SGM8953-1 [SGMICRO]

High Precision, Low Power, Rail-to-Rail I/O, CMOS Operational Amplifier;
SGM8953-1
型号: SGM8953-1
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

High Precision, Low Power, Rail-to-Rail I/O, CMOS Operational Amplifier

文件: 总19页 (文件大小:1358K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SGM8953-1/SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
GENERAL DESCRIPTION  
FEATURES  
Low Input Offset Voltage: 10μV (TYP), 50μV (MAX)  
Low Noise: 1μVP-P at 0.1Hz to 10Hz  
Unity-Gain Stable  
The single SGM8953-1 and dual SGM8953-2 are low  
power, high precision CMOS operational amplifiers,  
which can operate from 1.8V to 5.5V single supply or  
from ±0.9V to ±2.75V dual power supplies, while  
consuming only 17μA quiescent current per amplifier.  
The SGM8953-1/2 support rail-to-rail input and output  
operation. The input common mode voltage range is  
from (-VS) - 0.1V to (+VS) + 0.1V, and the output range is  
from (-VS) + 0.0055V to (+VS) - 0.0055V.  
Gain-Bandwidth Product: 200kHz  
Integrated RFI Filter  
Rail-to-Rail Input and Output  
Support Single or Dual Power Supplies:  
1.8V to 5.5V or ±0.9V to ±2.75V  
Quiescent Current: 17μA/Amplifier (TYP)  
-40to +125Operating Temperature Range  
Small Packaging:  
The SGM8953-1/2 are designed to provide optimal  
performance in low voltage and low power systems.  
They have high impedance inputs and zero-drift 50μV  
(MAX) offset voltage. These specifications make  
SGM8953-1 Available in Green SOT-23-5, SOIC-8  
and UTDFN-1.6×1.6-6L Packages  
SGM8953-2 Available in Green SOIC-8, MSOP-8  
and TDFN-2×2-8L Packages  
SGM8953-1/2 appropriate for  
a
wide range of  
applications requiring high precision, such as high  
linearity driver of high precision ADC.  
APPLICATIONS  
The SGM8953-1 is available in Green SOT-23-5,  
SOIC-8 and UTDFN-1.6×1.6-6L packages. The  
SGM8953-2 is available in Green SOIC-8, MSOP-8  
and TDFN-2×2-8L packages. They are specified over  
the extended industrial temperature range (-40to  
+125).  
Industrial Equipment  
Battery-Powered Equipment  
Sensor Signal Conditioning  
SG Micro Corp  
JANUARY 2019 – REV. A  
www.sg-micro.com  
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SOT-23-5  
SOIC-8  
SGM8953-1XN5G/TR  
MBAXX  
Tape and Reel, 3000  
Tape and Reel, 4000  
Tape and Reel, 3000  
Tape and Reel, 4000  
Tape and Reel, 4000  
Tape and Reel, 3000  
-40to +125℃  
-40to +125℃  
-40to +125℃  
-40to +125℃  
-40to +125℃  
-40to +125℃  
SGM  
89531XS8  
XXXXX  
SGM8953-1  
SGM8953-1XS8G/TR  
SGM8953-1XUDN6G/TR  
SGM8953-2XS8G/TR  
SGM8953-2XMS8G/TR  
SGM8953-2XTDE8G/TR  
UTDFN-1.6×1.6-6L  
SOIC-8  
98X  
SGM  
89532XS8  
XXXXX  
SGM89532  
XMS8  
XXXXX  
SGM8953-2  
MSOP-8  
MH7  
XXXX  
TDFN-2×2-8L  
MARKING INFORMATION  
NOTE: X = Date Code. XX = Date Code. XXXX = Date Code and Trace Code. XXXXX = Date Code, Trace Code and Vendor Code.  
SOT-23-5  
SOIC-8/MSOP-8  
YYY X X  
X X X X X  
Date Code - Week  
Date Code - Year  
Serial Number  
Vendor Code  
Trace Code  
Date Code - Year  
UTDFN-1.6×1.6-6L  
TDFN-2×2-8L  
Serial Number  
Y Y Y  
X X X X  
YY X  
Date Code - Quarter  
Serial Number  
Trace Code  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
2
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage...................................................................6V  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Input Common Mode Voltage Range  
Operating Conditions section is not implied.  
.................................................... (-VS) - 0.3V to (+VS) + 0.3V  
Junction Temperature .................................................+150℃  
Storage Temperature Range.........................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
ESD SENSITIVITY CAUTION  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
HBM.............................................................................8000V  
MM.................................................................................400V  
CDM ............................................................................1000V  
RECOMMENDED OPERATING CONDITIONS  
Specified Voltage Range ....................................1.8V to 5.5V  
Operating Temperature Range .....................-40to +125℃  
DISCLAIMER  
OVERSTRESS CAUTION  
SG Micro Corp reserves the right to make any change in  
circuit design, or specifications without prior notice.  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
PIN CONFIGURATIONS  
SGM8953-1 (TOP VIEW)  
SGM8953-1 (TOP VIEW)  
SGM8953-1 (TOP VIEW)  
1
2
3
4
8
7
6
5
NC  
NC  
-IN  
OUT  
-VS  
1
2
3
5
+VS  
_
+VS  
OUT  
-IN  
1
2
3
6
5
4
-VS  
NC  
+IN  
+VS  
OUT  
NC  
Exposed  
Pad  
_
+IN  
-VS  
+
+
+IN  
4
-IN  
NC = NO CONNECT  
SOIC-8  
SOT-23-5  
UTDFN-1.6×1.6-6L  
SGM8953-2 (TOP VIEW)  
SGM8953-2 (TOP VIEW)  
OUTA  
-INA  
+INA  
-VS  
1
2
3
4
8
7
6
5
+VS  
OUTA  
-INA  
+INA  
-VS  
1
2
3
4
8
7
6
5
+VS  
_
OUTB  
-INB  
OUTB  
-INB  
Exposed  
Pad  
+
_
+INB  
+
+INB  
SOIC-8/MSOP-8  
TDFN-2×2-8L  
NOTE: For UTDFN-1.6×1.6-6L and TDFN-2×2-8L packages, exposed pad can be connected to -VS or left floating.  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
3
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
ELECTRICAL CHARACTERISTICS  
(At TA = +25, VS = 1.8V to 5.5V, VCM = +VS/2, VOUT = +VS/2 and RL = 10kΩ to +VS/2, Full = -40to +125, unless otherwise  
noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
Input Characteristics  
10  
50  
62  
+25  
Full  
Input Offset Voltage  
VOS  
μV  
Input Offset Voltage Drift  
Input Bias Current  
ΔVOS/ΔT  
IB  
Full  
60  
80  
nV/℃  
pA  
500  
700  
+25℃  
+25℃  
Input Offset Current  
IOS  
170  
pA  
Input Common Mode Voltage Range  
VCM  
Full (-VS) - 0.1  
(+VS) + 0.1  
V
90  
87  
106  
118  
+25℃  
Full  
Common Mode Rejection Ratio  
CMRR (-VS) - 0.1V < VCM < (+VS) + 0.1V  
dB  
dB  
106  
103  
+25℃  
Full  
Open-Loop Voltage Gain  
Output Characteristics  
AOL  
(-VS) + 0.1V < VOUT < (+VS) - 0.1V, RL = 10kΩ  
5.5  
9
+25℃  
Full  
Output Voltage Swing from Rail  
RL = 10kΩ  
mV  
11  
VS = 1.8V  
VS = 5.5V  
6
9
+25℃  
+25℃  
Output Short-Circuit Current  
ISC  
mA  
18  
26  
Power Supply  
Specified Voltage Range  
VS  
PSRR VS = 1.8V to 5.5V  
Full  
+25℃  
Full  
1.8  
5.5  
12.6  
22  
V
3.2  
17  
Power Supply Rejection Ratio  
Quiescent Current/Amplifier  
μV/V  
23.5  
29  
+25℃  
Full  
IQ  
IOUT = 0  
μA  
Dynamic Performance  
Gain-Bandwidth Product  
Phase Margin  
GBP  
φO  
CL = 100pF  
CL = 100pF  
G = 1  
200  
70  
kHz  
°
+25℃  
+25℃  
+25℃  
+25℃  
Slew Rate  
SR  
0.05  
16  
V/μs  
μs  
Overload Recovery Time  
Noise  
G = -10  
Input Voltage Noise  
Input Voltage Noise Density  
Input Current Noise Density  
f = 0.1Hz to 10Hz  
f = 1kHz  
1
μVP-P  
+25℃  
+25℃  
+25℃  
en  
in  
50  
nV/  
Hz  
Hz  
f = 1kHz  
400  
fA/  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
4
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
TYPICAL PERFORMANCE CHARACTERISTICS  
At TA = +25, VS = 5V, RL = 10and CL = 100pF, unless otherwise noted.  
Quiescent Current vs. Temperature  
Output Short-Circuit Current vs. Temperature  
22  
20  
18  
16  
14  
12  
10  
45  
40  
35  
30  
25  
20  
15  
ISOURCE  
ISINK  
-50  
-50  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature ()  
Temperature ()  
PSRR vs. Temperature  
CMRR vs. Temperature  
2
1
4.5  
4
VS = 5.5V  
3.5  
3
0
2.5  
2
-1  
-2  
-3  
VS = 1.8V  
1.5  
1
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature ()  
Temperature ()  
Input Offset Voltage vs. Temperature  
10 Typical Units Shown  
Input Offset Voltage vs. Supply Voltage  
10 Typical Units Shown  
30  
20  
10  
0
30  
20  
10  
0
-10  
-20  
-30  
-10  
-20  
-30  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
-25  
0
25  
50  
75  
100 125  
Supply Voltage (V)  
Temperature ()  
SG Micro Corp  
www.sg-micro.com  
JANUARY 2019  
5
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5V, RL = 10and CL = 100pF, unless otherwise noted.  
Input Offset Voltage vs. Input Common Mode Voltage  
Input Offset Voltage vs. Input Common Mode Voltage  
30  
20  
10  
0
30  
20  
10  
0
10 Typical Units Shown  
10 Typical Units Shown  
VS = 5.5V  
VS = 1.8V  
-10  
-20  
-30  
-10  
-20  
-0.4  
0
0.4  
0.8  
1.2  
1.6  
2
-1  
0
1
2
3
4
5
6
Input Common Mode Voltage (V)  
Input Common Mode Voltage (V)  
Output Voltage Swing vs. Output Current (Maximum Supply)  
Quiescent Current vs. Supply Voltage  
6
40  
32  
24  
16  
8
VS = 5.5V  
5
4
3
-40℃  
+25℃  
+85℃  
+125℃  
2
1
0
0
0
8
16  
24  
32  
40  
48  
0
1
2
3
4
5
6
Supply Voltage (V)  
Output Current (mA)  
Input Bias Current vs. Input Common Mode Voltage  
Input Bias Current vs. Input Common Mode Voltage  
500  
300  
500  
300  
VS = 1.8V  
VS = 5.5V  
+IB  
+IB  
100  
100  
-100  
-300  
-500  
-100  
-300  
-500  
-IB  
-IB  
-0.4  
0
0.4  
0.8  
1.2  
1.6  
2
-1  
0
1
2
3
4
5
6
Input Common Mode Voltage (V)  
Input Common Mode Voltage (V)  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
6
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5V, RL = 10and CL = 100pF, unless otherwise noted.  
Large-Signal Step Response  
G = 1, VOUT = 2VP-P  
Small-Signal Step Response  
G = 1, VOUT = 40mVP-P  
Time (100μs/div)  
Time (100μs/div)  
Positive Overload Recovery  
Negative Overload Recovery  
G = -10  
G = -10  
0V  
VIN  
VIN  
0V  
0V  
VOUT  
VOUT  
0V  
Time (50μs/div)  
Time (50μs/div)  
Large-Signal Settling Time (Positive)  
G = -1  
Large-Signal Settling Time (Negative)  
G = -1  
VIN  
VOUT  
VOUT  
VIN  
Time (1ms/div)  
Time (1ms/div)  
SG Micro Corp  
www.sg-micro.com  
JANUARY 2019  
7
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5V, RL = 10and CL = 100pF, unless otherwise noted.  
No Phase Reversal  
Maximum Output Voltage vs. Frequency  
G = 1  
3
2
6
5
4
3
2
1
0
G = 1  
RL = No load  
CL = No load  
VIN  
VS = 5.5V  
1
0
-1  
-2  
-3  
VOUT  
VS = 1.8V  
10  
100  
1000  
Frequency (Hz)  
10000  
100000  
Time (1ms/div)  
+IN EMIRR vs. Frequency  
PRF = -16dBm  
PSRR vs. Frequency (Referred-to-Input)  
0
-20  
120  
100  
80  
60  
40  
20  
0
PSRR-  
-40  
-60  
-80  
PSRR+  
-100  
-120  
10  
100  
1000  
10000  
100000  
10  
100  
1000  
10000  
Frequency (Hz)  
Frequency (MHz)  
Closed-Loop Gain vs. Frequency  
Open-Loop Gain and Phase vs. Frequency  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
0
G = 100  
-30  
-60  
-90  
-120  
-150  
-180  
Open-Loop Gain  
G = 1  
G = 10  
Phase  
-20  
-40  
G = -1  
-20  
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
100  
1000  
Frequency (kHz)  
Frequency (kHz)  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
8
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, VS = 5V, RL = 10and CL = 100pF, unless otherwise noted.  
Channel Separation vs. Frequency  
Small-Signal Overshoot vs. Capacitive Load  
G = 1  
-60  
-80  
60  
50  
40  
30  
20  
10  
0
VIN = 1VP-P  
-100  
-120  
-140  
-160  
VIN = 4.99VP-P  
10  
100  
1000  
10  
100  
1000  
10000  
100000  
Load Capacitance (pF)  
Frequency (Hz)  
Input Voltage Noise Density vs. Frequency  
0.1Hz to 10Hz Input Voltage Noise  
1000  
100  
10  
10  
100  
1000  
10000  
Time (1s/div)  
Frequency (Hz)  
Input Offset Voltage Production Distribution  
Input Offset Voltage Drift Distribution  
-40TA +125℃  
18  
15  
12  
9
20  
15  
10  
5
3140 Samples  
1 Production Lot  
6
3
0
0
Input Offset Voltage (μV)  
Input Offset Voltage Drift (nV/)  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
9
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
APPLICATION INFORMATION  
Rail-to-Rail Input  
Driving Capacitive Loads  
When SGM8953-1/2 work at the power supply between  
1.8V and 5.5V, the input common mode voltage range  
is from (-VS) - 0.1V to (+VS) + 0.1V. In Figure 1, the ESD  
diodes between the inputs and the power supply rails  
will clamp the input voltage not to exceed the rails.  
The SGM8953-1/2 are unity-gain stable with heavy  
capacitive load. If greater capacitive load must be  
driven in application, the circuit in Figure 3 can be used.  
In this circuit, the IR drop voltage generated by RISO is  
compensated by feedback loop.  
+VS  
RF  
CF  
VP  
+
_
_
RISO  
VN  
VOUT  
CL  
VIN  
+
-VS  
Figure 1. Input Equivalent Circuit  
Figure 3. Circuit to Drive Heavy Capacitive Load  
Input Current-Limit Protection  
Power Supply Decoupling and Layout  
For ESD diode clamping protection, when the current  
flowing through ESD diode exceeds the maximum  
rating value, the ESD diode and amplifier will be  
damaged, so current-limit protection will be added in  
some applications. One resistor is selected to limit the  
current not to exceed the maximum rating value. In  
Figure 2, a series input resistor is used to limit the input  
current to less than 10mA, but the drawback of this  
current-limit resistor is that it contributes thermal noise  
at the amplifier input. If this resistor must be added, its  
value must be selected as small as possible.  
A clean and low noise power supply is very important in  
amplifier circuit design, besides of input signal noise,  
the power supply is one of important source of noise to  
the amplifiers through +VS and -VS pins. Power supply  
bypassing is an effective method to clear up the noise  
at power supply, and the low impedance path to ground  
of decoupling capacitor will bypass the noise to GND.  
In application, 10μF ceramic capacitor paralleled with  
0.1μF or 0.01μF ceramic capacitor is used in Figure 4.  
The ceramic capacitors should be placed as close as  
possible to +VS and -VS power supply pins.  
+VS  
+VS  
+VS  
10μF  
10μF  
_
IOVERLOAD  
10mA MAX  
VOUT  
0.1μF  
0.1μF  
VIN  
+
_
_
VN  
VP  
VN  
VP  
VOUT  
VOUT  
+
+
Figure 2. Input Current-Limit Protection  
10μF  
-VS (GND)  
Rail-to-Rail Output  
The SGM8953-1/2 support rail-to-rail output operation.  
In single power supply application, for example, when  
+VS = 5.5V, -VS = GND, 10kΩ load resistor is tied from  
OUT pin to +VS/2, the typical output swing range is from  
0.0055V to 5.4945V.  
0.1μF  
-VS  
Figure 4. Amplifier Power Supply Bypassing  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
10  
 
 
 
 
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
APPLICATION INFORMATION (continued)  
the input are used to increase the input impedance and  
eliminate drawback of low input impedance in Figure 5.  
Grounding  
In low speed application, one node grounding technique  
is the simplest and most effective method to eliminate  
the noise generated by grounding. In high speed  
application, the general method to eliminate noise is to  
use a complete ground plane technique, and the whole  
ground plane will help distribute heat and reduce EMI  
noise pickup.  
_
R1  
R2  
VN  
+
_
VOUT  
+
VP  
+
Reduce Input-to-Output Coupling  
R3  
To reduce the input-to-output coupling, the input traces  
must be placed as far away from the power supply or  
output traces as possible. The sensitive trace must not  
be placed in parallel with the noisy trace in same layer.  
They must be placed perpendicularly in different layers  
to reduce the crosstalk. These PCB layout techniques  
will help to reduce unwanted positive feedback and  
noise.  
_
R4  
VREF  
Figure 6. High Input Impedance Difference Amplifier  
Active Low-Pass Filter  
The circuit in Figure 7 is a design example of active  
low-pass filter, the DC gain is equal to -R2/R1 and the  
-3dB corner frequency is equal to 1/2πR2C. In this design,  
the filter bandwidth must be less than the bandwidth of  
the amplifier, the resistor values must be selected as  
low as possible to reduce ringing or oscillation generated  
by the parasitic parameters in PCB layout.  
Typical Application Circuits  
Difference Amplifier  
The circuit in Figure 5 is a design example of classical  
difference amplifier. If R4/R3 = R2/R1, then VOUT = (VP -  
VN) × R2/R1 + VREF  
.
C
R2  
R2  
R1  
_
VN  
R1  
_
VOUT  
VIN  
R3  
VP  
VOUT  
+
+
R4  
R3 = R1 // R2  
VREF  
Figure 5. Difference Amplifier  
Figure 7. Active Low-Pass Filter  
High Input Impedance Difference Amplifier  
The circuit in Figure 6 is a design example of high input  
impedance difference amplifier, the added amplifiers at  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
11  
 
 
 
 
SGM8953-1  
SGM8953-2  
High Precision, Low Power, Rail-to-Rail I/O,  
CMOS Operational Amplifiers  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Original (JANUARY 2019) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
JANUARY 2019  
www.sg-micro.com  
12  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
SOT-23-5  
1.90  
D
e1  
2.59  
E1  
E
0.99  
b
e
0.95  
0.69  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
c
θ
0.2  
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.250  
0.100  
1.150  
0.500  
0.200  
3.020  
1.700  
2.950  
MIN  
MAX  
0.049  
0.004  
0.045  
0.020  
0.008  
0.119  
0.067  
0.116  
A
A1  
A2  
b
1.050  
0.000  
1.050  
0.300  
0.100  
2.820  
1.500  
2.650  
0.041  
0.000  
0.041  
0.012  
0.004  
0.111  
0.059  
0.104  
c
D
E
E1  
e
0.950 BSC  
1.900 BSC  
0.037 BSC  
0.075 BSC  
e1  
L
0.300  
0°  
0.600  
8°  
0.012  
0°  
0.024  
8°  
θ
SG Micro Corp  
www.sg-micro.com  
TX00033.000  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
UTDFN-1.6×1.6-6L  
NOTE: All linear dimensions are in millimeters.  
SG Micro Corp  
TX00070.000  
www.sg-micro.com  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TDFN-2×2-8L  
D
e
N8  
E1  
D1  
L
E
k
N4  
N1  
b
BOTTOM VIEW  
TOP VIEW  
1.20  
0.65  
0.60 1.95  
A
A1  
A2  
SIDE VIEW  
0.24  
0.50  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
0.800  
0.050  
MIN  
0.028  
0.000  
MAX  
0.031  
0.002  
A
A1  
A2  
D
0.700  
0.000  
0.203 REF  
0.008 REF  
1.900  
1.100  
1.900  
0.500  
2.100  
1.300  
2.100  
0.700  
0.075  
0.043  
0.075  
0.020  
0.083  
0.051  
0.083  
0.028  
D1  
E
E1  
k
0.200 MIN  
0.500 TYP  
0.008 MIN  
0.020 TYP  
b
0.180  
0.250  
0.300  
0.450  
0.007  
0.010  
0.012  
0.018  
e
L
SG Micro Corp  
www.sg-micro.com  
TX00056.000  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
MSOP-8  
b
E1  
E
4.8  
1.02  
e
0.41  
0.65  
RECOMMENDED LAND PATTERN (Unit: mm)  
D
L
A
c
A1  
θ
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.100  
0.150  
0.950  
0.380  
0.230  
3.100  
3.100  
5.050  
MIN  
MAX  
0.043  
0.006  
0.037  
0.015  
0.009  
0.122  
0.122  
0.199  
A
A1  
A2  
b
0.820  
0.020  
0.750  
0.250  
0.090  
2.900  
2.900  
4.750  
0.032  
0.001  
0.030  
0.010  
0.004  
0.114  
0.114  
0.187  
c
D
E
E1  
e
0.650 BSC  
0.026 BSC  
L
0.400  
0°  
0.800  
6°  
0.016  
0°  
0.031  
6°  
θ
SG Micro Corp  
www.sg-micro.com  
TX00014.000  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
SOIC-8  
0.6  
D
e
2.2  
E1  
E
5.2  
b
1.27  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
c
θ
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.750  
0.250  
1.550  
0.510  
0.250  
5.100  
4.000  
6.200  
MIN  
MAX  
0.069  
0.010  
0.061  
0.020  
0.010  
0.200  
0.157  
0.244  
A
A1  
A2  
b
1.350  
0.100  
1.350  
0.330  
0.170  
4.700  
3.800  
5.800  
0.053  
0.004  
0.053  
0.013  
0.006  
0.185  
0.150  
0.228  
c
D
E
E1  
e
1.27 BSC  
0.050 BSC  
L
0.400  
0°  
1.270  
8°  
0.016  
0°  
0.050  
8°  
θ
SG Micro Corp  
www.sg-micro.com  
TX00010.000  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
SOT-23-5  
UTDFN-1.6×1.6-6L  
TDFN-2×2-8L  
MSOP-8  
7″  
7″  
9.5  
9.0  
3.20  
1.78  
2.30  
5.20  
6.40  
3.20  
1.78  
2.30  
3.30  
5.40  
1.40  
0.69  
1.10  
1.50  
2.10  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
2.0  
2.0  
2.0  
2.0  
2.0  
8.0  
8.0  
Q3  
Q1  
Q1  
Q1  
Q1  
7″  
9.5  
8.0  
13″  
13″  
12.4  
12.4  
12.0  
12.0  
SOIC-8  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
7″ (Option)  
368  
442  
386  
227  
410  
280  
224  
224  
370  
8
18  
5
7″  
13″  
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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