ST33HTPH2E32AHC0 [STMICROELECTRONICS]
Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface;
| 型号： | ST33HTPH2E32AHC0 |
| 厂家： | 
ST |
| 描述： | Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface |
| 文件： | 总26页 (文件大小：440K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ST33TPHF2ESPI
Data brief
Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI
interface
Features
TPM features
•
•
Flash-memory-based Trusted Platform Module (TPM)
Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0
command set
VFQFPN32
(5 × 5 mm)
TSSOP28
(9.7 × 6.4 mm,
4.4 mm body width)
•
•
Supporting dynamic switch from one mode to another and capability to lock one
mode irreversibly
For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform
Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client
Specific TPM Interface Specifications 1.3
•
For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform
Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC
Client Specific TPM Platform Specifications 1.03
•
•
TPM firmware code can be upgraded thanks to a persistent Flash-memory
loader application to support new standard evolutions
Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0
protection profiles at EAL4+
•
•
•
FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0
SPI support for up to 33 MHz in FIFO and CRB protocol modes
Support for software and hardware physical presence for TPM 1.2 and TPM 2.0
Hardware features
Product status link
•
•
•
•
•
•
Arm® SecurCore® SC300™ 32-bit RISC core
Highly reliable Flash memory technology
ST33TPHF2ESPI
Extended temperature range: −40 °C to 105 °C
ESD (electrostatic discharge) protection up to 4 kV (HBM)
1.8 V or 3.3 V supply voltage range
STSAFE-TPM
28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack
ECOPACK packages
Security features
•
•
Active shield and environmental sensors
Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2
and TPM 2.0 modes
•
•
•
Monitoring of environmental parameters (power)
Hardware and software protection against fault injection
FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an
AIS-31 Class PTG2 compliant true random number generator (TRNG)
•
Cryptographic algorithms:
–
–
–
–
–
RSA key generation (1024 or 2048 bits)
RSA signature and encryption
HMAC SHA-1 & SHA-256
AES-128-192-256
ECC 224 & 256 bits
DB2716 - Rev 4 - November 2019
www.st.com
For further information contact your local STMicroelectronics sales office.
ST33TPHF2ESPI
Product compliance
•
•
TPM 1.2 compliant with Microsoft® Windows® 7, 8.1 and 10
TPM 2.0 compliant with Microsoft Windows 10
•
•
Compliant with Intel® TXT for TPM1.2 and TPM 2.0 in SPI FIFO mode
TPM 1.2 and TPM 2.0 compliant with the respective TCG test suites
DB2716 - Rev 4
page 2/26
ST33TPHF2ESPI
Description
1
Description
The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions
for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.
It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services
to protect the confidentiality, integrity and authenticity of information and devices.
These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM
ecosystem software solutions.
The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against
advanced forms of attack.
The ST33TPHF2ESPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM
Profile specifications.
The ST33TPHF2ESPI supports two exclusive modes that support either TPM 1.2 or TPM 2.0 commands. The
product can be locked irreversibly in TPM 1.2 or TPM 2.0 mode during provisioning, or only after provisioning to
provide a smooth migration between TPM 1.2 and TPM 2.0.
The ST33TPHF2ESPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage
of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.
Note:
Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
DB2716 - Rev 4
page 3/26
ST33TPHF2ESPI
Data brief scope
2
Data brief scope
2.1
ST33TPHF2ESPI products
This document covers the functionality of the ST33TPHF2ESPI product family, the most recent of which has
firmware version 49.40 (73.64 in decimal) preloaded on ST TPM hardware with markings:
•
PEAHD0
The information to order the supporting platforms is provided in Section 8 Ordering information.
2.2
Firmware image
The firmware image version 49.40 can be loaded to the ST TPM hardware of the ST33TPHF2ESPI products,
identifiable by their firmware version, which is of the form 49.xx. The ordering codes of the products upgradable to
firmware version 49.40 are the following:
•
•
•
ST33HTPH2ExxAAF0 and ST33HTPH2ExxAAF1 (FW 49.00)
ST33HTPH2ExxAHB3 and ST33HTPH2ExxAHB4 (FW 49.04)
ST33HTPH2ExxAHC0 (FW 49.08)
See Section 9 Firmware image overview for an overview of the available firmware images.
DB2716 - Rev 4
page 4/26
ST33TPHF2ESPI
Pin and signal description
3
Pin and signal description
The two figures below give the pinouts of the two packages in which the devices are delivered. The table
describes the associated signals.
Figure 1. TSSOP28 pinout
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NiC
NiC
NiC
GND
NiC
GPI
PP
NiC
2
NiC
3
MISO
NiC
4
5
VPS
6
MOSI
SPI_CS
SPI_CLK
SPI_PIRQ
NiC
7
TSSOP28
8
NiC
NiC
NiC
NiC
NiC
NiC
NiC
9
10
11
12
13
14
NiC
NiC
SPI_RST
NiC
Figure 2. VQFN32 pinout
32 31 30 29 28 27 26 25
1
2
3
4
5
6
7
8
24
23
NiC
GND
NiC
NiC
NiC
GPI
PP
MISO
NiC
22
VPS
VQFN32
21
MOSI
NiC 33
20
SPI_CS
SPI_CLK
SPI_PIRQ
SPI_RST
19
18
17
NiC
9
10 11 12 13 14 15 16
Table 1. Pin descriptions
Signal
VPS
GND
Type
Input
Input
Description
Power supply. This pin must be connected to 1.8 V or 3.3 V DC power rail supplied by the motherboard.
GND has to be connected to the main motherboard ground.
SPI Reset, active low, used to re-initialize the device. Must not be unconnected. External pull-up resistor
required if it cannot be driven.
SPI_RST Input
MISO
MOSI
Output SPI Master Input, Slave Output (output from slave)
Input
SPI Master Output, Slave Input (output from master)
SPI Serial Clock (output from master)
SPI_CLK Input
SPI_CS Input
SPI Chip (or Slave) Select, internal pull-up (active low; output from master)
DB2716 - Rev 4
page 5/26
ST33TPHF2ESPI
Pin and signal description
Signal
Type
Description
SPI_PIRQ Output SPI IRQ, active low, open drain, used by TPM to generate an interrupt
PP
Input
Input
Physical Presence, active high, internal pull-down. Used to indicate Physical Presence.
Used for activation and deactivation of the TPM Standby mode (TPMLowPowerByGPIO). If this feature
is not used, connect an external pull-up resistor (10 kΩ) to this pad.
GPI
Not internally connected: not connected to the die. May be left unconnected but no impact on TPM if
connected.
NiC
-
Note:
The VQFN32 package has a central pad (PIN33) on the bottom, which is not connected to the die. This pin does
not impact the TPM, be it connected or not.
DB2716 - Rev 4
page 6/26
ST33TPHF2ESPI
Integration guidance
4
Integration guidance
4.1
Typical hardware implementation
The Physical Presence (PP) pin should be connected if platform implementation (at boot level) uses a hardware
physical presence function.
The figure below shows the hardware implementation in the case of the TSSOP28 package. The same
implementation is also valid for the TSSOP28 and QFN32 packages.
Figure 3. Typical hardware implementation (TSSOP28 package)
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NC
NC
NC
GND
NC
GPI
PP
NC
NC
3
MISO
MISO
NC
VPS
4
GND
VPS
10 kΩ
(optional)
5
VPS
6
MOSI
GPI (opt)
PP (opt)
MOSI
SPI_CS
SPI_CLK
SPI_PIRQ
NC
7
SPI_CS
SPI_CLK
SPI_PIRQ
100 nF
10 µF
8
NC
NC
NC
NC
NC
NC
NC
9
10
11
12
13
14
NC
NC
SPI_RST
SPI_RST
NC
DB2716 - Rev 4
page 7/26
ST33TPHF2ESPI
Power supply filtering
4.2
Power supply filtering
As mentioned in Section 3 Pin and signal description, the power supply of the circuit must be filtered using the
circuit shown in the figure below.
Figure 4. Mandatory filtering capacitors on VPS
Host device
SPI_MISO
SPI_MOSI
SPI_CLK
SPI_RST
SPI_CS
SPI_PIRQ
TPM
VPS
10 µF
100 nF
+
-
GND
1.
10 µF and 100 nF are recommended values. The minimum required capacitor value is 2.1 µF (2 µF in
parallel with 100 nF).
DB2716 - Rev 4
page 8/26
ST33TPHF2ESPI
Package information
5
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
5.1
TSSOP28 package information
TSSOP28 is a 28-pin, 9.7 × 6.4 mm, 4.4 mm body width, 0.65 mm pitch, thin shrink small outline package.
Unless otherwise specified, general tolerance is ± 0.1 mm.
Figure 5. TSSOP28 - outline
D
28
15
14
c
E1 E
1
k
A1
L
A
A2
L1
aaa
b
e
1.
Drawing is not to scale.
Table 2. TSSOP28 - mechanical data
millimeters
inches (1)
Symbol
Min.
Typ.
-
Max.
1.200
0.150
1.050
0.300
0.200
9.800
6.600
4.500
-
Min.
-
Typ.
-
Max.
A
A1
A2
b
-
0.0472
0.0059
0.0413
0.0118
0.0079
0.3858
0.2598
0.1772
-
0.050
0.800
0.190
0.090
9.600
6.200
4.300
-
-
0.0020
0.0315
0.0075
0.0035
0.3780
0.2441
0.1693
-
-
1.000
-
0.0394
-
c
-
-
D
9.700
6.400
4.400
0.650
0.600
1.000
0.3819
0.2520
0.1732
0.0256
0.0236
0.0394
E
E1
e
L
0.450
-
0.750
-
0.0177
-
0.0295
-
L1
DB2716 - Rev 4
page 9/26
ST33TPHF2ESPI
TSSOP28 package information
inches (1)
millimeters
Symbol
Min.
0°
Typ.
Max.
8°
Min.
0°
Typ.
Max.
8°
k
-
-
-
-
aaa
-
0.100
-
0.0039
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 6. TSSOP28 - recommended footprint
0.3
28
15
6.4
4.4
1
14
1.0
0.65
8.75
1.
All dimensions are in millimeters.
DB2716 - Rev 4
page 10/26
ST33TPHF2ESPI
VFQFPN32 package information
5.2
VFQFPN32 package information
VFQFPN32 is a 32-lead, 5 × 5 mm, 0.5 mm pitch, very thin fine pitch quad flat pack no-lead package.
Figure 7. VFQFPN32 - outline
Seating plane
C
ddd
C
A
A1
A3
D
e
16
9
17
8
b
E
E2
24
1
L
32
Pin # 1 ID
R = 0.30
D2
L
Bottom view
1.
Drawing is not to scale.
Table 3. VFQFPN32 - mechanical data
millimeters
inches (1)
Typ.
Symbol
Min.
Typ.
0.900
Max.
1.000
Min.
0.0315
Max.
A
A1
0.800
0.000
-
0.0354
0.0394
0.0020
-
0.020
0.200
0.250
5.000
3.600
0.050
-
0.0000
-
0.0008
0.0079
0.0098
0.1969
0.1417
A3
b
0.180
4.850
3.500
0.300
5.150
3.700
0.0071
0.1909
0.1378
0.0118
0.2028
0.1457
D
D2
DB2716 - Rev 4
page 11/26
ST33TPHF2ESPI
VFQFPN32 package information
inches (1)
millimeters
Typ.
Symbol
Min.
4.850
Max.
5.150
Min.
0.1909
Typ.
0.1969
Max.
0.2028
E
5.000
3.600
0.500
0.400
-
E2
e
3.500
3.700
-
0.1378
0.1417
0.0197
0.0157
-
0.1457
-
-
-
L
0.300
-
0.500
0.050
0.0118
-
0.0197
0.0020
ddd
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 8. VFQFPN32 - recommended footprint
5.30
3.80
0.60
24
32
25
1
3.45
0.50
8
0.30
17
9
16
0.75
All dimensions are in millimeters.
DB2716 - Rev 4
page 12/26
ST33TPHF2ESPI
Thermal characteristics of packages
5.3
Thermal characteristics of packages
The table below provides the thermal characteristics of the TSSOP28 and VFQFPN32 packages.
Table 4. Thermal characteristics
Parameter
Ambient temperature
Symbol
Value
T
−40 to 105 °C
-
A
T
Recommended operating temperature range
Case temperature
C
T
Junction temperature
−43 to 108 °C
125 °C
J
Absolute maximum junction temperature
Maximum power dissipation
-
-
63 mW
35.8 at 0 lfpm (1)
θ
Junction to ambient thermal resistance
Junction to case thermal resistance
Junction to board thermal resistance
JA
1.48 at 0 lfpm(1)
13.9 at 0 lfpm(1)
θ
Theta-JA, -JB and -JC
JC
θ
JB
1. Linear feet per minute.
DB2716 - Rev 4
page 13/26
ST33TPHF2ESPI
Delivery packing
6
Delivery packing
Surface-mount packages can be supplied with tape and reel packing. The reels have a 13" typical diameter.
Reels are in plastic, either anti-static or conductive, with a black conductive cavity tape. The cover tape is
transparent anti-static or conductive.
The devices are positioned in the cavities with the identifying pin (normally Pin “1”) on the same side as the
sprocket holes in the tape.
The STMicroelectronics tape and reel specifications are compliant to the EIA 481-A standard specification.
Table 5. Packages on tape and reel
Package
Description
Tape width Tape pitch
Reel diameter
13 in.
Quantity per reel
TSSOP 28
Thin shrink small outline package
16 mm
12 mm
8 mm
8 mm
2500
3000
VFQFPN 32
Very thin fine pitch quad flat pack no-lead package
13 in.
Figure 9. Reel diagram
T
B
A
N
C
D
G
Table 6. Reel dimensions
Reel size
Tape width
A Max.
330
B Min.
1.5
C
D Min.
20.2
G Max.
16.4 +2/–0
12.6
N Min.
T Max.
22.4
18.4
Unit
mm
16
12
13”
13 ±0.2
100
DB2716 - Rev 4
page 14/26
ST33TPHF2ESPI
Delivery packing
Figure 10. Embossed carrier tape for VFQFPN 5 × 5 mm
P0
P2
E
Y
T
D
D1
F
W
B0
Y
K0
P
A0
Section Y - Y
User direction of feed
1.
Drawing is not to scale.
Figure 11. Chip orientation in the embossed carrier tape for VFQFPN 5 × 5 mm
User direction of feed
Table 7. Carrier tape dimensions for VFQFPN 5 × 5 mm
Package
A0
B0
K0
D1 Min.
P
P2
D
P0
E
F
W
T Max. Unit
VFQFPN 5×5 5.25 ±0.1 5.25 ±0.1 1.1 ±0.1 1.5
8 ±0.1 2 ±0.1 1.55 ±0.05 4 ±0.1 1.75 ±0.1 5.5 ±0.1 12 ±0.3 0.3 ±0.05 mm
DB2716 - Rev 4
page 15/26
ST33TPHF2ESPI
Delivery packing
Figure 12. Embossed carrier tape for TSSOP28 4.4 mm body width
Po
K
T
P2
D
Top
Cover
Tape
E
F
Ao
W
Bo
B1
Bo
P
Ko
D1
User direction of feed
1.
Drawing is not to scale.
Figure 13. Chip orientation in the embossed carrier tape for TSSOP28 4.4 mm body width
Typical
User direction of feed
Table 8. Carrier tape constant dimensions for TSSOP 4.4 mm body width
Ao, Bo, Ko (1)
See note.
Tape size
16 mm
D
E
Po
4 ±0.1
T Max.
Unit
1.5 +0.1 / −0
1.75 ±0.1
0.4
mm
1. Ao, Bo, Ko, are determined by components sizes. The clearance between the component and the cavity
must be within 0.05 mm (Min.) to 0.90 mm (Max.)
DB2716 - Rev 4
page 16/26
ST33TPHF2ESPI
Package marking information
7
Package marking information
The two figures below illustrate the typical markings of the TSSOP28 and the VQFN32 device packages,
respectively.
Figure 14. TSSOP28 device package marking area
A: Marking area
B: Assembly plant
C: BE sequence
D: Diffusion plant
E: Assembly year
F: Assembly week
G: ECOPACK level
H: ST logo
A
B
C
D
E
F
H
J
a
G
J: Marking area - 2 digits
a: Dot
Figure 15. VQFN32 device package marking area
A: Marking area
B: Assembly plant
C: BE sequence
D: Diffusion plant
E: Country of origin
F: Assembly year
G: Assembly week
H: ECOPACK
A
B
E
C
D
F
G
I
J
H
I: ST logo
J: Marking area - 2 digits
K: Dot
K
For both packages, the 6-digit ‘A’ marking area is equal to "PXYZZZ", with:
•
•
Y = Hardware revision
ZZZ = Product identifier
DB2716 - Rev 4
page 17/26
ST33TPHF2ESPI
Ordering information
8
Ordering information
Table 9. Ordering information for ST33TPHF2ESPI products
Operating
temperature
range (1)
Default TPM libraryTPM 2.0
library revision & firmware
version
Maximum
SPI clock
frequency
Marking
area A
Ordering code
Package
Product status
ST33HTPH2E28AHD0
ST33HTPH2E32AHD0
ST33HTPH2E28AHC0
TSSOP28
VQFN32
TPM 2.0 active Rev 1.38
0x00 0x49 0x00 0x40
−40 °C to
+105 °C
33 MHz
33 MHz
PEAHD0
PEAHC0
Active
TSSOP28
NRND (not
recommended for new
design)
TPM 2.0 active Rev 1.38
0x00 0x49 0x00 0x08
−40 °C to
+105 °C
ST33HTPH2E32AHC0
ST33HTPH2E28AAF0
ST33HTPH2E32AAF0
ST33HTPH2E28AAF1
ST33HTPH2E32AAF1
ST33HTPH2E28AHB3
ST33HTPH2E32AHB3
ST33HTPH2E28AHB4
ST33HTPH2E32AHB4
VQFN32
TSSOP28
VQFN32
TSSOP28
VQFN32
TSSOP28
VQFN32
TSSOP28
VQFN32
NRND (not
recommended for new
design)
TPM 1.2 active Rev 1.16
0x01 0x02 0x49 0x00
−40 °C to
+105 °C
33 MHz
33 MHz
33 MHz
33 MHz
P68HAAF0
P68HAAF1
P68HAHB3
P68HAHB4
NRND (not
recommended for new
design)
TPM 2.0 activeRev 1.16
0x00 0x49 0x00 0x00
−40 °C to
+105 °C
NRND (not
recommended for new
design)
TPM 1.2 active Rev 1.16
0x01 0x02 0x49 0x04
−40 °C to
+105 °C
NRND (not
recommended for new
design)
TPM 2.0 active Rev 1.16
0x00 0x49 0x00 0x04
−40 °C to
+105 °C
1. Refer to Section 1 Description for the operating voltages associated with the different operating
temperature ranges.
DB2716 - Rev 4
page 18/26
ST33TPHF2ESPI
Firmware image overview
9
Firmware image overview
Table 10. Firmware image overview for the ST33TPHF2ESPI products
TPM 2.0 library
revision
Firmware version Firmware version (TPM capability)
Product status
73.00
73.04
73.20
73.08
73.64
0x00 0x49 0x00 0x00
0x00 0x49 0x00 0x04
0x00 0x49 0x00 0x14
0x00 0x49 0x00 0x08
0x00 0x49 0x00 0x40
1.16
NRND (not recommended for new design)
NRND (not recommended for new design)
Active
1.16
1.16
1.38
1.38
NRND (not recommended for new design)
Active
Table 11. Commercial product supporting the update with firmware image version 73.20
xx = 28 for products delivered in TSSOP28, and 32 for products delivered in QFN32 packages.
Commercial products Firmware preloaded in factory
ST33HTPH2ExxAAF0
73.00
ST33HTPH2ExxAAF1
0x00 0x49 0x00 0x00
ST33HTPH2ExxAHB3
ST33HTPH2ExxAHB4
73.04
0x00 0x49 0x00 0x04
Table 12. Commercial product supporting the update with firmware image version 73.64
xx = 28 for products delivered in TSSOP28, and 32 for products delivered in QFN32 packages.
Commercial products
ST33HTPH2ExxAAF0
Firmware preloaded in factory
73.00
ST33HTPH2ExxAAF1
0x00 0x49 0x00 0x00
ST33HTPH2ExxAHB3
ST33HTPH2ExxAHB4
73.04
0x00 0x49 0x00 0x04
73.08
ST33HTPH2ExxAHC0
0x00 0x49 0x00 0x08
DB2716 - Rev 4
page 19/26
ST33TPHF2ESPI
Support and information
10
Support and information
Additional information regarding ST TPM devices can be obtained from the www.st.com website.
For any specific support information you can contact STMicroelectronics through the following e-mail:
TPMsupport@list.st.com.
DB2716 - Rev 4
page 20/26
ST33TPHF2ESPI
Terms and abbreviations
Appendix A Terms and abbreviations
Table 13. List of abbreviations
Term
Meaning
Advanced Encryption Standard
Common Criteria
AES
CC
DES
Data Encryption Standard
Deterministic random-bit generator
Evaluation assurance level
Elliptic curve
DRBG
EAL
EC
ECC
ESD
FIFO
FIPS
FW
Elliptic curve cryptography
Electrostatic discharge
First in first out
Federal Information Processing Standard
Firmware
GPI
General-purpose input
HBM
HMAC
MPU
NIST
NRND
RNG
RSA
SHA
SPI
Human body model
Keyed-Hashing for message authentication
Memory protection unit
National Institute of Standards and Technology
Not recommended for new design
Random number generator
Rivest Shamir Adelman
Secure Hash algorithm
Serial Peripheral Interface
STMicroelectronics
ST
TCG
TIS
Trusted Computed Group
TPM interface specification
Trusted Platform Module
TPM
TRNG
True random number generator
DB2716 - Rev 4
page 21/26
ST33TPHF2ESPI
Revision history
Table 14. Document revision history
Date
12-Nov-2015
Version
1
Changes
Initial release.
In Features, updated:
•
•
•
•
•
TPM features.
Temperature range.
Updated CC and FIPS certification status.
Supported cryptographic algorithms
Product compliance
Updated Appendix B: Referenced documents and references in the data brief.
Updated Section 1.1: Security certifications.
Added Section 2: Data brief scope.
26-Apr-2018
2
Updated Section 3: Pin and signal description.
Added Section 4: Integration guidance.
Added Section 9: Ordering information.
Updated document reference to DB2716.
Small text changes.
Added STSAFE-TPM logo on cover page.
Updated Product compliance.
Reorganized Section 1 Description.
Updated Section 2.1 ST33TPHF2ESPI products and Section 2.2 Firmware
image.
Updated product marking. See:
•
•
•
Section 2.1 ST33TPHF2ESPI products
Section 7 Package marking information
Section 8 Ordering information
04-Jul-2019
3
Updated Figure 6. TSSOP28 - recommended footprint.
Added Section 5.3 Thermal characteristics of packages.
Removed list of references.
Small text changes.
Updated data brief for firmware version 49.40 (73.64 in decimal):
•
•
•
Updated Section 2.1 ST33TPHF2ESPI products.
Updated Section 2.2 Firmware image.
Updated descriptions of SPI_RST and GPI in Section 3 Pin and signal
description.
•
•
Added optional external pull-up resistor to GPI line in Figure 3. Typical
hardware implementation (TSSOP28 package).
12-Nov-2019
4
Added θ and θ values to Table 4. Thermal characteristics.
JC
JB
•
•
•
Updated Figure 14. TSSOP28 device package marking area.
Updated Table 9. Ordering information for ST33TPHF2ESPI products.
Added Section 9 Firmware image overview.
Small text changes.
DB2716 - Rev 4
page 22/26
ST33TPHF2ESPI
Contents
Contents
1
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Data brief scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2.1
2.2
ST33TPHF2ESPI products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Firmware image. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
4
Pin and signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Integration guidance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4.1
4.2
Typical hardware implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power supply filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
5.1
5.2
5.3
28-pin thin shrink small outline package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
32-lead very thin fine pitch quad flat pack no-lead (VFQFPN) package information. . . . . . . 10
Thermal characteristics of packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
6
7
8
9
Delivery packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Firmware image overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
10 Support and information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Appendix A Terms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
DB2716 - Rev 4
page 23/26
ST33TPHF2ESPI
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
TSSOP28 - mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VFQFPN32 - mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Packages on tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Carrier tape dimensions for VFQFPN 5 × 5 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Carrier tape constant dimensions for TSSOP 4.4 mm body width . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Ordering information for ST33TPHF2ESPI products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 10. Firmware image overview for the ST33TPHF2ESPI products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 11. Commercial product supporting the update with firmware image version 73.20 . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. Commercial product supporting the update with firmware image version 73.64 . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 13. List of abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 14. Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DB2716 - Rev 4
page 24/26
ST33TPHF2ESPI
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
TSSOP28 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
VQFN32 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Typical hardware implementation (TSSOP28 package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Mandatory filtering capacitors on VPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
TSSOP28 - outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
TSSOP28 - recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
VFQFPN32 - outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
VFQFPN32 - recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Reel diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Embossed carrier tape for VFQFPN 5 × 5 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Chip orientation in the embossed carrier tape for VFQFPN 5 × 5 mm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Embossed carrier tape for TSSOP28 4.4 mm body width . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Chip orientation in the embossed carrier tape for TSSOP28 4.4 mm body width . . . . . . . . . . . . . . . . . . . . . . 16
TSSOP28 device package marking area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
VQFN32 device package marking area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
DB2716 - Rev 4
page 25/26
ST33TPHF2ESPI
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
DB2716 - Rev 4
page 26/26
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