ICX406 [SONY]
Timing Generator and Signal Processor for Frame Readout CCD Image Sensor; 时序发生器和信号处理器的帧读出CCD图像传感器型号: | ICX406 |
厂家: | SONY CORPORATION |
描述: | Timing Generator and Signal Processor for Frame Readout CCD Image Sensor |
文件: | 总47页 (文件大小:403K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CXD3408GA
Timing Generator and Signal Processor for Frame Readout CCD Image Sensor
Description
96 pin LFLGA (Plastic)
The CXD3408GA is a timing generator and CCD
signal processor IC for the ICX406 CCD image sensor.
Features
• Timing generator functions
• Horizontal drive frequency 18MHz
(base oscillation frequency 36MHz)
• Supports frame readout/draft (quadruple speed)
/AF (auto-focus)
Absolute Maximum Ratings
• High-speed/low-speed shutter function
• Horizontal and vertical drivers for CCD image
sensor
• Supply voltage
VDDa, VDDb, VDDc, VDDd
VSS – 0.3 to +7.0
VSS – 0.3 to +4.0
–10.0 to VSS
V
V
V
V
VDDe, VDDf, VDDg
• CCD signal processor functions
• Correlated double sampling
• Programmable gain amplifier (PGA) allows gain
adjustment over a wide range (–6 to +42dB)
• 10-bit A/D converter
VL
VH
VL – 0.3 to +26.0
• Input voltage (analog)
VIN
VSS – 0.3 to VDD + 0.3
VSS – 0.3 to VDD + 0.3
V
V
• Input voltage (digital)
• Chip Scale Package (CSP):
CSP allows vast reduction in the CCD camera
block footprint
VI
• Output voltage
VO1
VSS – 0.3 to VDD + 0.3
VL – 0.3 to VSS + 0.3
VL – 0.3 to VH + 0.3
V
V
V
VO2
Applications
VO3
• Operating temperature
Topr
Digital still cameras
–20 to +75
°C
°C
Structure
• Storage temperature
Tstg
Silicon gate CMOS IC
–55 to +125
Applicable CCD Image Sensors
Recommended Operating Conditions
ICX406 (1/1.8", 3980K pixels)
• Supply voltage
VDDb
3.0 to 5.25
V
VDDa, VDDc, VDDd, VDDe, VDDf, VDDg
3.0 to 3.6
V
V
V
V
VM
0.0
VH
14.5 to 15.5
–7.0 to –8.0
VL
• Operating temperature
Topr
–20 to +75
°C
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
– 1 –
E01341A26
CXD3408GA
Block Diagram
A1 A2 C7 D8 D7
B8 B6 B9 A6 C5
A3 A4 B4 A5 C4 B5
E2 F2 F3 E3 F1
C4
AVDD5
AVSS6
C7
C8
A9
A8
B7
A7
C6
C9
E9
E8
D9
E7
F9
F8
F7
G9
G8
G7
H7
H8
K7
K8
K9
H9
D0 (LSB)
B3
B2
B1
C3
C2
C1
D3
D2
D1
E1
Serial Port
Register
DAC
D1
D2
C8
D3
C9
D4
CDS
PGA
ADC
CCDIN
AVDD1
AVDD2
AVSS1
Latch
D5
D6
D7
D8
AVSS2
XSHPI
D9 (MSB)
Dummy Pixel
Black Level
Auto Zero
XSHDI
PBLKI
XSHP
XSHD
PBLK
ADCLKI
CLPOBI
CLPDMI
Preblanking
G1
G2
G3
L3
Auto Zero
VSS4
ADCLK
CLPOB
CLPDM
H1
H2
H3
XRS
VDD4
VDD2
RG
VSS5
J3
OSCI
L1
K1
J1
VSS2
VDD3
OSCO
CKI
Pulse Generator
H1
H2
J8
J9
CKO
J2
1/2
MCKO
K2
VSS3
J7
ID/EXP
WEN
N9
M9
SNCSL
N8
Selector
Latch
SSI1
L2
M1
N1
Serial Port
Register
SCK1
SEN1
VH
VM
VL
M5
L4
V Driver
M6
SSGSL
L8
SSG
M8 M3 M7
L5 N5 M4 L6 N6 N4 N7
N2 M2
L9 K3 L7 N3
– 2 –
CXD3408GA
Pin Configuration (Top View)
A
B
C
D
E
F
NC
D2
NC
D1
SCK2
D0
SSI2
SEN2
TEST4
TEST3
TEST5
AVSS5
AVSS4
AVDD4
C9
C8
C7
AVSS6
AVDD3
C4
AVDD5
AVSS3
CCDIN
AVSS1
AVDD1
XSHPI
XSHP
VDD3
D5
D4
D3
C3
D8
D7
D6
C1
C2
D9
DVDD1
DVSS3
DVSS1
DVDD2
AVSS2
PBLKI
PBLK
XRS
AVDD2
XSHDI
XSHD
VDD4
DVSS2
G
H
ADCLKI CLPOBI CLPDMI
ADCLK CLPOB CLPDM
J
CKI
CKO
MCKO
SSI1
VD
VSS5
VDD5
VSS3
VDD2
H1
RG
H2
K
L
OSCO
OSCI
SCK1
VSS2
VDD1
WEN
VSS4
VM
V2
V1A
VH
V3A
VL
VSS1
SSGSL
RST
M
N
TEST1
TEST2
SEN1
1
HD
2
VSS6
V4
4
V1B
5
V3B
6
SUB
7
SNCSL
8
ID/EXP
9
3
– 3 –
CXD3408GA
Pin Description
Pin
Symbol
No.
I/O
Description
A1 NC
—
—
I
No connected. (Open)
No connected. (Open)
A2 NC
A3 SCK2
A4 SSI2
A5 TEST3
CCD signal processor block serial interface clock input. (Schmitt trigger)
CCD signal processor block serial interface data input. (Schmitt trigger)
CCD signal processor block test input 3. Connect to DVSS.
CCD signal processor block analog GND.
Capacitor connection.
I
I
A6
AVSS4
—
—
—
—
O
O
O
I
A7 C8
A8
A9
AVSS6
AVDD5
CCD signal processor block analog GND.
CCD signal processor block analog power supply.
ADC output.
B1 D2
B2 D1
ADC output.
B3 D0
ADC output (LSB).
B4 SEN2
B5 TEST5
CCD signal processor block serial interface enable input. (Schmitt trigger)
CCD signal processor block test input 5. Connect to DVDD.
CCD signal processor block analog power supply.
Capacitor connection.
I
B6
AVDD4
—
—
—
—
O
O
O
I
B7 C7
B8
B9
AVDD3
AVSS3
CCD signal processor block analog power supply.
CCD signal processor block analog GND.
ADC output.
C1 D5
C2 D4
ADC output.
C3 D3
ADC output.
C4 TEST4
CCD signal processor block test input 4. Connect to DVSS.
CCD signal processor block analog GND.
Capacitor connection.
C5
AVSS5
—
—
—
—
I
C6 C9
C7 C3
C8 C4
C9 CCDIN
D1 D8
D2 D7
D3 D6
D7 C1
D8 C2
Capacitor connection.
Capacitor connection.
CCD output signal input.
O
O
O
—
—
—
O
—
ADC output.
ADC output.
ADC output.
Capacitor connection.
Capacitor connection.
D9
E1 D9
E2
AVSS1
CCD signal processor block analog GND.
ADC output (MSB).
DVDD1
CCD signal processor block digital power supply. (Power supply for ADC)
– 4 –
CXD3408GA
Pin
No.
Symbol
I/O
Description
CCD signal processor block digital GND.
E3
E7
E8
E9
F1
F2
F3
F7
F8
F9
DVSS1
AVSS2
AVDD2
AVDD1
DVSS2
DVSS3
DVDD2
PBLKI
XSHDI
XSHPI
—
—
—
—
—
—
—
I
CCD signal processor block analog GND.
CCD signal processor block analog power supply.
CCD signal processor block analog power supply.
CCD signal processor block digital GND.
CCD signal processor block digital GND.
CCD signal processor block digital power supply.
Pulse input for horizontal and vertical blanking period pulse cleaning. (Schmitt trigger)
CCD data level sample-and-hold pulse input. (Schmitt trigger)
CCD precharge level sample-and-hold pulse input. (Schmitt trigger)
Clock input for analog/digital conversion. (Schmitt trigger)
CCD optical black signal clamp pulse input. (Schmitt trigger)
CCD dummy signal clamp pulse input. (Schmitt trigger)
Pulse output for horizontal and vertical blanking period pulse cleaning.
CCD data level sample-and-hold pulse output.
I
I
G1 ADCLKI
G2 CLPOBI
G3 CLPDMI
G7 PBLK
I
I
I
O
O
O
O
O
O
O
—
—
I
G8 XSHD
G9 XSHP
H1 ADCLK
H2 CLPOB
H3 CLPDM
H7 XRS
CCD precharge level sample-and-hold pulse output.
Clock output for analog/digital conversion.
CCD optical black signal clamp pulse output.
CCD dummy signal clamp pulse output.
Sample-and-hold pulse output for analog/digital conversion phase alignment.
Timing generator block digital power supply. (Power supply for CDS block)
Timing generator block 3.0 to 5.0V power supply. (Power supply for H1/H2)
Inverter input.
H8
H9
J1
J2
J3
J7
J8
J9
VDD4
VDD3
CKI
CKO
VSS5
VSS3
H1
O
—
—
O
O
O
O
—
—
O
—
I
Inverter output.
Timing generator block digital GND.
Timing generator block digital GND.
CCD horizontal register clock output.
H2
CCD horizontal register clock output.
K1 OSCO
K2 MCKO
Inverter output for oscillation. When not used, leave open or connect a capacitor.
System clock output for signal processor IC.
K3
K7
VDD5
VDD2
Timing generator block digital power supply. (Power supply for common logic block)
Timing generator block digital power supply. (Power supply for RG)
CCD reset gate pulse output.
K8 RG
K9
L1
VSS2
Timing generator block digital GND.
OSCI
Inverter input for oscillation. When not used, fix to low.
– 5 –
CXD3408GA
Pin
No.
Symbol
I/O
I
Description
Timing generator block serial interface data input.
Schmitt trigger input/No protective diode on power supply side.
L2 SSI1
L3
VSS4
—
—
O
Timing generator block digital GND.
Timing generator block digital GND. (GND for vertical driver)
CCD vertical register clock output.
CCD vertical register clock output.
Timing generator block digital GND.
Internal SSG enable.
L4 VM
L5 V1A
L6 V3A
O
L7
L8 SSGSL
L9
VSS1
—
I
—
I
High: Internal SSG valid, Low: External sync valid
(With pull-down resistor)
VDD1
Timing generator block digital power supply. (Power supply for common logic block)
Timing generator block serial interface clock input.
Schmitt trigger input/No protective diode on power supply side.
M1 SCK1
M2 VD
I
Vertical sync signal input.
Timing generator block test input 1.
Normally fix to GND.
M3 TEST1
I
(With pull-down resistor)
M4 V2
M5 VH
M6 VL
O
—
—
CCD vertical register clock output.
Timing generator block 15.0V power supply. (Power supply for vertical driver)
Timing generator block –7.5V power supply. (Power supply for vertical driver)
Timing generator block test input 2.
M7 TEST2
I
Normally fix to GND.
(With pull-down resistor)
Timing generator block reset input.
High: Normal operation, Low: Reset control
Normally apply reset during power-on.
M8 RST
I
Schmitt trigger input/No protective diode on power supply side
M9 WEN
N1 SEN1
N2 HD
O
I
Memory write timing pulse output.
Timing generator block serial interface strobe input.
Schmitt trigger input/No protective diode on power supply side
I
Horizontal sync signal input.
N3
VSS6
—
O
O
O
O
Timing generator block digital GND.
CCD vertical register clock output.
CCD vertical register clock output.
CCD vertical register clock output.
CCD electronic shutter pulse output.
Control input used to switch sync system.
N4 V4
N5 V1B
N6 V3B
N7 SUB
N8 SNCSL
N9 ID/EXP
I
High: CKI sync, Low: MCKO sync
(With pull-down resistor)
Vertical direction line identification pulse output/exposure time identification pulse
output.
O
Switching possible using the serial interface data. (Default: ID)
– 6 –
CXD3408GA
Electrical Characteristics
Timing Generator Block Electrical Characteristics
DC Characteristics
(Within the recommended operating conditions)
Item
Pins
Symbol
Conditions
Min.
3.0
Typ. Max. Unit
Supply voltage 1
Supply voltage 2
Supply voltage 3
Supply voltage 4
VDD2
VDD3
VDD4
3.3
3.3
3.3
3.3
3.6
5.25
3.6
V
V
V
V
V
VDDa
VDDb
VDDc
VDDd
VI +
3.0
3.0
VDD1, VDD5
3.0
3.6
0.8VDDd
Input
voltage 1
RST, SCK1,
SSI1, SEN1
1
VI –
0.2VDDd
0.3VDDd
0.2VDDd
0.4
V
V
V
V
V
V
V
V
V
V
V
VIH1
VIL1
0.7VDDd
0.8VDDd
Input
voltage 2
TEST1, TEST2
SNCSL, SSGSL
2
VIH2
VIL2
Input/Output
voltage
VD, HD
VOH1
VOL1
VOH2
VOL2
VOH3
VOL3
Feed current where IOH = –1.2mA VDDd – 0.8
Pull-in current where IOL = 2.4mA
Feed current where IOH = –22.0mA VDDb – 0.8
Pull-in current where IOL = 14.4mA
Output
voltage 1
H1, H2
RG
0.4
Feed current where IOH = –3.3mA VDDa – 0.8
Pull-in current where IOL = 2.4mA
Output
voltage 2
0.4
XSHP, XSHD,
XRS, PBLK,
CLPOB,
CLPDM,
ADCLK
Feed current where IOH = –3.3mA
V
V
VOH4
VOL4
VDDc – 0.8
Output
voltage 3
Pull-in current where IOL = 2.4mA
0.4
VOH5
VOL5
VOH6
VOL6
VOH7
VOL7
IOL
Feed current where IOH = –6.9mA VDDd – 0.8
Pull-in current where IOL = 4.8mA
V
V
Output
voltage 4
CKO
0.4
0.4
Feed current where IOH = –3.3mA VDDd – 0.8
Pull-in current where IOL = 2.4mA
V
Output
voltage 5
MCKO
V
Feed current where IOH = –2.4mA VDDd – 0.8
Pull-in current where IOL = 4.8mA
V
Output
voltage 6
ID/EXP,
WEN
0.4
V
V1A/B, V2, V3A/B, V4 = –8.25V
V1A/B, V2, V3A/B, V4 = –0.25V
V1A/B, V3A/B = 0.25V
V1A/B, V3A/B = 14.75V
SUB = –8.25V
10.0
mA
mA
mA
mA
mA
mA
V1A, V1B,
V3A, V3B,
V2, V4
IOM1
IOM2
IOH
–5.0
–7.2
–4.0
Output
current 1
5.0
IOSL
IOSH
5.4
Output
current 2
SUB
SUB = 14.75V
1
This input pin is a schmitt trigger input and it does not have protective diode of the power supply side in the IC.
These input pins are with pull-down resistor in the IC.
2
Note) This table indicates conditions at 3.3V drive.
– 7 –
CXD3408GA
Inverter I/O Characteristics for Oscillation
(Within the recommended operating conditions)
Item
Pins
Symbol
LVth
VIH
Conditions
Min.
Typ.
Max. Unit
Logical Vth OSCI
VDDd/2
V
V
0.7VDDd
Input
OSCI
voltage
VIL
0.3VDDd
V
V
V
VOH
VOL
Feed current where IOH = –3.6mA VDDd – 0.8
Output
OSCO
voltage
Pull-in current where IOL = 2.4mA
0.4
5M
Feedback
resistor
OSCI, OSCO RFB
VIN = VDDd or VSS
500k
20
2M
Ω
Oscillation
frequency
OSCI, OSCO
f
50
MHz
Inverter Input Characteristics for Base Oscillation Clock Duty Adjustment
(Within the recommended operating conditions)
Item
Pins
Symbol
LVth
VIH
Conditions
Min.
Typ.
Max.
Unit
V
Logical Vth
VDDd/2
0.7VDDd
V
Input
voltage
CKI
VIL
0.3VDDd
V
Input
amplitude
VIN
fmax 50MHz sine wave
0.3
Vp-p
Note) Input voltage is the input voltage characteristics for direct input from an external source. Input amplitude
is the input amplitude characteristics in the case of input through a capacitor.
Switching Characteristics
(VH = 15.0V, VM = GND, VL = –7.5V)
Item
Symbol
Conditions
Min.
200
200
30
Typ.
350
350
60
Max.
500
500
90
Unit
ns
ns
ns
ns
ns
ns
V
TTLM VL to VM
TTMH VM to VH
TTLH VL to VH
TTML VM to VL
TTHM VH to VM
TTHL VH to VL
VCLH
Rise time
Fall time
200
200
30
350
350
60
500
500
90
1.0
1.0
1.0
1.0
VCLL
V
Output noise voltage
VCMH
V
VCML
V
Notes)
1. The MOS structure of this IC has a low tolerance for static electricity, so full care should be given for
measures to prevent electrostatic discharge.
2. For noise and latch-up countermeasures, be sure to connect a by-pass capacitor (0.1µF or more) between
each power supply pin (VH, VL) and GND.
3. To protect the CCD image sensor, clamp the SUB pin output at VH before input to the CCD image sensor.
– 8 –
CXD3408GA
Switching Waveforms
TTMH
90%
TTHM
90%
VH
VM
V1A (V1B, V3A, V3B)
TTLM
10%
90%
TTML
10%
90%
10%
10%
VL
TTLM
TTML
VM
90%
90%
V2 (V4)
10%
10%
VL
TTLH
TTHL
VH
90%
90%
SUB
10%
10%
VL
Waveform Noise
VM
VCMH
VCML
VCLH
VCLL
VL
– 9 –
CXD3408GA
C 9
P B L K
X S H D
X S H P
S S 5 A V
T E S T 4
D 3
D 4
S S V 4
C L P O B
C L P D M
X R S
D 5
D D 3 A V
S S 3 A V
C 7
D D V 4
D D V 3
C K I
D D 4 A V
T E S T 5
C K O
S E N 2
D 0
S S V 5
S S V 3
H 1
D 1
D 2
H 2
D D 5 A V
D D V 5
S S 6 A V
C 8
O S C I
O S C O
S S 4 A V
D D V 2
R G
S S V 2
T E S T 3
S S I 2
S C K 2
N C
M C K O
S S I 1
N C
S S V 6
– 10 –
CXD3408GA
AC Characteristics
AC characteristics between the serial interface clocks
0.8VDDd
SSI1
SCK1
SEN1
SEN1
0.2VDDd
0.8VDDd
ts1
th1
ts2
0.2VDDd
ts3
0.8VDDd
(Within the recommended operating conditions)
Symbol
ts1
Definition
Min.
20
Typ.
Max.
Unit
ns
SSI1 setup time, activated by the rising edge of SCK1
SSI1 hold time, activated by the rising edge of SCK1
SCK1 setup time, activated by the rising edge of SEN1
SEN1 setup time, activated by the rising edge of SCK1
20
ns
th1
ts2
ts3
20
ns
20
ns
Serial interface clock internal loading characteristics (1)
Example: During frame mode
VD
HD
V1A
Enlarged view
HD
0.2VDDd
ts1
V1A
th1
0.8VDDd
SEN1
0.2VDDd
Be sure to maintain a constantly high SEN1 logic level near the falling edge of the HD in the horizontal period
during which V1A/B and V3A/B values take the ternary value and during that horizontal period.
(Within the recommended operating conditions)
Symbol
ts1
th1
Definition
SEN1 setup time, activated by the falling edge of HD
SEN1 hold time, activated by the falling edge of HD
– 11 –
Min.
0
Typ.
Max.
Unit
ns
µs
110
CXD3408GA
Serial interface clock internal loading characteristics (2)
Example: During frame mode
VD
HD
Enlarged view
VD
HD
0.2VDDd
ts1
th1
0.8VDDd
SEN1
0.2VDDd
Be sure to maintain a constantly high SEN1 logic level near the falling edge of VD.
(Within the recommended operating conditions)
Symbol
ts1
th1
Definition
Min.
0
Typ.
Max.
Unit
ns
SEN1 setup time, activated by the falling edge of VD
SEN1 hold time, activated by the falling edge of VD
200
ns
Serial interface clock output variation characteristics
Normally, the serial interface data is loaded to the CXD3408GA at the timing shown in "Serial interface clock
internal loading characteristics (1)" above. However, one exception to this is when the data such as STB is
loaded to the CXD3408GA and controlled at the rising edge of SEN1. See "Description of Operation".
0.8VDDd
SEN1
Output signal
tpdPULSE
(Within the recommended operating conditions)
Symbol
Definition
Min.
5
Typ.
Max.
100
Unit
ns
tpdPULSE Output signal delay, activated by the rising edge of SEN1
– 12 –
CXD3408GA
RST loading characteristics
0.8VDDd
RST
0.2VDDd
tw1
(Within the recommended operating conditions)
Symbol
Definition
Min.
25
Typ.
Max.
Unit
ns
RST pulse width
tw1
VD and HD phase characteristics
VD
HD
0.2VDDd
0.2VDDd
ts1
th1
0.2VDDd
(Within the recommended operating conditions)
Symbol
Definition
Min.
100
Typ.
Max.
Unit
ns
VD setup time, activated by the falling edge of HD
VD hold time, activated by the falling edge of HD
ts1
th1
20
ns
HD loading characteristics
HD
0.2VDDd
0.2VDDd
ts1
th1
0.8VDDd
MCKO
MCKO load capacitance = 10pF
Symbol
(Within the recommended operating conditions)
Definition
Min.
20
5
Typ.
Max.
Unit
ns
HD setup time, activated by the rising edge of MCKO
HD hold time, activated by the rising edge of MCKO
ts1
th1
ns
– 13 –
CXD3408GA
Output variation characteristics
0.8VDDd
MCKO
WEN, ID/EXP
tpd1
WEN and ID/EXP load capacitance = 10pF
(Within the recommended operating conditions)
Symbol
tpd1
Definition
Min.
20
Typ.
Max.
60
Unit
ns
Time until the above outputs change after the rise of MCKO
– 14 –
CXD3408GA
CCD Signal Processor Block Electrical Characteristics
DC Characteristics
(Fc = 18MSPS, DVDD1, 2 = AVDD1, 2, 3, 4, 5 = 3.3V, Ta = 25°C)
Item
Pins
Symbol
VDDe
Conditions
Min.
3.0
Typ. Max. Unit
Supply voltage 1 DVDD1
Supply voltage 2 DVDD2
3.3 3.6
3.3 3.6
V
V
VDDf
3.0
AVDD1,
AVDD2,
Supply voltage 3 AVDD3,
AVDD4,
VDDg
3.0
3.3 3.6
V
AVDD5
Analog input
CCDIN
CIN
VI +
15
pF
V
capacitance
SCK2, SSI2,
1.8
SEN2, TEST3,
TEST4, XSHDI,
XSHPI, ADCLKI,
CLPOBI,
Input voltage
VI –
1.1
V
CLPDMI, PBLKI
A/D clock duty ADCLKI
50
%
V
VOH
VOL
Feed current where IOH = –2.0mA VDDe – 0.9
Output voltage D0 to D9
Pull-in current where IOL = 2.0mA
0.4
V
Analog Characteristics
(Fc = 18MSPS, DVDD1, 2 = AVDD1, 2, 3, 4, 5 = 3.3V, Ta = 25°C)
Item
Symbol
Conditions
Min. Typ. Max. Unit
CCDIN input voltage amplitude
PGA maximum gain
VIN
PGA gain = 0dB, output full scale
PGA gain setting data = "3FFh"
PGA gain setting data = "000h"
900
1100 mV
Gmax
Gmin
42
–6
10
dB
dB
PGA minimum gain
ADC resolution
bit
ADC maximum conversion rate
ADC integral non-linearity error
Fc max
18
MHz
EL
PGA gain = 0dB
PGA gain = 0dB
±1.0 ±5.0 LSB
±0.5 ±1.0 LSB
ADC differential non-linearity error ED
CCDIN input connected to GND
via a coupling capacitor
PGA gain = 0dB
1
Signal-to-noise ratio
SNR
62
dB
CCDIN input voltage clamp level
CLP
OB
1.5
32
V
CCD optical black signal clamp
level
OBLVL = "8h"
PGA gain = 0dB
LSB
1
SNR = 20 log (full-scale voltage/rms noise)
– 15 –
CXD3408GA
AC Characteristics
AC characteristics between the serial interface clocks
0.8VDD
SSI2
0.2VDD
0.8VDD
ts1
SCK2
th1
SEN2
SEN2
0.2VDD
ts3
0.8VDD
ts2
The setting values are reflected to the operation 6 ADCLKI clocks after the serial data is loaded at the rise of
SEN2.
(Fc = 18MSPS, DVDD1, 2 = AVDD1, 2, 3, 4, 5 = 3.3V, Ta = 25°C)
Symbol
tp1
Definition
Min.
100
30
Typ.
Max.
Unit
ns
SCK2 clock period
SSI2 setup time, activated by the rise of SCK2
SSI2 hold time, activated by the rise of SCK2
SCK2 setup time, activated by the rise of SEN2
SEN2 setup time, activated by the rise of SCK2
ns
ts1
th1
ts2
ts3
30
ns
30
ns
30
ns
– 16 –
CXD3408GA
CDS/ADC Timing Chart
N
N + 1
N + 2
N + 3
CCDIN
XSHPI
XSHDI
tw1
ADCLKI
D0 to D9
DL
N – 10
N – 9
N – 8
N – 7
Set the input pulse polarity setting data D13, D14 and D15 of the serial interface data to "0".
(Fc = 18MSPS, DVDD1, 2 = AVDD1, 2, 3, 4, 5 = 3.3V, Ta = 25°C)
Symbol
tw1
Definition
Min.
54
Typ.
Max.
Unit
ADCLKI clock period
ADCLKI clock duty
Data latency
ns
%
50
9
DL
clocks
Preblanking Timing Chart
PBLKI
11 Clocks
ADCLKI
D0 to D9
11 Clocks
All "0"
– 17 –
CXD3408GA
Description of Operation
Pulses output from the CXD3408GA's timing generator block are controlled mainly by the RST pin and by the
serial interface data. The Pin Status Table is shown below, and the details of serial interface control are
described on page 20 and thereafter.
Pin Status Table
Pin
No.
Pin
No.
Symbol CAM SLP
STB
RST
Symbol CAM SLP
STB
RST
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
A1 NC
D3 D6
A2 NC
D7 C1
A3 SCK2
A4 SSI2
A5 TEST3
A6 AVSS4
A7 C8
D8 C2
D9 AVSS1
E1 D9
E2 DVDD1
E3 DVSS1
E7 AVSS2
E8 AVDD2
E9 AVDD1
F1 DVSS2
F2 DVSS3
F3 DVDD2
F7 PBLKI
F8 XSHDI
F9 XSHPI
G1 ADCLKI
G2 CLPOBI
G3 CLPDMI
G7 PBLK
G8 XSHD
G9 XSHP
H1 ADCLK
H2 CLPOB
H3 CLPDM
H7 XRS
A8 AVSS6
A9 AVDD5
B1 D2
B2 D1
B3 D0
B4 SEN2
B5 TEST5
B6 AVDD4
B7 C7
B8 AVDD3
B9 AVSS3
C1 D5
ACT
ACT
ACT
ACT
ACT
ACT
ACT
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
C2 D4
ACT
ACT
ACT
H
C3 D3
C4 TEST4
C5 AVSS5
C6 C9
H
C7 C3
ACT
C8 C4
—
—
C9 CCDIN
D1 D8
H8 VDD4
H9 VDD3
ACT ACT ACT
ACT
D2 D7
J1 CKI
– 18 –
CXD3408GA
Pin
No.
Pin
No.
Symbol CAM SLP
STB
RST
Symbol
CAM SLP
ACT ACT
STB
L
RST
J2 CKO
J3 VSS5
J7 VSS3
J8 H1
ACT L9 VDD1
M1 SCK1
—
—
—
ACT ACT ACT
DIS
H
1
M2 VD
ACT
L
L
ACT
ACT
L
L
L
L
ACT M3 TEST1
ACT M4 V2
ACT M5 VH
ACT M6 VL
M7 TEST2
—
J9 H2
ACT
VM
VM
VM
K1 OSCO
K2 MCKO
K3 VDD5
K7 VDD2
K8 RG
ACT ACT ACT
—
—
—
ACT ACT
L
—
—
M8 RST
ACT ACT ACT
ACT
ACT ACT ACT
L
L
ACT
L
L
ACT M9 WEN
N1 SEN1
L
L
K9 VSS2
L1 OSCI
L2 SSI1
L3 VSS4
L4 VM
—
DIS
H
1
ACT ACT ACT
ACT N2 HD
ACT
L
L
ACT ACT ACT
DIS
N3 VSS6
N4 V4
—
—
—
ACT
ACT
ACT
ACT
VM
VH
VH
VH
VM
VH
VH
VH
VL
VM
VL
N5 V1B
N6 V3B
N7 SUB
N8 SNCSL
L5 V1A
L6 V3A
L7 VSS1
L8 SSGSL
ACT
ACT
VH
VH
VH
VH
VM
VL
VL
—
ACT ACT ACT
ACT
ACT
L
ACT ACT ACT
ACT N9 ID/EXP
L
L
1 It is for output. For input, all items are "ACT".
Note) ACT means that the circuit is operating, and DIS means that loading is stopped.
L indicates a low output level, and H a high output level in the controlled status.
Also, VH, VM and VL indicate the voltage levels applied to VH (Pin M5), VM (Pin L4) and VL (Pin M6),
respectively, in the controlled status.
– 19 –
CXD3408GA
Timing Generator Block Serial Interface Control
The CXD3408GA's timing generator block basically loads and reflects the timing generator block serial
interface data sent in the following format in the readout portion at the falling edge of HD. Here, readout portion
specifies the horizontal period during which V1A/B and V3A/B, etc. take the ternary value.
Note that some items reflect the timing generator block serial interface data at the falling edge of VD or the
rising edge of SEN1.
00 01 02 03 04 05 06 07
41 42 43 44 45
46 47
SSI1
SCK1
SEN1
There are two categories of timing generator block serial interface data: CXD3408GA timing generator block
drive control data (hereafter "control data") and electronic shutter data (hereafter "shutter data").
The details of each data are described below.
– 20 –
CXD3408GA
Control Data
Data
Symbol
Function
Data = 0
Data = 1
RST
D00
to
D07
All
0
10000001 → Enabled
Other values → Disabled
CHIP
CTG
Chip enable
D08,
D09
All
0
Category switching
See D08 to D09 CTG.
D10
to
D12
All
0
MODE
Drive mode switching
See D10 to D12 MODE.
1
D13 SMD
Electronic shutter mode switching
0
0
OFF
OFF
ON
ON
1
D14 HTSG
HTSG control switching
D15,
D16
All
0
—
—
—
—
—
D17 NTPL
SSG function switching
0
NTSC
PAL
D18
to
D31
All
0
—
—
—
D32 FGOB
D33 EXP
Wide OBCLP generation switching
ID/EXP output switching
0
0
OFF
ID
ON
EXP
D34,
PTOB
D35
All
0
OBCLP waveform patterm switching
ADCLK logic phase adjustment
Standby control
See D34 to D35 PTOB.
See D36 to D37 LDAD.
See D38 to D39 STB.
1
0
D36,
LDAD
D37
D38,
STB
D39
All
0
D40
to
D47
All
0
—
—
—
—
1
See D13 SMD.
– 21 –
CXD3408GA
Shutter Data
Data
Symbol
Function
Data = 0
Data = 1
RST
D00
to
D07
10000001 → Enabled
Other values → Disabled
All
0
CHIP
CTG
SVD
Chip enable
D08,
D09
All
0
Category switching
See D08 to D09 CTG.
D10
to
D19
Electronic shutter vertical period
specification
All
0
See D10 to D19 SVD.
See D20 to D31 SHD.
See D32 to D41 SPL.
D20
to
D31
Electronic shutter horizontal period
specification
All
0
SHD
SPL
D32
to
D41
High-speed shutter position
specification
All
0
D42
to
D47
All
0
—
—
—
—
– 22 –
CXD3408GA
Detailed Description of Each Data
Shared data: D08 , D09 CTG [Category]
Of the data provided to the CXD3408GA by the serial interface, the CXD3408GA loads D10 and subsequent
data to each data register as shown in the table below according to the combination of D08 and D09 .
D09
0
D08
0
Description of operation
Loading to control data register
Loading to shutter data register
Test mode
0
1
1
X
Note that the CXD3408GA can apply these categories consecutively within the same vertical period. However,
care should be taken as the data is overwritten if the same category is applied.
Control data: D10 to D12 MODE [Drive mode]
The CXD3408GA timing generator block drive mode can be switched as follows. However, the drive mode bits
are located to the CXD3408GA and reflected at the falling edge of VD.
D12
0
D11
0
D10
0
Description of operation
Draft mode (default)
AF1 mode
D12
1
D11
0
D10
0
Description of operation
Draft mode
0
0
1
1
0
1
Frame mode (A field read out)
Frame mode (B field read out)
Test mode
0
1
0
AF2 mode
1
1
0
0
1
1
Frame mode
1
1
1
Draft mode is the pulse eliminator drive mode called octuple speed mode in the ICX406. This is a high frame
rate drive mode that can be used for purposes such as monitoring and auto focus (AF).
AF1 and AF2 modes are the pulse eliminator drive modes called by the same names in the ICX406. These
drive modes are based on draft mode, and are used to increase the frame rate for auto focus (AF). In these
modes, the screen is swept in the vertical direction and the center portion lines are cut out.
Frame mode is the ICX406 drive mode in which the data for all lines are read. This drive mode is comprised of
A and B Fields, so when it is established, repeated drive is performed in the manner of A → B → A → and so
on.
Frame mode (A or B Field) is the drive mode in which each field can be specified separately.
Control data: D17 NTPL [SSG function switching]
The CXD3408GA internal SSG output pattern can be switched as follows. However, the SSG function switching
bits are loaded to the CXD3408GA and reflected at the falling edge of VD.
D17
0
Description of Operation
NTSC equivalent pattern output
PAL equivalent pattern output
1
VD period in each pattern is defined as follows.
Frame mode
Draft mode
AF1 mode
AF2 mode
56H + 686ck
67H + 1178ck
112H + 1372ck
134H + 2354ck
NTSC equivalent pattern
PAL equivalent pattern
1012H + 1672ck 224H + 1372ck × 2
944H + 464ck
269H + 2039ck
See the Timing Charts for the actual operation.
– 23 –
CXD3408GA
Control data: D32 FGOB [Wide CLPOB generation]
This controls wide CLPOB generation during the vertical OPB period. See the Timing Charts for the actual
operation. The default is "OFF".
D32
0
Description of operation
Wide CLPOB generation OFF
Wide CLPOB generation ON
1
Control data: D34 , D35 PTOB [CLPOB waveform pattern]
This indicates the CLPOB waveform pattern. The default is "Normal".
D35
0
D34
0
Waveform pattern
(Normal)
(Shifted rearward)
0
1
(Shifted forward)
(Wide)
1
0
1
1
Control data: D36 , D37 LOAD [ADCLK logical phase]
This indicates the ADCLK logic phase adjustment data. The default is 90° relative to MCKO.
D37
0
D36 Degree of adjustment (°)
0
1
0
1
0
0
90
1
180
270
1
Control data: D38 , D39 STB [Standby]
The operating mode is switched as follows. However, the standby bits are loaded to the CXD3408GA and
control is applied immediately at the rising edge of SEN1.
D39
X
D38 Symbol
Operating mode
Normal operating mode
Sleep mode
0
1
1
CAM
SLP
STB
0
1
Standby mode
See the Pin Status Table for the pin status in each mode.
– 24 –
CXD3408GA
Control data/shutter data: [Electronic shutter]
The CXD3408GA realizes various electronic shutter functions by using control data D13 SMD and D14 HTSG
and shutter data D10 to D19 SVD, D20 to D31 SHD and D32 to D41 SPL.
These functions are described in detail below.
First, the various modes are shown below.
These modes are switched using control data D13 SMD.
D13
0
Description of operation
Electronic shutter stopped mode
Electronic shutter mode
1
The electronic shutter data is expressed as shown in the table below using D20 to D31 SHD as an example.
However, MSB (D31) is a reserve bit for the future specification, and it is handled as a dummy on this IC.
MSB
LSB
D31 D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20
X
0
0
1
1
1
0
0
0
0
1
1
↓
↓
↓
SHD is expressed as 1C3h .
1
C
3
[Electronic shutter stopped mode]
During this mode, all shutter data items are invalid.
SUB is not output in this mode, so the shutter speed is the accumulation time for one field.
[Electronic shutter mode]
During this mode, the shutter data items have the following meanings.
Symbol
SVD
Data
Description
D10 to D19 Number of vertical periods specification (000h ≤ SVD ≤ 3FFh)
D20 to D31 Number of horizontal periods specification (000h ≤ SHD ≤ 7FFh)
D32 to D41 Vertical period specification for high-speed shutter operation (000h ≤ SPL ≤ 3FFh)
SHD
SPL
Note) The bit data definition area is assured in terms of the CXD3408GA functions, and does not assure the
CCD characteristics.
The period during which SVD and SHD are specified together is the shutter speed. An image of the exposure
time calculation formula is shown below. In actual operation, the precise exposure time is calculated from the
operating frequency, VD and HD periods, decoding value during the horizontal period, and other factors.
(Exposure time) = SVD + {(number of HD per 1V) – (SHD + 1)}
Concretely, when specifying high-speed shutter, SVD is set to "000h". (See the figure.) During low-speed
shutter, or in other words when SVD is set to "001h" or higher, the serial interface data is not loaded until this
period is finished.
The vertical period indicated here corresponds to one field in each drive mode. In addition, the number of
horizontal periods applied to SHD can be considered as (number of SUB pulses – 1).
– 25 –
CXD3408GA
VD
SHD
SVD
V1A
SUB
WEN
EXP
SMD
SVD
SHD
1
1
002h
10Fh
000h
050h
Exposure time
Further, SPL can be used during this mode to specify the SUB output at the desired vertical period during the
low-speed shutter period.
In the case below, SUB is output based on SHD at the SPL vertical period out of (SVD + 1) vertical periods.
SPL
000
001
002
VD
SVD
SHD
V1A
SUB
WEN
EXP
SMD
SPL
SVD
SHD
1
1
001h
002h
10Fh
000h
000h
0A3h
Exposure time
Incidentally, SPL is counted as "000h", "001h", "002h" and so on in conformance with SVD.
Using this function it is possible to achieve smooth exposure time transitions when changing from low-speed
shutter to high-speed shutter or vice versa.
– 26 –
CXD3408GA
[HTSG control mode]
This mode controls the V1A/B and V3A/B ternary level outputs (readout pulse block) using D14 HTSG.
D14
0
Description of operation
Readout pulse (SG) normal operation
HTSG control mode
1
VD
V1A
SUB
Vck
WEN
EXP
HTSG
SMD
0
1
1
0
0
1
Exposure time
[EXP pulse]
The ID/EXP pin (N9) output can be switched between the ID pulse or the EXP pulse using D33 EXP. The
default is the "ID" pulse. See the Timing Charts for the ID pulse. The EXP pulse indicates the exposure time
when it is high. The transition point is the last SUB pulse falling edge, and midpoint value (1338ck) of each
V1A/B and V3A/B ternary out put falling edge. When there is no SUB pulse, the later ternary output falling
edge (1416ck) is used. See the EXP pulse indicated in the explanatory diagrams under [Electronic shutter] for
an image of operation.
Note that the above specification is based on draft mode. For frame mode, the former value is 1260ck and the
latter value is 1416ck.
– 27 –
CXD3408GA
1 7 1 9
1 5 4 7
1 7 1 5
1 7 1 3
1 7 1
1
1 7 0 9
1 7 2 0
1 7 1 8
1 7 1 6
1 7 1 4
1 7 1 2
– 28 –
CXD3408GA
1 7 1 7 1 7 1 3
1 7 1 0 1 7 0 6
1 7 1 7 1 7 1 3
1 7 1 0 1 7 0 6
– 29 –
CXD3408GA
– 30 –
CXD3408GA
– 31 –
CXD3408GA
– 32 –
CXD3408GA
– 33 –
CXD3408GA
– 34 –
CXD3408GA
– 35 –
CXD3408GA
2 8 4
2 5 2
2 2 0
1 8 8
1 5 6
1 2 4
1 2 9 2
1 2 6 0
1 2 0 2
1 2 0 0
1 1 6 8
1 1 3 6
1 1 0 4
– 36 –
CXD3408GA
1 8 0
1 6 4
1 4 8
1 3 2
1 7 2
1 5 6
1 4 0
1 2 4
1 0 8
9 2
6 1 1
1 0 0
8 4
6 8
7 6
6 0
1 4 1 6
1 3 5 8
1 2 0 2
1 3 5 6
1 3 2 4
1 2 9 2
1 2 6 0
1 2 0 0
1 1 6 8
1 1 3 6
1 1 0 4
– 37 –
CXD3408GA
3 0 8
2 9 2
2 7 6
2 6 0
2 4 4
2 2 8
2 1 2
1 9 6
1 8 0
1 6 4
1 4 8
1 3 2
3 0 0
2 8 4
2 6 8
2 5 2
2 3 6
2 2 0
2 0 4
1 8 8
1 7 2
1 5 6
1 4 0
1 2 4
1 0 8
9 2
6 1 1
1 0 0
8 4
6 8
7 6
6 0
1 5 6 8
1 5 5 2
1 5 3 6
1 5 2 0
1 5 0 4
1 4 8 8
1 4 7 2
1 4 5 6
1 5 6 0
1 5 4 4
1 5 2 8
1 5 1 2
1 4 9 6
1 4 8 0
1 4 6 4
1 4 4 8
1 4 1 6
1 3 5 8
1 3 5 6
1 3 2 4
1 2 9 2
1 2 6 0
1 2 0 2
1 2 0 0
1 1 6 8
1 1 3 6
1 1 0 4
– 38 –
CXD3408GA
– 39 –
CXD3408GA
– 40 –
CXD3408GA
CCD Signal Processor Block Serial Interface Control
The CXD3408GA's CCD signal processor block basically loads the CCD signal processor block serial interface
data sent in the following format at the rising edge of SEN2, and the setting values are then reflected to the
operation 6 ADCLKI clocks after that.
CCD signal processor block serial interface control requires clock input to ADCLKI in order to load and reflect
the serial interface data to operation, so this should normally be performed when the timing generator block is
in the normal operation mode.
00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15
SSI2
SCK2
SEN2
There are four categories of CCD signal processor block serial interface data: standby control data, PGA gain
setting data, OB clamp level setting data, and input pulse polarity setting data.
Note that when data from multiple categories is loaded consecutively, the data for the category loaded last is
valid and data from other categories is lost. When transferring data from multiple categories, raise SEN2 for
each category and wait until the setting value 6 ADCLKI clocks after that has been reflected to operation, then
transmit the next category.
The detail of each data are described below.
Standby Control Data
Data
Symbol
Function
Data = 0
Data = 1
D00 TEST
D01
Test code
Set to 0.
to
D03
CTG
Category switching
D01 to D03 CTG
Set to All 0.
D04
to
FIXED
—
D14
D15 STB
Standby control
Normal operating mode
Standby mode
PGA Gain Setting Data
Data
Symbol
Function
Data = 0
Data = 1
D00 TEST
D01
Test code
Set to 0.
to
D03
CTG
Category switching
—
D01 to D03 CTG
Set to All 0.
D04,
D05
FIXED
GAIN
D06
to
PGA gain setting data
See D06 to D15 GAIN.
D15
– 41 –
CXD3408GA
OB Clamp Level Setting Data
Data Symbol
Function
Data = 0
Data = 1
D00 TEST
D01
Test code
Set to 0.
to
D03
CTG
Category switching
—
D01 to D03 CTG
Set to All 0.
D04
to
D11
FIXED
OBLVL
D12
to
OB clamp level setting data
See D12 to D15 OBLVL.
D15
Input Pulse Polarity Setting Data
Data Symbol
Function
Data = 0
Data = 1
D00 TEST
D01
Test code
Set to 0.
to
CTG
Category switching
D01 to D03 CTG
D03
D04
to
D12
FIXED
POL
—
Set to All 0.
Set to All 0.
D13
to
Input pulse polarity setting data
D15
– 42 –
CXD3408GA
Detailed Description of Each Data
Shared data: D01 to D03 CTG [Category]
Of the data provided to the CXD3408GA by the CCD signal processor block serial interface, the CXD3408GA
loads D04 and subsequent data to each data register as shown in the table below according to the combination
of D01 to D03 .
D01 D02 D03
Description of operation
Loading to standby control data register
Loading to PGA gain setting data register
Loading to OB clamp level setting data register
Loading to input pulse polarity setting data register
Access prohibited
0
0
0
0
1
0
0
1
1
X
0
1
0
1
X
Standby control data: D15 STB [Standby]
The operating mode of the CCD signal processor block is switched as follows. When the CCD signal processor
block is in standby mode, only the serial interface is valid.
D15
0
Description of operation
Normal operating mode
Standby mode
1
PGA gain setting data: D06 to D15 GAIN [PGA gain]
The CXD3408GA can set the programmable gain amplifier (PGA) gain from –6dB to +42dB in 1024 steps by
using PGA gain setting data D06 to D15 GAIN.
The PGA gain setting data is expressed as shown in the table below using D06 to D15 GAIN.
MSB
LSB
D06 D07 D08 D09 D10 D11 D12 D13 D14 D15
0
1
1
1
0
0
0
0
1
1
↓
↓
↓
GAIN is expressed as 1C3h .
1
C
3
For example, when GAIN is set to "000h", "080h", "220h", "348h" and "3FFh", the respective PGA gain setting
values are –6dB, 0dB, +20dB, +34dB and +42dB.
– 43 –
CXD3408GA
OB clamp level setting data: D12 to D15 OBLVL [OB clamp level]
The CXD3408GA can set the OPB clamp output value from 0 to 60LSB in 4LSB steps by using CCD signal
processor block control data D12 to D15 OBLVL.
The OPB clamp output setting data is expressed as shown in the table below using D12 to D15 OBLVL.
MSB
LSB
D12 D13 D14 D15
0
1
1
0
↓
OBLVL is expressed as 6h .
6
For example, when OBLVL is set to "0h", "1h", "8h" and "Fh", the respective OPB clamp output setting values
are 0LSB, 4LSB, 32LSB and 60LSB.
– 44 –
CXD3408GA
S C K 2
S E N 2
S S I 2
C 9
C 8
C 7
F µ 0 . 1
F µ 0 . 1
F µ 0 . 1
S C K 1
S E N 1
S S I 1
A D C L K I
A D C L K
C L P O B
C L P D M
T E S
T E S
T E S
T E S
T E S
P B L K
X S H D
X S H P
C L P O B I
C L P D M I
P B L K I
O S C I
X S H D I
X S H P I
O S C
C K I
– 45 –
CXD3408GA
Notes on Operation
1. Be sure to start up the timing generator block VL and VH pin power supplies at the timing shown in the
figure below in order to prevent the SUB pin of the CCD image sensor from going to negative potential. In
addition, start up the timing generator block VDD1, VDD2, VDD3, VDD4 and VDD5 pin and CCD signal processor
block DVDD1, DVDD2, AVDD1, AVDD2, AVDD3, AVDD4 and AVDD5 pin power supplies at the same time either
before or at the same time as the VH pin power supply is started up.
15.0V
t1
20%
0V
20%
t2
–7.5V
t2 ≥ t1
2. Reset the timing generator block and CCD signal processor block during power-on. The timing generator
block is reset by inputting the reset signal to the RST pin. The CCD signal processor block is reset by
initializing the serial data.
3. Separate the timing generator block VDD1, VDD2, VDD3, VDD4 and VDD5 pins from the CCD signal processor
block DVDD1, DVDD2, AVDD1, AVDD2, AVDD3, AVDD4 and AVDD5 pins.
Also, the ADC output driver stage is connected to the dedicated power supply pin DVDD1. Separating this
pin from other power supplies is recommended to avoid affecting the internal analog circuits.
4. The difference in potential between the timing generator block VDD4 pin supply voltage 3 VDDc and the CCD
signal processor block DVDD1, DVDD2, AVDD1, AVDD2, AVDD3, AVDD4 and AVDD5 pin supply voltages 1 VDDe,
2 VDDf and 3 VDDg should be 0.1V or less.
5. The timing generator block and CCD signal processor block ground pins should use a shared ground which
is connected outside the IC. When the set ground is divided into digital and analog blocks, connect the
timing generator block ground pins to the digital ground and the CCD signal processor block ground pins to
the analog ground. The difference in potential between the timing generator block VSS1, VSS2, VSS3, VSS4,
VSS5, VSS6 and VM and the CCD signal processor block DVSS1, DVSS2, DVSS3, AVSS1, AVSS2, AVSS3, AVSS4,
AVSS5 and AVSS6 should be 0.1V or less.
6. Do not perform serial communication with the CCD signal processor block during the effective image
period, as this may cause the picture quality to deteriorate. In addition, using SCK2, SSI2 and SEN2, which
are used by the CCD signal processor block, use of the dedicated ports is recommended. When using
these pins as shared ports with the timing generator block or other ICs, be sure to thoroughly confirm the
effects on picture quality before use.
– 46 –
CXD3408GA
Package Outline
Unit: mm
0.2
S
A
96PIN LFLGA
Oita Ass'y
8.0
X
PIN 1 INDEX
1.3 MAX
0.10MAX
x4
0.15
DETAIL X
96 -φ0.45 ± 0.05
(0.3)
0.5
0.8
A
S
A B
φ0.08 M
N
M
L
K
J
B
H
G
F
E
D
C
B
3 – φ0.50
A
1
2
3 4 5 6 7 8 9
PACKAGE STRUCTURE
0.5
(0.3)
0.8
0.5
PACKAGE MATERIAL
TERMINAL TREATMENT
TERMINAL MATERIAL
PACKAGE MASS
ORGANIC SUBSTRATE
GOLD PLATING
NICKEL PLATING
0.3 g
LFLGA-96P-02
SONY CODE
EIAJ CODE
P-LFLGA96-12X8-0.8
JEDEC CODE
0.2
S
A
96PIN LFLGA
HITACHI TOKYO Ass'y
8.0
X
PIN 1 INDEX
1.3 MAX
0.10MAX
x4
0.15
DETAIL X
96 -φ0.45 ± 0.05
(0.3)
0.5
0.8
A
M
S A B
φ0.08
N
M
L
K
J
B
H
G
F
E
D
C
B
3 – φ0.50
A
1
2
3 4 5 6 7 8 9
PACKAGE STRUCTURE
0.5
(0.3)
0.8
0.5
PACKAGE MATERIAL
TERMINAL TREATMENT
TERMINAL MATERIAL
PACKAGE MASS
ORGANIC SUBSTRATE
NICKEL & GOLD PLATING
COPPER
LFLGA-96P-051
P-LFLGA96-12.0X8.0-0.8
SONY CODE
EIAJ CODE
JEDEC CODE
0.3g
– 47 –
Sony Corporation
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