SP3232EBCY/TR [SIPEX]
True +3.0V to +5.5V RS-232 Transceivers; 真正的+ 3.0V至+ 5.5V的RS - 232收发器
| 型号： | SP3232EBCY/TR |
| 厂家： | 
SIPEX CORPORATION |
| 描述： | True +3.0V to +5.5V RS-232 Transceivers |
| 文件： | 总20页 (文件大小：222K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
SP3222EB/3232EB
True +3.0V to +5.5V RS-232Transceivers
FEATURES
V
CC
1
2
3
4
5
6
7
16
15
■ Meets true EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
■ 250kbps Transmission Rate Under Load
■ 1µA Low-Power Shutdown with Receivers
Active (SP3222EB)
C1+
V+
GND
C1-
14 T1OUT
SP3232EB
C2+
C2-
13
12
11
R1IN
■ Interoperable with RS-232 down to +2.7V
power source
R1OUT
T1IN
■ Enhanced ESD Specifications:
±15kV Human Body Model
V-
10
9
T2OUT
R2IN
T2IN
±15kV IEC1000-4-2 Air Discharge
±8kV IEC1000-4-2 Contact Discharge
8
R2OUT
Now Available in Lead Free Packaging
DESCRIPTION
The SP3222EB/3232EB series is an RS-232 transceiver solution intended for portable or
hand-held applications such as notebook or palmtop computers. The SP3222EB/3232EB
series has a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors
in3.3Voperation. ThischargepumpallowstheSP3222EB/3232EB seriestodelivertrueRS-
232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222EB/
3232EB are 2-driver/2-receiver devices. This series is ideal for portable or hand-held
applications such as notebook or palmtop computers. The ESD tolerance of the SP3222EB/
3232EB devices are over ±15kV for both Human Body Model and IEC1000-4-2 Air discharge
test methods. The SP3222EB device has a low-power shutdown mode where the devices'
driver outputs and charge pumps are disabled. During shutdown, the supply current falls to
less than 1µA.
SELECTION TABLE
RS-232
Drivers
RS-232
External
TTL
No. of
Pins
MODEL
Power Supplies
Shutdown
Receivers Components
3-State
+3.0V to +5.5V
+3.0V to +5.5V
2
2
2
2
4
4
Yes
No
Yes
No
18, 20
16
SP3222EB
SP3232EB
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
1
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional
operation of the device at these ratings or any other
above those indicated in the operation sections of
the specifications below is not implied. Exposure to
absolute maximum rating conditions for extended
periods of time may affect reliability and cause
permanent damage to the device.
Output Voltages
TxOUT ........................................................... ±13.2V
RxOUT ..................................... -0.3V to (VCC + 0.3V)
Short-Circuit Duration
TxOUT .................................................... Continuous
Storage Temperature ...................... -65°C to +150°C
Power Dissipation Per Package
VCC ...................................................... -0.3V to +6.0V
V+ (NOTE 1) ...................................... -0.3V to +7.0V
V- (NOTE 1) ....................................... +0.3V to -7.0V
V+ + |V-| (NOTE 1)........................................... +13V
20-pin SSOP (derate 9.25mW/oC above +70oC) ........ 750mW
18-pin PDIP (derate 15.2mW/oC above +70oC) ....... 1220mW
18-pin SOIC (derate 15.7mW/oC above +70oC) ....... 1260mW
20-pin TSSOP (derate 11.1mW/oC above +70oC)...... 890mW
16-pin SSOP (derate 9.69mW/oC above +70oC) ........ 775mW
16-pin PDIP (derate 14.3mW/oC above +70oC) ....... 1150mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC) .... 900mW
16-pin TSSOP (derate 10.5mW/oC above +70oC)...... 850mW
16-pin nSOIC (derate 13.57mW/°C above +70°C) ...... 1086mW
ICC (DC VCC or GND current)......................... ±100mA
Input Voltages
TxIN, EN ............................................ -0.3V to +6.0V
RxIN .................................................................. ±25V
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
NOTE 2: Driver Input hysteresis is typically 250mV.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, C1 to
C4=0.1µF
PARAMETER
MIN.
TYP.
MAX.
UNITS CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
1.0
10
mA
no load, TAMB = +25°C, VCC = 3.3V,
TxIN = VCC or GND
Shutdown Supply Current
µA
SHDN = GND, TAMB = +25°C,
VCC = +3.3V, TxIN = VCC or GND
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
Input Logic Threshold HIGH
GND
0.8
V
TxIN, EN, SHDN, Note 2
2.0
2.4
VCC
V
V
VCC = 3.3V, Note 2
VCC = 5.0V, Note 2
Input Leakage Current
±0.01
±0.05
±1.0
µA
TxIN, EN, SHDN, TAMB = +25°C,
VIN = 0V to VCC
Output Leakage Current
Output Voltage LOW
Output Voltage HIGH
DRIVER OUTPUTS
Output Voltage Swing
±10
µA
V
receivers disabled, VOUT = 0V to VCC
IOUT = 1.6mA
0.4
VCC-0.6 VCC-0.1
V
IOUT = -1.0mA
±5.0
±5.4
±35
V
3kΩ load to ground at all driver
outputs, TAMB = +25°C
Output Resistance
300
Ω
VCC = V+ = V- = 0V, TOUT = +2V
VOUT = 0V
Output Short-Circuit Current
Output Leakage Current
±60
±25
mA
µA
VOUT = ±12V,VCC= 0V,
or 3.0V to 5.5V, drivers disabled
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
2
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX , C1 to
C4=0.1µF. Typical Values apply at VCC = +3.3V or +5.5V and TAMB = 25oC.
PARAMETER
MIN. TYP. MAX. UNITS CONDITIONS
RECEIVER INPUTS
Input Voltage Range
Input Threshold LOW
-25
+25
V
V
0.6
0.8
1.2
1.5
V
CC=3.3V
VCC=5.0V
Input Threshold HIGH
1.5
1.8
2.4
2.4
V
V =3.3V
VCCCC=5.0V
Input Hysteresis
0.3
5
V
Input Resistance
3
7
kΩ
TIMING CHARACTERISTICS
Maximum Data Rate
Receiver Propagation Delay
250
kbps
RL=3kΩ, CL=1000pF, one driver switching
µs
0.15
0.15
t
, RxIN to RxOUT, C =150pF
tPPLHHL, RxIN to RxOUT, CLL=150pF
Receiver Output Enable Time
Receiver Output Disable Time
Driver Skew
200
200
100
50
ns
ns
ns
| tPHL - tPLH |, TAMB = 25oC
| tPHL - tPLH
Receiver Skew
ns
|
Transition-Region Slew Rate
30
V/µs
V
= 3.3V, R = 3KΩ, T
= 25oC,
mCeCasurementLs taken froAmMB-3.0V to +3.0V
or +3.0V to -3.0V
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
3
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers
loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
6
4
30
25
20
15
10
5
- Slew
+ Slew
TxOUT +
2
T1 at 250Kbps
T2 at 15.6Kbps
All TX loaded 3K // CLoad
0
-2
-4
-6
T1 at 250Kbps
T2 at 15.6Kbps
All TX loaded 3K // CLoad
TxOUT -
0
0
1000
2000
3000
4000
5000
0
500 1000
2000 3000 4000 5000
Load Capacitance (pF)
Load Capacitance (pF)
Figure 1. Transmitter Output Voltage vs Load
Capacitance.
Figure 2. Slew Rate vs Load Capacitance.
35
16
14
12
10
8
T1 at Full Data Rate
T2 at 1/16 Data Rate
All TX loaded 3K // CLoad
30
25
20
15
10
5
250Kbps
125Kbps
20Kbps
6
1 Transmitter at 250Kbps
1 Transmitter at 15.6Kbps
All transmitters loaded with 3K // 1000pf
4
2
0
0
0
1000
2000
3000
4000
5000
2.7
3
3.5
4
4.5
5
Load Capacitance (pF)
Supply Voltage (V)
Figure 4. Supply Current vs Supply Voltage.
Figure 3. Supply Current vs Load Capacitance when
Transmitting Data.
6
TxOUT +
4
2
T1 at 250Kbps
T2 at 15.6Kbps
All TX loaded 3K // 1000 pF
0
-2
-4
TxOUT -
-6
2.7
3
3.5
4
4.5
5
Supply Voltage (V)
Figure 5. Transmitter Output Voltage vs Supply
Voltage.
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
4
PIN DESCRIPTION
PIN NUMBER
SP3222EB
NAME
FUNCTION
SP3232EB
SSOP
DIP/SO
TSSOP
Receiver Enable. Apply logic LOW for normal operation.
EN
1
1
-
Apply logic HIGH to disable the receiver outputs (high-Z state).
C1+
V+
Positive terminal of the voltage doubler charge-pump capacitor.
+5.5V generated by the charge pump.
2
3
2
3
1
2
C1-
C2+
C2-
V-
Negative terminal of the voltage doubler charge-pump capacitor.
Positive terminal of the inverting charge-pump capacitor.
Negative terminal of the inverting charge-pump capacitor.
-5.5V generated by the charge pump.
4
4
3
5
5
4
6
6
5
7
7
6
T1OUT RS-232 driver output.
T2OUT RS-232 driver output.
15
8
17
8
14
7
R1IN
R2IN
RS-232 receiver input.
RS-232 receiver input.
14
9
16
9
13
8
R1OUT TTL/CMOS reciever output.
R2OUT TTL/CMOS reciever output.
13
10
12
11
16
17
15
10
13
12
18
19
12
9
T1IN
T2IN
GND
VCC
TTL/CMOS driver input.
11
10
15
16
TTL/CMOS driver input.
Ground.
+3.0V to +5.5V supply voltage
Shutdown Control Input. Drive HIGH for normal device operation.
SHDN Drive LOW to shutdown the drivers (high-Z output) and the on-
board power supply.
18
-
20
-
-
N.C.
No Connect.
11, 14
Table 1. Device Pin Description
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
5
EN
1
2
3
4
5
6
7
20
19
18
17
16
15
SHDN
EN
1
2
3
4
5
6
7
18
17
16
15
14
13
SHDN
VCC
C1+
V+
V
CC
C1+
V+
GND
GND
C1-
T1OUT
R1IN
C1-
T1OUT
R1IN
SP3222EB
C2+
C2-
V-
SP3222EB
C2+
C2-
V-
R1OUT
R1OUT
14
13
N.C.
12
11
10
T1IN
T2OUT
R2IN
8
9
T1IN
T2OUT
R2IN
8
9
T2IN
12 T2IN
N.C.
R2OUT
10
R2OUT
11
DIP/SO
SSOP/TSSOP
Figure 6. Pinout Configurations for the SP3222EB
V
CC
1
2
3
4
5
6
7
16
C1+
V+
GND
15
14
13
12
11
C1-
T1OUT
R1IN
SP3232EB
C2+
C2-
R1OUT
T1IN
V-
10
9
T2OUT
R2IN
T2IN
8
R2OUT
Figure 7. Pinout Configuration for the SP3232EB
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
6
V
CC
V
CC
+
+
19
+
+
0.1µF
0.1µF
C5
C1
17
VCC
C5
C1
0.1µF
0.1µF
VCC
2
3
C1+
2
V+
V-
3
C1+
+
+
V+
V-
+
+
0.1µF
0.1µF
*C3
C4
0.1µF
0.1µF
*C3
C4
4
5
C1-
4
5
C1-
C2+
7
SP3222EB
C2+
7
SP3222EB
DIP/SO
+
SSOP
+
C2
0.1µF
C2
0.1µF
6
TSSOP
C2-
6
C2-
T1OUT
T2OUT
17
8
13 T1IN
T1OUT
T2OUT
15
8
12 T1IN
LOGIC
RS-232
LOGIC
RS-232
12
15
10
INPUTS
T2IN
OUTPUTS
11
13
10
INPUTS
T2IN
OUTPUTS
16
R1IN
R1OUT
R2OUT
14
R1IN
R1OUT
R2OUT
5kΩ
RS-232
INPUTS
LOGIC
5kΩ
RS-232
INPUTS
LOGIC
OUTPUTS
OUTPUTS
R2IN
9
R2IN
9
5kΩ
5kΩ
1 EN
20
1 EN
18
SHDN
SHDN
GND
18
GND
16
*can be returned to
either VCC or GND
*can be returned to
either VCC or GND
Figure 8. SP3222EB Typical Operating Circuits
V
CC
+
16
0.1µF
0.1µF
C5
C1
VCC
2
1
C1+
V+
V-
+
+
+
+
0.1µF
0.1µF
*C3
C4
3
4
C1-
6
C2+
SP3232EB
C2
0.1µF
5
C2-
T1OUT
T2OUT
14
11 T1IN
LOGIC
RS-232
7
10
12
9
INPUTS
T2IN
OUTPUTS
R1IN 13
R1OUT
R2OUT
5kΩ
5kΩ
RS-232
INPUTS
LOGIC
OUTPUTS
R2IN
8
GND
15
*can be returned to
either VCC or GND
Figure 9. SP3232EB Typical Operating Circuit
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
7
DESCRIPTION
Thedriverscanguaranteeadatarateof 250kbps
fully loaded with 3KΩ in parallel with 1000pF,
ensuring compatibility with PC-to-PC commu-
nication software.
The SP3222EB/3232EB transceivers meet the
EIA/TIA-232 and V.28/V.24 communication
protocols and can be implemented in battery-
powered, portable, or hand-held applications
such as notebook or palmtop computers. The
SP3222EB/3232EB devices all feature Sipex's
proprietary on-board charge pump circuitry that
generates 2 x VCC for RS-232 voltage levels
from a single +3.0V to +5.5V power supply.
This series is ideal for +3.3V-only systems,
mixed +3.3V to +5.5V systems, or +5.0V-only
systems that require true RS-232 performance.
TheSP3222EB/3232EBserieshavedriversthat
operate at a typical data rate of 250kbps fully
loaded.
The slew rate of the driver output is internally
limited to a maximum of 30V/µs in order to
meet the EIA standards (EIA RS-232D 2.1.7,
Paragraph 5). The transition of the loaded
output from HIGH to LOW also meets the
monotonicity requirements of the standard.
Figure 10 shows a loopback test circuit used to
the RS-232 drivers. Figure 11 shows the test
results of the loopback circuit with all drivers
active at 120kbps with RS-232 loads in parallel
with 1000pF capacitors. Figure 12 shows the
test results where one driver was active at
250kbps and all drivers loaded with an RS-232
receiver in parallel with a 1000pF capacitor. A
solid RS-232 data transmission rate of 250kbps
provides compatibility with many designs in
personal computer peripherals and LAN appli-
cations.
The SP3222EB and SP3232EB are 2-driver/2-
receiver devices ideal for portable or hand-held
applications. The SP3222EB features a 1µA
shutdown mode that reduces power consump-
tionandextendsbatterylifeinportablesystems.
Its receivers remain active in shutdown mode,
allowing external devices such as modems to be
monitored using only 1µA supply current.
The SP3222EB driver'soutputstagesareturned
off (tri-state) when the device is in shutdown
mode. When the power is off, the SP3222EB
device permits the outputs to be driven up to
±12V. The driver's inputs do not have pull-up
resistors. Designers should connect unused in-
puts to VCC or GND.
THEORY OF OPERATION
The SP3222EB/3232EB series are made up of
three basic circuit blocks: 1. Drivers, 2.
Receivers, and 3. the Sipex proprietary charge
pump.
In the shutdown mode, the supply current falls
to less than 1µA, where SHDN = LOW. When
the SP3222EB device is shut down, the device's
driver outputs are disabled (tri-stated) and the
charge pumps are turned off with V+ pulled
down to VCC and V- pulled to GND. The time
required to exit shutdown is typically 100µs.
Connect SHDN to VCC if the shutdown mode is
not used.
Drivers
The drivers are inverting level transmitters that
convert TTL or CMOS logic levels to ±5.0V
EIA/TIA-232 levels inverted relative to the in-
put logic levels. Typically, the RS-232 output
voltage swing is ±5.5V with no load and at least
±5V minimum fully loaded. The driver outputs
are protected against infinite short-circuits to
groundwithoutdegradationinreliability. Driver
outputs will meet EIA/TIA-562 levels of ±3.7V
with supply voltages as low as 2.7V.
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
8
V
CC
+
+
0.1µF
0.1µF
C5
C1
V
CC
C1+
V+
V-
+
+
C3
C4
0.1µF
0.1µF
C1-
SP3222EB
SP3232EB
C2+
+
C2
0.1µF
C2-
TxOUT
TxIN
LOGIC
INPUTS
RxIN
RxOUT
EN*
LOGIC
OUTPUTS
5kΩ
*SHDN
V
CC
GND
1000pF
* SP3222EB only
Figure 10. SP3222EB/3232EB Driver Loopback Test Circuit
Figure 11. Driver Loopback Test Results at 120kbps
Figure 12. Driver Loopback Test Results at 250 kbps
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
9
In applications that are sensitive to power-sup-
ply noise, decouple VCC to ground with a capaci-
tor of the same value as charge-pump capacitor
C1. Physically connect bypass capacitors as
close to the IC as possible.
Receivers
The receivers convert EIA/TIA-232 levels to
TTL or CMOS logic output levels. The
SP3222EB receivers have an inverting tri-state
output. Thesereceiveroutputs(RxOUT)aretri-
stated when the enable control EN = HIGH. In
the shutdown mode, the receivers can be active
or inactive. EN has no effect on TxOUT. The
truth table logic of the SP3222EB driver and
receiver outputs can be found in Table 2.
The charge pumps operate in a discontinuous
mode using an internal oscillator. If the output
voltages are less than a magnitude of 5.5V, the
charge pumps are enabled. If the output voltage
exceed a magnitude of 5.5V, the charge pumps
are disabled. This oscillator controls the four
phases of the voltage shifting. A description of
each phase follows.
Since receiver input is usually from a transmis-
sion line where long cable lengths and system
interference can degrade the signal, the inputs
haveatypicalhysteresismarginof300mV. This
ensures that the receiver is virtually immune to
noisy transmission lines. Should an input be left
unconnected, a 5kΩ pulldown resistor to ground
will commit the output of the receiver to a HIGH
state.
Phase 1
— VSS charge storage — During this phase of
the clock cycle, the positive side of capacitors
C1 and C2 are initially charged to VCC. Cl+ is
then switched to GND and the charge in C1– is
–
transferred to C2 . Since C2+ is connected to
VCC, the voltage potential across capacitor C2
is now 2 times VCC.
Charge Pump
The charge pump is a Sipex–patented design
(5,306,954) and uses a unique approach com-
paredtoolderless–efficientdesigns. Thecharge
pump still requires four external capacitors, but
uses a four–phase voltage shifting technique to
attain symmetrical 5.5V power supplies. The
internal power supply consists of a regulated
dual charge pump that provides output voltages
5.5V regardless of the input voltage (VCC) over
the +3.0V to +5.5V range.
Phase 2
— VSS transfer — Phase two of the clock con-
nects the negative terminal of C2 to the VSS
storage capacitor and the positive terminal of C2
to GND. This transfers a negative generated
voltage to C3. This generated voltage is regu-
lated to a minimum voltage of -5.5V. Simulta-
neous with the transfer of the voltage to C3, the
positive side of capacitor C1 is switched to VCC
and the negative side is connected to GND.
In most circumstances, decoupling the power
supplycanbeachievedadequatelyusinga0.1µF
bypasscapacitoratC5(refertoFigures8and9).
Phase 3
— VDD charge storage — The third phase of the
clock is identical to the first phase — the charge
transferred in C1 produces –VCC in the negative
terminal of C1, which is applied to the negative
side of capacitor C2. Since C2+ is at VCC, the
voltage potential across C2 is 2 times VCC.
SHDN
EN
0
TxOUT
Tri-state
Tri-state
Active
RxOUT
Active
0
0
1
1
1
Tri-state
Active
Phase 4
0
— VDD transfer — The fourth phase of the clock
connects the negative terminal of C2 to GND,
and transfers this positive generated voltage
across C2 to C4, the VDD storage capacitor.
1
Active
Tri-state
Table 2. SP3222EB Truth Table Logic for Shutdown
and Enable Control
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
10
This voltage is regulated to +5.5V. At this
voltage, the internal oscillator is disabled. Si-
multaneous with the transfer of the voltage to
C4, the positive side of capacitor C1 is switched
to VCC and the negative side is connected to
GND, allowing the charge pump cycle to begin
again. The charge pump cycle will continue as
long as the operational conditions for the inter-
nal oscillator are present.
The simulation is performed by using a test
model as shown in Figure 18. This method
will test the IC’s capability to withstand an
ESD transient during normal handling such as
in manufacturing areas where the ICs tend to
be handled frequently.
The IEC-1000-4-2, formerly IEC801-2, is
generally used for testing ESD on equipment
and systems. For system manufacturers, they
must guarantee a certain amount of ESD
protection since the system itself is exposed to
the outside environment and human presence.
The premise with IEC1000-4-2 is that the
system is required to withstand an amount of
static electricity when ESD is applied to points
and surfaces of the equipment that are
accessible to personnel during normal usage.
The transceiver IC receives most of the ESD
current when the ESD source is applied to the
connector pins. The test circuit for IEC1000-4-2
is shown on Figure 19. There are two methods
within IEC1000-4-2, the Air Discharge method
and the Contact Discharge method.
Since both V+ and V– are separately generated
from VCC; in a no–load condition V+ and V– will
besymmetrical. Olderchargepumpapproaches
that generate V– from V+ will show a decrease in
the magnitude of V– compared to V+ due to the
inherent inefficiencies in the design.
The clock rate for the charge pump typically
operatesat250kHz. Theexternalcapacitorscan
be as low as 0.1µF with a 16V breakdown
voltage rating.
ESD Tolerance
The SP3222EB/3232EB series incorporates
ruggedized ESD cells on all driver output and
receiver input pins. The ESD structure is
improved over our previous family for more
rugged applications and environments sensitive
to electrostatic discharges and associated
transients. The improved ESD tolerance is at
least ±15kV without damage nor latch-up.
With the Air Discharge Method, an ESD
voltage is applied to the equipment under
test (EUT) through air. This simulates an
electrically charged person ready to connect a
cable onto the rear of the system only to find
an unpleasant zap just before the person
touches the back panel. The high energy
potential on the person discharges through
an arcing path to the rear panel of the system
before he or she even touches the system. This
energy, whether discharged directly or through
air, is predominantly a function of the discharge
current rather than the discharge voltage.
Variables with an air discharge such as
approach speed of the object carrying the ESD
potential to the system and humidity will tend to
change the discharge current. For example, the
rise time of the discharge current varies with
the approach speed.
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
accepted ESD testing method for semiconduc-
tors. ThismethodisalsospecifiedinMIL-STD-
883,Method3015.7forESDtesting.Thepremise
of this ESD test is to simulate the human body’s
potential to store electrostatic energy and
discharge it to an integrated circuit.
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
11
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 13. Charge Pump — Phase 1
V
= +5V
CC
C
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
SS
+
–
+
C
C
2
1
–
–
C
–10V
3
Figure 14. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
T
GND
1
2
GND
b) C -
2
-6V
Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V
Figure 15. Charge Pump Waveforms
V
= +5V
CC
C
+
+5V
4
–
+
V
Storage Capacitor
Storage Capacitor
DD
SS
+
–
+
–
C
C
2
1
–
V
C
–5V
–5V
3
Figure 16. Charge Pump — Phase 3
V
= +5V
CC
C
+
+10V
+
4
–
V
V
Storage Capacitor
Storage Capacitor
DD
+
C
C
2
–
1
–
+
3
–
SS
C
Figure 17. Charge Pump — Phase 4
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
12
R
R
S
S
R
R
C
C
SW2
SW2
SW1
SW1
Device
Under
Test
DC Power
Source
C
C
S
S
Figure 18. ESD Test Circuit for Human Body Model
The circuit models in Figures 18 and 19
represent the typical ESD testing circuits used
forallthreemethods. TheCS isinitiallycharged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor is
charged, the second switch (SW2) is on while
SW1 switches off. The voltage stored in the
capacitor is then applied through RS, the current
limiting resistor, onto the device under test
(DUT). In ESD tests, the SW2 switch is pulsed
so that the device under test receives a duration
of voltage.
The Contact Discharge Method applies the ESD
current directly to the EUT. This method was
devised to reduce the unpredictability of the
ESD arc. The discharge current rise time is
constant since the energy is directly transferred
without the air-gap arc. In situations such as
hand held systems, the ESD charge can be
directly discharged to the equipment from a
person already holding the equipment. The
current is transferred on to the keypad or the
serial port of the equipment directly and then
travels through the PCB and finally to the IC.
Contact-Discharge Module
Contact-Discharge Module
R
R
R
R
S
S
R
R
V
V
C
C
SW2
SW2
SW1
SW1
Device
Under
Test
DC Power
Source
C
C
S
S
R
R
and R add up to 330Ω for IEC1000-4-2.
and R add up to 330Ω for IEC1000-4-2.
S
S
V
V
Figure 19. ESD Test Circuit for IEC1000-4-2
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
13
For the Human Body Model, the current
limiting resistor (RS) and the source capacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-1000-4-2, the current limiting resistor (RS)
and the source capacitor (CS) are 330Ω an
150pF, respectively.
30A
15A
0A
The higher CS value and lower RS value in the
IEC1000-4-2 model are more stringent than the
HumanBodyModel. Thelargerstoragecapacitor
injectsahighervoltagetothetestpointwhenSW2
isswitchedon. Thelowercurrentlimitingresistor
increases the current charge onto the test point.
t=0ns
t=30ns
t ➙
Figure 20. ESD Test Waveform for IEC1000-4-2
Device Pin
Tested
Human Body
Model
IEC1000-4-2
Air Discharge Direct Contact
Level
Driver Outputs
Receiver Inputs
±15kV
±15kV
±15kV
±15kV
±8kV
±8kV
4
4
Table 3. Transceiver ESD Tolerance Levels
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
14
PACKAGE: PLASTIC SHRINK
SMALL OUTLINE
(SSOP)
E
H
D
A
Ø
A1
L
e
B
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
16–PIN
20–PIN
0.068/0.078
(1.73/1.99)
A
A1
B
D
E
0.068/0.078
(1.73/1.99)
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
0.239/0.249
(6.07/6.33)
0.278/0.289
(7.07/7.33)
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
0.0256 BSC
(0.65 BSC)
e
0.0256 BSC
(0.65 BSC)
0.301/0.311
(7.65/7.90)
H
L
0.301/0.311
(7.65/7.90)
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
0°/8°
Ø
0°/8°
(0°/8°)
(0°/8°)
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
15
PACKAGE: PLASTIC
DUAL–IN–LINE
(NARROW)
E1
E
D1 = 0.005" min.
(0.127 min.)
A1 = 0.015" min.
(0.381min.)
D
A = 0.210" max.
(5.334 max).
C
A2
Ø
L
B1
B
e
= 0.300 BSC
(7.620 BSC)
e = 0.100 BSC
(2.540 BSC)
A
ALTERNATE
END PINS
(BOTH ENDS)
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
16–PIN
18–PIN
0.115/0.195
0.115/0.195
A2
(2.921/4.953)
(2.921/4.953)
0.014/0.022
0.014/0.022
B
(0.356/0.559)
(0.356/0.559)
0.045/0.070
0.045/0.070
B1
C
(1.143/1.778)
(1.143/1.778)
0.008/0.014
0.008/0.014
(0.203/0.356)
(0.203/0.356)
0.780/0.800
0.880/0.920
D
(19.812/20.320) (22.352/23.368)
0.300/0.325
0.300/0.325
E
(7.620/8.255)
(7.620/8.255)
0.240/0.280
0.240/0.280
E1
L
(6.096/7.112)
(6.096/7.112)
0.115/0.150
0.115/0.150
(2.921/3.810)
(2.921/3.810)
0°/ 15°
0°/ 15°
Ø
(0°/15°)
(0°/15°)
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
16
PACKAGE: PLASTIC
SMALL OUTLINE (SOIC)
(WIDE)
E
H
D
A
Ø
A1
L
e
B
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
16–PIN
18–PIN
A
A1
B
D
E
0.090/0.104
(2.29/2.649)
0.090/0.104
(2.29/2.649))
0.004/0.012
0.004/0.012
(0.102/0.300) (0.102/0.300)
0.013/0.020
0.013/0.020
(0.330/0.508) (0.330/0.508)
0.398/0.413
0.447/0.463
(10.10/10.49) (11.35/11.74)
0.291/0.299 0.291/0.299
(7.402/7.600) (7.402/7.600)
e
0.050 BSC
0.050 BSC
(1.270 BSC)
(1.270 BSC)
H
L
0.394/0.419
0.394/0.419
(10.00/10.64) (10.00/10.64)
0.016/0.050
0.016/0.050
(0.406/1.270) (0.406/1.270)
Ø
0°/8°
0°/8°
(0°/8°)
(0°/8°)
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
17
D
Ø1
E/2
E1
E
Gauge Plane
E1/2
L2
Ø
Seating Plane
Ø1
L
L1
1
3
2
b
INDEX AREA
(D/2 X E1/2)
VIEW C
e
TOP VIEW
B
16 Pin SOIC JEDEC MS-013 (AA) Variation
SEE VIEW C
B
MIN
2.35
0.1
2.05
0.31
0.2
NOM
MAX
2.65
0.3
2.55
0.51
0.33
SYMBOL
A
A1
A2
b
-
-
-
-
c
-
D
E
E1
e
L
10.30 BSC
10.30 DSC
7.50 BSC
1.27 BSC
-
A2
A
Seating Plane
SIDE VIEW
A1
0.4
1.27
L1
L2
ø
1.04 REF
0.25 BSC
-
0º
5º
8º
15º
ø1
-
b
WITH PLATING
Note: Dimensions in (mm)
c
BASE METAL
SECTION B-B
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
18
D
e
Ø2
E
E1
Seaing Plane
L
Ø3
Ø1
L1
DETAIL A
1
2
INDEX AREA
D
2
E1
x
2
SEE DETAIL “A”
A2
A
Seating Plane
A1
b
B
B
16 Pin TSSOP JEDEC MO-153 (AB)
Variation
MIN
-
0.05
0.8
0.19
0.09
4.9
NOM
MAX
1.2
0.15
1.05
0.3
SYMBOL
A
A1
A2
b
c
D
-
-
1
-
-
5
b
0.2
5.1
E
E1
e
Ø1
ø2
ø3
L
6.40 BSC
4.4
0.65 BSC
4º
12º REF
12º REF
0.6
4.3
0º
4.5
8º
C
Section B-B
0.45
0.75
L1
1.00 REF
Note: Dimensions in (mm)
Date: 02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
19
ORDERING INFORMATION
Package Type
Part Number
Temperature Range
SP3222EBCA .......................................... 0˚C to +70˚C .......................................... 20-Pin SSOP
SP3222EBCA/TR..................................... 0˚C to +70˚C .......................................... 20-Pin SSOP
SP3222EBCP .......................................... 0˚C to +70˚C ............................................ 18-Pin PDIP
SP3222EBCT........................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC
SP3222EBCT/TR ..................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC
SP3222EBCY .......................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP
SP3222EBCY/TR..................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP
SP3222EBEA.......................................... -40˚C to +85˚C ........................................ 20-Pin SSOP
SP3222EBEA/TR .................................... -40˚C to +85˚C ........................................ 20-Pin SSOP
SP3222EBEP.......................................... -40˚C to +85˚C .......................................... 18-Pin PDIP
SP3222EBET .......................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC
SP3222EBET/TR .................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC
SP3222EBEY.......................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP
SP3222EBEY/TR .................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP
SP3232EBCA .......................................... 0˚C to +70˚C .......................................... 16-Pin SSOP
SP3232EBCA/TR..................................... 0˚C to +70˚C .......................................... 16-Pin SSOP
SP3232EBCP .......................................... 0˚C to +70˚C ............................................ 16-Pin PDIP
SP3232EBCT........................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC
SP3232EBCT/TR ..................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC
SP3232EBCN .......................................... 0˚C to +70˚C ......................................... 16-Pin nSOIC
SP3232EBCN/TR .................................... 0˚C to +70˚C ......................................... 16-Pin nSOIC
SP3232EBCY .......................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP
SP3232EBCY/TR..................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP
SP3232EBEA.......................................... -40˚C to +85˚C ........................................ 16-Pin SSOP
SP3232EBEA/TR .................................... -40˚C to +85˚C ........................................ 16-Pin SSOP
SP3232EBEP.......................................... -40˚C to +85˚C .......................................... 16-Pin PDIP
SP3232EBET .......................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC
SP3232EBET .......................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC
SP3232EBEN ......................................... -40˚C to +85˚C ....................................... 16-Pin nSOIC
SP3232EBEN/TR.................................... -40˚C to +85˚C ....................................... 16-Pin nSOIC
SP3232EBEY.......................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP
SP3232EBEY/TR .................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP
Available in lead free packaging. To order add "-L" suffix to part number.
Example: SP3232EBEN/TR = standard; SP3232EBEN-L/TR = lead free
/TR = Tape and Reel
Pack quantity is 1,500 for WSOIC, SSOP or 20 pin TSSOP and 2,500 for NSOIC or 16 pin TSSOP.
CLICK HERE TO ORDER SAMPLES
Corporation
ANALOG EXCELLENCE
Headquarters and
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
Date:02/27/05
SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers
© Copyright 2005 Sipex Corporation
20
相关型号：
SP3232EBEA
True +3.0V to +5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
SIPEX
SP3232EBEA-L
Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, PDSO16, LEAD FREE, MO-153AC, SSOP-16Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
SIPEX
SP3232EBEA-L
True 3.0V to 5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
EXAR
SP3232EBEA-L/TR
True 3.0V to 5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
EXAR
SP3232EBEA-LTR
True 3.0V to 5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
EXAR
SP3232EBEA/TR
True +3.0V to +5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
SIPEX
SP3232EBEN
True +3.0V to +5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
SIPEX
SP3232EBEN-L
Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, PDSO16, LEAD FREE, MS-012AC, NSOIC-16Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
EXAR
SP3232EBEN-L/TR
Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, PDSO16, LEAD FREE, MS-012AC, NSOIC-16Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
EXAR
SP3232EBEN-LTR
True 3.0V to 5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
EXAR
SP3232EBEN/TR
True +3.0V to +5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
SIPEX
SP3232EBEP
True +3.0V to +5.5V RS-232 TransceiversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
SIPEX
©2020 ICPDF网 联系我们和版权申明