV. A. 1
www.sg-micro.com
VBUS Directly Powered, High Speed
SGM7226
USB 2.0 (480Mbps) DPDT Analog Switch
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
7226
XXXXX
SGM7226
TQFN-2.6×1.8-16L
SGM7226YTQA16G/TR
Tape and Reel, 3000
-40℃ to +85℃
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
X X X X X
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
VCC to GND............................................................0V to 6.0V
V
SET................................................................... -0.3V to 5.5V
, S, HSDn+, HSDn-, D+, D-................. -0.3V to 3.3+0.3V
OE
Continuous Current HSDn or Dn ................................±50mA
Peak Current HSDn or Dn ........................................±100mA
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................8000V
MM.................................................................................400V
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range........................................1.8V to 5.5V
Operating Temperature Range......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
MAY 2016
2
VBUS Directly Powered, High Speed
SGM7226
USB 2.0 (480Mbps) DPDT Analog Switch
PIN CONFIGURATION
(TOP VIEW)
D-
12
D+
11
S
BP
9
10
13
14
8
7
N.C.
N.C.
N.C.
GND
15
16
6
5
HSD1-
HSD1+
VCC
VSET
1
2
3
4
HSD2- HSD2+
GND
OE
TQFN-2.6×1.8-16L
PIN DESCRIPTION
PIN
1,2
NAME
FUNCTION
HSD2-,
HSD2+
HSD1-,
HSD1+
15, 16
11, 12
3
Data Ports.
D+, D-
Output Enable Control Pin.
Ground.
OE
GND
VSET
VCC
N.C.
BP
4, 14
5
Internal Used Pin. It is recommended to connect a 10kΩ resistor between VSET pin and VCC
pin.
6
Positive Power Supply Pin.
No Connect.
7, 8, 13
9
Internal Voltage Reference Decoupling Pin. A 2.2μF ceramic capacitor must be used to
provide enough decoupling. Connect the capacitor between BP pin and GND.
10
S
Select Input Pin.
SG Micro Corp
www.sg-micro.com
MAY 2016
3
VBUS Directly Powered, High Speed
SGM7226
USB 2.0 (480Mbps) DPDT Analog Switch
BLOCK DIAGRAM
HSD1+
HSD2+
D+
D-
HSD1-
HSD2-
LOGIC
S
OE
FUNCTION TABLE
S
0
1
X
HSD1+, HSD1-
HSD2+, HSD2-
OE
0
ON
OFF
ON
0
OFF
OFF
1
OFF
X = Don’t care.
SG Micro Corp
www.sg-micro.com
MAY 2016
4
VBUS Directly Powered, High Speed
SGM7226
USB 2.0 (480Mbps) DPDT Analog Switch
ELECTRICAL CHARACTERISTICS
(VCC = +5.0V, TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Analog Switch
Analog I/O Voltage
(D+, D-, HSD1+, HSD1-, HSD2+, HSD2-)
VIS
RON
0
3.3
6.5
0.6
1
V
Ω
VIS = 0V to 0.4V, ID = 8mA,
Test Circuit 1
VIS = 0V to 0.4V, ID = 8mA,
Test Circuit 1
VIS = 0V to 1.0V, ID = 8mA,
Test Circuit 1
VCC = 0V, VD = 0V to 3.6V,
VS , VOE = 0V or 3.6 V
On-Resistance
5
On-Resistance Match between Channels
On-Resistance Flatness
0.35
0.6
Ω
∆RON
RFLAT(ON)
IOFF
Ω
Power Off Leakage Current (D+, D-)
Source Off Leakage Current
1
μA
μA
μA
IHSD2(OFF)
IHSD1(OFF)
IHSD2(ON)
,
VIS = 3.3V/0.3V, VD = 0.3V/3.3V
1
,
VIS = 3.3V/0.3V, VD = 3.3V/0.3V or
floating
Channel On Leakage Current
1
IHSD1(ON)
Digital Inputs
VIH (S,
1.5
1.5
3.3
5.5
0.35
1
)
OE
Input High Voltage
Input Low Voltage
Input Leakage Current
V
V
VIH (VSET)
VIL
IIN (S,
)
OE
μA
IIN ((VSET)
1.5
Dynamic Characteristics
Turn-On Time
tON
15
20
ns
ns
V
IS = 0.8V, RL = 50Ω, CL = 10pF,
Test Circuit 2
Turn-Off Time
tOFF
VIS = 0.8V, RL = 50Ω, CL = 10pF,
Test Circuit 3
Break-Before-Make Time Delay
Propagation Delay
tD
3.5
0.5
-35
ns
ns
dB
tPD
RL = 50Ω, CL = 10pF
Signal = 0dBm, RL = 50Ω,
f = 250MHz, Test Circuit 4
Signal = 0dBm, RL = 50Ω,
f = 250MHz, Test Circuit 5
Signal = 0dBm, RL = 50Ω,
CL = 5pF, Test Circuit 6
Off Isolation
OISO
Channel-to-Channel Crosstalk
XTALK
-30
dB
-3dB Bandwidth
BW
tSKEW
Q
550
1.5
10
MHz
ns
Channel-to-Channel Skew
RL = 50Ω, CL = 10pF
Charge Injection Select Input to Common
I/O
VG = GND, CL = 1.0nF, RG = 0Ω,
Q = CL × VOUT, Test Circuit 7
pC
f = 1MHz
10
15
HSD+, HSD-, D+, D-
ON Capacitance
CON
pF
f = 250MHz
Power Requirements
Power Supply Range
Power Supply Current
VCC
ICC
1.8
5.5
30
V
20
μA
SG Micro Corp
www.sg-micro.com
MAY 2016
5
VBUS Directly Powered, High Speed
SGM7226
USB 2.0 (480Mbps) DPDT Analog Switch
TEST CIRCUITS
8mA
V1
HSDn
Dn
VIS
VS
GND
RON = V1/8mA
Test Circuit 1. On-Resistance
VCC
VIH
tR < 5ns
tF < 5ns
0.1μF
VCC
50%
50%
VS
VIL
HSDn
Dn
VOUT
90%
90%
RL
CL
VOUT
0V
VS
GND
tOF F
tON
Test Circuit 2. Switching Times (tON, tOFF
)
VCC
VIH
tR < 5ns
tF < 5ns
0.1μF
VCC
VS
50%
HSD1n
HSD2n
VIL
VIS
Dn
VOUT
90%
VOUT
0V
RL
CL
VS
GND
tD
Test Circuit 3. Break-Before-Make Time (tD)
VCC
0.1μF
VCC
VIN
50Ω
HSDn
Dn
VS
RL
S
VOUT
Network
Analyzer
50Ω
GND
Test Circuit 4. Off Isolation
SG Micro Corp
www.sg-micro.com
MAY 2016
6
VBUS Directly Powered, High Speed
SGM7226
USB 2.0 (480Mbps) DPDT Analog Switch
TEST CIRCUITS (continued)
VCC
0.1μF
VCC
Dn
HSDn
VIN
50Ω
RL
HSDn
NC
Dn
Network
Analyzer
VOUT
50Ω
S
VS
GND
Channel-to-Channel Crosstalk = -20 log (VHSDn/VOUT
)
Test Circuit 5. Channel-to-Channel Crosstalk
VCC
0.1μF
VCC
VIN
50Ω
HSDn
Dn
VS
S
VOUT
Network
Analyzer
50Ω
GND
CL
Test Circuit 6. -3dB Bandwidth
VCC
0.1μF
VIH
VS
VCC
tR < 5ns
tF < 5ns
Floating
HSD1n
HSD2n
VIL
RS
Dn
VOUT
VOUT
ΔVOUT
S
CL
GND
VS
Q = ΔVOUT × CL
Test Circuit 7. Charge Injection (Q)
SG Micro Corp
www.sg-micro.com
MAY 2016
7
VBUS Directly Powered, High Speed
SGM7226
USB 2.0 (480Mbps) DPDT Analog Switch
APPLICATION INFORMATION
under over-voltage conditions, the SGM7226 will limit
Power-Off Protection
the current flowing back to the VCC track, and the
current will not exceed the safe operating range.
When D+ or D- is shorted to VBUS, there is a special
protection circuit inside the SGM7226, so that the
device will not be damaged within 24 hours. In case of
power-down or over-voltage event, the protection
circuit can prevent the leakage signal on D+/D- pins to
ensure the reliability of the system.
Application Circuit
The application circuit is shown in Figure 1. If
SGM7226 is powered from VBUS, a 5.1V Zener diode is
recommended to be used to suppress the voltage spike
in VBUS power line generated by USB interface
hot-insertion.
Power-On Protection
The USB 2.0 specification requires USB device to
ensure that the device will not be damaged even if VBUS
short-circuit occurs during data transmission. Therefore,
Control
10
3
100Ω
S
OE
6
5
VBUS
VCC
VBUS
2
1
5.1V
Zener Diode
HSD2+
10kΩ
0.1μF
HSD2-
VSET
USB
D+
D-
11
12
9
SGM7226
D+
D-
D+
D-
16
15
HSD1+
HSD1-
GND
BP
2.2μF
GND
4
GND
14
Figure 1. Application Circuit
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
MAY 2016 ‒ REV.A to REV.A.1
Page
Changed Package Outline Dimensions of TQFN-2.6×1.8-16L to TX00078.001 ................................................................................................. 10
Changed Key Parameter List of Tape and Reel.................................................................................................................................................11
Changes from Original (OCTOBER 2014) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
MAY 2016
8
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TQFN-2.6×1.8-16L
NOTES:
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00078.001
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TQFN-2.6×1.8-16L
7″
9.0
2.01
2.81
0.93
4.0
4.0
2.0
8.0
Q1
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
相关型号：
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