PC123PY8 [SHARP]
Transistor Output Optocoupler, 1-Element, 5000V Isolation, PLASTIC, SMT, DIP-4;型号: | PC123PY8 |
厂家: | SHARP ELECTRIONIC COMPONENTS |
描述: | Transistor Output Optocoupler, 1-Element, 5000V Isolation, PLASTIC, SMT, DIP-4 输出元件 光电 |
文件: | 总16页 (文件大小:311K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PC123 Series
DIP 4pin Reinforced Insulation Type
Photocoupler
PC123 Series
■ Description
PC123 Series contains an IRED optically coupled to
a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
CTR is 50% to 400% at input current of 5mA.
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 file No. 7409, (as model No. PC123)
3. Approved by SEMCO, EN60065, EN60950, file No.
204582 (as model No. PC123)
4. Approved by DEMCO, EN60065, EN60950 (as mod-
el No. PC123)
5. Approved by NEMKO, EN60065, EN60950, file No.
P03100205 (as model No. PC123)
■ Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
6. Approved by FIMKO, EN60065, EN60950, file No.
19383 (as model No. PC123)
3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
7. Recognized by CSA file No. CA95323 (as model No.
PC123)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
8. Approved by VDE, VDE0884 (as an option) file No.
83601 or No. 134349 or No.40005304 (as model
No. PC123)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
9. Package resin : UL flammability grade (94V - 0)
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
■ Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A02902EN
1
Date Oct. 31. 2003
© SHARP Corporation
PC123 Series
■ Internal Connection Diagram
1
2
3
4
Anode
1
2
4
Cathode
Emitter
Collector
3
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PC123]
2. Through-Hole (VDE0884 option) [ex. PC123Y]
Rank mark
Factory identification mark
Rank mark
Anode mark
Anode mark
Factory identification mark
Date code
Date code
1
2
4
3
1
2
4
PC123
PC123
4
3
SHARP mark "S"
0.3
6.5
0.3
6.5
VDE0884
Indenfication mark
0.3
0.3
0.3
0.3
7.62
4.58
7.62
4.58
Epoxy resin
Epoxy resin
0.1
0.1
0.26
0.26
0.1
0.1
0.5
0.5
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
3. Wide Through-Hole Lead-Form [ex. PC123F]
4. Wide Through-Hole Lead-Form (VDE0884 option) [ex. PC123FY]
Factory identification mark
Rank mark
Factory identification mark
Rank mark
Anode mark
Anode mark
Date code
Date code
1
2
1
2
4
3
4
3
P C 1 2 3
P C 1 2 3
4
SHARP mark "S"
0.3
0.3
6.5
6.5
VDE0884
Indenfication mark
0.3
0.3
0.3
0.3
7.62
4.58
7.62
4.58
Epoxy resin
Epoxy resin
0.1
0.1
0.26
0.26
0.5
0.5
0.1
0.1
10.16
10.16
0.5
0.5
Product mass : approx. 0.18g
Sheet No.: D2-A02902EN
2
PC123 Series
(Unit : mm)
5. SMT Gullwing Lead-Form [ex. PC123P]
6. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123PY]
Rank mark
Anode mark
Factory identification mark
Rank mark
Anode mark
Factory identification mark
Date code
Date code
4
1
2
4
1
2
3
3
P C 1 2 3
P C 1 2 3
4
SHARP mark "S"
0.3
6.5
0.3
VDE0884
Indenfication mark
6.5
0.3
0.3
4.58
7.62
0.3
0.3
7.62
4.58
0.25
+0.4
+0.4
2.54
Epoxy resin
1.0
1.0
−0
−0
0.25
+0.4
+0.4
2.54
Epoxy resin
+0
1.0
1.0
−0
−0
10.0
−0.5
+0
10.0
−0.5
7. Wide SMT Gullwing Lead-Form [ex. PC123FP]
8. Wide SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123ZY]
Rank mark
Rank mark
Anode mark
Factory identification mark
Anode mark
Factory identification mark
Date code
Date code
1
2
4
1
2
4
3
3
P C 1 2 3
P C 1 2 3
4
SHARP mark "S"
0.3
6.5
0.3
VDE0884
Indenfication mark
6.5
0.3
0.3
4.58
7.62
0.3
0.3
4.58
7.62
Epoxy resin
10.16
0.1
0.5
0.25
0.5
0.25
0.75
0.75
12.0MAX
Epoxy resin
10.16
0.1
0.5
0.25
0.5
0.25
0.75
0.75
12.0MAX
Product mass : approx. 0.18g
Sheet No.: D2-A02902EN
3
PC123 Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory making is for identification purpose only.
Please contact the local SHARP sales representative to see the actual status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A02902EN
4
PC123 Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
50
*1 Peak forward current
Reverse voltage
IFM
1
VR
6
V
Power dissipation
P
70
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
70
6
50
V
mA
mW
mW
kV
Collector power dissipation
Total power dissipation
*2 Isolation voltage
Operating temperature
Storage temperature
*3 Soldering temperature
PC
150
Ptot
200
Viso (rms)
Topr
Tstg
Tsol
5.0
−30 to +100
−55 to +125
260
˚C
˚C
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Forward voltage
Symbol
VF
Conditions
MIN.
TYP.
MAX.
1.4
10
Unit
V
IF=20mA
VR=4V
−
1.2
Input Reverse current
Terminal capacitance
Collector dark current
IR
−
−
30
−
µA
pF
nA
V
Ct
V=0, f=1kHz
−
250
100
−
ICEO
VCE=50V, IF=0
−
Output Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
70
−
Emitter-collector breakdown voltage
BVECO
IC
IE=10µA, IF=0
6
−
−
nA
mA
V
Collector current
IF=5mA, VCE=5V
IF=20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
2.5
−
20
Collector-emitter saturation voltage VCE (sat)
−
0.1
1×1011
0.6
80
4
0.2
−
Isolation resistance
Floating capacitance
Cut-off frequency
RISO
Cf
fc
5×1010
Ω
Transfer
charac-
teristics
−
−
−
−
1.0
−
pF
kHz
µs
VCE=5V, IC=2mA, RL=100Ω, −3dB
Rise time
tr
18
Response time
VCE=2V, IC=2mA, RL=100Ω
Fall time
tf
3
18
µs
Sheet No.: D2-A02902EN
5
PC123 Series
■ Model Line-up
Lead Form
Through-Hole
Wide Through-Hole
Sleeve
100pcs/sleeve
Approved
SMT Gullwing
Wide SMT Gullwing
Taping
2 000pcs/reel
Approved
IC [mA]
Package
Rank mark
(I =5mA, V =5V, T =25˚C)
F
CE
a
VDE0884
−
−
Approved
−
−
Approved
PC123
PC123Y
PC123F PC123FY PC123P PC123PY PC123FP PC123ZY with or without 2.5 to 30.0
PC123A PC123Y1 PC123F1 PC123FY1 PC123P1 PC123PY1 PC123FP1 PC123ZY1
A
2.5 to 7.5
5.0 to 12.5
10.0 to 20.0
5.0 to 10.0
Model No. PC123B PC123Y2 PC123F2 PC123FY2 PC123P2 PC123PY2 PC123FP2 PC123ZY2
PC123C PC123Y5 PC123F5 PC123FY5 PC123P5 PC123PY5 PC123FP5 PC123ZY5
PC123S PC123YS PC123FS PC123FY8 PC123PS PC123PY8 PC123FP8 PC123ZY8
B
No mark
S
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A02902EN
6
PC123 Series
Fig.2 Diode Power Dissipation vs.
Fig.1 Forward Current vs. Ambient
Temperature
Ambient Temperature
100
50
40
30
20
80
70
60
40
20
0
10
0
−30
0
25
50 55 75
100
125
−30
0
25
50 55 75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
250
Temperature
250
200
150
100
200
150
100
50
0
50
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
10 000
500
Pulse width≤100µs
Ta=75˚C
5 000
Ta=25˚C
200
50˚C
25˚C
2 000
1 000
100
0˚C
−25˚C
50
500
20
10
5
200
100
50
20
10
5
2
1
5
10−3
2
5
10−2
Duty ratio
2
5
10−1
2
5
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward voltage VF (V)
Sheet No.: D2-A02902EN
7
PC123 Series
Fig.7 Current Transfer Ratio vs. Forward
Current
Fig.8 Collector Current vs. Collector-emitter
Voltage
300
Ta=25˚C
VCE=5V
Ta=25˚C
60
250
54
PC (MAX.)
48
200
150
100
42
36
30
24
18
12
50
0
6
0
0.1
1
10
100
0
1
2
3
4
5
6
7
8
9
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
150
0.16
IF=5mA
IF=20mA
VCE=5V
IC=1mA
0.14
0.12
0.10
0.08
0.06
0.04
100
50
0
0.02
0.00
−30
0
25
50
75
100
−30
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs. Ambient
Fig.12 Response Time vs. Load Resistance
Temperature
10−5
1 000
VCE=50V
5
VCE=2V
IC=2mA
Ta=25˚C
100
10−6
5
10−7
5
tr
tf
10−8
5
10
td
10−9
5
ts
1
10−10
5
10−11
0.1
0.01
0.1
1
10
100
−30
0
20
40
60
80
100
Load resistance (kΩ)
Ambient temperature Ta (˚C)
Sheet No.: D2-A02902EN
8
PC123 Series
Fig.13 Test Circuit for Response Time
Fig.14 Frequency Response
5
VCE=5V
IC=2mA
Ta=25˚C
Input
VCC
0
−5
Output
Output
VCE
RL
Input RD
10%
90%
tf
td
ts
tr
−10
Please refer to the conditions in Fig.12.
RL=10kΩ
100Ω
1kΩ
−15
−20
0.1
1
10
Frequency (kHz)
100
1 000
Fig.15 Collector-emitter Saturation Voltage
vs. Forward Current
Ta=25˚C
5.0
IC=0.5mA
1mA
3mA
4.5
5mA
7mA
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
2
4
6
8
10 12 14 16 18 20
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A02902EN
9
PC123 Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
● Recommended Foot Print (reference)
SMT Gullwing lead-form
Wide SMT Gullwing lead-form
10.2
8.2
2.2
2.2
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A02902EN
10
PC123 Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A02902EN
11
PC123 Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A02902EN
12
PC123 Series
■ Package specification
● Sleeve package
1. Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
2. Wide Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
6.35
(Unit : mm)
Sheet No.: D2-A02902EN
13
PC123 Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
E
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
0.3
0.1
0.1
0.1
0.1
0.1
0.1
0.1
+0.1
16.0
H
7.5
1.75
J
8.0
K
2.0
4.0
φ1.5
−0
I
0.05
0.1
10.4
0.4
4.2
5.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
1.5
1.0
0.5
330
e
17.5
f
100
g
13
f
b
1.0
0.5
0.5
a
23
2.0
2.0
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A02902EN
14
PC123 Series
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
C
I
E
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
0.3
0.1
0.1
0.1
0.1
0.1
0.1
0.1
24.0
H
11.5
I
1.75
J
8.0
K
2.0
4.0
φ1.5
−0
0.05
0.1
12.4
0.4
4.1
5.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
1.5
1.0
0.5
330
e
25.5
f
100
g
13
f
b
1.0
0.5
0.5
a
23
2.0
2.0
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A02902EN
15
PC123 Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A02902EN
16
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