PC900V0NIPX [SHARP]
Digital Output, Normal OFF Operation DIP 6 pin âOPIC Photocoupler; 数字输出,正常关闭操作DIP 6引脚上的???? OPIC光耦合器型号: | PC900V0NIPX |
厂家: | SHARP ELECTRIONIC COMPONENTS |
描述: | Digital Output, Normal OFF Operation DIP 6 pin âOPIC Photocoupler |
文件: | 总16页 (文件大小:264K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PC900V0NSZX Series
Digital Output, Normal OFF
Operation DIP 6 pin OPIC
Photocoupler
∗
PC900V0NSZX
Series
■ Description
PC900V0NSZX Series contains an IRED optically
coupled to an OPIC chip.
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC900V)
It is packaged in a 6 pin DIP, available in SMT gullw-
ing lead-form and Wide SMT gullwing lead-form op-
tion.
2. Approved by TÜV (VDE0884) (as an option) file No.
R9151577 (as model No. PC900V)
3. Package resin : UL flammability grade (94V-0)
Input-output isolation voltage(rms) is 5.0kV.
■ Applications
1. Programmable controllers
2. PC peripherals
■ Features
1. 6 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Electronic musical instruments
3. Normal OFF operation, open collector output
4. TTL and LSTTL compatible output
5. Operating supply voltage (VCC : 3 to 15 V)
6. Isolation voltage (Viso(rms) : 5.0 kV)
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A05301EN
1
Date Nov. 28. 2003
© SHARP Corporation
PC900V0NSZX Series
■ Internal Connection Diagram
6
5
4
1
2
3
4
5
6
Anode
Cathode
NC
VO
GND
VCC
Voltage
regulator
Amp
1
2
3
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC900V0NSZX]
2. Through-Hole (VDE0884 option) [ex. PC900V0YSZX]
0.3
0.3
1.2
1.2
0.2
0.2
0.6
0.6
SHARP
mark
"S"
6
5
4
6
5
4
SHARP
mark
"S"
VDE0884 Identification mark
P C 9 0 0 V
P C 9 0 0 V
Anode
mark
4
Anode
mark
Date code
Date code
1
2
3
1
2
3
0.5
0.5
7.12
7.12
0.3
0.3
7.62
7.62
Epoxy resin
Epoxy resin
0.1
0.1
0.25
0.5
0.25
0.5
2.54
2.54
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
3. SMT Gullwing Lead-Form [ex. PC900V0NIPX]
4. SMT Gullwing Lead-Form (VDE0884 option)
[ex. PC900V0YIPX]
0.3
0.3
1.2
0.2
6
1.2
0.2
6
0.6
0.6
5
4
5
4
SHARP
mark
"S"
SHARP
mark
"S"
VDE0884 Identification mark
P C 9 0 0 V
P C 9 0 0 V
Anode
mark
4
Anode
mark
Date code
Date code
1
2
3
1
2
3
0.5
0.5
7.12
7.12
0.3
0.3
7.62
7.62
0.25
0.25
2.54
Epoxy resin
2.54
Epoxy resin
+0.4
+0.4
+0.4
+0.4
1.0
1.0
1.0
−0
1.0
−0
−0
−0
+0
+0
10.0
10.0
−0.5
−0.5
Sheet No.: D2-A05301EN
2
PC900V0NSZX Series
(Unit : mm)
5. Wide SMT Gullwing Lead-Form
6. Wide SMT Gullwing Lead-Form (VDE0884 option)
[ex. PC900V0NUPX]
[ex. PC900V0YUPX]
0.3
0.3
1.2
1.2
0.2
0.2
0.6
0.6
SHARP
mark
"S"
SHARP
mark
"S"
P C 9 0 0 V
P C 9 0 0 V
Anode
mark
4
Anode
mark
Date code
Date code
VDE0884 Identification mark
0.5
0.5
7.12
0.3
0.3
7.12
7.62
7.62
Epoxy resin
10.16
12.0MAX.
Epoxy resin
10.16
12.0MAX.
0.25
0.25
2.54
2.54
0.25
0.5
0.25
0.25
0.5
0.25
0.75
0.75
0.75
0.75
Product mass : approx. 0.36g
Sheet No.: D2-A05301EN
3
PC900V0NSZX Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Country of origin
Japan
Sheet No.: D2-A05301EN
4
PC900V0NSZX Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
50
*1
Peak forward current
IFM
1
Input
Reverse voltage
Power dissipation
Supply voltage
High level output voltage
Low level output current
Power dissipation
VR
6
V
P
70
mW
V
VCC
VOH
IOL
16
16
V
Output
50
mA
mW
mW
˚C
PO
150
Total power dissipation
Operating temperature
Storage temperature
*2 Isolation voltage
*3 Soldering temperature
Ptot
170
Topr
Tstg
Viso (rms)
Tsol
−25 to +85
−40 to +125
5.0
˚C
kV
260
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
(Unless otherwise specified Ta=0 to +70˚C)
Parameter
Symbol
Conditions
MIN.
TYP.
1.1
1.0
−
MAX.
1.4
−
Unit
IF=4mA
IF=0.3mA
−
0.7
−
Forward voltage
VF
V
Reverse current
IR
Ta=25˚C, VR=3V
10
µA
pF
Terminal capacitance
Operating Supply voltage
Low level output voltage
High level output current
Low level supply current
High level supply current
*4 "High→Low" input
threshold current
*5 "Low→High" input
threshold current
Ct
Ta=25˚C, V=0, f=1kHz
−
−
30
250
15
VCC
VOL
IOH
ICCL
ICCH
3
−
V
IOL=16mA, VCC=5V, IF=4mA
VO=VCC=15V, IF=0
VCC=5V, IF=4mA
−
0.2
−
0.4
100
5.0
5.0
2.0
4.0
−
V
−
µA
mA
mA
−
2.5
1.0
1.1
−
VCC=5V, IF=0
−
Ta=25˚C, VCC=5V, RL=280Ω
VCC=5V, RL=280Ω
Ta=25˚C, VCC=5V, RL=280Ω
VCC=5V, RL=280Ω
VCC=5V, RL=280Ω
Ta=25˚C, DC500V, 40 to 60%RH
−
IFHL
IFLH
mA
mA
−
0.4
0.3
0.5
5×1010
−
0.8
−
−
*6 Hysteresis
IFLH/IFHL
RISO
tPHL
tPLH
tr
0.7
1×1011
1
0.9
−
−
Isolation voltage
"High→Low" propagation delay time
"Low→High" propagation delay time
Rise time
Ω
3
Ta=25˚C, VCC=5V, IF=4mA
RL=280Ω
−
2
6
µs
−
0.1
0.05
0.5
0.5
Fall time
tf
−
*4 IFHL represents forward current when output goes from high to low.
*5 IFLH represents forward current when output goes from low to high.
*6 Hysteresis stands for IFLH/IFHL
.
Sheet No.: D2-A05301EN
5
PC900V0NSZX Series
■ Model Line-up
Lead Form
Through-Hole
SMT Gullwing
Wide SMT Gullwing
Sleeve
Taping
1 000pcs/reel
Approved −−−−−−
Package
50pcs/sleeve
VDE0884
Model No.
−−−−−−
Approved
−−−−−−
Approved
−−−−−−
Approved
PC900V0NSZX PC900V0YSZX PC900V0NIZX PC900V0YIZX PC900V0NIPX PC900V0YIPX PC900V0NUPX PC900V0YUPX
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A05301EN
6
PC900V0NSZX Series
Fig.1 Test Circuit for Response Time
Voltage
regulator
50%
VIN
5V
280Ω
VO
tPHL
tPLH
tr=tf=0.01µs
Amp
ZO=50Ω
VIN
VOH
90%
10%
VOL
tr
0.1µF
VO
47Ω
1.5V
tf
Fig.2 Forward Current vs. Ambient
Fig.3 Power Dissipation vs. Ambient
Temperature
Temperature
200
60
Ptot
170
50
40
30
20
PO
150
100
50
0
10
0
−25
0
25
50
75 85 100
−25
0
25
50
75 85 100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.4 Forward Current vs. Forward Voltage Fig.5 Relative Input Threshold Current vs.
Supply Voltage
1.4
1.2
1.0
0.8
0.6
500
Ta=25˚C
Ta=75˚C
IFHL=1 at VCC=5V
50˚C
200
25˚C
0˚C
−25˚C
IFHL
100
50
IFLH
20
10
5
0.4
0.2
2
1
0
5
10
15
20
0
0.5
1.0
1.5
2.0
2.5
3.0
Supply voltage VCC (V)
Forward voltage VF (V)
Sheet No.: D2-A05301EN
7
PC900V0NSZX Series
Fig.7 Low Level Output Voltage vs. Low
Fig.6 Relative Input Threshold Current vs.
Ambient Temperature
Level Output Current
1.6
1.0
VCC=5V
1.4
VCC=5V
0.5
Ta=25˚C
1.2
0.2
0.1
IFHL
1.0
0.8
IFLH
0.6
0.05
0.4
0.02
0.01
IFHL=1 at Ta=25˚C
0.2
−25
0
25
50
75
100
1
2
5
10
20
50
100
Ambient temperature Ta (˚C)
Low level output current IOL (mA)
Fig.9 Supply Current vs. Supply Voltage
Fig.8 Low Level Output Voltage vs. Ambient
Temperature
0.5
9
Ta= −25˚C
IOL=30mA
VCC=5V
8
25˚C
0.4
0.3
0.2
7
6
5
4
16mA
Ta= −25˚C
85˚C
3
5mA
25˚C
15
2
0.1
0
ICCL
{
85˚C
1
0
ICCH
{
1
3
5
7
9
11
13
17
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Supply voltage VCC (V)
Fig.11 Rise Time, Fall Time vs. Load
Resistance
Fig.10 Propagation Delay Time vs. Forward
Current
5
0.5
VCC=5V
VCC=5V
RL=280Ω
IF=4mA
Ta=25˚C
Ta=25˚C
4
0.4
tPLH
3
0.3
2
0.2
tr
1
0.1
tf
tPHL
0
0
0
10
20
30
40
50
60
0.1 0.2
0.5
1
2
5
10
20
Forward current IF (mA)
Load resistance RL (kΩ)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
8
Sheet No.: D2-A05301EN
PC900V0NSZX Series
■ Design Considerations
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
Please decide the input current which become 2times of MAX. IFHL
.
Sheet No.: D2-A05301EN
9
PC900V0NSZX Series
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
Wide SMT Gullwing Lead-form
10.5
8.5
2.2
2.2
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A05301EN
10
PC900V0NSZX Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A05301EN
11
PC900V0NSZX Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A05301EN
12
PC900V0NSZX Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A05301EN
13
PC900V0NSZX Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
J
F
D
G
E
I
K
Dimensions List
(Unit:mm)
A
B
C
D
E
F
G
0.3
0.1
0.1
0.1
0.1
0.1
0.1
+0.1
16.0
H
7.5
1.75
J
12.0
K
2.0
4.0
φ1.5
−0
I
0.05
0.1
0.1
10.4
0.4
4.2
7.8
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
1.5
1.0
0.5
330
e
17.5
f
100
g
13
f
b
1.0
0.5
0.5
a
23
2.0
2.0
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A05301EN
14
PC900V0NSZX Series
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
C
I
E
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
0.3
0.1
0.1
0.1
0.1
0.1
0.1
+0.1
24.0
H
11.5
I
1.75
J
12.0
K
2.0
4.0
φ1.5
−0
0.05
0.1
0.1
12.2
0.4
4.1
7.6
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
1.5
1.0
0.5
330
e
25.5
f
100
g
13
f
b
1.0
0.5
0.5
23
2.0
2.0
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A05301EN
15
PC900V0NSZX Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A05301EN
16
相关型号:
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SHARP
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