500DBBA62M5000ACH [SILICON]

LVPECL Output Clock Oscillator,;
500DBBA62M5000ACH
型号: 500DBBA62M5000ACH
厂家: SILICON    SILICON
描述:

LVPECL Output Clock Oscillator,

文件: 总7页 (文件大小:977K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si500D  
DIFFERENTIAL OUTPUT SILICON OSCILLATOR  
Features  
Quartz-free, MEMS-free, and PLL-free all-silicon  
oscillator  
Any output frequencies from 0.9 to 200 MHz  
Short lead times  
Excellent temperature stability (±20 ppm)  
Highly reliable startup and operation  
High immunity to shock and vibration  
Low jitter: <1.5 ps rms  
0 to 85 °C operation includes 10-year aging in hot  
environments  
Footprint compatible with industry-  
standard 3.2 x 5.0 mm XOs  
CMOS, SSTL, LVPECL, LVDS, and HCSL  
versions available  
Driver stopped, tri-state, or powerdown  
operation  
RoHS compliant  
1.8, 2.5, or 3.3 V options  
Low power  
More than 10x better fit rate than  
competing crystal solutions  
Specifications  
Parameters  
Condition  
Min  
Typ  
Max  
Units  
Frequency Range  
0.9  
200  
MHz  
Temperature stability,  
0 to +70 °C  
±10  
±20  
ppm  
ppm  
ppm  
ppm  
Temperature stability,  
0 to +85 °C  
Frequency Stability  
Total stability,  
0 to +70 °C operation  
±150  
±250  
1
Total stability,  
0 to +85 °C operation  
2
Commercial  
0
70  
85  
°C  
°C  
°C  
V
Operating Temperature  
Storage Temperature  
Extended commercial  
0
–55  
1.71  
2.25  
2.97  
+125  
1.98  
2.75  
3.63  
1.8 V option  
2.5 V option  
3.3 V option  
Supply Voltage  
V
V
Notes:  
1. Inclusive of 25 °C initial frequency accuracy, operating temperature range, supply voltage change, output load change,  
first-year aging at 25 °C, shock, vibration, and one solder reflow.  
2. Inclusive of 25 °C initial frequency accuracy, operating temperature range, supply voltage change, output load change,  
ten-year aging at 85 °C, shock, vibration, and one solder reflow.  
3. See “AN409: Output Termination Options for the Si500S and Si500D Silicon Oscillators” for further details regarding  
output clock termination recommendations.  
4. VTT = .5 x VDD  
.
5. VTT = .45 x VDD  
.
Rev. 1.1 10/11  
Copyright © 2011 by Silicon Laboratories  
Si500D  
Si500D  
Parameters  
Condition  
LVPECL  
Min  
Typ  
34.0  
19.3  
14.9  
25.3  
Max  
36.0  
22.2  
16.5  
29.3  
Units  
mA  
Low Power LVPECL  
LVDS  
mA  
mA  
HCSL  
mA  
Differential CMOS(3.3 V option,  
10 pF on each output, 200 MHz)  
33  
16  
36  
mA  
mA  
Supply Current  
Differential CMOS(3.3 V option,  
1 pFon each output, 40 MHz)  
Differential SSTL-3.3  
Differential SSTL-2.5  
Differential SSTL-1.8  
Tri-State  
24.5  
24.3  
22.2  
9.7  
1.0  
27.7  
26.7  
mA  
mA  
mA  
mA  
mA  
%
25  
10.7  
Powerdown  
1.9  
Output Symmetry  
V
= 0  
46 – 13 ns/T  
54 + 13 ns/T  
460  
DIFF  
CLK  
CLK  
LVPECL/LVDS  
HCSL/Differential SSTL  
Differential CMOS, 15 pF, >80 MHz  
Mid-level  
ps  
3
Rise and Fall Times (20/80%)  
800  
ps  
1.1  
1.6  
ns  
V
– 1.5  
V
– 1.34  
DD  
V
LVPECL Output Option  
(DC coupling, 50 to V – 2.0 V)  
DD  
3
Diff swing  
.720  
.880  
V
DD  
PK  
Low Power LVPECL Output Option  
Mid-level  
N/A  
V
(AC coupling, 100 Differential  
Load)  
Diff swing  
.68  
.95  
V
3
PK  
Mid-level  
Diff swing  
1.15  
0.25  
0.85  
0.25  
0.35  
0.65  
45  
1.26  
0.45  
0.96  
0.45  
0.425  
0.82  
55  
V
LVDS Output Option (2.5/3.3 V)  
3
(R  
= 100 diff)  
V
TERM  
PK  
Mid-level  
V
LVDS Output Option (1.8 V)  
3
(R  
= 100 diff)  
Diff swing  
V
TERM  
PK  
Mid-level  
V
3
HCSL Output Option  
Diff swing  
V
PK  
DC termination per pad  
V
V
V
, sourcing 9 mA  
V
– 0.6  
DD  
OH  
3
CMOS Output Voltage  
V
, sinking 9 mA  
0.6  
OL  
V
V
+ 0.375  
OH  
TT  
4
4
5
SSTL-1.8 Output Voltage  
SSTL-2.5 Output Voltage  
SSTL-3.3 Output Voltage  
Powerup Time  
V
V
V
V
V
– 0.375  
OL  
TT  
V
V
+ 0.48  
OH  
TT  
V
V
V
– 0.48  
OL  
TT  
TT  
V
V
+ 0.48  
OH  
TT  
V
– 0.48  
OL  
From time V crosses min spec  
DD  
2
ms  
ns  
ns  
µs  
supply  
OE Deassertion to Clk Stop  
250 + 3 x T  
250 + 3 x T  
CLK  
CLK  
CLK  
Return from Output Driver Stopped  
Mode  
Return From Tri-State Time  
12 + 3 x T  
Notes:  
1. Inclusive of 25 °C initial frequency accuracy, operating temperature range, supply voltage change, output load change,  
first-year aging at 25 °C, shock, vibration, and one solder reflow.  
2. Inclusive of 25 °C initial frequency accuracy, operating temperature range, supply voltage change, output load change,  
ten-year aging at 85 °C, shock, vibration, and one solder reflow.  
3. See “AN409: Output Termination Options for the Si500S and Si500D Silicon Oscillators” for further details regarding  
output clock termination recommendations.  
4. VTT = .5 x VDD  
.
5. VTT = .45 x VDD  
.
2
Rev. 1.1  
Si500D  
Parameters  
Condition  
Min  
Typ  
Max  
Units  
Return From Powerdown Time  
2
ms  
ps  
RMS  
Non-CMOS  
1
2
3
Period Jitter (1-sigma)  
ps  
RMS  
CMOS, C = 7 pF  
1
L
1.0 MHz – min(20 MHz,  
ps  
RMS  
0.6  
0.7  
1
0.4 x F  
),non-CMOS  
OUT  
Integrated Phase Jitter  
1.0 MHz – min(20 MHz,  
0.4 x F ),CMOS format  
ps  
RMS  
1.5  
OUT  
Notes:  
1. Inclusive of 25 °C initial frequency accuracy, operating temperature range, supply voltage change, output load change,  
first-year aging at 25 °C, shock, vibration, and one solder reflow.  
2. Inclusive of 25 °C initial frequency accuracy, operating temperature range, supply voltage change, output load change,  
ten-year aging at 85 °C, shock, vibration, and one solder reflow.  
3. See “AN409: Output Termination Options for the Si500S and Si500D Silicon Oscillators” for further details regarding  
output clock termination recommendations.  
4. VTT = .5 x VDD  
.
5. VTT = .45 x VDD  
.
Rev. 1.1  
3
Si500D  
Package Specifications  
Table 1. Package Diagram Dimensions (mm)  
Dimension  
Min  
0.80  
Nom  
0.85  
0.03  
0.64  
Max  
0.90  
0.05  
0.69  
Dimension  
Min  
0.00  
Nom  
0.05  
Max  
0.10  
0.10  
0.10  
0.08  
A
A1  
b
L1  
0.00  
aaa  
bbb  
ccc  
0.59  
D
3.20 BSC.  
e
E
L
1.27 BSC.  
4.00 BSC.  
0.95  
ddd  
eee  
0.10  
0.05  
1.00  
1.05  
Table 2. Pad Connections  
Table 3. Tri-State/Powerdown/Driver Stopped  
Function on OE (3rd Option Code)  
1
2
OE  
A
B
C
D
E
F
NC—Make no external  
connection to this pin  
Open Active Active Active Active Active  
Active  
3
4
5
6
GND  
Output  
1
Tri-  
State  
Power-  
down  
Driver  
Stopped  
Active  
Active  
Active  
Level  
0
Tri-  
State  
Power-  
down  
Driver  
Stopped  
Complementary Output  
VDD  
Active  
Active  
Active  
Level  
0 C CC CC  
T T T T T T  
Y YWW  
Dimension  
(mm)  
C1  
E
X1  
Y1  
2.70  
1.27  
0.75  
1.55  
0 = Si500  
CCCCC = mark code  
TTTTTT = assembly manufacturing code  
YY = year  
WW = work week  
Figure 2. Top Mark  
Figure 1. Recommended Land Pattern  
4
Rev. 1.1  
Si500D  
Environmental Compliance  
Parameter  
Conditions/Test Method  
MIL-STD-883, Method 2002.4  
MIL-STD-883, Method 2007.3 A  
MIL-STD-202, 260 C° for 8 seconds  
MIL-STD-883, Method 2003.8  
IEC 68-2-3  
Mechanical Shock  
Mechanical Vibration  
Resistance to Soldering Heat  
Solderability  
Damp Heat  
Moisture Sensitivity Level  
J-STD-020, MSL 3  
Ordering Information  
The Si500D supports a variety of options including frequency, output format, supply voltage, and tri-  
state/powerdown. Specific device configurations are programmed into the Si500D at time of shipment.  
Configurations are specified using the figure below. Silicon Labs provides a web-based part number utility that can  
be used to simplify part number configuration. Refer to www.silabs.com/SiliconXOPartnumber to access this tool.  
The Si500D XO series is supplied in a ROHS-compliant, Pb-free, 6-pad, 3.2 x 4.0 mm package. Tape and reel  
packaging is available as an ordering option.  
500D  
X
X
X
XXMXXXX  
A
C
X
R
Frequency  
Si500  
Differential  
Oscillator  
R = Tape & Reel  
Blank = Cut-Tape  
xMxxxxx: fOUT < 10 MHz  
xxMxxxx: 10 MHz < fOUT < 100 MHz  
xxxMxxx: fOUT > 100 MHz  
1st Option Code  
VDD Format  
LVPECL  
3rd Option Code  
Oper. Temp Range  
A
B
C
D
E
F
G
H
J
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
1.8  
1.8  
1.8  
1.8  
1.8  
1.8  
Tri-State/Powerdown/  
Output Driver Stopped  
F
*H  
0 to 70 °C  
0 to 85 °C  
Low Power LVPECL  
LVDS  
HCSL  
Dual Output CMOS  
Differential CMOS  
Dual Output SSTL  
Differential SSTL  
LVPECL  
Low Power LVPECL  
LVDS  
HCSL  
Dual Output CMOS  
Differential CMOS  
Dual Output SSTL  
Differential SSTL  
LVDS  
A
B
C
D
E
F
OE active high/tristate  
OE active low/tristate  
OE active high/powerdown  
OE active low/powerdown  
OE active high/driver stopped  
OE active low/driver stopped  
Product Revision = C  
K
L
2nd Option Code  
Package  
Stability (ppm, max)  
M
N
P
Q
R
S
T
U
V
W
X
A
3.2 x 4.0 mm SMD  
A
B
±150  
±250  
HCSL  
Dual Output CMOS  
Differential CMOS  
Dual Output SSTL  
Differential SSTL  
*Note: Only +250 ppm is supported.  
Rev. 1.1  
5
Si500D  
DOCUMENT CHANGE LIST  
Revision 0.2 to Revision 0.3  
Revision B to Revision C updated in Ordering Information  
0 to 85 C° Operating Temperature Range option added  
Revision 0.3 to Revision 1.0  
Clarified SSTL specifications.  
Revised Differential CMOS supply current values.  
Clarified Differential CMOS supply current loading  
conditions.  
Revision 1.0 to Revision 1.1  
Updated Ordering information for ±250 ppm from 0 to  
+85 °C.  
Updated jitter from 1.5 ps to 1.5 ps rms.  
Updated operating temperature to include extended  
commercial at 0 to +85 °C.  
Updated features to include LVPECL, LVDS, and HCSL.  
6
Rev. 1.1  
ClockBuilder Pro  
One-click access to Timing tools,  
documentation, software, source  
code libraries & more. Available for  
Windows and iOS (CBGo only).  
www.silabs.com/CBPro  
Timing Portfolio  
www.silabs.com/timing  
SW/HW  
www.silabs.com/CBPro  
Quality  
www.silabs.com/quality  
Support and Community  
community.silabs.com  
Disclaimer  
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or  
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"  
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without  
further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior  
notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance  
of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to  
design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required  
or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails,  
can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no  
circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs  
disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.  
Trademark Information  
Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, ClockBuilder®, CMEMS®, DSPLL®, EFM®,  
EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®,  
Gecko®, Gecko OS, Gecko OS Studio, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® , Zentri, the Zentri logo and Zentri  
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Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective  
holders.  
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400 West Cesar Chavez  
Austin, TX 78701  
USA  
http://www.silabs.com  

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