ESDALC6V1PX

更新时间:2024-10-29 05:56:08
描述:ASD (Application Specific Devices) Low capacitance TRANSIL⑩ arrays for ESD protection

ESDALC6V1PX 概述

ASD (Application Specific Devices) Low capacitance TRANSIL⑩ arrays for ESD protection ASD (专用设备)的低电容TRANSIL⑩阵列的ESD保护

ESDALC6V1PX 数据手册

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ESDALC6V1Px  
ASD (Application Specific Devices)  
Low capacitance TRANSIL™ arrays for ESD protection  
Main applications  
Where transient overvoltage protection in ESD  
sensitive equipment is required, such as:  
Computers  
SOT663  
SOT665  
SOT666IP  
Marking  
Printers  
Communication systems  
Cellular phone handsets and acessories  
Wireline and wireless telephone sets  
Set top boxes  
Order code  
Part number  
ESDALC6V1P3  
ESDALC6V1P5  
ESDALC6V1P6  
A2  
A1  
D
Features  
2 to 4 unidirectional Transil functions  
Breakdown voltage V = 6.1 V min.  
ESDALC6V1P3 functional diagram  
ESDALC6V1P5 functional diagram  
ESDALC6V1P6 functional diagram  
BR  
Low leakage current < 100 nA  
Low capacitance (7.5 pF @ 3 V)  
2
Very small PCB area < 2.6 mm  
Description  
The ESDALC6V1Px are monolithic suppressors  
designed to protect components connected to  
data and transmission lines against ESD.  
These devices clamp the voltage just above the  
logic level supply for positive transients and to a  
diode drop below ground for negative transients.  
Benefits  
High ESD protection level  
High integration  
Complies with the following standards:  
IEC61000-4-2 level 4:  
15 kV(air discharge)  
8 kV(contact discharge)  
MIL STD 883E-Method 3015-7: class3  
25 kV HBM (Human Body Model)  
TM: TRANSIL is a trademark of STMicroelectronics  
October 2006  
Rev 3  
1/9  
www.st.com  
9
Characteristics  
ESDALC6V1Px  
1
Characteristics  
Table 1.  
Symbol  
Absolute ratings (T  
= 25° C)  
amb  
Parameter  
Value  
Unit  
IEC 61000-4-2 contact discharge  
IEC 61000-4-2 air discharge  
8
(1)  
VPP  
Peak pulse voltage  
kV  
15  
PPP  
Tj  
Peak pulse power (8/20 µs)(1) Tj initial = Tamb  
30  
W
Junction temperature  
150  
°C  
Tstg  
TL  
Storage temperature range  
-55 to +150 °C  
260 °C  
-40 to +150 °C  
Maximum lead temperature for soldering during 10 s  
Operating temperature range  
Top  
1. For a surge greater than the maximum values, the diode will fail in short-circuit.  
Table 2.  
Symbol  
Electrical characteristics (T  
= 25° C)  
amb  
Parameter  
Stand-off voltage  
I
VRM  
VBR  
VCL  
IRM  
IPP  
αT  
IF  
Breakdown voltage  
Clamping voltage  
VF  
Leakage current  
VCLVBR VRM  
V
IRM  
Peak pulse current  
Voltage temperature coefficient  
Forward voltage drop  
Capacitance  
VF  
Slope: 1/Rd  
C
IPP  
Rd  
Dynamic resistance  
VBR@ IR  
IRM @ VRM  
max.  
Rd  
αT  
typ.  
C
Part Number  
min.  
V
max.  
V
typ.  
typ.@ 3V  
pF  
mA  
µA  
V
10-4/°C  
ESDALC6V1P3  
ESDALC6V1P5  
ESDALC6V1P6  
6.1  
7.2  
1
0.1  
3
1.5  
4.5  
7.5  
2/9  
ESDALC6V1Px  
Characteristics  
Figure 1.  
Peak power dissipation versus  
initial junction temperature  
Figure 2.  
Peak pulse power versus  
exponential pulse duration  
(T initial = 25° C)  
j
PPP[Tj initial] / PPP [Tj initial=25°C]  
P
(W)  
PP  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1000  
100  
10  
Tj initial = 25°C  
t (µs)  
p
Tj(°C)  
0
25  
50  
75  
100  
125  
150  
175  
1
10  
100  
Figure 3.  
Clamping voltage versus peak  
pulse current (typical values,  
rectangular waveform)  
Figure 4.  
Forward voltage drop versus peak  
forward current (typical values)  
I
(A)  
I (A)  
FM  
PP  
1.E+00  
1.E-01  
1.E-02  
100.0  
10.0  
1.0  
t
p
= 2.5µs  
initial = 25°C  
T
j
Tj = 125°C  
Tj = 25°C  
V
(V)  
V
(V)  
CL  
FM  
1.E-03  
0.0  
0.1  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
0
10  
20  
30  
40  
50  
60  
70  
Figure 5.  
Junction capacitance versus  
reverse applied voltage (typical  
values)  
Figure 6.  
Relative variation of leakage  
current versus junction  
temperature (typical values)  
IR [Tj] / IR [Tj=25°C]  
C(pF)  
1.E+04  
1.E+03  
1.E+02  
1.E+01  
1.E+00  
13  
12  
11  
10  
9
VR =3 V  
F=1MHz  
VOSC=30mVRMS  
Tj=25°C  
8
7
6
5
4
3
2
V (V)  
R
1
0
0
Tj(°C)  
1
2
3
4
5
6
25  
50  
75  
100  
125  
150  
3/9  
Ordering information scheme  
ESDALC6V1Px  
Figure 7.  
ESD response to IEC 61000-4-2 (air Figure 8.  
discharge 15 kV positive surge)  
Analog crosstalk measurement  
10 V per div.  
dB  
0.00  
-10.00  
-20.00  
-30.00  
-40.00  
-50.00  
-60.00  
-70.00  
-80.00  
-90.00  
-100.00  
F (Hz)  
100.0k  
1.0M  
10.0M  
100.0M  
1.0G  
0.1 µs per division  
Figure 9.  
Digital crosstalk test measurement  
5 V per div.  
V
G1  
β
V
21 G1  
0.1 µs per div.  
2
Ordering information scheme  
ESDA LC 6V1 Px  
ESD Array  
Low Capacitance  
Breakdown Voltage (min)  
6V1 = 6.1 Volt  
Package  
P3 = SOT-663 (SC89-3L)  
P5 = SOT-665  
P6 = SOT-666IP (internal pad)  
4/9  
ESDALC6V1Px  
Package information  
3
Package information  
Table 3.  
SOT-663 dimensions  
Dimensions  
Millimeters  
Ref.  
Inches  
Min. Typ. Max. Min. Typ. Max.  
A
D
b
A
D
E
0.60 0.70 0.80 0.024 0.028 0.031  
1.40 1.60 1.80 0.055 0.063 0.071  
0.75 0.85 0.95 0.030 0.033 0.037  
HE 1.50 1.60 1.70 0.059 0.063 0.067  
0.39 0.015  
L2 0.44 0.47 0.50 0.017 0.018 0.020  
alpha  
HE  
E
L
L
L2  
e
c
b
e
0.08 0.13 0.18 0.003 0.005 0.007  
0.22 0.27 0.37 0.009 0.011 0.015  
c
2xe  
0.50  
0.020  
2xe 0.90 1.00 1.10 0.035 0.040 0.043  
4° 7° 4° 7°  
α
Figure 10. SOT-663 footprint (dimensions in mm)  
5/9  
Package information  
Table 4.  
ESDALC6V1Px  
SOT-665 dimensions  
Dimensions  
Millimeters  
Ref.  
Inches  
Min.  
Max.  
Min.  
Max.  
bp  
A
BP  
C
0.50  
0.17  
0.08  
1.50  
1.10  
1.00  
0.50  
1.50  
0.10  
0.60  
0.27  
0.18  
1.70  
1.30  
0.020  
0.007  
0.003  
0.060  
0.043  
0.040  
0.020  
0.059  
0.004  
0.024  
0.011  
0.007  
0.067  
0.051  
D
E
A
Lp  
D
He  
C
E
e
e1  
He  
Lp  
1.70  
0.30  
0.067  
0.012  
e1  
e
Figure 11. SOT-665 footprint (dimensions in mm)  
6/9  
ESDALC6V1Px  
Package information  
Table 5.  
SOT-666IP dimensions  
Dimensions  
Millimeters  
Min. Typ. Max. Min. Typ. Max.  
Ref.  
Inches  
b1  
L1  
L3  
L4  
A
0.45  
0.60 0.018  
0.18 0.003  
0.34 0.007  
0.024  
0.007  
0.013  
A3 0.08  
0.17  
b
b
D
E1  
E
b1 0.19 0.27 0.34 0.007 0.011 0.013  
D
E
1.50  
1.50  
1.70 0.059  
1.70 0.059  
1.30 0.043  
0.067  
0.067  
0.051  
A
L2  
E1 1.10  
A3  
e
0.50  
0.19  
0.020  
0.007  
L1  
L2 0.10  
0.30 0.004  
0.012  
e
L3  
L4  
0.10  
0.60  
0.004  
0.024  
Figure 12. SOT-666IP footprint (dimensions in mm)  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com.  
7/9  
Ordering information  
ESDALC6V1Px  
Delivery mode  
4
Ordering information  
Part number  
Marking  
Package  
Weight  
Base qty  
ESDALC6V1P3  
ESDALC6V1P5  
ESDALC6V1P6  
A2  
A1  
D
SOT663  
SOT665  
2.9 mg  
2.9 mg  
2.9 mg  
3000  
3000  
3000  
Tape and reel  
Tape and reel  
Tape and reel  
SOT666IP  
5
Revision history  
Date  
Revision  
Description of changes  
ESDALC6V1P3, ESDALC6V1P5, and ESDALC6V1P6  
merged and reformatted to current standards.  
16-Aug-2006  
1
Table 1 on page 2:  
23-Aug-2006  
11-Oct-2006  
2
3
Temperature range upgraded to Tj max = 150° C  
Added values for VPP in Table 1.  
8/9  
ESDALC6V1Px  
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9/9  

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