USB2660-JZX [SMSC]
Microprocessor Circuit, CMOS, 9 X 9 MM, ROHS COMPLIANT, QFN-64;
| 型号： | USB2660-JZX |
| 厂家： | 
SMSC CORPORATION |
| 描述： | Microprocessor Circuit, CMOS, 9 X 9 MM, ROHS COMPLIANT, QFN-64 时钟 外围集成电路 |
| 文件： | 总67页 (文件大小：626K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
USB2660/USB2660i
Ultra Fast USB 2.0 Hub and
Multi-Format Flash Media
Controller with Dual SD
Interfaces
Datasheet
PRODUCT FEATURES
General Description
Features
The SMSC USB2660/USB2660i is a USB 2.0 compliant, Hi-
Speed hub, card reader, and protocol converter combo
solution. This fully integrated single chip solution provides USB
expansion and flash card media reader/writer integration. SDIO
bridging is possible with custom firmware. The SMSC
USB2660/USB2660i provides an ultra fast interface between a
USB host and today’s popular flash media formats. The
controller allows read/write capability to flash media from the
following families:
Compliance with the following flash media card
specifications SD 2.0 / MMC 4.2 / MS 1.43 / MS-Pro 1.02 /
MS-Pro-HG 1.01 / MS-Duo 1.10 / xD 1.2
Supports a single external 3.3 V supply source; internal
regulators provide 1.8 V internal core voltage for additional
bill of materials and power savings
The transaction translator (TT) in the hub supports operation
of Full-Speed and Low-Speed peripherals
– Secure DigitalTM (SD)
– MultiMediaCardTM (MMC)
– Memory Stick® (MS)
9 K RAM | 64 K on-chip ROM
– xD-Picture CardTM (xD)1
Enhanced EMI rejection and ESD protection performance
Hub and flash media reader/writer configuration from a
single source: External I2C® ROM or external SPI ROM
The USB2660/USB2660i offers a versatile, cost-effective, and
energy-efficient hub controller with 2 downstream USB 2.0
ports. This combo solution leverages SMSC’s innovative
technology that delivers industry-leading data throughput in
mixed-speed USB environments. Average sustained transfer
rates exceeding 35 MB/s are possible2.
—
—
—
Configures internal code using an external I2C EEPROM
Supports external code using an SPI Flash EEPROM
Customizable vendor ID, product ID, and language ID if using
an external EEPROM
Highlights
Additional SD/SDIO port for card reader or to host wireless
applications such as WiFiTM, Bluetooth®, and GPS
2 exposed Hi-Speed USB 2.0 downstream ports for external
peripheral expansion
Up to 20 configurable GPIOs for special functions
The dedicated flash media reader is internally attached to a
3rd downstream port of the hub as a USB Compound
Device
The USB2660 supports the commercial temperature range
of 0°C to +70°C
—
—
a single or multiplexed flash media reader interface
a non-multiplexed SD/SDIO interface (slot) for SD card reader
or SDIO bridging applications
The USB2660i supports the industrial temperature range of
-40°C to +85°C
PortMap
64-pin QFN lead-free, RoHS compliant package (9 x 9 mm)
—
Flexible port mapping and port disable sequencing supports
multiple platform designs
Applications
PortSwap
—
Desktop and mobile PCs
Printers
Programmable USB differential-pair pin locations eases PCB
design by aligning USB signal traces directly to connectors
PHYBoost
—
GPS navigation systems
Media players/viewers
Consumer A/V
Programmable USB transceiver drive strength recovers signal
integrity
Set-top boxes
1.For xD-Picture CardTM support, please obtain a user license
from the xD-Picture Card License Office.
2.Host and media dependent.
Industrial products
SMSC USB2660/USB2660i
DATASHEET
Revision 1.1 (11-05-10)
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
ORDER NUMBERS:
USB2660/USB2660i-JZX for 64-PIN, QFN LEAD-FREE RoHS COMPLIANT PACKAGE
THIS PRODUCT MEETS THE HALOGEN MAXIMUM CONCENTRATION VALUES PER IEC61249-2-21.
FOR ROHS COMPLIANCE AND ENVIRONMENTAL INFORMATION, PLEASE VISIT WWW.SMSC.COM/ROHS.
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123
Copyright © 2010 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for
construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC
reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications
before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent
rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not
designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property
damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of
this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered
trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.
SMSC makes the following part-numbered device available for purchase only by customers who are xD-Picture Card licensees: USB2660/USB2660i.
TM
By purchasing or ordering any of such devices, Buyer represents, warrants, and agrees that Buyer is a duly licensed Licensee under an xD-Picture Card License Agreement
with Fuji Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation; and that Buyer will maintain in effect such xD-Picture Card license and will give SMSC
reasonable advance notice of any termination or expiration of such xD-Picture Card license, but in no event less than five days advance notice. SMSC may discontinue making
such devices available for purchase by Buyer and/or discontinue further deliveries of such devices if such xD-Picture Card license shall expire, terminate, or cease to be in
force, or if Buyer is or becomes in default of such xD-Picture Card license.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE
OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;
TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD
TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Revision 1.1 (11-05-10)
2
SMSC USB2660/USB2660i
DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
Table of Contents
Chapter 1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chapter 2 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Chapter 3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Chapter 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 5 Pin Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1
64-Pin Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Chapter 6 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1
6.2
6.3
6.4
USB2660/USB2660i Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Port Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
ROM BOOT Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Chapter 7 Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.1
Pin Reset States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Chapter 8 Configuration Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.1
Hub . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.1.1
8.1.2
Hub Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
VBus Detect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.2
8.3
Card Reader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
System Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.3.1
8.3.2
EEPROM/SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
EEPROM Data Descriptor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.4
Set bit 7 of bmAttribute to enable the registers in Table 8.4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
8.4.6
8.4.7
EEPROM Data Descriptor Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
A0h-A7h: Device Power Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Device ID Strings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Hub Controller Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Internal Flash Media Controller Extended Configurations . . . . . . . . . . . . . . . . . . . . . . . . 51
2
I C EEPROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
In-Circuit EEPROM Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
8.5
Default Configuration Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.5.1
8.5.2
External Hardware nRESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
USB Bus Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Chapter 9 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.1
9.2
9.3
Oscillator/Crystal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Ceramic Resonator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
External Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
2
9.3.1
9.3.2
I C EEPROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
USB 2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Chapter 10 DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
10.1 Maximum Guaranteed Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
10.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
10.3 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
SMSC USB2660/USB2660i
3
Revision 1.1 (11-05-10)
DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
10.4 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Chapter 11 GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Chapter 12 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
12.1 Tape and Reel Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Revision 1.1 (11-05-10)
4
SMSC USB2660/USB2660i
DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
List of Tables
Table 5.1 USB2660/USB2660i 64-Pin Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6.1 USB2660/USB2660i Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 6.2 USB2660/USB2660i Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 7.1 Legend for Pin Reset States Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 7.2 USB2660/USB2660i Reset States Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 8.1 Internal Flash Media Controller Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 8.2 Hub Controller Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 8.3 Other Internal Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 8.4 Internal Flash Media Controller Extended Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 8.5 Port Map Register for Ports 1 & 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 8.6 Port Map Register for Port 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 8.7 nRESET Timing for EEPROM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 9.1 Crystal Circuit Legend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Table 10.1 Pin Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 11.1 USB2660/USB2660i GPIO Usage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
SMSC USB2660/USB2660i
5
Revision 1.1 (11-05-10)
DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
List of Figures
Figure 3.1 USB2660/USB2660i 64-Pin QFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 4.1 USB2660/USB2660i Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6.1 Port Power Control with USB Power Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6.2 Port Power Control with a Single Poly Fuse and Multiple Loads . . . . . . . . . . . . . . . . . . . . . . 24
Figure 6.3 Port Power with Ganged Control with Poly Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 6.4 SPI ROM Connection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2
Figure 6.5 I C Connection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 7.1 Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 8.1 nRESET Timing for EEPROM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 9.1 Typical Crystal Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 9.2 Capacitance Formulas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 9.3 Ceramic Resonator Usage with SMSC IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 10.1 Supply Rise Time Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 12.1 USB2660/USB2660i 64-Pin QFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure 12.2 64-Pin Package Tape Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Figure 12.3 64-Pin Package Reel Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Revision 1.1 (11-05-10)
6
SMSC USB2660/USB2660i
DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
Chapter 1 Overview
The SMSC USB2660/USB2660i is an integrated USB 2.0 compliant, Hi-Speed hub, card reader, and
protocol converter combo solution. This combo solution supports today’s popular multi-format flash
media cards. This multi-format flash media controller and USB hub combo features two exposed
downstream USB ports available for external peripheral expansion. The dedicated flash media
reader/writer is internally attached to a third downstream port of the hub as a USB Compound Device
which supports the following two interfaces: One interface is multiplexed for xD-Picture Card,
Memory Stick, Secure Digital/MultiMediaCard, and SD/Secure Digital Input/Output. The other
interface is dedicated to a second SD card slot for SDIO bridging applications. SDIO bridging is
possible with custom firmware.
The USB2660/USB2660i will attach to an upstream port as a Full-Speed hub or as a Full-/Hi-Speed
hub. The hub supports Low-Speed, Full-Speed, and Hi-Speed (if operating as a Hi-Speed hub)
downstream devices on all of the enabled downstream ports.
All required resistors on the USB ports are integrated into the hub. This includes all series
termination resistors on D+ and D– pins and all required pull-down and pull-up resistors. The over-
current sense inputs for the downstream facing ports have internal pull-up resistors.
The USB2660/USB2660i includes programmable features such as:
PortMap which provides flexible port mapping and disable sequences. The downstream ports of a
USB2660/USB2660i hub can be reordered or disabled in any sequence to support multiple platform
designs with minimum effort. For any port that is disabled, the USB2660/USB2660i automatically
reorders the remaining ports to match the USB host controller’s port numbering scheme.
PortSwap which adds per-port programmability to USB differential-
pair pin locations. PortSwap allows direct alignment of USB signals
(D+/D-) to connectors avoiding uneven trace length or crossing of
the USB differential signals on the PCB.
PHYBoost which enables four programmable levels of USB signal
drive strengths in downstream port transceivers. PHYBoost attempts
to restore USB signal integrity. The diagram on the right shows an
example of Hi-Speed USB eye diagrams before (PHYBoost at 0%)
and after (PHYBoost at 12%) signal integrity restoration in a
compromised system environment.
SMSC USB2660/USB2660i
7
Revision 1.1 (11-05-10)
DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
Hardware Features
Single chip hub and flash media controller combo
USB2660 supports the commercial temperature range of 0°C to +70°C
USB2660i supports the industrial temperature range of -40°C to +85°C
Transaction translator (TT) in the hub supports operation of FS and LS peripherals
Full power management with individual or ganged power control of each downstream port
Optional support for external firmware access via SPI interface
Onboard 24 MHz crystal driver circuit
Optional external 24 MHz clock input which must be a 1.8 V signal
Code execution via SPI ROM which must meet
- 30 MHz or 60 MHz operation support
- Single bit or dual bit mode support
- Mode 0 or mode 3 SPI support
Compliance with the following flash media card specifications:
Secure Digital 2.0 / MultiMediaCard 4.2
- SD 2.0, SD-HS, SD-HC
- TransFlash™ and reduced form factor media
- 1/4/8 bit MMC 4.2
Memory Stick 1.43
Memory Stick Pro Format 1.02
Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, MS-HS, MS Pro-HG, MS Pro
Memory Stick Duo 1.10
xD-Picture Card 1.2
Up to 20 GPIOs: Configuration and polarity for special function use
- The number of actual GPIOs depends on the implementation configuration used
- Two GPIOs available with up to 200 mA drive and protected “fold-back” short circuit current
8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM | 9 KB RAM
Integrated regulator for 1.8 V core operation
Software Features
Hub and flash media reader/writer configuration from a single source:
External I2C ROM or external SPI ROM
If the OEM is using an external EEPROM or an external SPI ROM, the following features are
available:
- Customizable vendor ID, product ID, and device ID
- 12-hex digits maximum for the serial number string
- 28-character manufacturer ID and product strings for the flash media reader/writer
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OEM Selectable Hub Features
A default configuration is available in the USB2660/USB2660i following a reset. The
USB2660/USB2660i may also be configured by an external I2C EEPROM or via external SPI ROM
flash.
Compound Device support on a port-by-port basis
- a port is permanently hardwired to a downstream USB peripheral device
Select over-current sensing and port power control on an individual or ganged (all ports together)
basis to match the OEM’s choice of circuit board component selection
Port power control and over-current detection/delay features
Configure the delay time for filtering the over-current sense inputs
Configure the delay time for turning on downstream port power
Bus- or self-powered selection
Hub port disable or non-removable configurations
Flexible port mapping and disable sequencing supports multiple platform designs
Programmable USB differential-pair pin location eases PCB layout by aligning USB signal lines
directly to connectors
Programmable USB signal drive strength recovers USB signal integrity using 4 levels of signal drive
strength
Indicate the maximum current that the 2-port hub consumes from the USB upstream port
Indicate the maximum current required for the hub controller
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Chapter 2 Acronyms
ACK: Handshake packet (positive acknowledgement)
EOP: End of Packet
EOF: End of (micro) Frame
FM: Flash Media
FMC: Flash Media Controller
FS: Full-Speed Device
LS: Low-Speed Device
HS: Hi-Speed Device
I2C®: Inter-Integrated Circuit1
MMC: MultiMediaCard
MS: Memory Stick
MSC: Memory Stick Controller
OCS: Over-current Sense
PHY: Physical Layer
PLL: Phase-Locked Loop
RXD: Received eXchange Data
SD: Secure Digital
SDC: Secure Digital Controller
TXD: Transmit eXchange Data
UART: Universal Asynchronous Receiver-Transmitter
UCHAR: Unsigned Character
UINT: Unsigned Integer
Standard Microsystems is a registered trademark and SMSC is a trademark of Standard Microsystems Corporation. Other product and company names
are trademarks or registered trademarks of their respective holders.
*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made the subject of this
document or to use related SMSC software programs, technical information and licenses under patent and other intellectual property rights from or through
various persons or entities, including without limitation media standard companies, forums, and associations, and other patent holders may be required.
These media standard companies, forums, and associations include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro);
SD3 LLC (Secure Digital); MultiMedia Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact
Flash); and Fuji Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses or
technical information available; does not promise or represent that any such licenses or technical information will actually be obtainable from or through
the various persons or entities (including the media standard companies, forums, and associations), or with respect to the terms under which they may
be made available; and is not responsible for the accuracy or sufficiency of, or otherwise with respect to, any such technical information.
SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any customer, or otherwise, with respect to infringement,
including without limitation any obligations to defend or settle claims, to reimburse for costs, or to pay damages, shall not apply to any of the devices
made the subject of this document or any software programs related to any of such devices, or to any combinations involving any of them, with respect
to infringement or claimed infringement of any existing or future patents related to solid state disk or other flash memory technology or applications (“Solid
State Disk Patents”). By making any purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees
that it has obtained all necessary licenses under then-existing Solid State Disk Patents for the manufacture, use and sale of solid state disk and other
flash memory products and that the customer will timely obtain at no cost or expense to SMSC all necessary licenses under Solid State Disk Patents;
that the manufacture and testing by or for SMSC of the units of any of the devices made the subject of this document which may be sold to the customer,
and any sale by SMSC of such units to the customer, are valid exercises of the customer's rights and licenses under such Solid State Disk Patents; that
SMSC shall have no obligation for royalties or otherwise under any Solid State Disk Patents by reason of any such manufacture, use, or sale of such
units; and that SMSC shall have no obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under
any Solid State Disk Patents. SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER
VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES AGAINST
INFRINGEMENT AND THE LIKE.
No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask work right, trade secret,
or other intellectual property right.
**To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of these Software License
Agreements may be obtained by contacting SMSC.
1.I2C is a registered trademark of Philips Corporation.
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Chapter 3 Pin Configuration
SPI_CE_n
SD1_CMD / MS_D0 / xD_CLE
SD1_D5 / MS_D1 / xD_ALE
xD_nWE
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
SPI_CLK / GPIO4 / SCL
SPI_DO / GPIO5 / SDA / SPI_SPD_SEL
SPI_DI
GPIO1 / LED / TXD
nRESET
SD1_CLK / MS_BS / xD_nWP
SD1_D6 / MS_D7 / xD_D0
SD1_D7 / MS_D6 / xD_D1
SD1_D0 / MS_D4 / xD_D2
SD1_D1 / MS_D5 / xD_D3
VDD33
VBUS_DET
TEST
SMSC
USB2660/USB2660i
(Top View QFN-64)
VDD33
USBUP_DP
USBUP_DM
XTAL2
CRFILT
GPIO15 / SD1_nCD
GPIO6 / SD1_WP / MS_SCLK / xD_D4
SD2_D2 / GPIO20
XTAL1 (CLKIN)
PLLFILT
SD2_D3 / GPIO21
Ground Pad
(must be connected to VSS)
RBIAS
SD2_D4 / GPIO22
VDD33
SD2_CMD / GPIO27
Indicates pins on the bottom of the device.
Figure 3.1 USB2660/USB2660i 64-Pin QFN
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Chapter 4 Block Diagram
Figure 4.1 USB2660/USB2660i Block Diagram
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Chapter 5 Pin Table
5.1
64-Pin Table
Table 5.1 USB2660/USB2660i 64-Pin Table
SECURE DIGITAL / MEMORY STICK / xD INTERFACE (18 PINS)
SD1_D7 /
MS_D6 /
xD_D1
SD1_D5 /
MS_D1 /
xD_ALE
SD1_D4 /
MS_D2 /
xD_D7
SD1_D6 /
MS_D7 /
xD_D0
SD1_D3 /
MS_D3 /
xD_D6
SD1_D1 /
MS_D5 /
xD_D3
SD1_D0 /
MS_D4 /
xD_D2
SD1_D2 /
xD_D5
SD1_CLK /
MS_BS /
xD_ nWP
SD1_CMD /
MS_D0 /
xD_CLE
GPIO12 /
MS_INS
GPIO15 /
SD1_nCD
GPIO6 /
SD1_WP /
MS_SCLK /
xD_D4
GPIO14 /
xD_nCD
xD_nRE
xD_nB/R
xD_nCE
xD_nWE
SECOND SECURE DIGITAL INTERFACE (12 PINS)
SD2_D7 /
GPIO25
SD2_D6 /
GPIO24
SD2_D5 /
GPIO23
SD2_D4 /
GPIO22
SD2_D3 /
GPIO21
SD2_D2 /
GPIO20
SD2_D1 /
GPIO19
SD2_D0 /
GPIO18
SD2_nCD /
GPIO16
SD2_CLK /
GPIO26
SD2_CMD /
GPIO27
SD2_WP /
GPIO17
USB INTERFACE (5 PINS)
USBUP_DP
RBIAS
XTAL1 (CLKIN)
USBUP_DM
XTAL2
2-PORT USB INTERFACE (7 PINS)
USBDN_DP2
USBDN_DP3
USBDN_DM2
USBDN_DM3
PRTCTL2
PRTCTL3
VBUS_DET
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Table 5.1 USB2660/USB2660i 64-Pin Table (continued)
SPI INTERFACE (4 PINS)
SPI_DO /
GPIO5 /
SDA /
SPI_SPD_SEL
SPI_CLK /
GPIO4 /
SCL
SPI_CE_n
SPI_DI
MISC (8 PINS)
GPIO1 /
LED /
TXD
GPIO2 /
RXD
nRESET
TEST
GPIO8 (CRD_PWR2)
GPIO10 (CRD_PWR1)
(2) NC
POWER (10 PINS)
(8) VDD33
CRFILT
PLLFILT
TOTAL 64
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Chapter 6 Pin Descriptions
This section provides a detailed description of each signal. The signals are arranged in functional
groups according to their associated interface. The pin descriptions below are applied when using the
internal default firmware and can be referenced in Chapter 8, "Configuration Options," on page 29.
Please reference Chapter 2, "Acronyms," on page 10 for a list of the acronyms used.
The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal
is at a low voltage level. When “n” is not present in the signal name, the signal is asserted at a high
voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working
with a mixture of “active low” and “active high” signals. The term assert, or assertion, indicates that a
signal is active, independent of whether that level is represented by a high or low voltage. The term
negate, or negation, indicates that a signal is inactive.
6.1
USB2660/USB2660i Pin Descriptions
Table 6.1 USB2660/USB2660i Pin Descriptions
64-PIN
QFN
BUFFER
TYPE
(Table 6.2) DESCRIPTION
SYMBOL
SECURE DIGITAL INTERFACE
SD1_D[7:0]
27
28
31
38
40
41
25
26
I/O8PU
Secure Digital Data 7-0
These are the bi-directional data signals SD_D0 - SD_D7 with weak
pull-up resistors.
SD1_CLK
SD1_CMD
29
O8
Secure Digital Clock
This is an output clock signal to the SD/MMC device.
Secure Digital Command
32
I/O8PU
This is a bi-directional signal that connects to the CMD signal of the
SD/MMC device. The bi-directional signal has a weak internal pull-up
resistor.
GPIO15 /
SD1_nCD
22
I/O6
This general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
I/O8PU
Secure Digital Card Detect GPIO
This is a GPIO designated by the default firmware as the Secure
Digital card detection pin and has an internal pull-up.
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Table 6.1 USB2660/USB2660i Pin Descriptions (continued)
64-PIN
QFN
BUFFER
TYPE
SYMBOL
(Table 6.2) DESCRIPTION
GPIO6 /
21
I/O6
I/O8
This general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
Secure Digital Write Protected GPIO
SD1_WP
This is a GPIO designated by the default firmware as the Secure
Digital card mechanical write protect detect pin.
SECOND SECURE DIGITAL INTERFACE
SD2_D[7:0] /
11
12
16
18
19
20
9
I/O8PU
SD2 Data 7-0
These are the bi-directional data signals SD2_D0 - SD2_D7 and have
weak pull-up resistors.
I/O6
O8
These general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
GPIO[25:18]
SD2_CLK /
10
13
SD2 Clock GPIO
This is an output clock signal designated by the default firmware to the
SD2/MMC device.
I/O6
This general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
GPIO26
SD2_CMD /
17
I/O8PU
SD2 Command GPIO
This is a bi-directional signal designated by the default firmware that
connects to the CMD signal of the SD2/MMC device. The bi-directional
signal has a weak internal pull-up resistor.
I/O6
I/O8
This general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
GPIO27
SD2_nCD /
8
SD2 Card Detect GPIO
This is a GPIO designated by the default firmware as the second
Secure Digital card detection pin and has an internal pull-up.
GPIO16
I/O6
I/O8
This general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
SD2_WP /
GPIO17
45
SD2 Write Protected GPIO
This is a GPIO designated by the default firmware as the second
Secure Digital card interface mechanical write detect pin.
I/O6
This general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
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Table 6.1 USB2660/USB2660i Pin Descriptions (continued)
64-PIN
QFN
BUFFER
TYPE
(Table 6.2) DESCRIPTION
SYMBOL
MEMORY STICK INTERFACE
MS_BS
29
39
O8
Memory Stick Bus State
This pin is connected to the bus state pin of the MS device. It is used
to control the Bus States 0, 1, 2, and 3 (BS0, BS1, and BS3) of the
MS device.
GPIO12 /
MS_INS
I/O6
IPU
This general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
Memory Stick Card Insertion GPIO
This is a GPIO designated by the default firmware as the Memory Stick
card detection pin and has a weak internal pull-up resistor.
MS_SCLK
MS_D[7:0]
21
O8
Memory Stick System Clock
This pin is an output clock signal to the MS device.
Memory Stick System Data In/Out
28
27
25
26
40
38
31
32
I/O8PD
These pins are the bi-directional data signals for the MS device. In
serial mode, the most significant bit (MSB) of each byte is transmitted
first by either MSC or MS device on MS_D0.
MS_D0, MS_D2, and MS_D3 have weak pull-down resistors. MS_D1
has a pull-down resistor if in parallel mode, otherwise it is disabled. In
4- or 8-bit parallel modes, all MS_D7 - MS_D0 signals have weak pull-
down resistors.
xD-PICTURE CARD INTERFACE
xD_D[7:0]
38
40
41
21
25
26
27
28
I/O8PD
xD-Picture Card Data 7-0
These pins are the bi-directional data signals xD_D7 - xD_D0 and have
weak internal pull-down resistors.
xD_ALE
xD_nB/R
31
O8PD
IPU
xD-Picture Card Address Strobe
This pin is an active high Address Latch Enable (ALE) signal for the
xD device. This pin has a weak pull-down resistor that is permanently
enabled.
36
xD-Picture Card Busy or Data Ready
This pin is connected to the BSY/RDY pin of the xD-Picture Card
device.
When using the internal FET, this pin has an internal weak pull-up
resistor that is tied to the output of the internal power FET.
If an external FET is used (the internal FET is disabled), then the
internal pull-up is not available (an external pull-up is required).
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Table 6.1 USB2660/USB2660i Pin Descriptions (continued)
64-PIN
QFN
BUFFER
TYPE
SYMBOL
(Table 6.2) DESCRIPTION
xD_nCE
34
O8PU
xD-Picture Card Chip Enable
This pin is an active low chip enable signal for the xD-Picture Card
device.
When using the internal FET, this pin has an internal weak pull-up
resistor that is tied to the output of the internal power FET.
If an external FET is used (internal FET is disabled), then the internal
pull-up is not available (an external pull-up is required).
xD_CLE
32
37
O8PD
xD-Picture Card Command Strobe
This pin is an active high Command Latch Enable signal for the xD
device. This pin has a weak pull-down resistor that is permanently
enabled.
GPIO14 /
xD_nCD
I/O6
I/O8
This general purpose pin may be used either as input, edge sensitive
interrupt input, or output. Custom firmware is required to activate this
function.
xD-Picture Card Detection GPIO
This is a GPIO designated by the default firmware as the xD-Picture
Card detection pin.
xD_nRE
xD_nWE
xD_nWP
35
30
29
O8PU
O8PU
O8PD
xD-Picture Card Read Enable
This pin is an active low read strobe signal for the xD-Picture Card
device.
When using the internal FET, this pin has an internal weak pull-up
resistor that is tied to the output of the internal power FET.
If an external FET is used (internal FET is disabled), then the internal
pull-up is not available (an external pull-up is required).
xD-Picture Card Write Enable
This pin is an active low write strobe signal for the xD-Picture Card
device.
When using the internal FET, this pin has an internal weak pull-up
resistor that is tied to the output of the internal power FET.
If an external FET is used (internal FET is disabled), then the internal
pull-up is not available (an external pull-up is required).
xD-Picture Card Write Protect
This pin is an active low write protect signal for the xD-Picture Card
device. This pin has a weak pull-down resistor that is permanently
enabled.
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Table 6.1 USB2660/USB2660i Pin Descriptions (continued)
64-PIN
QFN
BUFFER
TYPE
(Table 6.2) DESCRIPTION
SYMBOL
USB INTERFACE
USB Bus Data
USBUP_DM
USBUP_DP
59
58
I/O-U
I/O-U
These pins connect to the upstream USB bus data signals (host port
or upstream hub). USBUP_DM and USBUP_DP can be swapped
using the PortSwap feature (See Section 8.4.4.20, "F1h: Port Swap,"
on page 48).
USBDN_DM
[3:2]
USBDN_DP
3
1
4
2
USB Bus Data
These pins connect to the downstream USB bus data signals and can
be swapped using the PortSwap feature (See Section 8.4.4.20, "F1h:
Port Swap," on page 48).
[3:2]
PRTCTL[3:2]
7
6
I/OD6
PU
USB Power Enable
As an output, these pins enable power to downstream USB peripheral
devices and have weak internal pull-up resistors. See Section 6.3,
"Port Power Control" for diagram and usage instructions.
As an input, when the power is enabled, these pins monitor the over-
current condition. When an over-current condition is detected, the pins
turn the power off.
VBUS_DET
55
I
Detect Upstream VBUS Power
Detects the state of upstream VBUS power. The hub monitors
VBUS_DET to determine when to assert the internal D+ pull-up resistor
(signaling a connect event).
When designing a detachable hub, connect this pin to the VBUS power
pin of the USB port that is upstream of the hub.
For self-powered applications with a permanently attached host, this
pin should be pulled up, typically to VDD33.
VBUS is a 3.3 volt input. A resistor divider must be used if connecting
to 5 volts of USB power.
RBIAS
XTAL1 (CLKIN)
XTAL2
63
61
60
I-R
USB Transceiver Bias
A 12.0 kΩ, ±1.0% resistor is attached from VSS to this pin in order to
set the transceiver's internal bias currents.
ICLKx
OCLKx
24 MHz Crystal Input or External Clock Input
This pin can be connected to one terminal of the crystal or it can be
connected to an external 24 MHz clock when a crystal is not used.
24 MHz Crystal Output
This is the other terminal of the crystal, or it is left open when an
external clock source is used to drive XTAL1(CLKIN).
SPI INTERFACE
SPI_CE_n
49
O12
SPI Chip Enable
This is the active low chip enable output. If the SPI interface is
enabled, this pin must be driven high in power down states.
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Table 6.1 USB2660/USB2660i Pin Descriptions (continued)
64-PIN
QFN
BUFFER
TYPE
SYMBOL
(Table 6.2) DESCRIPTION
SPI_CLK /
50
I/O12
I/O6
This is the SPI clock out to the serial ROM. See Section 6.4, "ROM
BOOT Sequence" for diagram and usage instructions. During reset,
drive this pin low.
This pin may be used either as input, edge sensitive interrupt input, or
output. Custom firmware is required to activate this function.
GPIO4 /
When configured, this is the I2C EEPROM clock pin.
SCL
SPI_DO /
51
I/O12
I/O6
This is the data out for the SPI port. See Section 6.4, "ROM BOOT
Sequence" for diagram and usage instructions.
This pin may be used either as input, edge sensitive interrupt input, or
output. Custom firmware is required to activate this function.
GPIO5 /
SDA /
This pin is the data pin when the device is connected to the optional
I2C EEPROM.
I/O12
This pin is used to select the speed of the SPI interface. During
nRESET assertion, this pin will be tri-stated with the weak pull-down
resistor enabled. When nRESET is negated, the value on the pin will
be internally latched, and the pin will revert to SPI_DO functionality, the
internal pull-down will be disabled.
SPI_SPD_SEL
‘0’ = 30 MHz (No external resistor should be applied.)
‘1’ = 60 MHz (A 10 K external pull-up resistor must be applied.)
If the latched value is '1', then the pin is tri-stated when the chip is in
the suspend state.
If the latched value is '0', then the pin is driven low during a suspend
state.
SPI_DI
52
53
I/O12PD
I/O6
This is the data in to the controller from the ROM. This pin has a weak
internal pull-down applied at all times to prevent floating.
MISC
GPIO1 /
General Purpose I/O
This pin may be used either as input, edge sensitive interrupt input, or
output. Custom firmware is required to activate this function.
GPIO1 can be used as an LED output.
LED /
TXD
This signal can be configured as the TXD output of the internal UART.
Custom firmware is required to activate this function.
GPIO2 /
RXD
44
I/O6
This pin may be used either as input, edge sensitive interrupt input, or
output. Custom firmware is required to activate this function.
This signal can be configured as input to the RXD of the internal UART.
Custom firmware is required to activate this function.
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Table 6.1 USB2660/USB2660i Pin Descriptions (continued)
64-PIN
QFN
BUFFER
TYPE
(Table 6.2) DESCRIPTION
SYMBOL
GPIO8
15
I/O200
Card power drive: 3.3 V (100 mA or 200 mA)
(CRD_PWR2)
This pin specifically powers the second Secure Digital interface (slot).
If card power is not being used to power the second SD interface, this
pin may be used as a GPIO.
Please reference Section 8.4.5.9, "147h-14Bh: Device to LUN
Mapping," on page 52.
GPIO10
43
I/O200
Card power drive: 3.3 V (100 mA or 200 mA)
(CRD_PWR1)
This pin powers the multiplexed flash media interface (slot) for xD, MS,
and SD/MMC. If card power is not being used to power the multiplexed
flash media interface, this pin may be used as a GPIO.
Please reference Section 8.4.2.3, "A4h-A5h: Smart Media Device
Power Configuration," on page 39.
nRESET
TEST
54
56
IS
I
RESET Input
The system uses this active low signal reset the chip. The active low
pulse should be at least 1 μs wide.
TEST Input
Tie this pin to ground for normal operation.
DIGITAL / POWER / GROUND
VDD Core Regulator Filter Capacitor
CRFILT
PLLFILT
23
62
This pin requires a 1.0 μF (or greater) ± 20% (ESR <0.1Ω) capacitor
to VSS.
Phase-locked Loop Regulator Filter Capacitor
This pin requires 1.0 μF (or greater) ± 20% (ESR <0.1Ω) capacitor to
VSS.
VDD33
5
3.3 V Power and Regulator Input
14
24
33
42
47
57
64
Please refer to Chapter 10, "DC Parameters," on page 58 for more
information.
Pins 24 and 64 require external bypass capacitors of 4.7 μF minimum.
VSS
NC
ePad
The ground pad is the only VSS for the device and must be tied to
ground with multiple vias.
46
48
No Connect pins
No trace or signal should be routed/attached to these pins.
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6.2
Buffer Type Descriptions
Table 6.2 USB2660/USB2660i Buffer Type Descriptions
BUFFER
DESCRIPTION
I
Input.
IPU
Input with weak internal pull-up.
IS
Input with Schmitt trigger.
I/O6
Input/output buffer with 6 mA sink and 6 mA source.
I/OD6PU
O8
Input/open drain output buffer with a 6 mA sink.
Output buffer with an 8 mA sink and an 8 mA source.
Output buffer with an 8 mA sink and an 8 mA source with a weak internal pull-down resistor.
Output buffer with an 8 mA sink and an 8 mA source with a weak internal pull-up resistor.
Input/output buffer with an 8 mA sink and an 8 mA source.
Input/output buffer with an 8 mA sink and an 8 mA source with a weak internal pull-down resistor.
Input/output buffer with an 8 mA sink and an 8 mA source with a weak internal pull-up resistor.
Output buffer with a 12 mA sink and a 12 mA source.
Input/output buffer with 12 mA sink and 12 mA source.
Input/output buffer with 12 mA sink and 12 mA source with a weak internal pull-down resistor.
Input/output buffer 12 mA with FET disabled, 100/200 mA source only when the FET is enabled.
XTAL clock input.
O8PD
O8PU
I/O8
I/O8PD
I/O8PU
O12
I/O12
I/O12PD
I/O200
ICLKx
OCLKx
I/O-U
I-R
XTAL clock output.
Analog input/output as defined in the USB 2.0 Specification.
RBIAS.
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6.3
Port Power Control
Port Power control using a USB Power Switch
The USB2660/USB2660i has a single port power control and over-current sense signal for each
downstream port. When disabling port power, the driver will actively drive a '0'. To avoid unnecessary
power dissipation, the internal pull-up resistor will be disabled at that time. When port power is enabled,
the output driver is disabled, and the pull-up resistor is enabled creating an open drain output.
If there is an over-current situation, the USB Power Switch will assert the open drain OCS signal. The
Schmitt trigger input will detect this event as a low. The open drain output does not interfere. The
internal over-current sense filter handles the transient conditions, such as low voltage, while the device
is powering up.
5 V
PRTCTL3
OCS
USB Power
Switch
EN
USB
Device
USB2660/60i
5 V
PRTCTL2
OCS
USB Power
Switch
EN
USB
Device
Figure 6.1 Port Power Control with USB Power Switch
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Port Power control using a Poly Fuse
When using the USB2660/USB2660i with a poly fuse, an external diode must be used (See
Figure 6.2). When disabling port power, the USB2660/USB2660i will drive a '0'. This procedure will
have no effect since the external diode will isolate the pin from the load. When port power is enabled,
the USB2660/USB2660i output driver is disabled, and the pull-up resistor is enabled which creates an
open drain output. This open drain output condition means that the pull-up resistor is providing 3.3
volts to the anode of the diode. If there is an over-current situation, the poly fuse will open. This will
cause the cathode of the diode to go to zero volts. The anode of the diode will be at 0.7 volts, and
the Schmitt trigger input will register this as a low resulting in an over-current detection. The open drain
output does not interfere.
5 V
PRTCTL3
USB
Device
USB2660/60i
5V
PRTCTL2
USB
Device
Figure 6.2 Port Power Control with a Single Poly Fuse and Multiple Loads
When using a single poly fuse to power all devices, note that for the ganged situation, all power control
pins must be tied together.
5 V
PRTCTL3
Poly Fuse
USB2660/60i
USB
Device
USB
Device
PRTCTL2
Figure 6.3 Port Power with Ganged Control with Poly Fuse
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6.4
ROM BOOT Sequence
After power-on reset, the internal firmware checks for an external SPI flash device that contains a valid
signature of "2DFU" (device firmware upgrade) beginning at address 0xFFFA. If a valid signature is
found, then the external ROM is enabled and code execution begins at address 0x0000 in the external
SPI device. Otherwise, code execution continues from the internal ROM.
If there is no SPI ROM detected, the internal firmware then checks for the presence of an I2C ROM.
The firmware looks for the signature ‘ATA2’ at the offset of FCh-FFh and ‘ecf1’ at the offset of 17Ch-
17Fh in the I2C ROM. The firmware reads in the I2C ROM to configure the hardware and software
internally. Please refer to Section 8.3.2, "EEPROM Data Descriptor," on page 30 for the details of the
configuration options.
The SPI ROM required for the USB2660/USB2660i is a recommended minimum of 1 Mbit and support
either 30 MHz or 60 MHz. The frequency used is set using the SPI_SPD_SEL. For 30 MHz operation,
this pin must be pulled to ground through a 100 kΩ resistor. For 60 MHz operation, this pin must pulled
up through a 100 kΩ resistor.
The SPI_SPD_SEL pin is used to choose the speed of the SPI interface. During nRESET assertion,
this pin will be tri-stated with the weak pull-down resistor enabled. When nRESET is negated, the value
on the pin will be internally latched, and the pin will revert to SPI_DO functionality. The internal pull-
down will be disabled.
The firmware can determine the speed of operation on the SPI port by checking the SPI_SPEED in
the SPI_CTL register (0x2400 - RESET = 0x02). Both 1- and 2-bit SPI operation is supported. For
optimum throughput, a 2-bit SPI ROM is recommended. Both mode 0 and mode 3 SPI ROMS are also
supported.
SPI_CE_n
CE#
CLK
SPI_CLK / GPIO4 / SCL
SPI ROM
USB2660/60i
SPI_DO / GPIO5 / SDA / SPI_SPD_SEL
SPI_DI
SI
SO
Figure 6.4 SPI ROM Connection
3. 3V
10K
SCL
3. 3V
I2C ROM
USB2660/60i
10K
SDA
Figure 6.5 I2C Connection
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Chapter 7 Pin Reset States
Hardware
Firmware
Initialization
Operational
Voltage
Signal
(v)
RESET
RESET
VDD33
Time
(t)
VSS
Figure 7.1 Pin Reset States
Table 7.1 Legend for Pin Reset States Table
SYMBOL DESCRIPTION
0
Output driven low
1
Output driven high
IP
Input enabled
PU
PD
none
--
Hardware enables pull-up
Hardware enables pull-down
Hardware disables pad
Hardware disables function
Z
Hardware disables pad. Both output
driver and input buffers are disabled.
7.1
Pin Reset States
Table 7.2 USB2660/USB2660i Reset States Table
RESET STATE
INPUT/
OUTPUT
PU/
PD
PIN
PIN NAME
FUNCTION
1
USBDN_DM2
USBDN_DP2
USBDN_DM3
USBDN_DP3
PRTCTL2
USBDN_DM2
USBDN_DP2
USBDN_DM3
USBDN_DP3
PRTCTL
IP
IP
IP
IP
0
PD
PD
PD
PD
--
2
3
4
6
7
PRTCTL3
PRTCTL
0
--
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Table 7.2 USB2660/USB2660i Reset States Table
RESET STATE
INPUT/
OUTPUT
PU/
PD
PIN
PIN NAME
FUNCTION
8
SD2_nCD / GPIO16
SD2_D1 / GPIO19
GPIO
SD2_D1
SD2_D0
SD2_D7
SD2_D6
SD2_CLK
GPIO
IP
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
0
PU
--
9
10
11
12
13
15
16
17
18
19
20
21
22
25
26
27
28
29
30
31
32
34
35
36
37
38
39
SD2_D0 / GPIO18
--
SD2_D7 / GPIO25
--
SD2_D6 / GPIO24
--
SD2_CLK / GPIO26
GPIO8 (CRD_PWR2)
SD2_D5 / GPIO23
--
--
SD2_D5
SD2_CMD
SD2_D4
SD2_D3
SD2_D2
GPIO
--
SD2_CMD / GPIO27
SD2_D4 / GPIO22
--
--
SD2_D3 / GPIO21
--
SD2_D2 / GPIO20
--
GPIO6 / SD1_WP / MS_SCLK / xD_D4
GPIO15 / SD1_nCD
SD1_D1 / MS_D5 / xD_D3
SD1_D0 / MS_D4 / xD_D2
SD1_D7 / MS_D6 / xD_D1
SD1_D6 / MS_D7 / xD_D0
SD1_CLK / MS_BS / xD_nWP
xD_nWE
--
GPIO
PU
--
IP
Z
none
none
Z
--
none
--
Z
Z
none
--
none
Z
Z
Z
Z
Z
Z
Z
--
xD_nWE
none
--
SD1_D5 / MS_D1 / xD_ALE
SD1_CMD / MS_D0 / xD_CLE
xD_nCE
--
none
--
xD_nCE
xD_nRE
xD_nB/R
GPIO
--
xD_nRE
--
xD_nB/R
--
GPIO14 / xD_nCD
PU
--
IP
Z
SD1_D4 / MS_D2 / xD_D7
GPIO12 / MS_INS
none
GPIO
IP
PU
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Table 7.2 USB2660/USB2660i Reset States Table
RESET STATE
INPUT/
OUTPUT
PU/
PD
PIN
PIN NAME
FUNCTION
40
SD1_D3 / MS_D3 / xD_D6
SD1_D2 / xD_D5
GPIO10 (CRD_PWR1)
GPIO2 / RXD
none
none
--
--
Z
Z
41
43
44
45
49
50
51
52
53
54
55
56
58
59
GPIO
Z
--
GPIO
0
0
--
--
SD2_WP / GPIO17
SPI_CE_n
GPIO
SPI_CE_n
GPIO
1
0
--
--
SPI_CLK / GPIO4 / SCL
SPI_DO / GPIO5 / SDA / SPI_SPD_SEL
SPI_DI
GPIO
0
--
SPI_DI
GPIO
IP
PD
GPIO1 / LED / TXD
nRESET
0
--
--
nRESET
VBUS_DET
TEST
IP
VBUS_DET
IP
IP
--
TEST
PD
USBUP_DP
USBUP_DP
USBUP_DM
Z
Z
--
--
USBUP_DM
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Chapter 8 Configuration Options
8.1
Hub
SMSC’s USB 2.0 hub is fully compliant to the Universal Serial Bus Specification available from the
USB Implementer’s Forum found at http://www.usb.org (Revision 2.0 April 27, 2000 and the 12/7/2000
and 5/28/2002 Errata). Please reference Chapter 11 (Hub Specification) for general details regarding
hub operation and functionality.
For performance reasons, the hub provides 1 transaction translator (TT) that is shared by both
downstream ports defined as a single-TT configuration. The TT contains 4 non-periodic buffers.
8.1.1
Hub Configuration Options
The SMSC hub supports a large number of features (some are mutually exclusive), and must be
configured in order to correctly function when attached to a USB host controller. There are two principal
ways to configure the hub:
via the internal default settings or
by settings stored in an external EEPROM or SPI Flash device.
8.1.1.1
Power Switching Polarity
The hub will only support active high power controllers.
8.1.2
VBus Detect
According to Section 7.2.1 of the USB 2.0 Specification, a device cannot provide power to its D+ or
D- pull-up resistors unless the upstream port’s VBUS is in the asserted (powered) state. The
VBUS_DET pin on the hub monitors the state of the upstream VBUS signal and will not pull-up the
D+ resistor if VBUS is not active. If VBUS goes from an active to an inactive state (not powered), the
hub will remove power from the D+ pull-up resistor within 10 seconds.
8.2
Card Reader
The SMSC USB2660/USB2660i is fully compliant with the following flash media card reader
specifications:
Secure Digital 2.0 / MultiMediaCard 4.2
-SD 2.0, HS-SD, HC-SD
-TransFlash™ and reduced form factor media
-1/4/8 bit MMC 4.2
Memory Stick 1.43
Memory Stick Pro Format 1.02
Memory Stick Pro-HG Duo Format 1.01
-Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
Memory Stick Duo 1.10
xD-Picture Card 1.2
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8.3
System Configurations
8.3.1
EEPROM/SPI Interface
The USB2660/USB2660i can be configured via a 2-wire (I2C) EEPROM (512x8) or an external SPI
flash device containing the firmware for the USB2660/USB2660i. If an external configuration device
does not exist the internal default values will be used. If one of the external devices is used for
configuration, the OEM can update the values through the USB interface. The hub will then “attach”
to the upstream USB host.
The USBDM tool set is available in the USB264x Hub Card reader combo software release package.
To download the software package from SMSC's website, please visit:
https://www2.smsc.com/mkt/CW_SFT_PUB.nsf/Agreements/OBJ+Hub+Card+Reader
to go to the OBJ Hub Card Reader Software Download Agreement. Review the license, and if you
agree, check the "I agree" box and then select “Confirm”. You will then be able to download USB264x
Hub Card reader combo release package zip file containing the USBDM tool set.
Please note that the following applies to the system values and descriptions when used:
N/A = Not applicable to this part
Reserved = For internal use
8.3.2
EEPROM Data Descriptor
Table 8.1 Internal Flash Media Controller Configurations
ADDRESS
REGISTER NAME
DESCRIPTION
INTERNAL DEFAULT VALUE
00h
01h
USB_SER_LEN
USB Serial String
Descriptor Length
1Ah
USB_SER_TYP
USB_SER_NUM
USB Serial String
Descriptor Type
03h
02h-19h
USB Serial Number
"000008264001"
(See Note 8.1)
1Ah-1Bh
1Ch-1Dh
1Eh
USB_VID
USB_PID
USB Vendor Identifier
USB Product Identifier
0424
4040
04h
USB_LANG_LEN
USB Language String
Descriptor Length
1Fh
20h
USB_LANG_TYP
USB_LANG_ID_LSB
USB_LANG_ID_MSB
USB_MFR_STR_LEN
USB_MFR_STR_TYP
USB_MFR_STR
USB Language String
Descriptor Type
03h
USB Language Identifier
Least Significant Byte
09h
(See Note 8.3)
21h
USB Language Identifier
Most Significant Byte
04h
(See Note 8.3)
22h
USB Manufacturer String
Descriptor Length
10h
03h
23h
USB Manufacturer String
Descriptor Type
24h-31h
USB Manufacturer String
“Generic”
(See Note 8.1)
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Table 8.1 Internal Flash Media Controller Configurations (continued)
ADDRESS
REGISTER NAME
DESCRIPTION
INTERNAL DEFAULT VALUE
32h-5Dh
5Eh
Reserved
-
00h
30h
USB_PRD_STR_LEN
USB Product String
Descriptor Length
5Fh
USB_PRD_STR_TYP
USB_PRD_STR
USB Product String
Descriptor Type
03h
60h-99h
USB Product String
"Ultra Fast Media Reader"
(See Note 8.1)
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
USB_BM_ATT
USB_MAX_PWR
ATT_LB
USB BmAttribute
USB Max Power
Attribute Lo byte
Attribute Hi Lo byte
Attribute Lo Hi byte
Attribute Hi byte
80h
30h (96 mA)
40h (Reverse SD_WP only)
ATT_HLB
80h (Reverse SD2_WP only)
ATT_LHB
00h
00h
00h
ATT_HB
MS_PWR_LB
Memory Stick Device
Power Lo byte
A1h
MS_PWR_HB
Memory Stick Device
Power Hi byte
0Ah
00h
A2h-A3h
A4h
Not Applicable
SM_PWR_LB
-
Smart Media Device
Power Lo byte
00h
(See Note 8.2)
A5h
A6h
A7h
SM_PWR_HB
SD_PWR_LB
SD_PWR_HB
Smart Media Device
Power Hi byte
0Ah
(See Note 8.2)
Secure Digital Device
Power Lo byte
00h
0Ah
Secure Digital Device
Power Hi byte
A8h
LED_BLK_INT
LED_BLK_DUR
DEV0_ID_STR
DEV1_ID_STR
DEV2_ID_STR
LED Blink Interval
02h
28h
A9h
LED Blink After Access
Device 0 Identifier String
Device 1 Identifier String
Device 2 Identifier String
AAh - B0h
B1h - B7h
B8h - BEh
N/A
“MS”
“SM”
(See Note 8.2)
BFh - C5h
C6h - CDh
CEh - D2h
D3h
DEV3_ID_STR
INQ_VEN_STR
INQ_PRD_STR
DYN_NUM_LUN
DEV_LUN_MAP
Reserved
Device 3 Identifier String
Inquiry Vendor String
Inquiry Product String
Dynamic Number of LUNs
Device to LUN Mapping
-
“SD/MMC”
“Generic”
82660
01h
D4h - D7h
D8h - DAh
FFh, 00h, 00h, 00h
00h, 06h, 0Dh
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Table 8.1 Internal Flash Media Controller Configurations (continued)
ADDRESS
REGISTER NAME
DESCRIPTION
INTERNAL DEFAULT VALUE
DBh - DDh
Reserved
-
59h, 56h, 97h
Table 8.2 Hub Controller Configurations
ADDRESS
REGISTER NAME
DESCRIPTION
INTERNAL DEFAULT VALUE
DEh
DFh
E0h
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
EBh
ECh
EDh
EEh
EFh
F0h
F1h
F2h
F3h
VID_LSB
VID_MSB
Vendor ID Least Significant Byte
Vendor ID Most Significant Byte
Product ID Least Significant Byte
Product ID Most Significant Byte
Device ID Least Significant Byte
Device ID Most Significant Byte
Configuration Data Byte 1
Configuration Data Byte 2
Configuration Data Byte 3
Non-Removable Devices
Port Disable (Self)
24h
04h
60h
26h
A1h
08h
8Bh
28h
00h
02h
00h
00h
01h
32h
01h
32h
32h
00h
00h
00h
00h
00h
PID_LSB
PID_MSB
DID_LSB
DID_MSB
CFG_DAT_BYT1
CFG_DAT_BYT2
CFG_DAT_BYT3
NR_DEVICE
PORT_DIS_SP
PORT_DIS_BP
MAX_PWR_SP
MAX_PWR_BP
HC_MAX_C_SP
HC_MAX_C_BP
PWR_ON_TIME
BOOST_UP
BOOST_3:0
PRT_SWP
Port Disable (Bus)
Max Power (Self)
Max Power (Bus)
Hub Controller Max Current (Self)
Hub Controller Max Current (Bus)
Power-on Time
Boost_Up
Boost_3:0
Port Swap
PRTM12
Port Map 12
PRTM3
Port Map 3
Table 8.3 Other Internal Configurations
DESCRIPTION
ADDRESS
REGISTER NAME
INTERNAL DEFAULT VALUE
F4h
F5h
F6h
F7h
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
00h
66h
00h
00h
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Table 8.3 Other Internal Configurations (continued)
ADDRESS
REGISTER NAME
DESCRIPTION
INTERNAL DEFAULT VALUE
F8h-FAh
FBh
Reserved
Reserved
59h, 56h, 97h
00h
Not Applicable
NVSTORE_SIG
-
FCh-FFh
Non-Volatile Storage Signature
“ATA2”
8.4
Set bit 7 of bmAttribute to enable the registers in Table 8.4.
Table 8.4 Internal Flash Media Controller Extended Configurations
ADDRESS
REGISTER NAME
DESCRIPTION
INTERNAL DEFAULT VALUE
100h - 106h
107h - 10Dh
10Eh - 114h
115h - 11Bh
11Ch - 122h
123h - 129h
12Ah-145h
CLUN0_ID_STR
CLUN1_ID_STR
CLUN2_ID_STR
CLUN3_ID_STR
CLUN4_ID_STR
DEV4_ID_STR
Not applicable
Combo LUN 0 Identifier String
Combo LUN 1 Identifier String
Combo LUN 2 Identifier String
Combo LUN 3 Identifier String
Combo LUN 4 Identifier String
Device 4 Identifier String
-
“COMBO”
“COMBO”
“COMBO”
“COMBO”
“COMBO”
"SD/MMC2"
00h
DYN_NUM_
EXT_LUN
Dynamic Number of Extended
LUNs
146h
01h
147h - 14Bh
14Ch
DEV_LUN_MAP
SD2_PWR_LB
Device to LUN Mapping
01h, FFh, FFh, FFh, FFh
0Ah
Second Secure Digital
Power Lo byte
14Dh
SD2_PWR_HB
Second Secure Digital
Power Hi byte
00h
14Eh-17Bh
17Ch-17Fh
Not Applicable
-
00h
NVSTORE_SIG2
Non-Volatile Storage Signature
“ecf1”
Note 8.1 This value is a UNICODE UTF-16LE encoded string value that meets the USB 2.0
specification (Revision 2.0, 2000). Values in double quotations without this note are ASCII
values.
Note 8.2 A value of “SM” will be overridden with “xD” once an xD-Picture Card has been identified.
Note 8.3 For a list of the most current 16-bit language ID’s defined by the USB-IF, please visit
http://www.unicode.org or consult The Unicode Standard, Worldwide Character Encoding,
(Version 4.0), The Unicode Consortium, Addison-Wesley Publishing Company, Reading,
Massachusetts.
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8.4.1
EEPROM Data Descriptor Register Descriptions
8.4.1.1
00h: USB Serial String Descriptor Length
NAME
BYTE
DESCRIPTION
0
USB_SER_LEN
USB serial string descriptor length as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes).
8.4.1.2
01h: USB Serial String Descriptor Type
NAME
BYTE
DESCRIPTION
1
USB_SER_TYP
USB serial string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string
descriptor type.
8.4.1.3
02h-19h: USB Serial Number Option
NAME
BYTE
DESCRIPTION
25:2
USB_SER_NUM
Maximum string length is 12 hex digits. Must be unique to each device.
8.4.1.4
1Ah-1Bh: USB Vendor ID Option
NAME
BYTE
DESCRIPTION
1:0
USB_VID
This ID is unique for every vendor. The vendor ID is assigned by the USB
Implementer’s Forum.
8.4.1.5
1Ch-1Dh: USB Product ID Option
NAME
BYTE
DESCRIPTION
1:0
USB_PID
This ID is unique for every product. The product ID is assigned by the vendor.
8.4.1.6
1Eh: USB Language Identifier Descriptor Length
BYTE
NAME
DESCRIPTION
0
USB_LANG_LEN
USB language ID string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
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8.4.1.7
1Fh: USB Language Identifier Descriptor Type
NAME
BYTE
DESCRIPTION
1
USB_LANG_TYP
USB language ID string descriptor type as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string
descriptor type.
8.4.1.8
20h: USB Language Identifier Least Significant Byte
BYTE
NAME
DESCRIPTION
2
USB_LANG_ID
_LSB
English language code = ‘0409’. See Note 8.3 to reference additional
language ID’s defined by the USB-IF.
8.4.1.9
21h: USB Language Identifier Most Significant Byte
BYTE
NAME
DESCRIPTION
3
USB_LANG_ID
_MSB
English language code = ‘0409’. See Note 8.3 to reference additional
language ID’s defined by the USB-IF.
8.4.1.10
22h: USB Manufacturer String Descriptor Length
BYTE
NAME
DESCRIPTION
0
USB_MFR_STR
_LEN
USB manufacturer string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
8.4.1.11
23h: USB Manufacturer String Descriptor Type
BYTE
NAME
DESCRIPTION
1
USB_MFR_STR
_TYP
USB manufacturer string descriptor type as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string
descriptor type.
8.4.1.12
24h-31h: USB Manufacturer String Option
NAME
BYTE
DESCRIPTION
15:2
USB_MFR_STR
The maximum string length is 28 characters.
8.4.1.13
32h-5Dh: Reserved
BYTE
NAME
DESCRIPTION
59:16
Reserved
Reserved.
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8.4.1.14
5Eh: USB Product String Descriptor Length
BYTE
NAME
DESCRIPTION
0
USB_PRD_STR
_LEN
USB product string descriptor length as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
8.4.1.15
5Fh: USB Product String Descriptor Type
NAME
BYTE
DESCRIPTION
1
USB_PRD_STR
_TYP
USB product string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string
descriptor type.
8.4.1.16
60h-99h: USB Product String Option
NAME
BYTE
DESCRIPTION
59:2
USB_PRD_STR
This string will be used during the USB enumeration process in the
Windows® operating system. Maximum string length is 28 characters.
8.4.1.17
9Ah: USB BmAttribute (1 byte)
NAME
BIT
DESCRIPTION
7:0
USB_BM_ATT
Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA of upstream bus
power) or bus-powered (limited to a 100 mA maximum of upstream power
prior to being configured by the host controller).
When configured as a bus-powered device, the SMSC hub consumes less
than 100 mA of current prior to being configured. After configuration, the bus-
powered SMSC hub (along with all associated hub circuitry, any embedded
devices if part of a compound device, and 100 mA per externally available
downstream port) must consume no more than 500 mA of upstream VBUS
current. The current consumption is system dependent, and the OEM must
ensure that the USB 2.0 Specification is not violated.
When configured as a self-powered device, <1 mA of upstream VBUS
current is consumed and all ports are available, with each port being capable
of sourcing 500 mA of current.
80 = Bus-powered operation (default)
C0 = Self-powered operation
A0 = Bus-powered operation with remote wake-up
E0 = Self-powered operation with remote wake-up
8.4.1.18
9Bh: USB MaxPower (1 byte)
NAME
BIT
DESCRIPTION
7:0
USB_MAX_PWR
USB Max Power per the USB 2.0 Specification. Do NOT set this value
greater than 100 mA.
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8.4.1.19
9Ch-9Fh: Attribute Byte Descriptions
BYTE
BYTE
NAME
BIT
DESCRIPTION
0
ATT_LB
3:0
4
Always reads ‘0’.
Inquire Manufacturer and Product ID Strings
‘1’ - Use the Inquiry Manufacturer and Product ID Strings.
‘0’ (default) - Use the USB Descriptor Manufacturer and Product ID Strings.
Always reads ‘0’.
5
6
Reverse SD Card Write Protect Sense
‘1’ (default) - SD cards will be write protected when SW_nWP is high, and
writable when SW_nWP is low.
‘0’ - SD cards will be write protected when SW_nWP is low, and writable
when SW_nWP is high.
7
Extended Configuration Enable
'1' - This bit must be set to '1' to enable editing, updating, and reading from
registers 100h-17Fh.
'0' - The internal configuration is loaded. When this bit is not set (and it
equals '0'). It will not read from registers 100h-17Fh.
1
ATT_HLB
3:0
4
Always reads ‘0’.
Activity LED True Polarity
‘1’ - Activity LED to Low True.
‘0’ (default) - Activity LED polarity to High True.
Common Media Insert / Media Activity LED
5
‘1’ - The activity LED will function as a common media inserted/media
access LED.
‘0’ (default) - The activity LED will remain in its idle state until media is
accessed.
6
7
Always reads ‘0’.
Reverse SD2 Card Write Protect Sense
‘1’ (default) - SD cards in LUN 1 will be write protected when SW_nWP is
high, and writable when SW_nWP is low.
‘0’ - SD cards in LUN 1 will be write protected when SW_nWP is low, and
writable when SW_nWP is high.
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BYTE
NAME
BYTE
BIT
DESCRIPTION
2
ATT_LHB
0
Attach on Card Insert / Detach on Card Removal
‘1’ - Attach on Insert is enabled.
‘0’ (default) - Attach on Insert is disabled.
Always reads ‘0’.
1
2
Enable Device Power Configuration
‘1’ - Custom Device Power Configuration stored in the NVSTORE is used.
‘0’ (default) - Default Device Power Configuration is used.
Always reads ‘0’.
7:3
6:0
7
3
ATT_HB
Always reads ‘0’.
xD Player Mode
8.4.2
A0h-A7h: Device Power Configuration
The USB2660/USB2660i has two internal FETs which can be utilized for card power. For information
about the other internal FET, please see Section 8.4.5.10, "14Ch-14Dh: Second Secure Digital Device
Power Configuration," on page 52. This section describes the default internal configuration. The
settings are stored in NVSTORE and provide the following features:
1. A card can be powered by an external FET or by an internal FET.
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or
external card power FET options. For internal FET card power control, bits 0 through 2 are used to
set the power limit. The “Device Power Configuration” bits are ignored unless the “Enable Device
Power Configuration” bit is set. See Section 8.4.1.19, "9Ch-9Fh: Attribute Byte Descriptions," on
page 37.
8.4.2.1
FET
A0h-A1h: Memory Stick Device Power Configuration
TYPE
BITS
BIT TYPE
Low Nibble
DESCRIPTION
0
1
2
FET Lo Byte
MS_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
Low Nibble
0001b External FET enabled
MS_PWR_HB
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
8.4.2.2
A2h-A3h: Not Applicable
NAME
BYTE
1:0
DESCRIPTION
Not Applicable
Not applicable.
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8.4.2.3
A4h-A5h: Smart Media Device Power Configuration
FET
TYPE
BITS
BIT TYPE
Low Nibble
DESCRIPTION
0
1
2
FET Lo Byte
SM_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
SM_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
8.4.2.4
A6h-A7h: Secure Digital Device Power Configuration
FET
TYPE
BITS
BIT TYPE
Low Nibble
DESCRIPTION
0
1
2
FET Lo Byte
SD_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
SD_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
8.4.2.5
A8h: LED Blink Interval
NAME
BYTE
DESCRIPTION
0
LED_BLK_INT
The blink rate is programmable in 50 ms intervals. The high bit (7) indicates
an idle state:
‘0’ - Off
‘1’ - On
The remaining bits (6:0) are used to determine the blink interval up to a max
of 128 x 50 ms.
8.4.2.6
A9h: LED Blink Duration
NAME
BYTE
DESCRIPTION
1
LED_BLK_DUR
LED Blink After Access. This byte is used to designate the number of
seconds that the GPIO1 LED will continue to blink after a drive access.
Setting this byte to "05" will cause the GPIO 1 LED to blink for 5 seconds
after a drive access.
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8.4.3
Device ID Strings
These bytes are used to specify the LUN descriptor returned by the device. These bytes are used in
combination with the device to LUN mapping bytes in applications where the OEM wishes to reorder
and rename the LUNs. If multiple devices are mapped to the same LUN (a COMBO LUN), then the
CLUN#_ID_STR will be used to name the COMBO LUN instead of the individual device strings. When
applicable, the "SM" value will be overridden with xD once an xD-Picture Card has been identified.
8.4.3.1
AAh-B0h: Device 0 Identifier String
BYTE
NAME
DESCRIPTION
6:0
DEV0_ID_STR
Not applicable.
8.4.3.2
B1h-B7h: Device 1 Identifier String
NAME
BYTE
DESCRIPTION
6:0
DEV1_ID_STR
This ID string is associated with the Memory Stick device.
8.4.3.3
B8h-BEh: Device 2 Identifier String
NAME
BYTE
DESCRIPTION
6:0
DEV2_ID_STR
This ID string is associated with the Smart Media (Note 8.2) device.
8.4.3.4
BFh-C5h: Device 3 Identifier String
NAME
BYTE
DESCRIPTION
6:0
DEV3_ID_STR
This ID string is associated with the Secure Digital / MultiMediaCard device.
8.4.3.5
C6h-CDh: Inquiry Vendor String
NAME
BYTE
DESCRIPTION
7:0
INQ_VEN_STR
If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
8.4.3.6
CEh-D2h: Inquiry Product String
NAME
BYTE
DESCRIPTION
4:0
INQ_PRD_STR
If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
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8.4.3.7
D3h: Dynamic Number of LUNs
NAME
BIT
DESCRIPTION
7:0
DYN_NUM_LUN
These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device
utilizes a combo socket and the OEM wishes to have only a single icon
displayed for one or more interfaces.
If this field is set to "FF", the program assumes that you are using the default
value and icons will be configured per the default configuration.
8.4.3.8
D4h-D7h: Device to LUN Mapping
NAME
BYTE
DESCRIPTION
3:0
DEV_LUN_MAP
These registers map a device controller (SD/MMC, SM (Note 8.2), and MS)
to a Logical Unit Number (LUN). The device reports the mapped LUNs to
the USB host in the USB descriptor during enumeration. The icon installer
associates custom icons with the LUNs specified in these fields.
Setting a register to "FF" indicates that the device is not mapped. Setting all
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the
default mapping configuration. Not all configurations are valid. Valid
configurations depend on the hardware, packaging, and OEM board layout.
The number of unique LUNs mapped must match the value in the Section
8.4.3.7, "D3h: Dynamic Number of LUNs," on page 41.
8.4.3.9
D8h-DDh: Reserved
BYTE
NAME
DESCRIPTION
2:0
Reserved
Reserved.
8.4.4
Hub Controller Configurations
8.4.4.1
DEh: Vendor ID (LSB)
BIT
BYTE NAME
DESCRIPTION
7:0
VID_LSB
Least Significant Byte of the Vendor ID. This is a 16-bit value that uniquely
identifies the vendor of the user device (assigned by USB Implementer’s
Forum).
8.4.4.2
DFh: Vendor ID (MSB)
BYTE NAME
BIT
DESCRIPTION
7:0
VID_MSB
Most Significant Byte of the Vendor ID. This is a 16-bit value that uniquely
identifies the vendor of the user device (assigned by USB Implementer’s
Forum).
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8.4.4.3
E0h: Product ID (LSB)
BIT
NAME
DESCRIPTION
7:0
PID_LSB
Least Significant Byte of the Product ID. This is a 16-bit value that the vendor
can assign that uniquely identifies this particular product.
8.4.4.4
E1h: Product ID (MSB)
NAME
BIT
DESCRIPTION
7:0
PID_MSB
Most Significant Byte of the Product ID. This is a 16-bit value that the vendor
can assign that uniquely identifies this particular product.
8.4.4.5
E2h: Device ID (LSB)
BIT
NAME
DESCRIPTION
7:0
DID_LSB
Least Significant Byte of the Device ID. This is a 16-bit device release
number in BCD (binary coded decimal) format.
8.4.4.6
E3h: Device ID (MSB)
BIT
NAME
DESCRIPTION
7:0
DID_MSB
Most Significant Byte of the Device ID. This is a 16-bit device release
number in BCD format.
8.4.4.7
E4h: Configuration Data Byte 1 (CFG_DAT_BYT1)
BIT
NAME
DESCRIPTION
7
SELF_BUS_PWR
Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA of upstream bus
power) or bus-powered (limited to a 100 mA maximum of upstream power
prior to being configured by the host controller).
When configured as a bus-powered device, the SMSC hub consumes less
than 100 mA of current prior to being configured. After configuration, the bus-
powered SMSC hub (along with all associated hub circuitry, any embedded
devices if part of a compound device, and 100 mA per externally available
downstream port) must consume no more than 500 mA of upstream VBUS
current. The current consumption is system dependent, and the OEM must
ensure that the USB 2.0 specifications are not violated.
When configured as a self-powered device, <1 mA of upstream VBUS
current is consumed and all ports are available, with each port being capable
of sourcing 500 mA of current.
‘0’ = Bus-powered operation
‘1’ = Self-powered operation
6
5
Reserved
Reserved
HS_DISABLE
Hi-Speed Disable: Disables the capability to attach as either a Hi-/Full-Speed
device, and forces attachment as Full-Speed only (i.e. no Hi-Speed support).
‘0’ = Hi-/Full-Speed
‘1’ = Full-Speed-Only (Hi-Speed disabled!)
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BIT
NAME
DESCRIPTION
4
3
Reserved
Reserved
EOP_DISABLE
EOP Disable: Disables EOP generation of EOF1 when in Full-Speed mode.
During FS operation only, this permits the hub to send EOP if no
downstream traffic is detected at EOF1. See Section 11.3.1 of the USB 2.0
Specification for additional details.
‘0’ = An EOP is generated at the EOF1 point if no traffic is detected.
‘1’ = EOP generation at EOF1 is disabled (normal USB operation).
Note:
Generation of an EOP at the EOF1 point may prevent a host
controller (operating in FS mode) from placing the USB bus in
suspend.
2:1
CURRENT_SNS
Over-Current Sense: Selects current sensing on a port-by-port basis, all
ports ganged, or none (only for bus-powered hubs). The ability to support
current sensing on a per port or ganged basis is dependent upon the
hardware implementation.
‘00’ = Ganged sensing (all ports together)
‘01’ = Individual (port-by-port)
‘1x’ = Over-current sensing not supported (must only be used with bus-
powered configurations!)
0
PORT_PWR
Port Power Switching: Enables power switching on all ports simultaneously
(ganged), or port power is individually switched on and off on a port-by-port
basis (individual). The ability to support power enabling on a port or ganged
basis is dependent upon the hardware implementation.
‘0’ = Ganged switching (all ports together)
‘1’ = Individual port-by-port switching
8.4.4.8
BIT
E5h: Configuration Data Byte 2 (CFG_DAT_BYT2)
NAME
DESCRIPTION
7:6
5:4
Reserved
Reserved
OC_TIMER
OverCurrent Timer: Over-current timer delay.
‘00’ = 50 ns
‘01’ = 100 ns
‘10’ = 200 ns
‘11’ = 400 ns
3
COMPOUND
Compound Device: Allows OEM to indicate that the hub is part of a
compound device (per the USB 2.0 Specification). The applicable port(s)
must also be defined as having a “non-removable device”.
Note:
When configured via strapping options, declaring a port as non-
removable automatically causes the hub controller to report that it
is part of a compound device.
‘0’ = No
‘1’ = Yes, the hub is part of a compound device
2:0
Reserved
Reserved
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8.4.4.9
BIT
E6h: Configuration Data Byte 3 (CFG_DAT_BYT3)
NAME
DESCRIPTION
7:4
3
Reserved
Reserved
PRTMAP_EN
Port Mapping Enable: Selects the method used by the hub to assign port
numbers and disable ports.
‘0’ = Standard Mode. Strap options or the following registers are used to
define which ports are enabled, and the ports are mapped as port ‘n’ on the
hub is reported as port ‘n’ to the host, unless one of the ports is disabled,
then the higher numbered ports are remapped in order to report contiguous
port numbers to the host.
Register 300Ah: Port disable for self-powered operation (Reset = 0x00).
Register 300Bh: Port disable for bus-powered operation (Reset = 0x00).
‘1’ = Port Map mode. The mode enables remapping via the registers defined
below.
Register 30FBh: Port Map 12 (Reset = 0x00)
Register 30FCh: Port Map 3 (Reset = 0x00)
2:0
Reserved
Reserved
8.4.4.10
E7h: Non-Removable Device
BYTE NAME
BIT
DESCRIPTION
7:0
NR_DEVICE
Indicates which port(s) include non-removable devices.
‘0’ = Port is removable
‘1’ = Port is non-removable
Informs the host if one of the active ports has a permanent device that is
undetachable from the hub. The device must provide its own descriptor data.
When using the internal default option, the NON_REM[1:0] pins will
designate the appropriate ports as being non-removable.
Bit 7= Reserved
Bit 6= Reserved
Bit 5= Reserved
Bit 4= Reserved
Bit 3= Controls physical port 3
Bit 2= Controls physical port 2
Bit 1= Controls physical port 1
Bit 0= Reserved
Note:
Bit 1 must be set to a ‘1’ by the firmware for proper identification of
the card reader as a non-removable device.
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8.4.4.11
E8h: Port Disable For Self-Powered Operation
BYTE NAME
BIT
DESCRIPTION
7:0
PORT_DIS_SP
Disables 1 or more ports.
‘0’ = Port is available
‘1’ = Port is disabled
During self-powered operation this register selects the ports which will be
permanently disabled. The ports are unavailable to be enabled or
enumerated by a host controller. The ports can be disabled in any order
since the internal logic will automatically report the correct number of
enabled ports to the USB host and will reorder the active ports in order to
ensure proper function.
Bit 7= Reserved
Bit 6= Reserved
Bit 5= Reserved
Bit 4= Reserved
Bit 3= Controls physical port 3
Bit 2= Controls physical port 2
Bit 1= Controls physical port 1
Bit 0= Reserved
8.4.4.12
E9h: Port Disable For Bus-Powered Operation
BYTE NAME
BIT
DESCRIPTION
7:0
PORT_DIS_BP
Disables 1 or more ports.
‘0’ = Port is available
‘1’ = Port is disabled
During self-powered operation, this register selects the ports which will be
permanently disabled. The ports are unavailable to be enabled or
enumerated by a host controller. The ports can be disabled in any order, the
internal logic will automatically report the correct number of enabled ports to
the USB host and will reorder the active ports in order to ensure proper
function.
When using the internal default option, the PRT_DIS[1:0] pins will disable the
appropriate ports.
Bit 7= Reserved
Bit 6= Reserved
Bit 5= Reserved
Bit 4= Reserved
Bit 3= Controls physical port 3
Bit 2= Controls physical port 2
Bit 1= Controls physical port 1
Bit 0 is Reserved
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8.4.4.13
EAh: Max Power For Self-Powered Operation
BIT
BYTE NAME
DESCRIPTION
7:0
MAX_PWR_SP
Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a self-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value also includes the power
consumption of a permanently attached peripheral if the hub is configured
as a compound device, and the embedded peripheral reports 0 mA in its
descriptors.
Note:
The USB 2.0 Specification does not permit this value to exceed 100
mA.
8.4.4.14
EBh: Max Power For Bus-Powered Operation
BYTE NAME
BIT
DESCRIPTION
7:0
MAX_PWR_BP
Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a bus-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value also includes the power
consumption of a permanently attached peripheral if the hub is configured
as a compound device, and the embedded peripheral reports 0 mA in its
descriptors.
8.4.4.15
ECh: Hub Controller Max Current For Self-Powered Operation
BIT
BYTE NAME
DESCRIPTION
7:0
HC_MAX_C_SP
Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a self-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value does NOT include the power
consumption of a permanently attached peripheral if the hub is configured
as a compound device.
Note:
The USB 2.0 Specification does not permit this value to exceed 100
mA.
A value of 50 (decimal) indicates 100 mA, which is the default value.
8.4.4.16
EDh: Hub Controller Max Current For Bus-Powered Operation
BIT
BYTE NAME
DESCRIPTION
7:0
HC_MAX_C_BP
Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a bus-powered hub. This value will include the
hub silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value will NOT include the power
consumption of a permanently attached peripheral if the hub is configured
as a compound device.
A value of 50 (decimal) would indicate 100 mA, which is the default value.
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8.4.4.17
EEh: Power-On Time
BIT
BYTE NAME
DESCRIPTION
7:0
PWR_ON_TIME
The length of time that it takes (in 2 ms intervals) from the time the host
initiated power-on sequence begins on a port until power is adequate on that
port. If the host requests the power-on time, the system software uses this
value to determine how long to wait before accessing a powered-on port.
8.4.4.18
BIT
EFh: Boost_Up
NAME
DESCRIPTION
7:2
1:0
Reserved
Reserved
BOOST_IOUT
USB electrical signaling drive strength boost bit for the upstream port ‘A’.
‘00’ = Normal electrical drive strength = No boost
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)
Note:
“Boost” could result in non-USB compliant parameters. OEM
should use a ‘00’ value unless specific implementation issues
require additional signal boosting to correct for degraded USB
signaling levels.
8.4.4.19
BIT
F0h: Boost_3:0
NAME
DESCRIPTION
7:6
5:4
Reserved
Reserved
BOOST_IOUT_3
Upstream USB electrical signaling drive strength boost bit for downstream
port ‘3’.
‘00’ = Normal electrical drive strength = No boost
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)
3:2
BOOST_IOUT_2
Upstream USB electrical signaling drive strength boost bit for downstream
port ‘2’.
‘00’ = Normal electrical drive strength = No boost
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)
Note:
“Boost” could result in non-USB Compliant parameters. OEM
should use a ‘00’ value unless specific implementation issues
require additional signal boosting to correct for degraded USB
signaling levels.
1:0
Reserved
Always reads ‘0’.
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8.4.4.20
F1h: Port Swap
BIT
BYTE NAME
DESCRIPTION
7:0
PRT_SWP
Swaps the upstream and downstream USB DP and DM pins for ease of
board routing to devices and connectors.
‘0’ = USB D+ functionality is associated with the DP pin and D- functionality
is associated with the DM pin.
‘1’ = USB D+ functionality is associated with the DM pin and D- functionality
is associated with the DP pin.
Bit 7= Reserved
Bit 6= Reserved
Bit 5= Reserved
Bit 4= Reserved
Bit 3= Controls physical port 3
Bit 2= Controls physical port 2
Bit 1= Reserved
Bit 0= Controls physical port 0
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8.4.4.21
F2h: Port Map 12
BIT
BYTE NAME
DESCRIPTION
PortMap register for ports 1 & 2
7:0
PRTM12
When a hub is enumerated by a USB host controller, the hub is only
permitted to report how many ports it has; the hub is not permitted to select
a numerical range or assignment. The host controller will number the
downstream ports of the hub starting with the number '1', up to the number
of ports that the hub reported having.
The host's port number is referred to as “logical port number” and the
physical port on the hub is the “physical port number”. When remapping
mode is enabled (see PRTMAP_EN in Register 08h: Configuration Data
Byte 3) the hub's downstream port numbers can be remapped to different
logical port numbers (assigned by the host).
Note:
The OEM must ensure that contiguous logical port numbers are
used, starting from number ‘1’ up to the maximum number of
enabled ports; this ensures that the hub's ports are numbered in
accordance with the way a host will communicate with the ports.
Table 8.5 Port Map Register for Ports 1 & 2
Bit [7:4]
‘0000’
‘0001’
‘0010’
‘0011’
Physical port 2 is disabled
Physical port 2 is mapped to Logical port 1
Physical port 2 is mapped to Logical port 2
Physical port 2 is mapped to Logical port 3
Illegal; Do not use
‘0100’
to
‘1111’
Bit [3:0]
‘0000’
‘0001’
‘0010’
‘0011’
Physical port 1 is disabled
Physical port 1 is mapped to Logical port 1
Physical port 1 is mapped to Logical port 2
Physical port 1 is mapped to Logical port 3
Illegal; Do not use
‘0100’
to
‘1111’
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8.4.4.22
F3h: Port Map 3
BIT
BYTE NAME
DESCRIPTION
7:0
PRTM3
PortMap register for port 3.
When a hub is enumerated by a USB host controller, the hub is only
permitted to report how many ports it has; the hub is not permitted to select
a numerical range or assignment. The host controller will number the
downstream ports of the hub starting with the number '1', up to the number
of ports that the hub reported having.
The host's port number is referred to as “logical port number” and the
physical port on the hub is the “physical port number”. When remapping
mode is enabled (see PRTMAP_EN in Register 08h: Configuration Data
Byte 3) the hub's downstream port numbers can be remapped to different
logical port numbers (assigned by the host).
Note:
The OEM must ensure that contiguous logical port numbers are
used, starting from number ‘1’ up to the maximum number of
enabled ports; this ensures that the hub's ports are numbered in
accordance with the way a host will communicate with the ports.
Table 8.6 Port Map Register for Port 3
Bit [7:4]
‘0000’
‘0001’
‘0010’
‘0011’
Reserved
Reserved
Reserved
Reserved
‘0100’
to
Illegal; Do not use
‘1111’
Bit [3:0]
‘0000’
‘0001’
‘0010’
‘0011’
Physical port 3 is disabled
Physical port 3 is mapped to Logical port 1
Physical port 3 is mapped to Logical port 2
Physical port 3 is mapped to Logical port 3
Illegal; Do not use
‘0100’
to
‘1111’
8.4.4.23
F4h-FAh: Reserved
BYTE
BYTE NAME
DESCRIPTION
6:0
Reserved
Reserved.
8.4.4.24
FBh: Not Applicable
BIT
BYTE NAME
DESCRIPTION
7:0
Not Applicable
Not applicable.
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8.4.4.25
FCh-FFh: Non-Volatile Storage Signature
NAME
BYTE
DESCRIPTION
3:0
NVSTORE_SIG
This signature is used to verify the validity of the data in the first 256 bytes of
the configuration area. The signature must be set to ‘ATA2’ for
USB2660/USB2660i.
8.4.5
Internal Flash Media Controller Extended Configurations
Enable Registers 100h - 17Fh by setting bit 7 of bmAttribute.
8.4.5.1
100h-106h: Combo LUN 0 Identifier String
BYTE
NAME
DESCRIPTION
6:0
CLUN0_ID_STR
If the device to LUN mapping bytes have configured this LUN to be a combo
LUN, then these strings will be used to identify the LUN rather than the
device identifier strings.
8.4.5.2
107h-10Dh: Combo LUN 1 Identifier String
NAME
BYTE
DESCRIPTION
6:0
CLUN1_ID_STR
If the device to LUN bytes have configured this LUN to be a combo LUN,
then these strings will be used to identify the LUN rather than the device
identifier strings.
8.4.5.3
10Eh-114h: Combo LUN 2 Identifier String
NAME
BYTE
DESCRIPTION
6:0
CLUN2_ID_STR
If the device to LUN mapping bytes have configured this LUN to be a combo
LUN, then these strings will be used to identify the LUN rather than the
device identifier strings.
8.4.5.4
115h-11Bh: Combo LUN 3 Identifier String
NAME
BYTE
DESCRIPTION
6:0
CLUN3_ID_STR
If the device to LUN mapping bytes have configured this LUN to be a combo
LUN, then these strings will be used to identify the LUN rather than the
device identifier strings.
8.4.5.5
11Ch-122h: Combo LUN 4 Identifier String
NAME
BYTE
DESCRIPTION
6:0
CLUN4_ID_STR
If the device to LUN mapping bytes have configured this LUN to be a combo
LUN, then these strings will be used to identify the LUN rather than the
device identifier strings.
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8.4.5.6
BYTE
123h-129h: Device 4 Identifier String
NAME
DESCRIPTION
6:0
DEV4_ID_STR
This ID string is associated with the second Secure Digital / MultiMediaCard
“SD/MMC2” device.
8.4.5.7
130h-145h: Not Applicable
NAME
BYTE
DESCRIPTION
DESCRIPTION
21:0
Not Applicable
Not applicable.
8.4.5.8
146h: Dynamic Number of Extended LUNs
NAME
BIT
7:0
DYN_NUM_
EXT_LUN
These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device
utilizes a combo socket and the OEM wishes to have only a single icon
displayed for one or more interfaces.
If this field is set to "FF", the program assumes that you are using the default
value and icons will be configured per the default configuration.
8.4.5.9
147h-14Bh: Device to LUN Mapping
NAME
BYTE
DESCRIPTION
4:0
DEV_LUN_MAP
These registers map a device controller (SD/MMC, SM (Note 8.2), and MS)
to a Logical Unit Number (LUN). The device reports the mapped LUNs to
the USB host in the USB descriptor during enumeration. The icon installer
associates custom icons with the LUNs specified in these fields.
Setting a register to "FF" indicates that the device is not mapped. Setting all
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the
default mapping configuration. Not all configurations are valid. Valid
configurations depend on the hardware, packaging, and OEM board layout.
The number of unique LUNs mapped must match the value in the Section
8.4.3.7, "D3h: Dynamic Number of LUNs," on page 41.
8.4.5.10
14Ch-14Dh: Second Secure Digital Device Power Configuration
The device has two internal FETs which can be utilized for card power. For information about the other
internal FET, please see Section 8.4.2.3, "A4h-A5h: Smart Media Device Power Configuration," on
page 39. The settings are stored in NVSTORE. This section describes the default internal
configuration.
1. A card can be powered by an external FET or by an internal FET.
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or
external card power FET options. For internal FET card power control, bits 0 through 2 are used to
set the power limit. The “Device Power Configuration” bits are ignored unless the “Enable Device
Power Configuration” bit is set. See Section 8.4.1.19, "9Ch-9Fh: Attribute Byte Descriptions," on
page 37.
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FET
0
TYPE
BITS
3:0
BIT TYPE
DESCRIPTION
FET Lo Byte
SD2_PWR_LB
Low Nibble
0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
1
2
3
7:4
3:0
7:4
High Nibble
Low Nibble
High Nibble
0000b Disabled
0000b Disabled
0000b Disabled
FET Hi Byte
SD2_PWR_HB
8.4.5.11
14Eh-17Bh: Not Applicable
NAME
BIT
DESCRIPTION
47:0
Not Applicable
Not applicable.
8.4.5.12
17Ch -17Fh: Non-Volatile Storage Signature for Extended Configuration
BYTE
NAME
DESCRIPTION
3:0
NVSTORE_SIG2
This signature is used to verify the validity of the data in the upper 256 bytes
if a 512 byte EEPROM is used, otherwise this bank is a read-only configuration
area. The signature must be set to 'ecf1'.
2
8.4.6
I C EEPROM
The I2C EEPROM interface implements a subset of the I2C Master Specification (Please refer to the
Philips Semiconductor Standard I2C-Bus Specification for details on I2C bus protocols). The device’s
I2C EEPROM interface is designed to attach to a single “dedicated” I2C EEPROM, and it conforms to
the Standard-mode I2C Specification (100 kbps transfer rate and 7-bit addressing) for protocol and
electrical compatibility.
Note: Extensions to the I2C Specification are not supported. The device acts as the master and
generates the serial clock SCL, controls the bus access (determines which device acts as the
transmitter and which device acts as the receiver), and generates the START and STOP
conditions.
8.4.6.1
8.4.6.2
Implementation Characteristics
The device will only access an EEPROM using the sequential read protocol.
Pull-Up Resistor
The circuit board designer is required to place external pull-up resistors (10 kΩ recommended) on the
SPI_DO / GPIO5 / SDA / SPI_SPD_SEL and SPI_CLK / GPIO4 / SCL lines (per SMBus 1.0
Specification and EEPROM manufacturer guidelines) to VDD33 in order to assure proper operation.
8.4.7
In-Circuit EEPROM Programming
The EEPROM can be programmed via automatic test equipment (ATE). Pulling nRESET low tri-states
the device’s EEPROM interface and allows an external source to program the EEPROM.
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8.5
Default Configuration Option
The SMSC device can be configured via its internal default configuration. Please see Section 8.3.2,
"EEPROM Data Descriptor" for specific details on how to enable default configuration. Please refer to
Table 8.1 for the internal default values that are loaded when this option is selected.
8.5.1
External Hardware nRESET
A valid hardware reset is defined as assertion of nRESET for a minimum of 1 μs after all power
supplies are within operating range. While reset is asserted, the device (and its associated external
circuitry) consumes less than 500 μA of current from the upstream USB power source.
Assertion of nRESET (external pin) causes the following:
1. All downstream ports are disabled and PRTCTL power to downstream devices is removed.
2. The PHYs are disabled and the differential pairs will be in a high-impedance state.
3. All transactions immediately terminate; no states are saved.
4. All internal registers return to the default state (in most cases, 00h).
5. The external crystal oscillator is halted.
6. The PLL is halted.
8.5.1.1
nRESET for EEPROM Configuration
Start
completion
request
Hardware
reset
asserted
Device
Recovery/
Stabilization
8051 Sets
Configuration
Registers
Attach
USB
Upstream
USB Reset
recovery
Idle
response
t4
t6
t7
t1
t5
t2
t3
nRESET
VSS
Figure 8.1 nRESET Timing for EEPROM Mode
Table 8.7 nRESET Timing for EEPROM Mode
NAME
DESCRIPTION
MIN
TYP
MAX
UNITS
t1
t2
t3
t4
t5
t6
t7
nRESET asserted
1
μsec
μsec
msec
msec
msec
msec
msec
Device recovery/stabilization
8051 programs device configuration
USB attach (See Note)
500
50
20
100
Host acknowledges attach and signals USB reset
USB idle
100
Undefined
Completion time for requests (with or without data
stage)
5
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Note: All power supplies must have reached the operating levels mandated in Chapter 10, DC
Parameters, prior to (or coincident with) the assertion of nRESET.
8.5.2
USB Bus Reset
In response to the upstream port signaling a reset to the device, the device does the following:
Note: The device does not propagate the upstream USB reset to downstream devices.
1. Sets default address to ‘0’.
2. Sets configuration to: Unconfigured.
3. Negates PRTCTL[3:2] to all downstream ports.
4. Clears all TT buffers.
5. Moves device from suspended to active (if suspended).
6. Complies with Section 11.10 of the USB 2.0 Specification for behavior after completion of the reset
sequence.
The host then configures the device and the device’s downstream port devices in accordance with the
USB 2.0 Specification.
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Chapter 9 AC Specifications
9.1
Oscillator/Crystal
Parallel Resonant, Fundamental Mode, 24 MHz ± 350 ppm.
Figure 9.1 Typical Crystal Circuit
Table 9.1 Crystal Circuit Legend
SYMBOL
DESCRIPTION
IN ACCORDANCE WITH
C0
CL
CB
Crystal shunt capacitance
Crystal load capacitance
Crystal manufacturer’s specification (See Note 9.1)
OEM board design
Total board or trace
capacitance
CS
Stray capacitance
SMSC IC and OEM board design
SMSC IC
CXTAL
C1
XTAL pin input capacitance
Load capacitors installed on
OEM board
Calculated values based on Figure 9.2,
"Capacitance Formulas" (See Note 9.2)
C2
C1 = 2 x (CL – C0) – CS1
C2 = 2 x (CL – C0) – CS2
Figure 9.2 Capacitance Formulas
Note 9.1 C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL
and should be set to ‘0’ for use in the calculation of the capacitance formulas in Figure 9.2,
"Capacitance Formulas". However, the OEM PCB itself may present a parasitic
capacitance between XTAL1 and XTAL2. For an accurate calculation of C1 and C2, take
the parasitic capacitance between traces XTAL1 and XTAL2 into account.
Note 9.2 Each of these capacitance values is typically approximately 18 pF.
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9.2
Ceramic Resonator
24 MHz ± 350 ppm
Figure 9.3 Ceramic Resonator Usage with SMSC IC
9.3
External Clock
50% Duty cycle ± 10%, 24 MHz ± 350 ppm, Jitter < 100 ps rms.
The external clock is recommended to conform to the signaling level designated in the JESD76-2
specification on 1.8 V CMOS Logic. XTAL2 should be treated as a no connect.
2
9.3.1
9.3.2
I C EEPROM
Frequency is fixed at 58.6 kHz ± 20%
USB 2.0
The SMSC device conforms to all voltage, power, and timing characteristics and specifications as set
forth in the USB 2.0 Specification. Please refer to the USB 2.0 Specification for more information.
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Chapter 10 DC Parameters
10.1
Maximum Guaranteed Ratings
PARAMETER
SYMBOL
MIN
-55
MAX
UNITS
COMMENTS
Storage
Temperature
TSTOR
150
°C
Lead
°C
V
Please refer to JEDEC
specification J-STD-020D.
Temperature
3.3 V supply
voltage
VDD33
-0.5
-0.5
4.0
Voltage on
USB+ and
USB- pins
(3.3 V supply voltage + 2) ≤ 6
V
Voltage on
GPIO8 and
GPIO10
-0.5
VDD33 + 0.3
V
When internal power FET
operation of these pins are
enabled, these pins may be
simultaneously shorted to
ground or any voltage up to
3.63 V indefinitely, without
damage to the device as
long as VDD33 is less than
3.63 V and TA is less than
70oC.
Voltage on
-0.5
-0.5
-0.5
VDD33 + 0.3
V
V
V
any signal pin
Voltage on
XTAL1
3.6
2.0
Voltage on
XTAL2
Note: Stresses above the specified parameters may cause permanent damage to the device. This is
a stress rating only. Functional operation of the device at any condition above those indicated
in the operation sections of this specification is not implied. When powering this device from
laboratory or system power supplies the absolute maximum ratings must not be exceeded or
device failure can result. Some power supplies exhibit voltage spikes on their outputs when the
AC power is switched on or off. In addition, voltage transients on the AC power line may appear
on the DC output. When this possibility exists, a clamp circuit should be used.
Voltage
tRT
VDD33
3.3 V
100%
90%
10%
VSS
t90%
Time
t10%
Figure 10.1 Supply Rise Time Model
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10.2
Operating Conditions
PARAMETER
SYMBOL
MIN
MAX
UNITS
COMMENTS
Commercial
USB2660
TA
0
70
85
3.6
°C
Ambient temperature in still air.
Operating
Temperature
Industrial
TA
-40
3.0
°C
V
Ambient temperature in still air.
USB2660i
Operating
Temperature
3.3 V supply voltage
VDD33
A 3.3 V regulator with an output
tolerance of 1% must be used if
the output of the internal power
FET’s must support a 5%
tolerance.
3.3 V supply rise time tRT
0
400
5.5
μs
(Figure 10.1)
Voltage on
USB+ and USB- pins
-0.3
V
If any 3.3 V supply voltage drops
below 3.0 V, then the MAX
becomes:
(3.3 V supply voltage) + 0.5 ≤ 5.5
Voltage on any signal
pin
-0.3
VDD33
V
Voltage on XTAL1
Voltage on XTAL2
-0.3
-0.3
2.0
2.0
V
V
10.3
DC Electrical Characteristics
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
I, IPU, IPD Type Input Buffer
Low Input Level
VILI
VIHI
PD
PU
0.8
V
V
TTL Levels
High Input Level
2.0
Pull Down
72
58
μA
μA
Pull Up
IS Type Input Buffer
Low Input Level
High Input Level
Hysteresis
VILI
VIHI
0.8
V
V
TTL Levels
2.0
VHYSI
420
mV
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PARAMETER
ICLK Input Buffer
SYMBOL
MIN
TYP
MAX
0.5
UNITS
COMMENTS
Low Input Level
High Input Level
Input Leakage
VILCK
VIHCK
IIL
V
V
1.4
-10
+10
μA
VIN = 0 to VDD33
Input Leakage
(All I and IS buffers)
Low Input Leakage
IIL
-10
-10
+10
+10
μA
μA
VIN = 0
High Input Leakage
IIH
VIN = VDD33
I/O6, I/OD6PU Type Buffers
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
0.4
V
V
IOL = 6 mA @
VDD33 = 3.3 V
VDD33
- 0.4
IOH = -6 mA @
VDD33 = 3.3 V
-10
+10
µA
VIN = 0 to VDD33
(Note 10.1)
Pull Down
Pull Up
PD
PU
72
58
μA
μA
O8, O8PD, 08PU, I/O8, I/O8PD, and
I/O8PU Type Buffers
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
0.4
V
V
IOL = 8 mA @
VDD33 = 3.3 V
VDD33
- 0.4
IOH = -8 mA @
VDD33 = 3.3 V
-10
+10
µA
VIN = 0 to VDD33
(Note 10.1)
Pull Down
Pull Up
PD
PU
72
58
μA
μA
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PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
O12, I/O12, and I/O12PD
Type Buffers
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
0.4
V
V
IOL = 12 mA @
VDD33 = 3.3 V
VDD33
- 0.4
IOH = -12 mA @
VDD33 = 3.3 V
-10
+10
µA
VIN = 0 to VDD33
(Note 10.1)
Pull Down
Pull Up
PD
PU
72
58
μA
μA
IO-U
I-R
Note 10.2
Note 10.3
I/O200 Integrated Power FET for
GPIO8 and GPIO10
High Output Current
IOUT
IOUT
200
100
mA
mA
VdropFET = 0.46 V
VdropFET = 0.23 V
Low Output Current
(Note 10.4)
On Resistance
(Note 10.4)
RDSON
tDSON
2.1
Ω
IFET = 70 mA
Output Voltage Rise Time
800
μs
CLOAD = 10 μF
Integrated Power FET Set to 100 mA
Output Current (Note 10.4)
Short Circuit Current Limit
On Resistance (Note 10.4)
Output Voltage Rise Time
IOUT
ISC
RDSON
tDSON
100
mA
mA
Ω
VdropFET = 0.22 V
VoutFET = 0 V
IFET = 70 mA
140
2.1
800
μs
CLOAD = 10 μF
Integrated Power FET Set to 200 mA
Output Current (Note 10.4)
Short Circuit Current Limit
On Resistance (Note 10.4)
Output Voltage Rise Time
IOUT
ISC
RDSON
tDSON
200
mA
mA
Ω
VdropFET = 0.46 V
VoutFET = 0 V
IFET = 70 mA
181
2.1
800
μs
CLOAD = 10 μF
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Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
Note 10.5
Supply Current Unconfigured
Hi-Speed Host
USB2660
USB2660i
ICCINTHS
ICCINTHS
70
70
80
80
mA
mA
Full Speed Host
USB2660
USB2660i
ICCINITFS
ICCINITFS
65
65
75
75
mA
mA
Supply Current Configured
Hi-Speed Host, 1 downstream port
(Note 10.5)
USB2660
USB2660i
IHCH1
IHCH1
260
260
270
275
mA
mA
Supply Current Configured
Hi-Speed Host, each additional
downstream port
USB2660
USB2660i
25
25
30
35
mA
mA
Supply Current Configured
Full-Speed Host, 1 downstream port
USB2660
USB2660i
IFCC1
IFCC1
200
200
210
215
mA
mA
Supply Current Configured
Full-Speed Host, each additional
downstream port
USB2660
USB2660i
20
20
25
25
mA
mA
Supply Current Suspend
(Note 10.5)
USB2660
USB2660i
ICSBY
ICSBY
500
500
950
1200
µA
µA
Supply Current Reset
USB2660
USB2660i
IRST
IRST
230
230
700
900
µA
µA
Note 10.1 Output leakage is measured with the current pins in high impedance.
Note 10.2 See the USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics
Note 10.3 RBIAS is a 3.3 V tolerant analog pin.
Note 10.4 Output current range is controlled by program software. The software disables the FET
during short circuit condition.
Note 10.5 Typical and maximum values were characterized using the following temperature ranges:
The USB2660 supports the commercial temperature range of 0°C to +70°C
The USB2660i supports the industrial temperature range of -40°C to +85°C
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Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
10.4
Capacitance
TA = 25°C; fc = 1 MHz; VDD33= 3.3 V
Table 10.1 Pin Capacitance
LIMITS
TYP
PARAMETER
SYMBOL
MIN
MAX
UNIT
TEST CONDITION
Clock Input Capacitance
CXTAL
2
pF
All pins (except USB pins
and pins under test) are tied
to AC ground.
Input Capacitance
Output Capacitance
CIN
10
20
pF
pF
COUT
SMSC USB2660/USB2660i
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Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
Chapter 11 GPIO Usage
Table 11.1 USB2660/USB2660i GPIO Usage
NAME
ACTIVE LEVEL
SYMBOL
TxD / LED
DESCRIPTION AND NOTE
GPIO1
GPIO2
H
H
H
H
L
Serial port transmit line / LED indicator
Serial port receive line
RxD
GPIO4
SCL
Serial EEPROM clock
GPIO5
SDA
Serial EEPROM data
GPIO6
SD1_WP
CRD_PWR_CTRL
CRD_PWR_CTRL
MS_nCD
xD_nCD
Secure Digital card write protect assertion
Card power control
GPIO8
L
GPIO10
GPIO12
GPIO14
GPIO15
GPIO16
GPIO17
GPIO[25:18]
GPIO26
GPIO27
L
Card power control
L
Memory Stick card detect
xD-Picture card detect
L
L
SD1_nCD
SD2_nCD
SD2_WP
SD2_D[7:0]
SD2_CLK
SD2_CMD
Secure Digital card detect
Second SD card detect
L
L
Second SD card write protect
Second SD data pins
H
H
H
Output clock signal to the SD/MMC2 device
SD/MMC2 Command signal
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SMSC USB2660/USB2660i
DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
Chapter 12 Package Specifications
Figure 12.1 USB2660/USB2660i 64-Pin QFN
SMSC USB2660/USB2660i
65
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DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
12.1
Tape and Reel Specifications
Figure 12.2 64-Pin Package Tape Specifications
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SMSC USB2660/USB2660i
DATASHEET
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller with Dual SD Interfaces
Datasheet
Figure 12.3 64-Pin Package Reel Specifications
SMSC USB2660/USB2660i
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Revision 1.1 (11-05-10)
DATASHEET
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