TS1107 [SILICON]
Power Management Systems;
| 型号： | TS1107 |
| 厂家： | 
SILICON |
| 描述： | Power Management Systems |
| 文件： | 总22页 (文件大小：1557K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS1107/10 Data Sheet
Electronic Circuit Breaker: High Side Current Sense Amplifier with
Current Limiter Comparator and FET Control (TS1110 only)
KEY FEATURES
• Circuit Breaker with Latching Load
Disconnect
The TS1110 Electronic Circuit Breaker uses a bidirectional current-sense amplifier for
current limit detection to disconnect the load by use of an external P-channel MOSFET.
An internal Current Limit Comparator with an adjustable threshold provides a latch capa-
ble output to signal when a fault condition has occurred. Once the Current Limit Compa-
rator’s output is latched the internal FET control is enabled which drives the gate of the
external P-channel MOSFET, disconnecting the load from the power supply. Once the
fault condition is removed, the system may be reset by strobing or pulling the latch ena-
ble pin, CLATCH, low. The Circuit Breaker system delay of the TS1110 is typically 428
µs. The Current Limiter system delay of the TS1107 and TS1110 is typically 670 µs.
• Internal Latching Current Limiter
Comparator with CLATCH Reset
• Programmable Current Limit
• COUT Output Signals Fault Condition
• Low Supply Current
• Current Sense Amplifier: 0.68 µA
• TS1110 I
• TS1107 I
: 1.16 µA
VDD
VDD
: 1.15 µA
Applications
• High Side Bidirectional Current Sense
Amplifier
• Power Management Systems
• Portable/Battery-Powered Systems
• Smart Chargers
• Wide CSA Input Common Mode Range: +2
V to +27 V
• Low CSA Input Offset Voltage: 150
µV(max)
• Battery Monitoring
• Overcurrent and Undercurrent Detection
• Remote Sensing
• Low Gain Error: 1% (max)
• Two Gain Options Available for TS1107
and TS1110:
• Industrial Controls
• Gain = 20 V/V : TS1107-20 and
TS1110-20
• Gain = 200 V/V : TS1107-200 and
TS1110-200
• 16-Pin TQFN Packaging (3 mm x 3 mm)
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TS1107/10 Data Sheet
Ordering Information
1. Ordering Information
Table 1.1. Ordering Part Numbers
Description
Ordering Part Number
FET Control
Gain V/V
TS1107-20ITQ1633
Electronic Circuit Breaker: High Side Current Sense Amplifier with Current
Limiter Comparator
No
20
TS1107-200ITQ1633
TS1110-20ITQ1633
TS1110-200ITQ1633
Electronic Circuit Breaker: High Side Current Sense Amplifier with Current
Limiter Comparator
No
200
20
Electronic Circuit Breaker: High Side Current Sense Amplifier with Current
Limiter Comparator and FET Control
Yes
Yes
Electronic Circuit Breaker: High Side Current Sense Amplifier with Current
Limiter Comparator and FET Control
200
Note: Adding the suffix “T” to the part number (e.g. TS1107-200ITQ1633T) denotes tape and reel.
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TS1107/10 Data Sheet
System Overview
2. System Overview
2.1 Functional Block Diagrams
Figure 2.1. TS1110 Current Limit with FET Control Block Diagram
Figure 2.2. TS1107 Current Limit Block Diagram
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TS1107/10 Data Sheet
System Overview
2.2 Current Sense Amplifier + Output Buffer
The internal configuration of the TS1107/10 bidirectional current-sense amplifier is a variation of the TS1101 bidirectional current-sense
amplifier. The TS1107/10 current-sense amplifier is configured for fully differential input/output operation.
Referring to the block diagram, the inputs of the TS1107/10’s differential input/output amplifier are connected to RS+ and RS– across
an external RSENSE resistor that is used to measure current. At the non-inverting input of the current-sense amplifier, the applied volt-
age difference in voltage between RS+ and RS– is ILOAD x RSENSE. Since the RS– terminal is the non-inverting input of the internal op-
amp, the current-sense op-amp action drives PMOS[1/2] to drive current across RGAIN[A/B] to equalize voltage at its inputs.
Thus, since the M1 PMOS source is connected to the inverting input of the internal op-amp and since the voltage drop across RGAINA is
the same as the external VSENSE, the M1 PMOS drain-source current is equal to:
V
SENSE
I
=
DS(M 1)
R
GAINA
or
I
× R
LOAD
SENSE
GAINA
I
=
DS(M 1)
R
The drain terminal of the M1 PMOS is connected to the transimpedance amplifier’s gain resistor, ROUT, via the inverting terminal. The
non-inverting terminal of the transimpedance amplifier is internally connected to VBIAS, therefore the output voltage of the TS1107/10
at the OUT terminal is:
R
OUT
V
= V
− I
× R
×
OUT
BIAS
LOAD
SENSE
R
GAINA
When the voltage at the RS– terminal is greater than the voltage at the RS+ terminal, the external VSENSE voltage drop is impressed
upon RGAINB. The voltage drop across RGAINB is then converted into a current by the M2 PMOS. The M2 PMOS drain-source current is
the input current for the NMOS current mirror which is matched with a 1-to-1 ratio. The transimpedance amplifier sources the M2 PMOS
drain-source current for the NMOS current mirror. Therefore the output voltage of the TS1107/10 at the OUT terminal is:
R
OUT
V
= V
+ I
× R
×
OUT
BIAS
LOAD
SENSE
R
GAINB
When M1 is conducting current (VRS+ > VRS–), the TS1107/10’s internal amplifier holds M2 OFF. When M2 is conducting current (VRS–
> VRS+), the internal amplifier holds M1 OFF. In either case, the disabled PMOS does not contribute to the resultant output voltage.
The current-sense amplifier’s gain accuracy is therefore the ratio match of ROUT to RGAIN[A/B]. For each of the gain options available,
The following table lists the values for RGAIN[A/B]
.
Table 2.1. Internal Gain Setting Resistors (Typical Values)
GAIN (V/V)
RGAIN[A/B] (Ω)
ROUT (Ω)
40 k
Part Number
TS1110-20
TS1110-200
TS1107-20
TS1107-200
20
200
20
2 k
200
2 k
40 k
40 k
200
200
40 k
The TS1107/10 allows access to the inverting terminal of the transimpedance amplifier by the FILT pin, whereby a series RC filter may
be connected to reduce noise at the OUT terminal. The recommended RC filter is 4 kΩ and 0.47 μF connected in series from FILT to
GND to suppress the noise. Any capacitance at the OUT terminal should be minimized for stable operation of the buffer.
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TS1107/10 Data Sheet
System Overview
2.3 Sign Output
The TS1107/10 SIGN output indicates the load current’s direction. The SIGN output is a logic HIGH when M1 is conducting current
(VRS+ > VRS–). Alternatively, the SIGN output is a logic LOW when M2 is conducting current (VRS– > VRS+). The SIGN comparator’s
transfer characteristic is illustrated in Figure 1. Unlike other current-sense amplifiers that implement an OUT/SIGN arrangement, the
TS1107/10 exhibits no “dead zone” at ILOAD switchover.
Figure 2.3. TS1107/10 Sign Output Transfer Characteristic
2.4 Current Limit Comparator
The TS1107/10 provides a comparator which can be used for current limit detection. The current limit threshold can be set to detect
either positive or negative current, though it provides fastest response in the positive direction. In a typical configuration, the inverting
terminal, CIN– is connected to OUT. The non-inverting terminal of the comparator, CIN+, should be supplied with an external voltage or
a resistor divider from the supply voltage, which is used as the threshold voltage for the current limiter. The output of the comparator is
latch capable only when the Sign Comparator is HIGH (VRS+>VRS–), and CLATCH is held HIGH. Once the comparator output (COUT)
is triggered, COUT will latch HIGH and maintain the HIGH state as long as CLATCH is held HIGH. To reset COUT to the default com-
parator output state, CLATCH must be held or strobed LOW.
2.5 FET Control (TS1110 Only)
A “circuit breaker” feature is supplied within the TS1110 as a FET control which drives the gate drive of an external P-channel MOS-
FET. When the Current Limit Comparator’s output goes HIGH and the LATCH feature is enabled, the FET control output will latch HIGH
thereby disconnecting current flow to the load by holding the gate of the external PMOS HIGH. To resume current flow to the load, the
FET control must be brought low by holding or strobing CLATCH low. The output of the comparator controls the gate logic of an internal
FET whereby the source is connected to the non-inverting terminal of the CSA, RS+, while the drain is fed to the FET pin. The FET pin
is intended to drive the gate of an external PMOS, where the PMOS source is connected to the inverting terminal of the CSA, RS–, and
the drain is connected to the external load. FET will maintain its logic LOW state while the comparator output, COUT, is LOW. When
COUT is latched HIGH, the FET pin will latch to a HIGH state, thereby switching and holding the external PMOS OFF. The FET control
features a Turn ON Time, tFET(ON), of 720 ns(typ) and a Turn OFF Time, tFET(OFF), of 2.9 ms(typ) when driving a 860 pF gate capaci-
tance. Note that the FET Control is a pull-up only. A pull-down resistor is required from the external FET’s gate to ground to ensure the
FET is normally ON.
2.6 VREF Divider
The TS1107/10 provides an internal voltage divider network to set VBIAS, eliminating the need for externally setting the voltage. The
VREF Divider is activated once the voltage applied to VREF is 0.9 V or greater. The VREF divider connects to VBIAS, where the VBIAS
voltage is equal to 50% of VREF . The VREF Divider exhibits a total series resistance of 9.2 MΩ from VREF to GND.
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TS1107/10 Data Sheet
System Overview
2.7 Selecting a Sense Resistor
Selecting the optimal value for the external RSENSE is based on the following criteria and for each commentary follows:
1. RSENSE Voltage Loss
2. VOUT Swing vs. Desired VSENSE and Applied Supply Voltage at VDD
3. Total ILOAD Accuracy
4. Circuit Efficiency and Power Dissipation
5. RSENSE Kelvin Connections
2.7.1 RSENSE Voltage Loss
For lowest IR power dissipation in RSENSE, the smallest usable resistor value for RSENSE should be selected.
2.7.2 VOUT Swing vs. Desired VSENSE and Applied Supply Voltage at VDD
Although the Current Sense Amplifier draws its power from the voltage at its RS+ and RS– terminals, the signal voltage at the OUT
terminal is provided by a buffer, and is therefore bounded by the buffer’s output range. As shown in the Electrical Characteristics table,
the CSA Buffer has a maximum and minimum output voltage of:
V
V
= VDD
= 0.2V
− 0.2V
(min)
OUT (max )
OUT (min )
Therefore, the full-scale sense voltage should be chosen so that the OUT voltage is neither greater nor less than the maximum and
minimum output voltage defined above. To satisfy this requirement, the positive full-scale sense voltage, VSENSE(pos_max), should be
chosen so that:
VBIAS − V
OUT (min )
V
<
SENSE(pos_max)
GAIN
The negative full-scale sense voltage, VSENSE(neg_min), should be chosen so that:
V
− VBIAS
OUT (max )
V
<
SENSE(neg_min )
GAIN
For best performance, RSENSE should be chosen so that the full-scale VSENSE is less than ±75 mV.
2.7.3 Total Load Current Accuracy
In the TS1107/10’s linear region where VOUT(min) < VOUT < VOUT(max), there are two specifications related to the circuit’s accuracy: a)
the TS1107/10 CSA’s input offset voltage (VOS(max) = 150 μV), b) the TS1107/10 CSA’s gain error (GE(max) = 1%). An expression for
the TS1110’s total error is given by:
V
= VBIAS − GAIN × 1 ± GE × V
± GAIN × V
SENSE OS
(
)
(
)
OUT
A large value for RSENSE permits the use of smaller load currents to be measured more accurately because the effects of offset voltag-
es are less significant when compared to larger VSENSE voltages. Due care though should be exercised as previously mentioned with
large values of RSENSE
.
2.7.4 Circuit Efficiency and Power Dissipation
IR loses in RSENSE can be large especially at high load currents. It is important to select the smallest, usable RSENSE value to minimize
power dissipation and to keep the physical size of RSENSE small. If the external RSENSE is allowed to dissipate significant power, then
its inherent temperature coefficient may alter its design center value, thereby reducing load current measurement accuracy. Precisely
because the TS1107/10 CSA’s input stage was designed to exhibit a very low input offset voltage, small RSENSE values can be used to
reduce power dissipation and minimize local hot spots on the pcb.
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TS1107/10 Data Sheet
System Overview
2.7.5 RSENSE Kelvin Connections
For optimal VSENSE accuracy in the presence of large load currents, parasitic pcb track resistance should be minimized. Kelvin-sense
pcb connections between RSENSE and the TS1107/10’s RS+ and RS– terminals are strongly recommended. The drawing below illus-
trates the connections between the current-sense amplifier and the current-sense resistor. The pcb layout should be balanced and
symmetrical to minimize wiring-induced errors. In addition, the pcb layout for RSENSE should include good thermal management techni-
ques for optimal RSENSE power dissipation.
Figure 2.4. Making PCB Connections to RSENSE
2.7.6 RSENSE Composition
Current-shunt resistors are available in metal film, metal strip, and wire-wound constructions. Wire-wound current-shunt resistors are
constructed with wire spirally wound onto a core. As a result, these types of current shunt resistors exhibit the largest self-inductance. In
applications where the load current contains high-frequency transients, metal film or metal strip current sense resistors are recommen-
ded.
2.7.7 Internal Noise Filter
In power management and motor control applications, current-sense amplifiers are required to measure load currents accurately in the
presence of both externally-generated differential and common-mode noise. An example of differential-mode noise that can appear at
the inputs of a current-sense amplifier is high-frequency ripple. High-frequency ripple (whether injected into the circuit inductively or ca-
pacitively) can produce a differential-mode voltage drop across the external current-shunt resistor, RSENSE. An example of externally-
generated, common-mode noise is the high-frequency output ripple of a switching regulator that can result in common-mode noise in-
jection into both inputs of a current-sense amplifier.
Even though the load current signal bandwidth is dc, the input stage of any current-sense amplifier can rectify unwanted, out-of-band
noise that can result in an apparent error voltage at its output. Against common-mode injection noise, the current-sense amplifier’s in-
ternal common-mode rejection ratio is 130 dB (typ).
To counter the effects of externally-injected noise, the TS1107/10 incorporates a 50 kHz (typ), 2nd-order differential low-pass filter as
shown in the TS1107/10’s block diagram, thereby eliminating the need for an external low-pass filter which can generate errors in the
offset voltage and the gain error.
2.7.8 PC Board Layout and Power-Supply Bypassing
For optimal circuit performance, the TS1107/10 should be in very close proximity to the external current-sense resistor and the pcb
tracks from RSENSE to the RS+ and the RS– input terminals of the TS1107/10 should be short and symmetric. Also recommended are
surface mount resistors and capacitors, as well as a ground plane.
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TS1107/10 Data Sheet
Electrical Characteristics
3. Electrical Characteristics
Table 3.1. Recommended Operating Conditions1
Parameter
Symbol
Conditions
Min
Typ
Max
Units
System Specifications
Operating Voltage Range
Common-Mode Input Range
Note:
VDD
VCM
1.7
2
—
—
5.25
27
V
V
VRS+, Guaranteed by CMRR
1. All devices 100% production tested at TA = +25 °C. Limits over Temperature are guaranteed by design and characterization.
Table 3.2. DC Characteristics1
Parameter
Symbol
Conditions
Min
Typ
Max
Units
System Specifications
No Load Input Supply Current
IRS+ + IRS–
IVDD
See Note 2
—
—
—
0.68
1.15
1.16
1.2
μA
μA
μA
See Note 2
TS1107
TS1110
1.84
1.85
Current Sense Amplifier
Common Mode Rejection Ratio
CMRR
VOS
2 V < VRS+ < 27 V
120
—
130
±100
—
—
±150
±200
—
dB
μV
μV
μV
Input Offset Voltage3
TA = +25 °C
–40 °C < TA < +85 °C
TA = +25 °C
—
VOS Hysteresis4
Gain
VHYS
G
—
10
TS1107-20, TS1110-20
TS1107-200, TS1110-200
TA = +25 °C
—
—
—
—
—
—
—
—
28
20
200
±0.1
—
—
—
V/V
V/V
%
Positive Gain Error5
Negative Gain Error5
Gain Match5
GE+
GE–
GM
±0.6
±1
–40 °C < TA < +85 °C
TA = +25 °C
%
±0.6
—
±1
%
–40 °C < TA < +85 °C
TA = +25 °C
±1.4
±1
%
±0.6
—
%
–40 °C < TA < +85 °C
From FILT to OUT
±1.4
52.8
%
Transfer Resistance
CSA Buffer
ROUT
40
kΩ
Input Bias Current
Input referred DC Offset
Offset Drift
IBuffer_BIAS
VBuffer_OS
TCVBuffer_OS
VBuffer_CM
–40 °C < TA < +85 °C
—
—
0.3
—
—
±2.5
—
nA
mV
–40 °C < TA < +85 °C
–40 °C < TA < +85 °C
—
0.6
—
μV/°C
V
Input Common Mode Range
0.2
VDD –
0.2
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TS1107/10 Data Sheet
Electrical Characteristics
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Output Range
VOUT(min,max)
IOUT = ±150 μA
0.2
—
VDD –
0.2
V
Sign Comparator Parameters
Output Low Voltage
Output High Voltage
Comparator
VSIGN_OL
VSIGN_OH
VDD = 1.8 V, ISINK = 35 μA
—
—
—
0.2
—
V
V
V
DD = 1.8 V, ISOURCE = 35 μA VDD – 0.2
Input Bias Current
ICIN–_BIAS
ICIN+_BIAS
VC_OS
CIN–
CIN+
—
—
0.3
0.3
—
—
—
nA
nA
mV
V
Input Bias Current
Input referred DC offset
Input Common Mode Range
COUT Output Range
–40 °C < TA < +85 °C
—
±4
VC_CM
0.4
0.4
—
VDD
VCOUT(min,max) ICOUT = ±500 μA; VDD = 1.7 V
—
VDD –
0.4
V
CLATCH Input Voltage
CLATCHLo
CLATCHHi
Low CMOS Logic Level
High CMOS Logic Level
—
—
—
0.4
—
V
V
VDD – 0.4
FET Control (TS1110 Only)
FET Leakage
IFET_Leakage
IFET_Source(max)
RFET_ON
TA = +25 °C
TA = +25 °C
TA = +25 °C
—
—
—
—
3.2
487
4.5
17.4
794
nA
mA
Ω
FET Sourcing Current
FET Internal On Resistance
VREF Divider
VREF Activation voltage
Resistor on VREF
VBIAS
VREF(min)
RVREF
VREF Rising edge
VREF = 1 V
—
—
—
0.9
—
V
MΩ
V
9.2
0.5
VVBIAS
0.495
0.505
Note:
1. RS+ = RS– = 3.6 V; VSENSE =(VRS+ – VRS–) = 0 V; VDD = 3 V; VBIAS = 1.5 V; CIN+ = 0.75 V; VREF = GND; CLATCH = GND;
RFET = 1 MΩ; FILT connected to 4 kΩ and 470 nF in series to GND. TA = TJ = –40 °C to +85 °C unless otherwise noted. Typical
values are at TA=+25 °C.
2. Extrapolated to VOUT = VFILT; IRS+ + IRS– is the total current into the RS+ and the RS– pins.
3. Input offset voltage VOS is extrapolated from a VOUT(+) measurement with VSENSE set to +1 mV and a VOUT(–) measurement with
VSENSE set to –1 mV; average VOS = (VOUT(–) – VOUT(+))/(2 x GAIN).
4. Amplitude of VSENSE lower or higher than VOS required to cause the comparator to switch output states.
5. Gain error is calculated by applying two values for VSENSE and then calculating the error of the actual slope vs. the ideal transfer
characteristic. For GAIN = 20 V/V, the applied VSENSE for GE± is ±25 mV and ±60 mV. For GAIN = 200 V/V, the applied VSENSE
for GE± is ±2.5 mV and ±6 mV
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TS1107/10 Data Sheet
Electrical Characteristics
Table 3.3. AC Characteristics1
Conditions
Parameter
Symbol
Min
Typ
Max
Units
CSA Buffer
Output Settling time
tOUT_s
1% Final value,
VOUT = 1.3 V
Gain = 20 V/V
—
1.35
—
msec
Sign Comparator
Propagation Delay
tSIGN_PD
VSENSE = ±1 mV
—
—
3
—
—
msec
msec
VSENSE = ±10 mV
0.4
Comparator
Rising Propagation Delay
Comparator Hysteresis
FET Control (TS1110 Only)
FET Turn ON Time
Note:
tC_PDR
Overdrive = 10 mV, CCOUT = 15 pF
CIN– falling
—
—
9
—
—
μs
VC_HYS
20
mV
TFET(ON)
See Note 2
—
0.255
—
μs
1. RS+ = RS– = 3.6 V, VSENSE = (VRS+ – VRS–) = 0 V, VDD = 3 V, VBIAS = 1.5 V. TA = TJ = –40 °C to +85 °C unless otherwise
noted. Typical values are at TA = +25 °C.
2. Delay after comparator is triggered. Refer to FET ON Time vs. Gate Capacitance graph.
Table 3.4. Thermal Conditions
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Operating Temperature Range
TOP
–40
—
+85
°C
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TS1107/10 Data Sheet
Electrical Characteristics
Table 3.5. Absolute Maximum Limits
Parameter
Symbol
VRS+
Conditions
Min
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
—
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max
Units
V
RS+ Voltage
27
RS– Voltage
VRS–
27
V
FET Voltage (TS1110 Only)
Supply Voltage
VFET
27
V
VDD
6
V
OUT Voltage
VOUT
6
V
SIGN Voltage
VSIGN
6
V
FILT Voltage
VFILT
6
V
CLATCH Voltage
VCLATCH
VCOUT
VVREF
VCIN+
6
V
COUT Voltage
6
6
V
VREF Voltage
V
CIN+ Voltage
VDD + 0.3
VDD + 0.3
VDD + 0.3
27
V
CIN– Voltage
VCIN–
V
VBIAS Voltage
VVBIAS
VRS+ – VRS–
V
RS+ to RS– Voltage
Short Circuit Duration: OUT to GND
Continuous Input Current (Any Pin)
Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering, 10 s)
Soldering Temperature (Reflow)
ESD Tolerance
V
—
Continuous
20
–20
—
mA
°C
°C
°C
°C
150
–65
—
150
300
—
260
Human Body Model
Machine Model
—
—
—
—
2000
200
V
V
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TS1107/10 Data Sheet
Electrical Characteristics
For the following graphs, VRS+ = VRS– = 3.6 V; VDD = 3 V; VREF = GND; VBIAS = 1.5 V, CIN+ = 0.75 V, CLATCH = VDD, CIN– =
OUT, RFET = 1 MΩ, CFET = 820 pF, and TA = +25 C unless otherwise noted.
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TS1107/10 Data Sheet
Electrical Characteristics
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TS1107/10 Data Sheet
Electrical Characteristics
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TS1107/10 Data Sheet
Electrical Characteristics
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TS1107/10 Data Sheet
Electrical Characteristics
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TS1107/10 Data Sheet
Typical Application Circuit
4. Typical Application Circuit
Figure 4.1. TS1110 Typical Application Circuit
Figure 4.2. TS1107 Typical Application Circuit
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TS1107/10 Data Sheet
Pin Descriptions
5. Pin Descriptions
TS1110
TS1107
Table 5.1. Pin Descriptions
Pin
1
Label
SIGN
VDD
Function
Sign output. SIGN is HIGH for VRS+ > VRS– and LOW for VRS– > VRS+
External power supply pin. Connect this to the system’s VDD supply.
Bias voltage for CSA output. When VREF is activated, leave open.
Ground. Connect to analog ground.
.
2
3
VBIAS
GND
CIN–
CIN+
4
5
Inverting terminal of Current Limiter Comparator. Connect to OUT.
6
Non-inverting terminal of Current Limiter Comparator. Connect an external reference voltage to set cur-
rent limit.
7
8
NC
No connection. Leave open.
VREF
Voltage reference. To activate, a minimum voltage of 0.9V is required. To disable voltage divider, con-
nect to analog ground, GND.
9
OUT
FILT
RS+
RS–
CSA buffered output. Connect to CIN–.
10
11
12
Inverting terminal of CSA Buffer. Connect a series RC Filter of 4kΩ and 0.47µF, otherwise leave open.
External Sense Resistor Power-Side Connection
External Sense Resistor Load-Side Connection. For TS1110 only, connect external PFET’s source to
RS– pin and connect load to PFET’s drain. For TS1107, connect load directly to RS– pin.
13
FET
NC
TS1110 External PFET Gate Connection. Connect an external pull-down resistor of 1MΩ.
TS1107 No connection. Leave open.
14
15
NC
No connection. Leave open.
CLATCH Current Limiter Comparator Latch Enable. CLATCH must be HIGH for latch enable. To disable latch,
CLACTH must be held LOW.
16
COUT
EPAD
Current Limiter Comparator Output.
Exposed Pad
Exposed backside paddle. For best electrical and thermal performance, solder to analog ground.
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Rev. 1.0 | 17
TS1107/10 Data Sheet
Packaging
6. Packaging
Figure 6.1. TS1107/10 3x3 mm 16-QFN Package Diagram
Table 6.1. Package Dimensions
Dimension
Min
0.70
0.00
0.20
Nom
0.75
Max
0.80
0.05
0.30
A
A1
b
0.02
0.25
C1
C2
D
1.50 REF
0.25 REF
3.00 BSC
2.00
D2
e
1.90
2.10
0.50 BSC
3.00 BSC
2.00
E
E2
L
1.90
0.20
—
2.10
0.30
0.05
0.05
0.05
0.10
0.25
aaa
bbb
ccc
ddd
—
—
—
—
—
—
—
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
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Rev. 1.0 | 18
TS1107/10 Data Sheet
Top Marking
7. Top Marking
Figure 7.1. Top Marking
Table 7.1. Top Marking Explanation
Mark Method
Laser
Circle = 0.50 mm Diameter (lower left corner)
0.50 mm (20 mils)
Pin 1 Mark:
Font Size:
Line 1 Mark Format:
Line 2 Mark Format:
Line 3 Mark Format:
Product ID
Note: A = 20 gain, B = 200 gain
Manufacturing code
TTTT – Mfg Code
YY = Year; WW = Work Week
Year and week of assembly
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Rev. 1.0 | 19
Table of Contents
1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1 Functional Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2 Current Sense Amplifier + Output Buffer . . . . . . . . . . . . . . . . . . . . . 3
2.3 Sign Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.4 Current Limit Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.5 FET Control (TS1110 Only) . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.6 VREF Divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.7 Selecting a Sense Resistor . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.7.1 RSENSE Voltage Loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.7.2 VOUT Swing vs. Desired VSENSE and Applied Supply Voltage at VDD. . . . . . . . . . 5
2.7.3 Total Load Current Accuracy . . . . . . . . . . . . . . . . . . . . . . . . 5
2.7.4 Circuit Efficiency and Power Dissipation . . . . . . . . . . . . . . . . . . . . 5
2.7.5 RSENSE Kelvin Connections . . . . . . . . . . . . . . . . . . . . . . . . 6
2.7.6 RSENSE Composition . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.7.7 Internal Noise Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.7.8 PC Board Layout and Power-Supply Bypassing . . . . . . . . . . . . . . . . . . 6
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . 16
5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6. Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7. Top Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table of Contents 20
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Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories
reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply
or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific
written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected
to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no
circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
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thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®,
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