STB80NF10T4 [STMICROELECTRONICS]

N-CHANNEL 100V - 0.012ohm - 80A D2PAK LOW GATE CHARGE STripFET⑩ POWER MOSFET; N沟道100V - 0.012ohm - 80A D2PAK低栅电荷STripFET⑩功率MOSFET
STB80NF10T4
型号: STB80NF10T4
厂家: ST    ST
描述:

N-CHANNEL 100V - 0.012ohm - 80A D2PAK LOW GATE CHARGE STripFET⑩ POWER MOSFET
N沟道100V - 0.012ohm - 80A D2PAK低栅电荷STripFET⑩功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 栅 PC
文件: 总11页 (文件大小:309K)
中文:  中文翻译
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STP80NF10  
STB80NF10  
N-CHANNEL 100V - 0.012- 80A - TO-220/D2PAK  
LOW GATE CHARGE STripFET™II MOSFET  
Table 1: General Features  
Figure 1: Package  
TYPE  
V
R
I
D
DSS  
DS(on)  
STB80NF10  
STP80NF10  
100 V  
100 V  
< 0.015  
< 0.015 Ω  
80 A  
80 A  
TYPICAL R (on) = 0.012  
DS  
EXCEPTIONAL dv/dt CAPABILITY  
100% AVALANCHE TESTED  
APPLICATION ORIENTED  
CHARACTERIZATION  
3
1
3
2
1
2
D PAK  
DESCRIPTION  
TO-220  
This MOSFET series realized with STMicroelec-  
tronics unique STripFET process has specifically  
been designed to minimize input capacitance and  
gate charge. It is therefore suitable as primary  
switch in advanced high-efficiency isolated DC-DC  
converters for Telecom and Computer application.  
It is also intended for any application with low gate  
charge drive requirements.  
Figure 2: Internal Schematic Diagram  
APPLICATIONS  
HIGH-EFFICIENCY DC-AC CONVERTERS  
UPS AND MOTOR CONTROL  
Table 2: Order Codes  
SALES TYPE  
STB80NF10T4  
STP80NF10  
MARKING  
B80NF10@  
P80NF10@  
PACKAGE  
PACKAGING  
TAPE & REEL  
TUBE  
2
D PAK  
TO-220  
Rev. 3  
February 2005  
1/11  
STP80NF10 - STB80NF10  
Table 3: Absolute Maximum ratings  
Symbol  
Parameter  
Value  
100  
Unit  
V
V
DS  
Drain-source Voltage (V = 0)  
GS  
V
DGR  
Drain-gate Voltage (R = 20 k)  
100  
V
GS  
V
GS  
Gate- source Voltage  
±20  
V
I
D
Drain Current (continuous) at T = 25°C  
80  
A
C
I
Drain Current (continuous) at T = 100°C  
80 (*)  
320  
A
D
C
I
( )  
Drain Current (pulsed)  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
300  
W
C
Derating Factor  
2
W/°C  
V/ns  
mJ  
°C  
°C  
dv/dt (1)  
Peak Diode Recovery voltage slope  
Single Pulse Avalanche Energy  
Storage Temperature  
7
E
(2)  
200  
AS  
T
stg  
55 to 175  
175  
T
Operating Junction Temperature  
j
() Pulse width limited by safe operating area  
(*) Limited by Package  
(1) I 80A, di/dt 300A/µs, V V  
, T T  
j JMAX.  
SD  
DD  
(BR)DSS  
(2) Starting T = 25°C, I = 80A, V = 50V  
j
D
DD  
Table 4: Thermal Data  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case Max  
0.5  
62.5  
300  
°C/W  
°C/W  
°C  
Thermal Resistance Junction-ambient Max  
Maximum Lead Temperature For Soldering Purpose  
T
l
ELECTRICAL CHARACTERISTICS (T  
=25°C UNLESS OTHERWISE SPECIFIED)  
CASE  
Table 5: Off  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
D
= 250 µA, V = 0  
100  
V
(BR)DSS  
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
V
= Max Rating  
1
µA  
µA  
nA  
DSS  
DS  
Drain Current (V = 0)  
GS  
= Max Rating, T = 125°C  
10  
DS  
C
I
Gate-body Leakage  
= ± 20V  
±100  
GSS  
GS  
Current (V = 0)  
DS  
Table 6: On  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
3
Max.  
4
Unit  
V
V
GS(th)  
V
V
= V , I = 250µA  
Gate Threshold Voltage  
2
DS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 40 A  
0.012  
0.015  
DS(on)  
GS  
D
2/11  
STP80NF10 - STB80NF10  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
Table 7: Dynamic  
Symbol  
Parameter  
Test Conditions  
= 15V I = 40A  
Min.  
Typ.  
Max.  
Unit  
g
fs  
(1)  
Forward Transconductance  
V
50  
S
DS  
, D  
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
V
= 25V, f = 1 MHz, V = 0  
5500  
700  
175  
pF  
pF  
pF  
iss  
DS  
GS  
C
oss  
C
rss  
Table 8: Switching On  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time  
Rise Time  
V
= 50V, I = 40A  
26  
80  
ns  
ns  
d(on)  
DD  
D
t
r
R = 4.7V = 10V  
G GS  
(see Figure 14)  
Q
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
V
V
= 80V, I = 80A,  
= 10V  
135  
23  
51.3  
182  
nC  
nC  
nC  
g
DD  
D
Q
gs  
gd  
GS  
Q
Table 9: Switching Off  
Symbol  
Parameter  
Test Conditions  
Min.  
Min.  
Typ.  
Max.  
Unit  
t
Turn-off-Delay Time  
Fall Time  
V
= 50V, I = 40A,  
116  
60  
ns  
ns  
d(off)  
DD  
D
t
f
R =4.7Ω, V = 10V  
G GS  
(see Figure 14)  
Table 10: Source Drain Diode  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
80  
Unit  
A
I
Source-drain Current  
Source-drain Current (pulsed)  
Forward On Voltage  
SD  
I
(2)  
(1)  
320  
1.3  
A
SDM  
V
I
I
= 80A, V = 0  
GS  
V
SD  
SD  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
106  
0.45  
8.5  
= 80A, di/dt = 100A/µs,  
ns  
µC  
A
SD  
Q
rr  
V
DD  
= 50V, T = 150°C  
j
I
(see test circuit, Figure 5)  
RRM  
(1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
(2) Pulse width limited by safe operating area.  
3/11  
STP80NF10 - STB80NF10  
Figure 3: Safe Operating Area  
Figure 6: Thermal Impedance  
Figure 4: Output Characteristics  
Figure 7: Transfer Characteristics  
Figure 5: Transconductance  
Figure 8: Static Drain-source On Resistance  
4/11  
STP80NF10 - STB80NF10  
Figure 9: Gate Charge vs Gate-source Voltage  
Figure 12: Capacitance Variations  
Figure 10: Normalized Gate Thereshold Volt-  
age vs Temperature  
Figure 13: Normalized On Resistance vs Tem-  
perature  
Figure 11: Source-Drain Diode Forward Char-  
acteristics  
5/11  
STP80NF10 - STB80NF10  
Figure 14: Switching Times Test Circuit For  
Resistive Load  
Figure 16: Gate Charge Test Circuit  
Figure 15: Test Circuit For Inductive Load  
Switching and Diode Recovery Times  
6/11  
STP80NF10 - STB80NF10  
TO-220 MECHANICAL DATA  
mm.  
inch  
DIM.  
MIN.  
4.40  
0.61  
1.15  
0.49  
15.25  
10  
TYP  
MAX.  
4.60  
0.88  
1.70  
0.70  
15.75  
10.40  
2.70  
5.15  
1.32  
6.60  
2.72  
14  
MIN.  
0.173  
0.024  
0.045  
0.019  
0.60  
TYP.  
MAX.  
0.181  
0.034  
0.066  
0.027  
0.620  
0.409  
0.106  
0.202  
0.052  
0.256  
0.107  
0.551  
0.154  
A
b
b1  
c
D
E
0.393  
0.094  
0.194  
0.048  
0.244  
0.094  
0.511  
0.137  
e
2.40  
4.95  
1.23  
6.20  
2.40  
13  
e1  
F
H1  
J1  
L
L1  
L20  
L30  
øP  
Q
3.50  
3.93  
16.40  
28.90  
0.645  
1.137  
3.75  
2.65  
3.85  
2.95  
0.147  
0.104  
0.151  
0.116  
7/11  
STP80NF10 - STB80NF10  
D2PAK MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
TYP  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.027  
0.044  
0.017  
0.048  
0.352  
MAX.  
0.181  
0.106  
0.009  
0.036  
0.067  
0.023  
0.053  
0.368  
A
A1  
A2  
B
4.4  
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.393  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.590  
0.050  
0.055  
0.094  
0.208  
0.625  
0.055  
0.068  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0º  
4º  
3
1
8/11  
STP80NF10 - STB80NF10  
2
D PAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
TAPE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
24.4  
100  
0.059  
13.2 0.504 0.520  
0795  
26.4 0.960 1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7 0.413 0.421  
15.7 15.9 0.618 0.626  
A0  
B0  
D
1.5  
1.6 0.059 0.063  
D1  
E
1.59 1.61 0.062 0.063  
1.65 1.85 0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449 0.456  
5.0 0.189 0.197  
4.1 0.153 0.161  
12.1 0.468 0.476  
2.1 0.075 0.082  
1.574  
K0  
P0  
P1  
P2  
R
T
0.25 0.35 0.0098 0.0137  
23.7 24.3 0.933 0.956  
W
* on sales type  
9/11  
STP80NF10 - STB80NF10  
Table 11: Revision History  
Date  
Revision  
Description of Changes  
04-Nov-2003  
22-Nov-2004  
21-Jan-2005  
1
2
3
NEW DATASHEET ACCORDING TO PCN DSG-TRA/03/382  
NEW STYLESHEET, NO CONTENT CHANGE  
Value Change on Table 3  
10/11  
STP80NF10 - STB80NF10  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
All other names are the property of their respective owners  
© 2005 STMicroelectronics - All Rights Reserved  
STMicroelectronics group of companies  
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
11/11  

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