STOD32WJR [STMICROELECTRONICS]
100 mA triple DC-DC converter for powering AMOLED displays;
| 型号： | STOD32WJR |
| 厂家： | 
ST |
| 描述： | 100 mA triple DC-DC converter for powering AMOLED displays 开关 |
| 文件： | 总7页 (文件大小：245K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STOD32W
100 mA triple DC-DC converter for powering AMOLED displays
Data brief
Applications
• Active matrix OLED power supply in portable
devices
• Cellular phones, multimedia players,
camcorders and digital cameras
Description
Flip Chip 12 (1.618x1.710 mm)
The STOD32W is a triple DC-DC converter for
AMOLED display panels. It integrates a step-up of
Features
100 mA, inverting DC-DC converters and an
auxiliary step-up converter. This device is
particularly suitable for battery operated products,
in which the major concern is the overall system
efficiency. All three output voltages can be
programmed by a dedicated pin, which
implements SWIRE protocol.The auxiliary step-up
positive output voltage is also configured by an
external pull-down resistor. Soft-start with
controlled inrush current limit, thermal shutdown
and short-circuit protection are integrated
functions of the device.
• Operating input voltage range from 2.9 V to
4.5 V
• 100 mA output current for step-up converters
(VIN > 2.9 V)
• 55 mA output current for auxiliary step-up
converters (VIN > 2.9 V)
• Step-up converter fixed at 4.6 V positive
voltage
• Programmable negative voltage from - 0.8 V to
- 4.6 V default -3.0 V
• Auxiliary step-up converter positive voltage
programmable step from 6.6 V to 7.6 V default
7.0 V
• Soft-start with inrush current protection
• Overtemperature protection
• True-shutdown mode
• Short-circuit protection
• Package Flip Chip 12 bumps
(1.618x1.710 mm), 0.4 mm pitch
Table 1. Device summary
Auxiliary positive
voltage
Order code
Negative voltage
Package
Packaging
Flip Chip 12
(1.618x1.710 mm)
STOD32WJR
-0.8 to -4.6 V
6.6 to 7.6 V
5000 parts per reel
June 2014
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For further information contact your local STMicroelectronics sales office.
www.st.com
7
Application schematic
STOD32W
1
Application schematic
Figure 1. Application schematic
L3 10 µH
2
2
1
L2 4.7 µH
2
1
L1 4.7 µH
1
GND
VIN
CINP
GND
LX1
VO3
VINP
LX3
LX2
10
VO3
VO1
VINA
CINA
CO3
VO1
VO2
GND
CO1
Swire
ENO3
S_WIRE
STOD32W
GND
VO2
EN_VO3
CO2
GND
GND
GND
GIPG2805141200LM
Table 2. Typical external components
Reference
Manufacturer
TOKO
Part Number
Value
Size
Ratings
1.0 A 0.460 Ω
1239AS-H-100N=P2
PITB20161T-100MDR
2520 1.2T
2016 1.0T
L1, L2, L3
10 µH
CYNTEC
0.8 A 0.750 Ω
CINP, CINA, CO1,
CO2, CO3
CL10A226MP8NUN
CL05A106MP5NUN
22 µF
10 µF
1608
1005
SEMCO
X5R 10 V ±20%
Note:
All the above components refer to the typical application performance characteristics.
Operation of the device is not limited to the choice of these external components.
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STOD32W
Package mechanical data
2
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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Package mechanical data
STOD32W
Figure 2. Flip Chip 12 (1.618x1.710 mm) drawings
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Package mechanical data
Table 3. Flip Chip 12 (1.618x1.710 mm) mechanical data
mm
Dim.
Min.
Typ.
Max.
A
A1
A2
b
0.49
0.17
0.27
0.23
1.68
0.55
0.20
0.30
0.26
1.71
1.20
1.618
0.80
0.40
0.255
0.409
0.20
0.08
0.05
0.61
0.23
0.33
0.29
1.74
D
D1
E
1.588
1.648
E1
e
fD
fE
SD
ccc
$
Figure 3. Flip Chip 12 (1.618x1.710 mm) recommended footprint
Note:
All dimensions are in mm.
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Revision history
STOD32W
3
Revision history
Table 4. Document revision history
Changes
Date
Revision
04-Jun-2014
1
Initial release.
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STOD32W
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