SKY66184-11 [SKYWORKS]
Narrow Band Medium Power Amplifier,;
| 型号： | SKY66184-11 |
| 厂家： | 
SKYWORKS SOLUTIONS INC. |
| 描述： | Narrow Band Medium Power Amplifier, 射频 微波 |
| 文件： | 总14页 (文件大小：975K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
SKY66184-11: 2110 to 2170 MHz Linear Power Amplifier
Applications
3G/4G LTE Band 1, 4, and 10 small cell
Active distributed antenna system
Cellular repeaters
VCC1
VBIAS
VCC3
VEN
RFOUT
Coupling Port
Active Bias
Driver amplifier
Output
Match
RFOUT
Input
Match
RFIN
Stage 3
PA
Stage 2
PA
Stage 4
PA
Stage 1
PA
Features
203259-001
High gain: 39.0 dB (unconditionally stable)
VCC2
High linearity: +23 dBm with –50 dBc ACLR @ 85°C
(WCDMA Test Model 1 with 64 DPCH)
Figure 1. SKY66184-11 Linear PA Block Diagram
RF input and output internally matched to 50
Excellent output return loss: < –17 dB
Description
SKY66184-11 is a high-linearity power amplifier (PA) with fully
matched input/output and high gain. The compact 5 x 5 mm PA is
designed for FDD 3G/4G LTE small cell base stations operating
from 2100 to 2200 MHz. The active biasing circuitry is integrated
to compensate PA performance over temperature, voltage, and
process variation as well as an internal coupler for power
monitoring.
Integrated active bias: performance compensated over temp
PA On/Off function: 2.5 μs switching time
Integrated coupler for output power monitoring
Single supply voltage: 3.3 V
Minimal external components
The SKY66184-11 requires minimal external components and is
part of a high-linearity, pin-to-pin compatible PA family
supporting all 3GPP bands.
Pin-to-pin compatible PA family supporting all 3GPP bands
Small 5 x 5 mm, 28-pin package
(MSL3, 260 C per JEDEC J-STD-020)
A block diagram of the SKY66184-11 is shown in Figure 1. The
device package and pinout for the 28-pin device are shown in
Figure 2. Table 1 lists the pin-to-pin compatible parts in the PA
family.
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
Table 1. Pin-to-Pin Compatible PA Family
Part Number
SKY66181-11
Frequency (MHz)
1805 to 1880
2110 to 2170
851 to 894
LTE Band
3
SKY66184-11
SKY66185-11
SKY66186-11
SKY66187-11
SKY66188-11
SKY66189-11
1, 4, and 10
5, 6, 18, 19, 26, and 27
728 to 768
12, 13, 14, and 17
2620 to 2690
758 to 803
7
28
1930 to 1995
2 and 25
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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1
DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
28 27 26 25 24 23 22
21
20
19
18
17
16
15
GND
GND
N/C
GND
GND
RFOUT
N/C
1
2
3
4
5
6
7
RFIN
N/C
N/C
GND
VEN
GND
GND
8
9
10 11 12 13 14
203259D-002
Figure 2. SKY66184-11 Pinout (Top View)
Table 2. SKY66184-11 Signal Descriptions
Pin
1
Name
Description
Pin
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Name
Description
GND
GND
N/C
Ground
Ground
GND
GND
N/C
Ground
Ground
2
3
No internal connection
RF input
No internal connection
No internal connection
RF output
4
RFIN
N/C
N/C
5
No internal connection
Ground
RFOUT
GND
GND
N/C
6
GND
VEN
N/C
Ground
7
Enable (active low)
No internal connection
No internal connection
Bias voltage
Ground
8
No internal connection
Output stage supply voltage
No internal connection
Ground
9
N/C
VCC3
N/C
10
11
12
13
14
VBIAS
GND
N/C
Ground
GND
VCC2
GND
VCC1
No internal connection
Ground
Stage 2 PA supply voltage
Ground
GND
RFOUT_COUP
RF output coupling port
Input stage supply voltage
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2
DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
Technical Description
Electrical and Mechanical Specifications
The SKY66184-11 PA contains all of the needed RF matching and
DC biasing circuits. This three-stage device is optimized for high
linearity and power efficiency. These features make the device
suitable for wideband applications where PA linearity and power
consumption are of critical importance (e.g., small cell and
infrastructure applications).
The absolute maximum ratings of the SKY66184-11 are provided
in Table 3. The recommended operating conditions are specified
in Table 4, and electrical specifications are provided in Table 5.
Typical performance characteristics are shown in Figures 3
through 6.
The device is designed for standard WCDMA and LTE modulated
signals. Under these stringent test conditions, the device exhibits
excellent spectral purity and power efficiency.
Table 3. SKY66184-11 Absolute Maximum Ratings1
Parameter
Symbol
Minimum
Maximum
+4.0
1400
3.6
Units
V
Supply voltage (VCC)
VCC
ICC
0
Total supply current
mA
V
Logic control input voltage (VEN)
VEN
TC
–0.5
–40
–55
2
Case operating temperature
+98
C
Storage temperature
Junction temperature
Thermal resistance
Power dissipation
TSTG
TJ
+150
+150
23
C
C
θJC
PD
C/W
W
4.6
Electrostatic discharge:
ESD
Charged Device Model (CDM)
Human Body Model (HBM)
500
150
V
V
1
2
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters
set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Case operating temperature (Tc) refers to the temperature of the bottom ground pad.
ESD HANDLING:Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device.
This device must be protected at all times from ESD when handling or transporting. Static charges may easily produce
potentials of several kilovolts on the human body or equipment, which can discharge without detection.
Industry-standard ESD handling precautions should be used at all times.
Table 4. SKY66184-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
2110
Typical
Maximum
2170
Units
MHz
V
Frequency range
Supply voltage (VCC1, VCC2, VCC3)
f
1
VCC
3.0
3.3
3.6
PA enable control voltage (active low):
Disable
Enable
VENH
VENL
2.5
0
3.6
0.6
V
V
PA enable current (@ PAEN = 3.6 V)
Case operating temperature
IEN
TC
3.0
mA
+25
+40
+85
C
1
Voltage levels measured at the pads of the package. The Evaluation Board supply voltage levels may be different.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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3
DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
Table 5. SKY66184-11 Electrical Specifications1
(VCC = +3.3 V, TC = +25 C, f = 2140 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = 0 V, Unless Otherwise Noted)
Parameter
Symbol
G @ 23 dBm
|S11|
Test Condition
CW, POUT = +23 dBm
Min
38.0
8
Typical
39.0
10
Max
Units
dB
Gain
Input return loss
CW, PIN = –30 dBm
CW, PIN = –30 dBm:
dB
Output return loss:
|S22|
In-band
Out-of-band
In-band frequency: 2.11 and 2.17 GHz
Out-of-band frequency: 2.03 and 2.25 GHz
12
10
17.5
14
dB
dB
Quiescent current
ICQ
No RF
400
650
1.5
460
730
2.5
mA
mA
mA
Operating current
ICC
CW, POUT = +23 dBm
VEN = 2.5 V
Power-down current
Adjacent channel leakage ratio
IPD
ACLR
5 MHz offset, WCDMA test model 1,
with 64 DPCH, 8.5 dB PAR, POUT = +23 dBm
–50
–47
dBc
Output 1 dB compression point
OP1dB
CW (Gain compression less than 1dB
reference to G@23dBm)
+30.3
7.5
+31
9.5
21
dBm
%
Power added efficiency
Output coupling factor
PAE
CW @ POUT = +23 dBm
POUT = +23 dBm, CW
CPLOUT
19
23
dB
1
Performance is guaranteed only under the conditions listed in this table.
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
Typical Performance Characteristics
(VCC = +3.3 V, Tc = +25 C, f = 2140 MHz, Characteristic Impedance [Zo] = 50 Ω, VEN = 0 V, Unless Otherwise Noted)
44
42
40
38
36
34
32
30
35
30
25
20
15
10
5
25 ˚C
40 ˚C
85 ˚C
25 ˚C
40 ˚C
85 ˚C
0
9
11 13 15 17 19 21 23
25 27 29 31 33
9
11
13
15
17
19
21
23
25
27
29
31
33
POUT (dBm)
POUT (dBm)
Figure 3. Gain vs Output Power
Figure 4. PAE vs Output Power
32.5
32.0
31.5
31.0
30.5
30.0
–30
–35
–40
–45
–50
–55
–60
25 ˚C
40 ˚C
85 ˚C
25 30 35 40 45 50 55 60 65 70 75 80 85
20
21
22
23
OUT (dBm)
24
25
P
Temperature (°C)
Figure 6. ACLR vs Output Power
Figure 5. OP1dB vs Temperature
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
Application Circuit Notes
Evaluation Board Description
The SKY66184-11 Evaluation Board is used to test the
performance of the SKY66184-11 PA. A typical application
schematic diagram is shown in Figure 7. A Bill of Materials for the
SKY66184-11 Evaluation Board is listed in Table 6. An assembly
drawing for the Evaluation Board is shown in Figure 8. The board
layer detail is shown in Figure 9. The layer detail physical
characteristics are shown in Figure 10.
Center Ground. It is extremely important to sufficiently ground
the bottom ground pad of the device for both thermal and stability
reasons. Multiple small vias are acceptable and work well under
the device if solder migration is an issue.
GND (pins 1, 2, 6, 11, 13, 15, 16, 20, 21, 25, and 27). Attach all
ground pins to the RF ground plane with the largest diameter and
lowest inductance via that the layout allows. Multiple small vias
are acceptable and work well under the device if solder migration
is an issue.
VBIAS (pin 10). The bias supply voltage for each stage, nominally
set to +3.3 V.
RFOUT (pin 19). Amplifier RF output pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
VCC1, VCC2, and VCC3 (pins 28, 26, and 23, respectively).
Supply voltage for each stage collector bias is nominally set to
3.3 V. Bypass and decoupling capacitors C1, C2, C3, C4, C5, and
C6 should be placed in the approximate location shown on the
evaluation board assembly drawing, although exact placement is
not critical.
RFIN (pin 4). Amplifier RF input pin (Zo = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
J1
1
2
3
4
5
6
7
8
PAEN
VBIAS
VCC1
VCC2
C3
C2
0.1 μF
C4
10 μF
C1
10 μF
0.1 μF
VCC1
L1
0 Ω
VCC2
VCC3
VCC3
C12
DNI
C5
0.1 μF
C6
10 μF
X
X
29
28 27 26 25 24 23 22
GND
8 Header
J3
21
20
19
18
17
16
15
1
2
3
4
5
6
7
GND
GND
N/C
GND
GND
RFOUT
N/C
C7
100 pF
RFOUT
X
X
J2
RFIN
N/C
SKY66184-11
X
X
C8
DNI
N/C
GND
VEN
GND
GND
RFIN
R2
0Ω
8
9 10 11 12 13 14
R5
0 Ω
RF Output
Coupling Port
X
X
X
PAEN
J4
C10
0.1 μF
C11
0.1 μF
203259D-007
VBIAS
Figure 7. SKY66184-11 Application Schematic
Table 6. SKY66184-11 Evaluation Board Bill of Materials (BOM)
Quantity
Component
C1, C4, C6
Size
Part Number
C1206X7R160-106KNE
GRM155R71C104KA88
GRM1555C1H101JZ01J
DNI
Description
Capacitor, 10 μF, 16 V, 10%, X7R
3
5
1
2
1
2
1206
0402
0402
C2, C3, C5, C10, C11
Ceramic capacitor, 0.1 μF, 10%, X7R, 16 V
Capacitor, 100 pF, 50 V, 5%, COG/NPO
DNI
C7
C8, C12
L1
0603
0402
RM73ZIJ000
Resistor, 0 Ω, 5%
R2, R5
ERJ2GE0R00
Resistor, 0 Ω, jumper, 0.063 W
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
J1
C6
C5
C4
L1
C12
C1
C3
C2
C8
RF Out
U1
RF In
C7
C10 R2
R5
C11
RF Out Coupling Port
Notes:
203259D-008
The C3 and C4 components are not required.
Some of the other components shown are optional.
Figure 8. SKY66184-11 Evaluation Board Assembly Diagram
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
Figure 9. SKY66184-11 Board Layer Detail
Cross Section
Name
Top Solder Mask
L1
Thickness (mm)
Material
Solder Resist
Cu – 1 oz
0.010
0.035
0.250
0.035
0.500
Dielectric
L2
Rogers RO4350B
Cu – 1 oz
Dielectric
FR4
L3
0.035
0.250
Cu – 1 oz
Dielectric
FR4
L4
0.035
0.010
Cu – 1 oz
Bottom Solder Mask
Solder Resist
203259D-010
Figure 10. SKY66184-11 Layer Detail Physical Characteristics
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
Package Dimensions
The typical part marking is shown in Figure 11. Figure 12 shows
the PCB layout footprint. Figure 13 shows the package
dimensions, and Figure 14 provides the tape and reel dimensions.
The SKY66184-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Pin 1
Indicator
Skyworks
66184-11
Part Number
Lot Code
XXXXXXXXX
YYWW CC
Date Code:
YY = Calendar Year
WW = Work Week
203259D-011
CC = Country Code
Figure 11. Typical Part Marking
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
5.3 mm
Pin 28
Package Outline
6X 1.25 mm
Pin 1 Indicator
0.43 X 0.43
Pin 1
0.5 mm Pitch
5.3 mm
6X 1.25 mm
9X 1.1 mm
28X 0.55 mm
Exposed Center Pad
Stencil aperture size of
80% to 100% of the module/package
solder mask openings
28X 0.25 mm
9X 1.1 mm
Stencil Aperture
Top View
5.4 mm
5.3 mm
Pin 28
Package Outline
Package Outline
0.25 mm Typ
Pin 1 Indicator
0.43 x 0.43
Pin 28
Pin 1
Pin 1
0.5 mm Pitch
0.5 mm Pitch
5.3 mm
5.4 mm
2X 1.8 mm
0.6 mm Pitch
17X 0.55 mm
28X 0.65 mm
Thermal via array
Ø
0.3 mm
Exposed Center Pad
Opening size of 60%
to 100% of exposed
center opening shown
on 0.6 mm pitch
improves thermal performance
17X 0.25 mm
28X 0.35 mm
2X 1.8 mm
0.6 mm Pitch
Metallization
Top View
Solder Mask Opening
Top View
Notes:
1. Thermal vias should be resin filled and capped in accordance with IPC–4761 type VII vias.
2. Recommended Cu thickness is 30 to 35 μm.
203259D-012
Figure 12. SKY66184-11 PCB Layout Footprint
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
28X SMT Pad
0.1
5
B
Top
A
B C
Pin 28
Pin 1
Indicator
C
See Detail B
Pin 1 Indicator
See Detail C
Pin 1
4X 1.5
4X 0.5
5
0
4X
1
6X 1.25
14X 2.4
A
A
1.25 0.1
Solder Mask Opening
0.2
0.075
A B C
A
B C
0.1
Top View
Side View
Bottom View
0.35 0.05
2X (0.05)
1.1
0.43 X 0.43
0.3 0.1
(0.1)
1.1
1.1
Metal Pad Edge
0.25 0.05
4X R0.05 Max
5X R0.05 Max
1.1
Detail B
Pad
Detail C
Pad
Detail A
Pad
Scale: 2X
Scale: 2X
Scale: 2X
8X This Rotation
Notes:
7X This Rotation
7X Rotated 180°
7X Rotated 90° CW
1X This Rotation
1. Dimensions are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
203259D-013
7X Rotated 90° CCW
Figure 13. SKY66184-11 Package Dimensions
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
Ø1.50
Pin 1
2.00 0.10
4.00 0.10
1.75 0.10
0.25 0.20
0.10
Ø1.50 0.10
1.40 0.10
8.00 0.10
Notes:
1.Carrier tapes must meet all requirements of Skyworks GP01-D232 procurement spec for tape and reel shipping.
2.Carrier tape shall be black conductive polycarbonate.
5.25 0.10
3.Cover tape shall be transparent conductive material.
4.ESD-surface resistivity shall be ≤ 1 × 1010 Ω/square per EJA, JEDEC TNR specification.
5.All measurements are in millimeters.
203259D-014
Figure 14. SKY66184-11 Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY66184-11: 2110 TO 2170 MHz LINEAR POWER AMPLIFIER
Ordering Information
Model Name
Manufacturing Part Number
SKY66184-11
Evaluation Board Part Number
SKY66184-11-EVB
SKY66184-11: Linear PA
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September 14, 2017 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203259G
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