STGW30H60DF [STMICROELECTRONICS]
600 V, 30 A high speed trench gate field-stop IGBT;
| 型号： | STGW30H60DF |
| 厂家： | 
ST |
| 描述： | 600 V, 30 A high speed trench gate field-stop IGBT 双极性晶体管 |
| 文件： | 总24页 (文件大小：1943K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STGB30H60DF, STGF30H60DF,
STGP30H60DF, STGW30H60DF
600 V, 30 A high speed
trench gate field-stop IGBT
Datasheet
-
production data
Features
TAB
• High speed switching
• Tight parameters distribution
• Safe paralleling
3
1
3
2
1
D²PAK
• Low thermal resistance
• Short circuit rated
TO-220FP
TAB
• Ultrafast soft recovery antiparallel diode
Applications
3
3
• Inverter
• UPS
2
2
1
1
TO-220
TO-247
• PFC
Figure 1. Internal schematic diagram
Description
C (2, TAB)
This device is an IGBT developed using an
advanced proprietary trench gate and field stop
structure. This IGBT series offers the optimum
compromise between conduction and switching
losses, maximizing the efficiency of very high
frequency converters. Furthermore, a positive
G (1)
VCE(sat) temperature coefficient and very tight
parameter distribution result in easier paralleling
operation.
E (3)
Table 1. Device summary
Order codes
Marking
Package
Packaging
STGB30H60DF
STGF30H60DF
STGP30H60DF
STGW30H60DF
GB30H60DF
GF30H60DF
GP30H60DF
GW30H60DF
D²PAK
TO-220FP
TO-220
Tape and reel
Tube
TO-247
March 2013
DocID022363 Rev 3
1/24
This is information on a product in full production.
www.st.com
24
Contents
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Contents
1
2
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
. . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Electrical ratings
1
Electrical ratings
Table 2. Absolute maximum ratings
TO-220
D²PAK
TO-247
Symbol
Parameter
TO-220FP
Unit
VCES
IC
Collector-emitter voltage (VGE = 0)
Continuous collector current at TC = 25 °C
Continuous collector current at TC = 100 °C
Pulsed collector current
600
±20
V
A
A
A
V
A
A
A
W
60
30
60 (1)
30(1)
IC
(2)
ICP
120
120(1)
VGE
IF
Gate-emitter voltage
Continuous forward current TC = 25 °C
Continuous forward current at TC = 100 °C
Pulsed forward current
60
30
60(1)
30(1)
120(1)
37(1)
IF
(2)
IFP
120
260
PTOT
TSTG
TJ
Total dissipation at TC = 25 °C
Storage temperature range
- 55 to 150
- 40 to 175
°C
Operating junction temperature
1. Limited by maximum junction temperature
2. Pulse width limited by maximum junction temperature and turn-off within RBSOA.
Table 3. Thermal data
Value
Symbol
Parameter
Unit
D²PAK TO-220FP TO-220 TO-247
Thermal resistance junction-
case IGBT
RthJC
RthJC
RthJA
0.58
2.5
4
0.58
2.5
°C/W
°C/W
°C/W
Thermal resistance junction-
case diode
5.6
62.5
Thermal resistance junction-
ambient
50
DocID022363 Rev 3
3/24
Electrical characteristics
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
2
Electrical characteristics
TJ = 25 °C unless otherwise specified.
Table 4. Static
Test condition
Symbol
Parameter
Min.
Typ.
Max. Unit
Collector-emitter breakdown voltage
(VGE = 0)
V(BR)CES
IC = 2 mA
600
V
V
V
GE = 15 V, IC = 30 A
GE = 15 V, IC = 30 A
2.0
2.4
6.0
2.4
V
V
VCE(sat)
Collector-emitter saturation voltage
TJ = 175 °C
VGE(th)
ICES
Gate threshold voltage
VCE = VGE, IC = 1 mA
VCE = 600 V
5.0
7.0
25
V
Collector cut-off current (VGE = 0)
µA
Gate-emitter leakage
current (VCE = 0)
IGES
VGE = ± 20 V
250
nA
Table 5. Dynamic
Test condition
Symbol
Parameter
Input capacitance
Min.
Typ.
Max. Unit
Cies
Coes
Cres
Qg
3600
130
65
pF
VCE = 25 V, f = 1 MHz,
Output capacitance
-
-
pF
pF
nC
nC
nC
V
GE = 0
Reverse transfer capacitance
Total gate charge
-
-
-
105
30
-
-
-
VCC = 400 V, IC = 30 A,
GE = 15 V
Qge
Qgc
Gate-emitter charge
Gate-collector charge
V
35
4/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Table 6. Switching on/off (inductive load)
Electrical characteristics
Symbol
Parameter
Turn-on delay time
Test condition
Min.
Typ.
Max. Unit
td(on)
tr
50
15
ns
VCE = 400 V, IC = 30 A,
Current rise time
ns
-
-
RG = 10 Ω, VGE = 15 V
(di/dt)on
Turn-on current slope
1600
A/µs
td(on)
tr
Turn-on delay time
Current rise time
47
17
ns
ns
VCE = 400 V, IC = 30 A,
RG = 10 Ω, VGE = 15 V
-
-
-
-
T = 175 °C
J
(di/dt)on
Turn-on current slope
1400
A/µs
tr(Voff)
td(off)
tf
Off voltage rise time
Turn-off delay time
Current fall time
20
160
60
ns
ns
ns
ns
ns
ns
µs
VCE = 400 V, IC = 30 A,
RG = 10 Ω, VGE = 15 V
tr(Voff)
td(off)
tf
Off voltage rise time
Turn-off delay time
Current fall time
22
VCE = 400 V, IC = 30 A,
G = 10 Ω, VGE = 15 V
R
-
146
88
-
-
T = 175 °C
J
tsc
Short circuit withstand time
VCC ≤ 360 V, VGE = 15 V
3
6
Table 7. Switching energy (inductive load)
Parameter Test condition
Symbol
Min.
Typ.
Max. Unit
Eon (1)
Turn-on switching losses
Turn-off switching losses
Total switching losses
Turn-on switching losses
Turn-off switching losses
Total switching losses
-
0.35
0.40
0.75
0.61
0.84
1.45
-
mJ
mJ
mJ
mJ
mJ
mJ
V
CE = 400 V, IC = 30 A,
(2)
Eoff
RG = 10 Ω, VGE = 15 V
Ets
Eon (1)
VCE = 400 V, IC = 230 A,
(2)
Eoff
R
G = 10 Ω, VGE = 15 V
T = 175 °C
J
Ets
1. Energy losses include reverse recovery of the diode.
2. Turn-off losses include also the tail of the collector current.
DocID022363 Rev 3
5/24
Electrical characteristics
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Table 8. Collector-emitter diode
Symbol
Parameter
Test condition
Min.
Typ.
Max. Unit
IF = 30 A
-
2.0
1.5
2.3
V
V
VF
Forward on-voltage
IF = 30 A, T = 175 °C
J
trr
Qrr
Irrm
trr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Reverse recovery time
Reverse recovery charge
Reverse recovery current
-
-
110
136
2.5
-
ns
nC
A
Vr = 400 V, IF = 30 A;
diF/dt = 400 A / µs
190
506
5.3
-
ns
nC
A
Vr = 400 V, IF = 30 A;
diF/dt = 400 A / µs
Qrr
Irrm
T = 175 °C
J
6/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Electrical characteristics
2.1
Electrical characteristics (curves)
Figure 2. Output characteristics (TJ = 25°C)
Figure 3. Output characteristics (TJ = 175°C)
AM17360v1
AM17361v1
I
C
(A)
IC
VGE=15V
VGE=15V
(A)
11V
13V
100
100
11V
13V
80
80
60
40
60
40
9V
9V
20
0
20
0
7V
1
1
4
V
CE(V)
4
VCE(V)
0
2
3
0
2
3
Figure 4. Transfer characteristics
Figure 5. Normalized VGE(th) vs. junction
temperature
AM17362v1
AM17369v1
I
C
(A)
V
GE(th)
norm
TJ=-40°C
TJ=175°C
100
V
CE=5V
1.0
TJ
=25°C
80
0.9
0.8
60
40
0.7
0.6
20
0
8
11
VGE(V)
100
150
TJ(°C)
7
9
10
-50
0
50
Figure 6. Power dissipation vs. case
temperature for D²PAK, TO-220 and TO-247
Figure 7. Power dissipation vs. case
temperature for TO-220FP
AM17364v1
AM17365v1
P
TOT
(W)
PTOT
(W)
240
32
24
16
8
200
160
120
80
40
0
0
0
25
25
100 125 150 TCASE(°C)
100 125 150 TCASE(°C
0
50
75
50
75
DocID022363 Rev 3
7/24
Electrical characteristics
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Figure 8. Collector current vs. frequency for
D²PAK, TO-220 and TO-247
Figure 9. Collector current vs. frequency for
TO-220FP
AM17380v1
AM17381v1
I
C
(A)
IC
(A)
60
16
Tc=80°C
Tc=80°C
50
12
Tc=100°C
Tc=100°C
40
30
20
8
4
0
rectangular current shape,
(duty cycle=0.5, Vcc= 400V Rg=10ohm,Vge=0/15V, Tj=175 °C)
rectangular current shape,
(duty cycle=0.5, Vcc= 400V Rg=10ohm,Vge=0/15V, Tj=175 °C)
10
10
f(kHz)
f(kHz)
1
1
Figure 10. VCE(sat) vs. junction temperature
Figure 11. VCE(sat) vs. collector current
AM17366v1
AM17367v1
V
CE(sat)
(V)
V
CE(sat)
(V)
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
V
GE=15V
V
GE=15V
3.0
2.8
2.6
2.4
TJ=175°C
I
C
=60A
TJ=25°C
2.2
2.0
1.8
1.6
IC
=30A
1.6
1.4
TJ
=-40°C
IC=15A
1.4
1.2
1.2
1.
100
150
TJ(°C)
40
50
IC(A)
-50
0
50
10
20
30
Figure 12. Collector current vs. case
temperature for D²PAK, TO-220 and TO-247
Figure 13. Collector current vs. case
temperature for TO-220FP
AM17363v1
AM17378v1
I
C
(A)
IC
(A)
V
GE>15V
V
GE>15V
TJ<175°C
60
TJ<175°C
20
50
40
30
15
10
20
10
0
5
0
25
25
100 125 150 TCASE(°C)
100 125 150 TCASE(°C)
0
50
75
0
50
75
8/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Electrical characteristics
Figure 14. Forward bias safe operating area for
TO-220, D²PAK and TO-247
Figure 15. Thermal impedance for TO-220,
D²PAK and TO-247
AM17370v1
ZthTO2T_B
I
C
(A)
K
δ0
δ0.01
δ0.02
δ0.05
δ0.1
δ0.2
1µs
100
10-1
δ0.5
Zth=k Rthj-c
δ=tp/t
10
1
100µs
1ms
tp
(single pulse T
C=25°C,
t
TJ
<175°C, VGE=15V)
10-2
10-5
10-2
10-4
10-1
10-3
p(s)
t
10
VCE(V)
1
100
Figure 16. Forward bias safe operating area for
TO-220FP
Figure 17. Thermal impedance for TO-220FP
AM17371v1
ZthTO2T_B_FP
I
C
(A)
K
δ
0.05
0.2
δ
10-1
10-2
10-3
δ
0.1
0.05
100
δ
1µs
δ
0.02
δ
0.01
Zth=k Rthj-c
10
1
δ=tp/t
δ
0
100µs
1ms
(single pulse T
C=25°C,
tp
TJ
<175°C, VGE=15V)
t
10-2
10-5
10-4
10-3
10-1 100
p(s)
t
10
VCE(V)
1
100
Figure 18. Gate charge vs. gate-emitter voltage
Figure 19. Capacitance variations vs. VCE
AM17372v1
AM17373v1
C
(pF)
V
GE
(V)
VCC= 400V, IC=30A
16
Cies
14
1000
12
10
8
100
10
6
Coes
Cres
4
2
0
Qg
(nC)
V
CE(V)
100
10
0
50
0.1
1
DocID022363 Rev 3
9/24
Electrical characteristics
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Figure 20. Diode VF vs. forward current
Figure 21. Switching losses vs. gate resistance
AM17368v1
AM17374v1
E
(µJ)
VF
(V)
2.6
2.4
2.2
V
CC= 400V, VGE=15V
I
C
= 30A, TJ=175°C
TJ=-40°C
1500
1250
1000
750
Eon
Eoff
TJ=25°C
2.0
1.8
TJ=175°C
1.6
1.4
500
250
1.2
15 20 25
RG(Ω)
40
30 35 40 45 50 55
IF(A)
20
30
0
10
Figure 22. Switching losses vs. collector
current
Figure 23. Switching losses vs temperature
AM17375v1
AM17376v1
E
E
(µJ)
(µJ)
800
700
600
500
V
CC= 400V, VGE=15V
VCC= 400V, VGE=15V
Eon
Eoff
Eon
Eoff
R
G
= 10Ω, T =175°C
J
R
G
= 10Ω, I
C
=30A
2000
1600
1200
800
400
0
400
300
IC
(A)
TJ(°C)
55
125 150
35
45
75
100
15
25
25
50
Figure 24. Short circuit time & current vs. VGE
AM17377v1
tsc
(µs)
ISC(A)
V
CC= 360V, RG= 10Ω
450
400
ISC
20
15
10
tSC
350
300
250
200
150
100
50
5
0
0
V
GE(V)
12
8
10
14
10/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Test circuits
3
Test circuits
Figure 25. Test circuit for inductive load
switching
Figure 26. Gate charge test circuit
AM01504v1
AM01505v1
Figure 27. Switching waveform
Figure 28. Diode recovery time waveform
Qrr
90%
di/dt
10%
VG
IF
trr
90%
10%
ta
tb
VCE
Tr(Voff)
Tcross
t
90%
10%
IRRM
IRRM
IC
Td(off)
Toff
Td(on)
Ton
Tf
Tr(Ion)
VF
dv/dt
AM01506v1
AM01507v1
DocID022363 Rev 3
11/24
Package mechanical data
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 9. D²PAK (TO-263) mechanical data
mm
Dim.
Min.
Typ.
Max.
A
A1
b
4.40
0.03
0.70
1.14
0.45
1.23
8.95
7.50
10
4.60
0.23
0.93
1.70
0.60
1.36
9.35
b2
c
c2
D
D1
E
10.40
E1
e
8.50
2.54
e1
H
4.88
15
5.28
15.85
2.69
2.79
1.40
1.75
J1
L
2.49
2.29
1.27
1.30
L1
L2
R
0.4
V2
0°
8°
12/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Package mechanical data
Figure 29. D²PAK (TO-263) drawing
0079457_T
DocID022363 Rev 3
13/24
Package mechanical data
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Table 10. TO-220FP mechanical data
mm
Dim.
Min.
Typ.
Max.
A
B
4.4
2.5
4.6
2.7
D
2.5
2.75
0.7
E
0.45
0.75
1.15
1.15
4.95
2.4
F
1
F1
F2
G
1.70
1.70
5.2
G1
H
2.7
10
10.4
L2
L3
L4
L5
L6
L7
Dia
16
28.6
9.8
2.9
15.9
9
30.6
10.6
3.6
16.4
9.3
3
3.2
14/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Figure 30. TO-220FP drawing
Package mechanical data
7012510_Rev_K_B
DocID022363 Rev 3
15/24
Package mechanical data
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Table 11. TO-220 type A mechanical data
mm
Dim.
Min.
Typ.
Max.
A
b
4.40
0.61
1.14
0.48
15.25
4.60
0.88
1.70
0.70
15.75
b1
c
D
D1
E
1.27
10
10.40
2.70
5.15
1.32
6.60
2.72
14
e
2.40
4.95
1.23
6.20
2.40
13
e1
F
H1
J1
L
L1
L20
L30
3.50
3.93
16.40
28.90
∅
Q
P
3.75
2.65
3.85
2.95
16/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Figure 31. TO-220 type A drawing
Package mechanical data
0015988_typeA_Rev_S
DocID022363 Rev 3
17/24
Package mechanical data
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Table 12. TO-247 mechanical data
mm.
Dim.
Min.
Typ.
Max.
A
A1
b
4.85
2.20
1.0
5.15
2.60
1.40
2.40
3.40
0.80
20.15
15.75
5.60
14.80
4.30
b1
b2
c
2.0
3.0
0.40
19.85
15.45
5.30
14.20
3.70
D
E
e
5.45
18.50
5.50
L
L1
L2
∅P
∅R
S
3.55
4.50
5.30
3.65
5.50
5.70
18/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Figure 32. TO-247 drawing
Package mechanical data
0075325_G
DocID022363 Rev 3
19/24
Packaging mechanical data
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
5
Packaging mechanical data
Table 13. D²PAK (TO-263) tape and reel mechanical data
Tape Reel
mm
mm
Dim.
Dim.
Min.
Max.
Min.
Max.
A0
B0
D
10.5
15.7
1.5
10.7
15.9
1.6
A
B
C
D
G
N
T
330
1.5
12.8
20.2
24.4
100
13.2
26.4
30.4
D1
E
1.59
1.65
11.4
4.8
1.61
1.85
11.6
5.0
F
K0
P0
P1
P2
R
3.9
4.1
11.9
1.9
12.1
2.1
Base qty
Bulk qty
1000
1000
50
T
0.25
23.7
0.35
24.3
W
Figure 33. D²PAK footprint(a)
16.90
12.20
5.08
1.60
3.50
9.75
Footprint
20/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Figure 34. Tape
Packaging mechanical data
10 pitches cumulative
tolerance on tape +/- 0.2 mm
P0
P2
Top cover
tape
D
T
E
F
W
K0
B0
A0
D1
P1
User direction of feed
R
Bending radius
User direction of feed
AM08852v2
a. All dimensions are in millimeters
DocID022363 Rev 3
21/24
Packaging mechanical data
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Figure 35. Reel
T
REEL DIMENSIONS
40mm min.
Access hole
At slot location
B
D
C
N
A
G measured at hub
Full radius
Tape slot
in core for
tape start 25 mm min.
width
AM08851v2
22/24
DocID022363 Rev 3
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Revision history
6
Revision history
Table 14. Document revision history
Changes
Date
Revision
14-Oct-2011
1
Initial release.
Document status promoted from target specification ti preliminary
data.
03-Oct-2012
2
Document status promoted from preliminary data to production data.
Added new root part number STGF30H60DF in TO-220FP package.
Added new root part number STGW30H60DF in TO-247 package.
20-Mar-2013
3
DocID022363 Rev 3
23/24
STGB30H60DF, STGF30H60DF, STGP30H60DF, STGW30H60DF
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT AUTHORIZED FOR USE IN WEAPONS. NOR ARE ST PRODUCTS DESIGNED OR AUTHORIZED FOR USE
IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH
PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR
ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED
FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN
WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE,
AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS.
PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE
CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2013 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
24/24
DocID022363 Rev 3
相关型号：
©2020 ICPDF网 联系我们和版权申明