CXG1090TN [SONY]

High Power 2 x 4 Antenna Switch MMIC with Integrated Control Logic; 高功率2× 4天线开关单片集成控制逻辑
CXG1090TN
型号: CXG1090TN
厂家: SONY CORPORATION    SONY CORPORATION
描述:

High Power 2 x 4 Antenna Switch MMIC with Integrated Control Logic
高功率2× 4天线开关单片集成控制逻辑

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CXG1090TN  
High Power 2 × 4 Antenna Switch MMIC with Integrated Control Logic  
Description  
16 pin TSSOP (Plastic)  
The CXG1090TN is a high power antenna switch  
MMIC. The CXG1090TN is suited to connect Tx/Rx  
to one of 4 antennas in cellular handset such as PDC.  
The CXG1090TN has the integrated control logic  
and can be operated with CMOS input.  
This IC is designed using the Sony's GaAs J-FET  
process which enable the CXG1090TN to be operated  
with low voltage.  
Features  
Low insertion loss: 0.30dB (Typ.)@900MHz, 0.40dB (Typ.)@1.5GHz  
Small package: TSSOP-16pin  
High power handling: PldB: 37dBm  
CMOS compatible input control  
Low bias voltage: VDD = 3.0V  
Applications  
2 × 4 antenna switch for digital cellular telephones such as PDC handsets.  
Structure  
GaAs J-FET MMIC  
Absolute Maximum Ratings  
Bias voltage  
VDD  
7
V @Ta = 25°C  
V @Ta = 25°C  
Control voltage  
Vctl  
5
Operating temperature Topr  
Storage temperature Tstg  
–35 to +85  
–65 to +150  
°C  
°C  
GaAs MMICs are ESD sensitive devices. Special handling precautions are required.  
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
– 1 –  
E99747A9Z-PS  
CXG1090TN  
Block Diagram  
F1  
RF4  
(Ant/Ext.1)  
RF3  
(Tx)  
9
8
F2  
F4  
F8  
RF5 11  
(Rx)  
RF2  
(Ant/Ext.2)  
RF1  
6
4
F3  
F6  
RF6 13  
(Diversity 1)  
F5  
(Diversity 2)  
F7  
14  
RF-GND6  
3
RF-GND1  
Package Outline/Pin Configuration  
RF4  
9
RF3  
8
7
6
5
4
3
2
1
GND 10  
GND  
11  
12  
13  
RF5  
GND  
RF6  
RF2  
GND  
RF1  
RF-GND6 14  
RF-GND1  
CTLC  
15  
16  
VDD  
CTLA  
CTLB  
Recommended Circuit  
RF4  
9
8
7
6
5
4
3
2
1
RF3  
100pF  
100pF  
100pF  
L1  
L1  
L1  
L1  
L1  
L1  
10  
11  
12  
13  
14  
15  
16  
GND  
RF5  
GND  
RF2  
100pF  
GND  
GND  
RF6  
RF1  
100pF  
Z1  
100pF  
Z6  
RF-GND6  
RF-GND1  
VDD  
CTLC  
100pF  
100pF  
100pF  
100pF  
1k  
1kΩ  
CTLA  
CTLB  
1kΩ  
– 2 –  
CXG1090TN  
Truth Table  
Control  
CTLA CTLB CTLC  
ON  
F1  
F2  
F3  
F4  
F5  
F6  
F7  
F8  
H
H
L
L
L
L
L
L
L
H
L
RF3 RF2 OFF  
ON  
OFF  
OFF  
ON  
OFF  
ON  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
OFF  
OFF  
ON  
ON  
ON  
ON  
ON  
OFF  
ON  
ON  
ON  
ON  
ON  
ON  
OFF  
RF3 RF4  
RF5 RF2  
ON  
ON  
L
ON  
L
H
L
RF5 RF4 OFF  
RF5 RF6 OFF  
RF5 RF1 OFF  
OFF  
OFF  
OFF  
H
H
OFF  
OFF  
OFF  
OFF  
H
OFF  
DC Bias Condition  
(Ta = 25°C)  
Parameter  
Vctl (H) A to C  
Vctl (L) A to C  
VDD  
Min.  
Typ.  
Max.  
3.6  
Unit  
V
2.4  
0
0.8  
V
2.8  
3.2  
V
– 3 –  
CXG1090TN  
Electrical Characteristics  
(Vctl (L) = 0V, Vctl (H) = 3V, Ta = 25°C)  
Min. Typ. Max. Unit  
Parameter  
Frequency  
Condition  
RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V  
RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V  
RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V  
RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V  
RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V  
RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V  
RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 17  
RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 17  
0.32 0.55 dB  
0.30 0.55 dB  
0.55 0.85 dB  
0.55 0.85 dB  
Insertion loss  
0.5  
0.5  
19  
21  
21  
19  
34  
25  
0.8  
0.8  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V  
RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V  
RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V  
RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V  
17  
17  
27  
20  
Isolation  
Each ON  
810 to 960MHz  
Port  
VSWR  
1.4  
1
RF3-RF2  
RF3-RF4  
RF3-RF2  
RF3-RF4  
RF3-RF2  
RF3-RF4  
RF3-RF2  
RF3-RF4  
Pin = 29.5dBm, VDD = 3.0V  
Pin = 29.5dBm, VDD = 2.8V  
Pin = 29.5dBm, VDD = 3.0V  
Pin = 29.5dBm, VDD = 2.8V  
Pin = 29.5dBm, VDD = 3.0V  
Pin = 29.5dBm, VDD = 2.8V  
Pin = 29.5dBm, VDD = 3.0V  
Pin = 29.5dBm, VDD = 2.8V  
–67  
–67  
–75  
–75  
–67  
–67  
–67  
–67  
85  
–57 dBc  
–55 dBc  
–65 dBc  
–62 dBc  
–60 dBc  
–57 dBc  
–60 dBc  
–57 dBc  
ACP (±50kHz)  
889 to 960MHz  
889 to 960MHz  
889 to 960MHz  
889 to 960MHz  
1
1
1
1
1
1
1
ACP (±100kHz)  
2nd harmonics  
3nd harmonics  
Control current  
Bias current  
150  
1
µA  
mA  
mA  
µs  
VDD = 3.0V  
VDD = 2.8V  
0.45  
0.4  
0.9  
5.0  
1.0  
Switching speed  
1
Input Signal: ACP (±50kHz) < –65dBc, APC (±100kHz) < –75dBc,  
2nd harmonics < –65dBc, 3rd harmonics < –65dBc  
– 4 –  
CXG1090TN  
Package Outline  
Unit: mm  
16PIN TSSOP(PLASTIC)  
1.2MAX  
S
4.1  
2.05  
A
0.08  
S
B
X2  
16  
9
0.2 S A B  
X
0.1 ± 0.05  
0.25  
X
1
8
X4  
0.1 S A B  
0° to 8°  
0.5  
M
0.08  
S A  
B
0.2 ± 0.02  
+ 0.036  
0.22 – 0.03  
B
DETAIL  
PACKAGE STRUCTURE  
EPOXY RESIN  
PACKAGE MATERIAL  
LEAD TREATMENT  
LEAD MATERIAL  
PACKAGE MASS  
SOLDER PLATING  
SONY CODE  
EIAJ CODE  
TSSOP-16P-L01  
COPPER ALLOY  
0.03g  
JEDEC CODE  
– 5 –  

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