TLV1112CDCY [STMICROELECTRONICS]

1.2-V, 0.8-A LOW-DROPOUT VOLTAGE REGULATOR; 1.2 -V ， 0.8 -A低压差稳压器


型号：	TLV1112CDCY
厂家：	ST
描述：	1.2-V, 0.8-A LOW-DROPOUT VOLTAGE REGULATOR 1.2 -V ， 0.8 -A低压差稳压器稳压器调节器光电二极管输出元件
文件：	总12页 (文件大小：323K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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ꢃ ꢅꢄ ꢆꢂꢇ ꢈ ꢅꢉ ꢆꢊ ꢁ ꢋꢌꢆꢍꢎꢋ ꢏ ꢋꢐꢀ ꢂꢋ ꢁꢀꢊꢑ ꢒ ꢎꢒꢑ ꢐ ꢁꢊꢀꢋ ꢎ

SLVS562B – DECEMBER 2004 – REVISED APRIL 2005

Output Current of Up to 800 mA

Operates Down to 1.1-V Dropout

0.2% Line Regulation Maximum

0.5% Load Regulation Maximum

Specified Dropout Voltage at Multiple

Current Levels

KTP (PowerFLEXE) PACKAGE

KCS (TO-220) PACKAGE

(TOP VIEW)

INPUT

OUTPUT

GND

INPUT

OUTPUT

GND

DCY (SOT-223) PACKAGE

(TOP VIEW)

KTT (TO-263) PACKAGE

(TOP VIEW)

INPUT

OUTPUT

GND

description/ordering information

The TLV1112 is a low-dropout voltage regulator, designed to provide up to 800 mA of output current at 1.2 V

(typ). All internal circuitry is designed to operate down to 1.1-V input-to-output differential. Dropout voltage is

specified at a maximum of 1.3 V at 800 mA, decreasing at lower load currents.

ORDERING INFORMATION

TYP

(V)

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

†

PACKAGE

PowerFLEXt (KTP)

Reel of 2000

TLV1112IKTPR

TLV1112IDCY

TLV1112IDCYR

TLV1112IKCS

TLV1112IKTT

Tube of 80

Reel of 2500

Tube of 50

Reel of 1000

Reel of 2000

Tube of 80

Reel of 2500

Tube of 50

Reel of 1000

SOT-223 (DCY)

−40°C to 125°C

1.2 V

TO-220 (KCS)

TO-263 (KTT)

TLV1112IKTTR

TLV1112CKTPR

TLV1112CDCY

TLV1112CDCYR

TLV1112CKCS

TLV1112CKTT

TLV1112CKTTR

PowerFLEX (KTP)

SOT-223 (DCY)

TO-220 (KCS)

0°C to 125°C

1.2 V

TO-263 (KTT)

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerFLEX is a trademark of Texas Instruments.

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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁꢂ ꢃꢃꢃ ꢄ

ꢃꢅ ꢄꢆꢂꢇ ꢈ ꢅ ꢉꢆꢊ ꢁ ꢋꢌꢆꢍꢎ ꢋꢏ ꢋ ꢐꢀ ꢂ ꢋꢁꢀꢊꢑ ꢒ ꢎꢒ ꢑꢐꢁ ꢊꢀꢋ ꢎ

SLVS562B – DECEMBER 2004 – REVISED APRIL 2005

description/ordering information (continued)

The low-profile surface-mount KTP package allows the device to be used in applications where space is limited.

The TLV1112 requires a minimum of 10 mF of output capacitance for stability. Output capacitors of this size or

larger normally are included in most regulator designs.

Unlike pnp-type regulators, where up to 10% of the output current is wasted as quiescent current, the quiescent

current of the TLV1112 flows into the load, increasing efficiency.

The TLV1112C is characterized for operation over the virtual junction temperature range of 0°C to 125°C. The

TLV1112I is characterized for operation over the virtual junction temperature range of −40°C to 125°C.

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Continuous input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V

Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

package thermal data (see Note 1)

‡

PACKAGE

BOARD

PowerFLEXt/TO-252 (KTP)

High K, JESD 51-5

1.4°C/W

19°C/W

28°C/W

SOT (DCY)

High K, JESD 51-7

High K, JESD 51-5

4°C/W

53°C/W

19°C/W

TBD

TO-220 (KCS)

TO-263 (KTT)

3°C/W

17°C/W

TBD

NOTE 1: Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable ambient

temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.

‡

For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, θ is defined as the thermal resistance between the die

junction and the bottom of the exposed pad.

recommended operating conditions

MIN

MAX

UNIT

Input voltage

2.7

Output current

800

125

OUT

TLV1112I

−40

Operating virtual junction temperature range

°C

TLV1112C

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀꢁꢂ ꢃꢃꢃꢄ

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SLVS562B – DECEMBER 2004 – REVISED APRIL 2005

electrical characteristics, T = 0°C to 125°C, all typical values are at T = 25°C

(unless otherwise noted)

TLV1112C

TYP

1.2

†

PARAMETER

TEST CONDITIONS

UNIT

MIN

1.17

1.14

MAX

1.23

1.26

0.2

− V

OUT

= 2 V, I = 10 mA, T = 25°C

OUT

Output voltage, V

OUT

10 mA ≤ I

OUT

≤ 800 mA, 1.4 V ≤ V − V

IN OUT

≤ 10 V

1.2

Line regulation

Load regulation

= 10 mA, 1.5 ≤ V − V

IN OUT

≤ 13.8 V

= 3 V

0.035

0.1

OUT

10 mA ≤ I

≤ 800 mA, V − V

IN OUT

0.5

OUT

= 100 mA

= 500 mA

= 800 mA

1.1

1.2

OUT

1.15

1.2

1.25

1.3

Dropout voltage (see Note 4)

‡

Current limit

− V

OUT

= 5 V , T = 25°C

0.8

1.2

1.5

%/W

Quiescent current

Thermal regulation

Ripple rejection

≤ 15 V

30 ms pulse, T = 25°C

0.01

0.1

− V

OUT

= 3 V, V

ripple

= 1 V , f = 120 Hz

Minimum load current

Temperature stability

Long-term stability

= 15 V

1.7

T = 0°C to 125°C

0.5

1000 hrs, No load, T = 125°C

0.3

Output noise voltage (% of V

)

f = 10 Hz to 100 kHz

0.003

OUT

†

‡

All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse testing techniques are

used to maintain the junction temperature as close to the ambient temperature as possible.

Current limit test specified under recommended operating conditions

NOTE 2: Dropout is defined as the input-to-output differential at which V

drops 100 mV below the value of V , measured at

OUT

= V + 1.5 V.

OUT(nom)

electrical characteristics, T = −40°C to 125°C, all typical values are at T = 25°C

(unless otherwise noted)

TLV1112I

TYP

1.2

†

PARAMETER

TEST CONDITIONS

UNIT

MIN

MAX

1.23

1.26

0.3

− V

OUT

= 2 V, I = 10 mA, T = 25°C

1.17

1.14

OUT

Output voltage, V

OUT

10 mA ≤ I

OUT

≤ 800 mA, 1.4 V ≤ V − V

IN OUT

≤ 10 V

1.2

Line regulation

Load regulation

= 10 mA, 1.5 ≤ V − V

IN OUT

≤ 13.8 V

= 3 V

0.035

0.2

OUT

10 mA ≤ I

≤ 800 mA, V − V

IN OUT

0.5

OUT

= 100 mA

= 500 mA

= 800 mA

1.1

1.3

OUT

1.15

1.2

1.35

1.4

Dropout voltage (see Note 4)

‡

Current limit

− V

OUT

= 5 V , T = 25°C

0.8

1.2

1.5

%/W

Quiescent current

Thermal regulation

Ripple rejection

≤ 15 V

30 ms pulse, T = 25°C

0.01

0.1

− V

OUT

= 3 V, V

ripple

= 1 V , f = 120 Hz

Minimum load current

Temperature stability

Long-term stability

= 15 V

1.7

T = −40°C to 125°C

0.5

1000 hrs, No load, T = 125°C

0.3

Output noise voltage (% of V

)

f = 10 Hz to 100 kHz

0.003

OUT

†

‡

All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse-testing techniques are

used to maintain the junction temperature as close to the ambient temperature as possible.

Current limit test specified under recommended operating conditions

NOTE 4: Dropout is defined as the input-to-output differential at which V

drops 100 mV below the value of V , measured at

OUT

= V + 1.5 V.

OUT(nom)

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁꢂ ꢃꢃꢃ ꢄ

ꢃꢅ ꢄꢆꢂꢇ ꢈ ꢅ ꢉꢆꢊ ꢁ ꢋꢌꢆꢍꢎ ꢋꢏ ꢋ ꢐꢀ ꢂ ꢋꢁꢀꢊꢑ ꢒ ꢎꢒ ꢑꢐꢁ ꢊꢀꢋ ꢎ

SLVS562B – DECEMBER 2004 – REVISED APRIL 2005

TYPICAL CHARACTERISTICS

Figure 1. Short-Circuit Current vs (V − V )

Figure 2. Load Regulation vs Temperature

Figure 4. Ripple Rejection vs Current

Figure 6. GND Pin Current vs Temperature

Figure 3. Ripple Rejection vs Frequency

Figure 5. Temperature Stability

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLVS562B – DECEMBER 2004 – REVISED APRIL 2005

TYPICAL CHARACTERISTICS

Figure 7. Load-Transient Response

Figure 8. Line-Transient Response

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLVS562B – DECEMBER 2004 – REVISED APRIL 2005

APPLICATION INFORMATION

1N4002 (See Note C)

TLV1112

INPUT

OUTPUT

GND

10 µF

(see Note B)

100 µF

(see Note A)

NOTES: A. Output capacitor selection is critical for regulator stability. The recommended minimum is 10-µF tantalum or 50-µF aluminum

electrolytic, with either one having an ESR between the range of 0.3 Ω to 22 Ω. Larger C

values benefit the regulator by

OUT

improving transient response and loop stability.

is recommended if TLV1112 is not located near the power-supply filter.

C. An external diode is recommended to protect the regulator if the input instantaneously is shorted to GND.

Figure 9. Typical Application Circuit

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

11-Oct-2007

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

SOT-223

TO-220

PFM

Drawing

TLV1112IDCY

TLV1112IDCYR

TLV1112IKCS

TLV1112IKTPR

TLV1112IKTT

PREVIEW

DCY

2500

TBD

Call TI

DCY

KCS

KTP

3000

DDPAK/

TO-263

KTT

TLV1112IKTTR

PREVIEW

DDPAK/

TO-263

KTT

500

TBD

Call TI

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

DCY (R-PDSO-G4)

PLASTIC SMALL-OUTLINE

6,70 (0.264)

6,30 (0.248)

3,10 (0.122)

2,90 (0.114)

0,10 (0.004)

3,70 (0.146)

3,30 (0.130)

7,30 (0.287)

6,70 (0.264)

Gauge Plane

0,25 (0.010)

0,84 (0.033)

0,66 (0.026)

0°–10°

2,30 (0.091)

0,10 (0.004)

4,60 (0.181)

0,75 (0.030) MIN

1,70 (0.067)

1,50 (0.059)

1,80 (0.071) MAX

0,35 (0.014)

0,23 (0.009)

Seating Plane

0,08 (0.003)

0,10 (0.0040)

0,02 (0.0008)

4202506/B 06/2002

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC TO-261 Variation AA.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MPSF001F – JANUARY 1996 – REVISED JANUARY 2002

KTP (R-PSFM-G2)

PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE

0.080 (2,03)

0.070 (1,78)

0.243 (6,17)

0.233 (5,91)

0.228 (5,79)

0.218 (5,54)

0.050 (1,27)

0.040 (1,02)

0.130 (3,30) NOM

0.010 (0,25) NOM

Thermal Tab

(See Note C)

0.215 (5,46)

0.287 (7,29)

0.277 (7,03)

NOM

0.247 (6,27)

0.237 (6,02)

0.381 (9,68)

0.371 (9,42)

0.100 (2,54)

0.090 (2,29)

0.032 (0,81) MAX

Seating Plane

0.004 (0,10)

0.090 (2,29)

0.180 (4,57)

0.005 (0,13)

0.001 (0,02)

0.031 (0,79)

0.025 (0,63)

0.010 (0,25)

0.047 (1,19)

0.037 (0,94)

0.010 (0,25) NOM

Gage Plane

0.010 (0,25)

2°–ā6°

4073388/M 01/02

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. The center lead is in electrical contact with the thermal tab.

D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).

E. Falls within JEDEC TO-252 variation AC.

PowerFLEX is a trademark of Texas Instruments.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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TLV1112CDCY [STMICROELECTRONICS]

相关型号：

TLV1112CDCYR

TLV1112CKCS

TLV1112CKTPR

TLV1112CKTT

TLV1112CKTTR

TLV1112IDCY

TLV1112IDCYR

TLV1112IKCS

TLV1112IKCS

TLV1112IKTPR