SM4041DSKC-TRG [SINOPWER]

Dual N-Channel Enhancement Mode MOSFET;
SM4041DSKC-TRG
型号: SM4041DSKC-TRG
厂家: Sinopower Semiconductor Inc    Sinopower Semiconductor Inc
描述:

Dual N-Channel Enhancement Mode MOSFET

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SM4041DSK  
®
Dual N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
D1  
D1  
D2  
40V/7.8A,  
RDS(ON) = 14.5m(max.) @ VGS = 10V  
D2  
RDS(ON) = 18m(max.) @ VGS = 4.5V  
100% UIS + Rg Tested  
S1  
G1  
S2  
G2  
Reliable and Rugged  
Lead Free andGreenDevicesAvailable  
(RoHS Compliant)  
Top View of SOP-8  
(6) (5)  
D2 D2  
(8) (7)  
D1 D1  
Applications  
Car charger.  
(2)  
G1  
(4)  
G2  
Power Management in Note book.  
Battery Powered System.  
DC/DC Converter.  
S1  
(1)  
S2  
(3)  
Load Switch.  
N-ChannelMOSFET  
Ordering and Marking Information  
Package Code  
SM4041DS  
K : SOP-8  
Operating Junction Temperature Range  
Assembly Material  
Handling Code  
C : -55 to 150 oC  
Handling Code  
Temperature Range  
TR : Tape & Reel  
Assembly Material  
Package Code  
G : Halogen and Lead Free Device  
4041DS  
XXXXX  
SM4041DS K :  
XXXXX - Lot Code  
Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate  
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the lead-  
free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER  
defines Greento mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight  
in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and  
advise customers to obtain the latest version of relevant information to verify before placing orders.  
1
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings  
VDSS  
VGSS  
TJ  
Drain-Source Voltage  
Gate-Source Voltage  
40  
±20  
150  
-55 to 150  
2
V
Maximum Junction Temperature  
Storage Temperature Range  
Diode Continuous Forward Current  
Pulsed Drain Current  
°C  
TSTG  
IS  
TA=25°C  
TA=25°C  
TA=25°C  
TA=70°C  
TA=25°C  
TA=70°C  
t 10s  
a
IDM  
19  
A
7.8  
b
ID  
Continuous Drain Current  
Power Dissipation  
6.2  
1.31  
0.84  
54  
b
PD  
W
b
Thermal Resistance-Junction to Ambient  
RθJA  
Steady State  
Steady State  
L=0.1mH  
L=0.1mH  
95  
°C/W  
Thermal Resistance-Junction to Lead  
Avalanche Current, Single pulse  
Avalanche Energy, Single pulse  
32  
RθJL  
c
IAS  
20  
A
c
EAS  
20  
mJ  
Note aMax. current is limited by bonding wire.  
Note bRθJA steady state t=999s. RθJA is measured with the device mounted on 1in2, FR-4 board with 2oz. Copper.  
Note cUIS tested and pulse width limited by maximum junction temperature 150oC (initial temperature Tj=25oC).  
2
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Unit  
Static Characteristics  
BVDSS Drain-Source Breakdown Voltage  
40  
-
-
-
V
VGS=0V, IDS=250µA  
VDS=32V, VGS=0V  
-
1
IDSS Zero Gate Voltage Drain Current  
µA  
TJ=85°C  
-
1.5  
-
-
30  
VGS(th) Gate Threshold Voltage  
IGSS Gate Leakage Current  
1.8  
-
2.5  
±100  
14.5  
18  
V
VDS=VGS, IDS=250µA  
VGS=±20V, VDS=0V  
VGS=10V, IDS=12A  
VGS=4.5V, IDS=10A  
nA  
-
12  
13.5  
d
RDS(ON) Drain-Source On-state Resistance  
mΩ  
-
Diode Characteristics  
d
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
ISD=10A, VGS=0V  
-
-
-
0.88  
17  
1.1  
V
-
-
ns  
nC  
IDS=12A, dlSD/dt=100A/µs  
VDS=20V  
Qrr  
12  
Dynamic Characteristicse  
RG  
Ciss  
Coss  
Crss  
td(ON)  
tr  
Gate Resistance  
VGS=0V,VDS=0V,F=1MHz  
-
-
-
-
-
-
-
-
1.3  
2.5  
Input Capacitance  
1095 1424  
VGS=0V,  
VDS=20V,  
Frequency=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
135  
74  
176  
pF  
111  
8.2  
6.8  
25.2  
6.4  
-
-
-
-
VDD=30V, RL=30,  
IDS=1A, VG=10V,  
RG=6Ω  
ns  
td(OFF) Turn-off Delay Time  
tf Turn-off Fall Time  
Gate Charge Characteristics e  
VDS=20V, VGS=10V,  
IDS=12A  
Qg  
Total Gate Charge  
-
20  
30  
Qg  
Qgs  
Qgd  
Qgth  
Total Gate Charge  
-
-
-
-
9.6  
2.5  
3.8  
1.5  
-
-
-
-
nC  
Gate-Source Charge  
Gate-Drain Charge  
Threshold Gate Charge  
VDS=20V, VGS=4.5V  
ISD=12A  
Note dPulse test ; pulse width300µs, duty cycle2%.  
Note eGuaranteed by design, not subject to production testing.  
3
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Typical Operating Characteristics  
Drain Current  
Power Dissipation  
1.4  
9.0  
7.5  
6.0  
4.5  
3.0  
1.5  
0.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
TA=25oC  
0.0  
TA=25oC,VG=10V  
0
20 40 60 80 100 120 140 160  
0
20 40 60 80 100 120 140 160  
Tj - Junction Temperature (°C)  
Tj - Junction Temperature (°C)  
Safe Operation Area  
Thermal Transient Impedance  
2
1
50  
10  
Duty = 0.5  
0.2  
0.1  
0.05  
300µs  
0.1  
0.01  
1E-3  
0.02  
0.01  
1
0.1  
1ms  
10ms  
Single Pulse  
100ms  
Mounted on 1in2 pad  
TA=25oC  
DC  
1s  
0.01  
1E-4 1E-3 0.01 0.1  
1
10 100 1000  
0.01  
0.1  
1
10  
100 300  
Square Wave PulseDuration (sec)  
VDS - Drain - Source Voltage (V)  
4
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Output Characteristics  
18  
16  
14  
12  
10  
8
20  
16  
12  
8
VGS=3,3.5,4,5,6,7,8,9,10V  
VGS=4.5V  
VGS=10V  
4
2.5V  
0
0.0  
0
4
8
12  
16  
20  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
VDS - Drain - Source Voltage (V)  
ID -Drain Current (A)  
Gate-Source On Resistance  
Gate Threshold Voltage  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
60  
50  
40  
30  
20  
10  
0
IDS=12A  
IDS =250µA  
-50 -25  
0
25 50 75 100 125 150  
2
3
4
5
6
7
8
9
10  
Tj - Junction Temperature (°C)  
VGS - Gate - Source Voltage (V)  
5
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
20  
10  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
VGS = 10V  
IDS = 12A  
Tj=150oC  
Tj=25oC  
1
RON@Tj=25oC: 12mΩ  
0.1  
-50 -25  
0
25 50 75 100 125 150  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
Tj - Junction Temperature (°C)  
VSD - Source - Drain Voltage (V)  
Capacitance  
Gate Charge  
1500  
1250  
1000  
750  
500  
250  
0
10  
Frequency=1MHz  
VDS=20V  
IDS=12A  
9
8
7
6
5
4
3
2
1
0
Ciss  
Coss  
Crss  
5
0
10 15 20 25 30 35 40  
0
4
8
12  
16  
20  
QG -Gate Charge (nC)  
VDS - Drain - Source Voltage (V)  
6
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Avalanche Test Circuit and Waveforms  
VDS  
L
VDSX(SUS)  
tp  
DUT  
VDS  
IAS  
RG  
VDD  
VDD  
IL  
tp  
EAS  
0.01  
tAV  
Switching Time Test Circuit and Waveforms  
VDS  
RD  
VDS  
90%  
DUT  
VGS  
RG  
VDD  
10%  
VGS  
tp  
td(on) tr  
td(off) tf  
7
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Disclaimer  
Sinopower Semiconductor, Inc. (hereinafter Sinopower) has been making  
great efforts to development high quality and better performance products to  
satisfy all customersneeds. However, a product may fail to meet customers  
expectation or malfunction for various situations.  
All information which is shown in the datasheet is based on Sinopowers  
research and development result, therefore, Sinopower shall reserve the right  
to adjust the content and monitor the production.  
In order to unify the quality and performance, Sinopower has been following  
JEDEC while defines assembly rule. Notwithstanding all the suppliers  
basically follow the rule for each product, different processes may cause  
slightly different results.  
The technical information specified herein is intended only to show the typical  
functions of and examples of application circuits for the products. Sinopower  
does not grant customers explicitly or implicitly, any license to use or exercise  
intellectual property or other rights held by Sinopower and other parties.  
Sinopower shall bear no responsible whatsoever for any dispute arising from  
the use of such technical information.  
The products are not designed or manufactured to be used with any  
equipment, device or system which requires an extremely high level of  
reliability, such as the failure or malfunction of which any may result in a direct  
threat to human life or a risk of human injury. Sinopower shall bear no  
responsibility in any way for use of any of the products for the above special  
purposes. If a product is intended to use for any such special purpose, such  
as vehicle, military, or medical controller relevant applications, please contact  
Sinopower sales representative before purchasing.  
8
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Classification Profile  
9
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Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  
SM4041DSK  
®
Classification Reflow Profiles  
Profile Feature  
Preheat & Soak  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
150 C  
100 C  
°
°
Temperature min (Tsmin  
)
Temperature max (Tsmax  
Time (Tsmin to Tsmax) (ts)  
150 C  
200 C  
°
°
)
60-120 seconds  
60-120 seconds  
Average ramp-up rate  
(Tsmax to TP)  
3 C/second max.  
°
3 C/second max.  
°
Liquidous temperature (TL)  
Time at liquidous (tL)  
183 C  
60-150 seconds  
217 C  
60-150 seconds  
°
°
Peak package body Temperature  
(Tp)*  
See Classification Temp in table 1  
See Classification Temp in table 2  
30** seconds  
Time (t )** within 5 C of the specified  
°
P
20** seconds  
classification temperature (Tc)  
Average ramp-down rate (Tp to Tsmax  
)
6 C/second max.  
°
6 C/second max.  
°
6 minutes max.  
8 minutes max.  
Time 25 C to peak temperature  
°
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process Classification Temperatures (Tc)  
Volume mm3  
Package  
Volume mm3  
Thickness  
<350  
350  
<2.5 mm  
235 °C  
220 °C  
220 °C  
220 °C  
2.5 mm  
Table 2. Pb-free Process Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm3  
Volume mm3  
350-2000  
260 °C  
Volume mm3  
<350  
>2000  
260 °C  
245 °C  
245 °C  
260 °C  
1.6 mm 2.5 mm  
2.5 mm  
260 °C  
250 °C  
250 °C  
245 °C  
Reliability Test Program  
Test item  
Method  
JESD-22, B102  
JESD-22, A108  
Description  
SOLDERABILITY  
HTRB  
5 Sec, 245°C  
1000 Hrs, 80% of VDS max @ Tjmax  
1000 Hrs, 100% of VGS max @ Tjmax  
168 Hrs, 100%RH, 2atm, 121°C  
500 Cycles, -65°C~150°C  
HTGB  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
PCT  
TCT  
Customer Service  
Sinopower Semiconductor, Inc.  
5F, No. 6, Dusing 1St Rd., Hsinchu Science Park,  
Hsinchu, 30078, Taiwan  
TEL: 886-3-5635818 Fax: 886-3-5635080  
10  
www.sinopowersemi.com  
Copyright Sinopower Semiconductor, Inc.  
Rev. A.1 - April, 2016  

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