CXM3539XR [SONY]
SP8T Antenna Switch for GSM/UMTS Dual Mode Handsets; SP8T天线开关，用于GSM / UMTS双模手机
| 型号： | CXM3539XR |
| 厂家： | 
SONY CORPORATION |
| 描述： | SP8T Antenna Switch for GSM/UMTS Dual Mode Handsets |
| 文件： | 总12页 (文件大小：246K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SP8T Antenna Switch for GSM/UMTS Dual Mode Handsets
Preliminary
CXM3539XR
Preliminary
Description
The CXM3539XR is SP8T antenna switch for Triple bands GSM and Triple bands UMTS dual mode handsets.
The CXM3539XR has a 1.8V CMOS compatible decoder.
The Sony GaAs junction gate pHEMT (JPHEMT) MMIC process is used for low insertion loss and high linearity.
(Applications: Triple bands GSM/Triple bands UMTS Dual Mode Handsets)
Features
Low Insertion Loss:
0.30dB (Typ.) Tx1 (GSM Low Band Tx)
0.45dB (Typ.) Tx2 (GSM High Band Tx)
0.60dB (Typ.) TRx1 (UMTS Band I)
Low Voltage Operation:VDD = 2.5V
No DC Blocking Capacitors
Small package size: XQFN-24P-02 (2.2mm × 2.9mm × 0.4mm Max.)
Lead-Free and RoHS Compliant
Structure
GaAs Junction Gate pHEMT (JPHEMT) MMIC Switch, CMOS Decoder
Absolute Maximum Ratings
°
(Ta = 25 C)
Bias voltage (VDD)
4
V
Control voltage (CTL-A/B/C/D)
Input power max. (Tx1)
4
V
36
34
dBm (Duty cycle = 12.5 to 50%)
Input power max. (Tx2)
dBm (Duty cycle = 12.5 to 50%)
Input power max. (TRx1, 2, 3)
Input power max. (Rx1, 2, 4)
Operating temperature range
Storage temperature range
32
dBm
dBm
13
°
C
–35 to +85
–65 to +150
°
C
Note on Handling
GaAs MMIC’s are ESD sensitive devices. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
PE09702
- 1 -
CXM3539XR
Block Diagram
SP8T Antenna Switch
TRx1
TRx2
TRx3
Tx1
Ant
Decoder Logic
Tx2
Rx1
Rx2
Rx4
Pin Configuration
12
8
11 10
9
GND 13
7
6
5
4
3
2
1
GND
TRx3
TRx2
GND
GND
TRx1
GND
GND 14
Rx1 15
24-pin XQFN
(2.2mm × 2.9mm
× 0.4mm Max.)
Top View
Rx2
GND
Rx4
16
17
18
19
GND
20
24
21 22 23
- 2 -
CXM3539XR
Pin Description
Pin No.
Name
Pin No.
13
Name
1
2
GND
TRx1
GND
GND
TRx2
TRx3
GND
Ant
GND
GND
Rx1
14
3
15
4
16
Rx2
5
17
GND
Rx4
6
18
7
19
GND
VDD
8
20
9
GND
21
CTLD
CTLC
CTLB
CTLA
10
11
12
Tx2 (DCS/PCS)
GND
22
23
Tx1 (GSM850/900M)
24
- 3 -
CXM3539XR
RF Switch
Ant
FF1
F2
F14
F7
F16
F17
F18
F19
F10
F9
F6
F3 F4
Tx1 Tx2
Rx1 Rx2 Rx4
TRx1
TRx2
TRx3
Truth Table
Vctl State
Switch State
F1 F2 F3 F4 F6 F7 F9 F10 F14 F16 F17 F18 F19
State Active Path
A
H
H
L
B
H
L
C
L
D
H
H
H
H
H
H
H
H
L
1
2
3
4
5
6
7
8
9
Tx1
Tx2
H
L
L
L
H
L
L
L
L
L
L
L
L
L
H
L
H
H
L
L
L
L
L
H
H
H
H
H
H
L
L
L
H
H
H
H
H
H
H
L
L
Rx1
L
L
H
L
L
L
L
H
H
H
H
H
H
—
H
H
H
L
L
L
Rx2
L
L
H
H
L
L
L
H
L
L
L
L
L
L
Rx4
L
H
H
L
L
L
L
H
L
L
L
L
L
L
TRx1
TRx2
TRx3
Sleep
L
L
L
L
L
H
L
L
H
H
H
—
L
L
H
H
L
H
H
L
L
L
L
L
L
H
L
—
L
H
L
L
L
L
L
L
L
H
—
H
—
—
—
—
—
—
—
—
—
- 4 -
CXM3539XR
Electrical Characteristics
Supply Voltage Value
°
(Ta = 25 C)
Item
Min.
+2.5
Typ.
Max.
+3.3
Unit
V
Bias voltage (VDD)
+2.65
Logic Value
°
(Ta = 25 C)
Item
State
Min.
+1.5
0
Typ.
+1.8
—
Max.
+3.3
+0.3
Unit
V
High
Low
Control voltage
(CTL-A/B/C/D)
- 5 -
CXM3539XR
Specification 1
°
(Ta = 25 C, VDD = 2.5V, Vctl = 1.5V)
Item
Symbol
Port
Condition
Min. Typ. Max.
Unit
*1
*2
*3
*4
*3
*4
*3
*4
*5
*6
*5
*6
*7
*8
*9
*10
*5
*6
*7
*8
*9
*10
Ant-Tx1
Ant-Tx2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.30 0.45
0.45 0.60
0.75 0.90
1.00 1.15
0.75 0.90
1.00 1.15
0.75 0.90
1.00 1.15
0.55 0.70
0.60 0.75
0.58 0.73
0.63 0.78
0.45 0.60
0.45 0.60
0.57 0.72
0.60 0.75
0.60 0.75
0.63 0.78
0.45 0.60
0.45 0.60
0.60 0.75
0.62 0.77
1.20 1.50
Ant-Rx1
Ant-Rx2
Ant-Rx4
Ant-TRx1
Insertion loss
IL
dB
Ant-TRx2
Ant-TRx3
VSWR
VSWR
2fo
All ports in Active Paths
Tx1-Ant
824 to 2170MHz
—
–52
–40
–52
–38
–53
–54
–56
–55
–56
–53
–36
–35
–36
–33
–39
–39
–39
–39
–39
–39
*1
3fo
2fo
*2
*5
Tx2-Ant
3fo
2fo
Harmonics
TRx1-Ant
TRx2-Ant
TRx3-Ant
dBm
3fo
2fo
*7 *9
,
3fo
2fo
*7 *9
,
3fo
- 6 -
CXM3539XR
Item
Symbol
IMD2
Port
Condition
Min. Typ. Max.
Unit
*11 *19
TRx1-Ant
TRx2-Ant
,
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
–106 –97
–108 –97
–106 –97
–117 –97
–106 –97
–105 –97
–116 –97
–105 –97
–105 –97
–108 –97
–109 –97
–104 –97
–107 –97
–108 –97
*12 *19
,
*13 *19
,
*14 *19
,
*12 *19
,
*13 *19
TRx3-Ant
TRx1-Ant
TRx2-Ant
,
Intermodulation
distortion level
in Rx band
*14 *19
,
dBm
*15 *19
,
*16 *19
,
*17 *19
,
*18 *19
IMD3
,
*16 *19
,
*17 *19
TRx3-Ant
,
*18 *19
,
Switching time
Control current
Supply current
Ts
50%Ctl to 90%RF
Vctl = 1.80V
3
1
5
5
μs
μA
mA
Ictl
Idd
VDD = 2.65V
0.18 0.40
Sleep Mode
*State9
Sleep current
Isleep
—
1
10
μA
VDD = 2.65V
Electrical Characteristics are measured with all RF ports terminated in 50Ω.
*1
Pin on Tx1: 34dBm, 824 to 915MHz, Tx1 enabled
*2
Pin on Tx2: 32dBm, 1710 to 1910MHz, Tx2 enabled
*3
Pin on Ant: 10dBm, 869 to 960MHz, Rx1, Rx2 or Rx4 enabled
*4
Pin on Ant: 10dBm, 1805 to 1990MHz, Rx1, Rx2 or Rx4 enabled
*5
Pin on TRx1, TRx2 or TRx3: 26dBm, 1920 to 1980MHz, TRx1, TRx2 or TRx3 enabled
Pin on Ant: 10dBm, 2110 to 2170MHz, TRx1, TRx2 or TRx3 enabled
Pin on TRx2 or TRx3: 26dBm, 824 to 849MHz, TRx2 or TRx3 enabled
Pin on Ant: 10dBm, 869 to 894MHz, TRx2 or TRx3 enabled
*6
*7
*8
*9
Pin on TRx2 or TRx3: 26dBm, 1710 to 1910MHz, TRx2 or TRx3 enabled
Pin on Ant: 10dBm, 1805 to 1990MHz, TRx2 or TRx3 enabled
*10
*11
*12
*13
*14
*15
*16
*17
*18
*19
Pin on TRx1: 20dBm, 1950MHz, Pin on Ant: –15dBm, 190MHz, TRx1 enabled
Pin on TRx2 or TRx3: 20dBm, 1745MHz, Pin on Ant: –15dBm, 95MHz, TRx2 or TRx3 enabled
Pin on TRx2 or TRx3: 20dBm, 1880MHz, Pin on Ant: –15dBm, 80MHz, TRx2 or TRx3 enabled
Pin on TRx2 or TRx3: 20dBm, 835MHz, Pin on Ant: –15dBm, 45MHz, TRx2 or TRx3 enabled
Pin on TRx1: 20dBm, 1950MHz, Pin on Ant: –15dBm, 1760MHz, TRx1 enabled
Pin on TRx2 or TRx3: 20dBm, 1745MHz, Pin on Ant: –15dBm, 1650MHz, TRx2 or TRx3 enabled
Pin on TRx2 or TRx3: 20dBm, 1880MHz, Pin on Ant: –15dBm, 1800MHz, TRx2 or TRx3 enabled
Pin on TRx2 or TRx3: 20dBm, 835MHz, Pin on Ant: –15dBm, 790MHz, TRx2 or TRx3 enabled
Measured with the recommended circuit
- 7 -
CXM3539XR
Specification 1-Isolation
°
(Ta = 25 C, VDD = 2.5V, Vctl = 1.5V)
Path
Isolation
Item
Symbol
Condition
Min. Typ. Max.
Unit
Active
Tx1-Rx1
35
35
35
25
25
25
25
18
35
35
35
20
20
20
16
30
30
30
27
23
17
20
30
30
30
20
20
20
20
30
30
30
18
18
17
20
46
55
57
29
48
38
28
22
51
55
55
23
38
31
19
52
57
54
34
26
19.5
28
59
60
60
28
28
26
43
52
57
56
21
20.5
19.5
33
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Tx1-Rx2
Tx1-Rx4
Tx1-TRx1
Tx1-TRx2
Tx1-TRx3
Tx1-Tx2
824 to 915MHz
Tx1
Tx1-Tx2
1648 to 1830MHz
1710 to 1910MHz
Tx2-Rx1
Tx2-Rx2
Tx2-Rx4
Tx2
Tx2-TRx1
Tx2-TRx2
Tx2-TRx3
Tx2-Tx1
TRx1-Rx1
TRx1-Rx2
TRx1-Rx4
TRx1-TRx2
TRx1-TRx3
TRx1-Tx1
TRx1-Tx2
TRx2-Rx1
TRx2-Rx2
TRx2-Rx4
TRx2-TRx1
TRx2-TRx3
TRx2-Tx1
TRx2-Tx2
TRx2-Rx1
TRx2-Rx2
TRx2-Rx4
TRx2-TRx1
TRx2-TRx3
TRx2-Tx1
TRx2-Tx2
Isolation
ISO
dB
TRx1
1920 to 1980MHz
824 to 849MHz
TRx2
1710 to 1910MHz
- 8 -
CXM3539XR
Path
Isolation
Item
Symbol
Condition
Min. Typ. Max.
Unit
Active
TRx3-Rx1
TRx3-Rx2
TRx3-Rx4
TRx3-TRx1
TRx3-TRx2
TRx3-Tx1
TRx3-Tx2
TRx3-Rx1
TRx3-Rx2
TRx3-Rx4
TRx3-TRx1
TRx3-TRx2
TRx3-Tx1
TRx3-Tx2
30
30
30
20
20
20
20
30
30
30
18
18
17
20
59
60
59
29
30
26
43
52
57
55
22
22
19.5
36
—
—
—
—
—
—
—
—
—
—
—
—
—
—
824 to 849MHz
Isolation
ISO
TRx3
dB
1710 to 1910MHz
Electrical Characteristics are measured with all RF ports terminated in 50Ω.
- 9 -
CXM3539XR
Recommended Circuit
C1
L1
12 11 10
9
8
13
14
15
16
17
18
19
7
6
5
4
3
2
1
TRx3
TRx2
Rx1
Rx2
24-pin XQFN
(2.2mm × 2.9mm
× 0.4mm Max.)
Top View
TRx1
Rx4
20
24
21 22 23
C2
C2
C2
C2
C2 100pF
Note) 1. No DC blocking Capacitors are required on all RF ports.
2. DC levels of all RF ports are GND.
3. L1 Inductor(22nH) and C1 Capacitor(22pF) are recommended on Ant port for ESD protection.
4. C2 Capacitor (100pF) is recommended.
- 10 -
CXM3539XR
PCB Layout Template
XQFN-24P-02 Macro for MMIC (Reference)
Specification
• PKG size:
2.9mm × 2.2mm t0.35mm
• Terminal pitch: 0.35mm
• Terminal length: 0.25mm
• Mask thickness: 0.11mm
3.3
2.9 (PKG size)
1.8
0.35
Detail A
0.28
0.2
0.28
0.2
R0.05
C0.1
R0.05
C0.05
PKG Outline
0.35
Detail A
: Land area
: Mask open area (Solder printing area)
: Metal area in board (GND plane is recommended.)
: Board resist open area
: PKG outline
- 11 -
CXM3539XR
Package Outline
(Unit: mm)
LEAD PLATING SPECIFICATIONS
ITEM
SPEC.
LEAD MATERIAL
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
SOLDER COMPOSITION
PLATING THICKNESS
Sony Corporation
- 12 -
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