STP22NM50 [STMICROELECTRONICS]

N-CHANNEL 500V - 0.16ohm - 20A TO-220/FP/D2PAK/I2PAK MDmesh⑩Power MOSFET; N沟道500V - 0.16ohm - 20A TO- 220 / FP / D2PAK / I2PAK MDmesh⑩Power MOSFET
STP22NM50
型号: STP22NM50
厂家: ST    ST
描述:

N-CHANNEL 500V - 0.16ohm - 20A TO-220/FP/D2PAK/I2PAK MDmesh⑩Power MOSFET
N沟道500V - 0.16ohm - 20A TO- 220 / FP / D2PAK / I2PAK MDmesh⑩Power MOSFET

文件: 总10页 (文件大小:357K)
中文:  中文翻译
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STP22NM50 - STP22NM50FP  
STB22NM50 - STB22NM50-1  
2
2
N-CHANNEL 500V - 0.16- 20A TO-220/FP/D PAK/I PAK  
MDmesh™Power MOSFET  
ADVANCED DATA  
TYPE  
V
R
R
*Q  
ds(on)  
I
D
DSS  
DS(on)  
g
STP22NM50  
STP22NM50FP  
STB22NM50  
STB22NM50-1  
500 V <0.2156.4 *nC  
500 V <0.2156.4 *nC  
500 V <0.2156.4 *nC  
500 V <0.2156.4 *nC  
20 A  
20 A  
20 A  
20 A  
3
1
3
2
2
D PAK  
1
TYPICAL R (on) = 0.16  
DS  
HIGH dv/dt AND AVALANCHE CAPABILITIES  
100% AVALANCHE TESTED  
LOW INPUT CAPACITANCE AND GATE CHARGE  
LOW GATE INPUT RESISTANCE  
TO-220  
TO-220FP  
3
2
1
I²PAK  
(Tabless TO-220)  
DESCRIPTION  
The MDmesh™ is a new revolutionary MOSFET tech-  
nology that associates the Multiple Drain process with  
the Company’s PowerMESH™ horizontal layout. The  
resulting product has an outstanding low on-resis-  
tance, impressively high dv/dt and excellent avalanche  
characteristics. The adoption of the Company’s propri-  
etary strip technique yields overall dynamic perfor-  
mance that is significantly better than that of similar  
competition’s products.  
I
NTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
The MDmesh™ family is very suitable for increasing  
power density of high voltage converters allowing sys-  
tem miniaturization and higher efficiencies.  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
STP(B)22NM50(-1) STP22NM50FP  
V
Drain-source Voltage (V = 0)  
500  
500  
±30  
V
V
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuous) at T = 25°C  
20  
12.6  
80  
20(*)  
12.6(*)  
80(*)  
45  
A
D
C
I
Drain Current (continuous) at T = 100°C  
A
D
C
I
()  
Drain Current (pulsed)  
A
DM  
P
Total Dissipation at T = 25°C  
192  
1.2  
W
TOT  
C
Derating Factor  
0.36  
W/°C  
V/ns  
V
dv/dt(1)  
Peak Diode Recovery voltage slope  
Insulation Winthstand Voltage (DC)  
Storage Temperature  
15  
V
ISO  
--  
2000  
T
stg  
–65 to 150  
150  
°C  
°C  
T
Max. Operating Junction Temperature  
j
(•)Pulse width limited by safe operating area  
(1)I 20A, di/dt 400A/µs, V V  
, T T  
(BR)DSS j JMAX.  
SD  
DD  
(*)Limited only by maximum temperature allowed  
January 2003  
1/10  
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
THERMAL DATA  
2
TO-220/I PAK/  
TO-220FP  
2
D PAK  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case  
Thermal Resistance Junction-ambient  
Max  
Max  
0.65  
2.8  
°C/W  
°C/W  
°C  
62.5  
300  
T
Maximum Lead Temperature For Soldering Purpose  
l
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
I
AR  
Avalanche Current, Repetitive or Not-Repetitive  
10  
A
(pulse width limited by T max)  
j
E
Single Pulse Avalanche Energy  
650  
mJ  
AS  
(starting T = 25 °C, I = 5 A, V = 50 V)  
j
D
DD  
ELECTRICAL CHARACTERISTICS (T  
= 25 °C UNLESS OTHERWISE SPECIFIED)  
CASE  
OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
= 250 µA, V = 0  
500  
V
(BR)DSS  
D
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
V
= Max Rating  
DS  
1
µA  
µA  
nA  
DSS  
Drain Current (V = 0)  
GS  
= Max Rating, T = 125 °C  
10  
DS  
GS  
C
I
Gate-body Leakage  
= ±30V  
±100  
GSS  
Current (V = 0)  
DS  
ON (1)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
4
Max.  
5
Unit  
V
V
V
V
= V , I = 250µA  
Gate Threshold Voltage  
3
GS(th)  
DS  
GS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 10A  
0.16  
0.215  
DS(on)  
D
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
(1)  
Forward Transconductance  
V
> I  
x R  
DS(on)max,  
10  
S
fs  
DS  
D(on)  
I
= 10A  
D
C
C
V
= 25V, f = 1 MHz, V = 0  
DS GS  
Input Capacitance  
Output Capacitance  
1480  
285  
34  
pF  
pF  
pF  
iss  
oss  
C
rss  
Reverse Transfer  
Capacitance  
C
(2) Equivalent Output  
Capacitance  
V
= 0V, V = 0V to 400V  
130  
1.6  
pF  
oss eq.  
GS  
DS  
R
Gate Input Resistance  
f=1 MHz Gate DC Bias=0  
Test Signal Level=20mV  
Open Drain  
g
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. C  
V
is defined as a constant equivalent capacitance giving the same charging time as C  
when V increases from 0 to 80%  
oss DS  
oss eq.  
.
DSS  
2/10  
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
V
R
= 250 V, I = 10 A  
Turn-on Delay Time  
24  
ns  
d(on)  
DD  
D
= 4.7V = 10 V  
G
GS  
t
Rise Time  
16  
ns  
r
(see test circuit, Figure 3)  
Q
V
V
= 400 V, I = 20 A,  
= 10 V  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
40  
13  
19  
56  
nC  
nC  
nC  
g
DD  
GS  
D
Q
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Off-voltage Rise Time  
Fall Time  
Test Conditions  
Min.  
Typ.  
9
Max.  
Unit  
ns  
t
V
R
= 400 V, I = 20 A,  
r(Voff)  
DD  
D
= 4.7Ω, V = 10 V  
GS  
(see test circuit, Figure 5)  
G
t
8.5  
23  
ns  
f
t
Cross-over Time  
ns  
c
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
20  
Unit  
A
I
SD  
Source-drain Current  
I
(2)  
(1)  
Source-drain Current (pulsed)  
Forward On Voltage  
80  
A
SDM  
V
I
I
= 20 A, V = 0  
1.5  
V
SD  
SD  
SD  
GS  
t
= 20 A, di/dt = 100A/µs,  
= 100 V, T = 25°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
350  
4.6  
26  
ns  
µC  
A
rr  
Q
V
DD  
rr  
j
I
(see test circuit, Figure 5)  
RRM  
t
Q
I
= 20 A, di/dt = 100A/µs,  
= 100 V, T = 150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
435  
5.9  
27  
ns  
µC  
A
rr  
SD  
V
DD  
rr  
j
I
(see test circuit, Figure 5)  
RRM  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
3/10  
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuits For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
4/10  
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
TO-220 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.40  
1.23  
2.40  
TYP.  
MAX.  
4.60  
1.32  
2.72  
MIN.  
0.173  
0.048  
0.094  
MAX.  
0.181  
0.051  
0.107  
A
C
D
D1  
E
1.27  
0.050  
0.49  
0.61  
1.14  
1.14  
4.95  
2.4  
0.70  
0.88  
1.70  
1.70  
5.15  
2.7  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.027  
0.034  
0.067  
0.067  
0.203  
0.106  
0.409  
F
F1  
F2  
G
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
DIA.  
10.0  
10.40  
16.4  
0.645  
13.0  
2.65  
15.25  
6.2  
14.0  
2.95  
15.75  
6.6  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.260  
0.154  
0.151  
3.5  
3.93  
3.85  
3.75  
L2  
Dia.  
L5  
L9  
L7  
L6  
L4  
P011C  
5/10  
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
D2PAK MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
4.4  
TYP  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.027  
0.044  
0.017  
0.048  
0.352  
MAX.  
0.181  
0.106  
0.009  
0.036  
0.067  
0.023  
0.053  
0.368  
A
A1  
A2  
B
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.393  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.590  
0.050  
0.055  
0.094  
0.208  
0.625  
0.055  
0.068  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0º  
8º  
3
6/10  
1
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
TO-220FP MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.4  
TYP.  
MAX.  
4.6  
2.7  
2.75  
0.7  
1
MIN.  
0.173  
0.098  
0.098  
0.017  
0.030  
0.045  
0.045  
0.195  
0.094  
0.393  
MAX.  
0.181  
0.106  
0.108  
0.027  
0.039  
0.067  
0.067  
0.204  
0.106  
0.409  
A
B
2.5  
D
2.5  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
F1  
F2  
G
1.7  
1.7  
5.2  
2.7  
10.4  
G1  
H
10  
L2  
L3  
L4  
L6  
L7  
Ø
16  
0.630  
28.6  
9.8  
15.9  
9
30.6  
10.6  
16.4  
9.3  
1.126  
0.385  
0.626  
0.354  
0.118  
1.204  
0.417  
0.645  
0.366  
0.126  
3
3.2  
L3  
L6  
L7  
¯
1 2 3  
L4  
L2  
7/10  
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
TO-262 (I2PAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
4.4  
TYP.  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.027  
0.044  
0.017  
0.048  
0.352  
0.094  
0.393  
0.515  
0.137  
0.050  
MAX.  
0.181  
0.106  
0.036  
0.067  
0.023  
0.053  
0.368  
0.106  
0.409  
0.531  
0.149  
0.055  
A
A1  
B
2.49  
0.7  
2.69  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
2.4  
0.6  
C2  
D
1.36  
9.35  
2.7  
e
E
10  
10.4  
13.6  
3.78  
1.4  
L
13.1  
3.48  
1.27  
L1  
L2  
L1  
L2  
D
L
P011P5/E  
8/10  
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
D2PAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
TAPE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
0.059  
12.8  
20.2  
24.4  
100  
13.2 0.504 0.520  
0795  
26.4 0.960 1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7 0.413 0.421  
15.7 15.9 0.618 0.626  
A0  
B0  
D
1.5  
1.6  
0.059 0.063  
D1  
E
1.59 1.61 0.062 0.063  
1.65 1.85 0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449 0.456  
K0  
P0  
P1  
P2  
R
5.0  
4.1  
0.189 0.197  
0.153 0.161  
12.1 0.468 0.476  
2.1  
0.075 0.082  
1.574  
T
0.25 0.35 0.0098 0.0137  
23.7 24.3 0.933 0.956  
W
* on sales type  
9/10  
STP22NM50 / STP22NM50FP / STB22NM50 / STB22NM50-1  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2002 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
10/10  

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