TS882 [STMICROELECTRONICS]

Rail-to-rail 1.1 V dual and quad nanopower comparators;
TS882
型号: TS882
厂家: ST    ST
描述:

Rail-to-rail 1.1 V dual and quad nanopower comparators

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TS882  
TS884  
Rail-to-rail 1.1 V dual and quad nanopower comparators  
Datasheet  
-
production data  
Quad version available in SO14, TSSOP14  
and QFN16 3 x 3 mm package  
Related product  
See the TS881 datasheet for single operator  
with smaller package.  
DFN8 (2 x 2 mm)  
MiniSO8  
SO14  
Applications  
Portable systems  
Signal conditioning  
Medical  
TSSOP14  
Description  
The TS882 is a dual and the TS884 device a  
quad comparator featuring ultra-low supply  
current (220 nA typical per operator with output  
high, VCC = 1.2 V, no load) with rail-to-rail input  
and output capability. The performance of these  
comparators allows them to be used in a wide  
range of portable applications. The TS882 and  
TS884 devices minimize battery supply leakage  
and therefore enhance battery lifetime.  
QFN16 (3 x 3 mm)  
Features  
Ultra-low current consumption: 220 nA typ./op.  
Propagation delay: 2 µs typ.  
Rail-to-rail inputs  
Operating from 1.1 to 5.5 V supply voltage, these  
comparators can be used over a wide  
temperature range (-40 to +125 °C) keeping the  
current consumption at an ultra-low level.  
Push-pull outputs  
Supply operation from 1.1 V to 5.5 V  
Wide temperature range: -40 to +125 °C  
ESD tolerance: 8 kV HBM / 300 V MM  
Dual version available in MiniSO8 and DFN8  
(2 x 2 mm) package  
Table 1. Device summary  
Order codes  
Temperature range  
Packages  
Packaging  
Marking  
TS882IST  
TS882IQ2T  
TS884IDT  
TS884IPT  
TS884IQ4T  
MiniSO8  
DFN8 2 x 2 mm  
SO14  
K514  
K56  
-40 to +125 °C  
Tape and reel  
S884I  
S884I  
K514  
-40 to +125 °C  
TSSOP14  
Tape and reel  
QFN16 3 x 3 mm  
July 2014  
DocID024119 Rev 3  
1/26  
This is information on a product in full production.  
www.st.com  
 
Contents  
TS882, TS884  
Contents  
1
2
3
4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4.1  
4.2  
4.3  
4.4  
4.5  
DFN8 2 x 2 mm package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 17  
MiniSO8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
SO14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
QFN16 3 x 3 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
2/26  
DocID024119 Rev 3  
TS882, TS884  
Pin description  
1
Pin description  
Figure 1. Pin connections TS882 (top view)  
TS882IDT/IST/IQ2T  
MiniSO8/DFN8  
Figure 2. Pin connections TS884 (top view)  
SO14 / TSSOP14  
287ꢄ 287ꢀ  
,1ꢄꢂ  
,1ꢀꢂ  
ꢄꢆ ꢄꢇ ꢄꢀ ꢄꢃ  
ꢄꢅ  
ꢄꢄ  
ꢄꢈ  
,1ꢄꢁ  
9&&ꢁ  
1&  
,1ꢀꢁ  
9&&ꢂ  
1&  
,1ꢅꢁ  
,1ꢃꢁ  
,1ꢅꢂ  
,1ꢃꢂ  
287ꢅ 287ꢃ  
QFN16  
DocID024119 Rev 3  
3/26  
26  
 
 
Absolute maximum ratings and operating conditions  
TS882, TS884  
2
Absolute maximum ratings and operating conditions  
Table 2. Absolute maximum ratings  
Parameter  
Symbol  
Value  
Unit  
VCC  
VID  
VIN  
Supply voltage(1)  
6
V
V
V
Differential input voltage(2)  
±6  
Input voltage range  
(VCC-) - 0.3 to (VCC+) + 0.3  
Thermal resistance junction to ambient (TS882)(3)  
MiniSO8  
190  
57  
DFN8 2 x 2 mm  
Thermal resistance junction to ambient (TS884)(3)  
RTHJA  
°C/W  
SO14  
105  
100  
45  
TSSOP14  
QFN16 3 x 3 mm  
TSTG Storage temperature  
TJ Junction temperature  
-65 to +150  
150  
°C  
°C  
°C  
kV  
TLEAD Lead temperature (soldering 10 seconds)  
Human body model (HBM)(4)  
260  
8
ESD  
Machine model (MM)(5)  
Charged device model (CDM)(6)  
Latch-up immunity  
300  
V
1300  
200  
mA  
1. All voltage values, except differential voltages, are referenced to V -. V is defined as the difference  
CC  
CC  
between V + and V -.  
CC  
CC  
2. The magnitude of input and output voltages must never exceed the supply rail ±0.3 V.  
3. Short-circuits can cause excessive heating. These values are typical.  
4. According to JEDEC standard JESD22-A114F.  
5. According to JEDEC standard JESD22-A115A.  
6. According to ANSI/ESD STM5.3.1.  
Table 3. Operating conditions  
Symbol  
Parameter  
Value  
Unit  
Toper Operating temperature range  
-40 to +125  
°C  
Supply voltage  
VCC  
V
V
-40 °C < Tamb < +125 °C  
1.1 to 5.5  
Common mode input voltage range  
VICM -40 °C < Tamb < +85 °C  
-40 °C < Tamb < +125 °C  
(VCC-) - 0.2 to (VCC+) + 0.2  
(VCC-) to (VCC+) + 0.2  
4/26  
DocID024119 Rev 3  
 
TS882, TS884  
Electrical characteristics  
3
Electrical characteristics  
Table 4. VCC = +1.2 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1)  
Symbol  
VIO  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
Tamb = +25 °C  
1
Input offset voltage(2)  
mV  
µV/°C  
mV  
-40 °C < Tamb < +125 °C  
-40 °C < Tamb < +125 °C  
-6  
6
VIO Input offset voltage drift  
3
Tamb = +25 °C  
2.4  
VHYST Input hysteresis voltage(3)  
-40 °C < Tamb < +125 °C  
1.5  
4.2  
Tamb = +25 °C  
10  
100  
IIO  
Input offset current(4)  
Input bias current(4)  
pA  
pA  
-40 °C < Tamb < +125 °C  
Tamb = +25 °C  
1
10  
100  
IIB  
-40 °C < Tamb < +125 °C  
No load, output low, VID = -0.1 V  
-40 °C < Tamb < +125 °C  
300  
450  
350  
ICC  
Supply current per operator  
nA  
No load, output high, VID = +0.1 V  
-40 °C < Tamb < +125 °C  
220  
Source  
Sink  
1.0  
1.7  
ISC  
Short-circuit current  
Output voltage high  
mA  
V
Isource = 0.2 mA  
-40 °C < Tamb < +85 °C  
-40 °C < Tamb < +125 °C  
1.13  
1.10  
1.00  
1.15  
VOH  
Isink = 0.2 mA  
-40 °C < Tamb < +85 °C  
-40 °C < Tamb < +125 °C  
35  
50  
60  
70  
VOL  
Output voltage low  
mV  
dB  
0 < VICM < VCC  
-40 °C < Tamb < +125 °C  
68  
CMRR Common mode rejection ratio  
50  
f = 1 kHz, CL = 30 pF, RL = 1 MΩ  
5.5  
2.1  
11  
13  
Overdrive = 10 mV  
-40 °C < Tamb < +125 °C  
Propagation delay  
TPLH  
µs  
(low to high)  
3.1  
3.4  
Overdrive = 100 mV  
-40 °C < Tamb < +125 °C  
f = 1 kHz, CL = 30 pF, RL = 1 MΩ  
Overdrive = 10 mV  
5.1  
8
Propagation delay  
TPHL  
-40 °C < Tamb < +125 °C  
10  
µs  
ns  
(high to low)  
Overdrive = 100 mV  
-40 °C < Tamb < +125 °C  
1.9  
2.6  
3.1  
TR  
Rise time (10% to 90%)  
CL = 30 pF, RL = 1 MΩ  
100  
DocID024119 Rev 3  
5/26  
26  
Electrical characteristics  
TS882, TS884  
Table 4. VCC = +1.2 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1) (continued)  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
TF  
Fall time (90% to 10%)  
Power-up time  
CL = 30 pF, RL = 1 MΩ  
110  
1.1  
ns  
TON  
1.7  
ms  
1. All values over the temperature range are guaranteed through correlation and simulation. No production test is performed  
at the temperature range limits.  
2. The offset is defined as the average value of positive and negative trip points (input voltage differences requested to  
change the output state in each direction).  
3. The hysteresis is a built-in feature of the TS882 device. It is defined as the voltage difference between the trip points.  
4. Maximum values include unavoidable inaccuracies of the industrial tests.  
6/26  
DocID024119 Rev 3  
TS882, TS884  
Electrical characteristics  
Table 5. VCC = +2.7 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1)  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
Tamb = +25 °C  
1
VIO  
Input offset voltage(2)  
mV  
µV/°C  
mV  
-40 °C < Tamb < +125 °C  
-40 °C < Tamb < +125 °C  
-6  
6
VIO Input offset voltage drift  
3
Tamb = +25 °C  
2.7  
VHYST Input hysteresis voltage(3)  
-40 °C < Tamb < +125 °C  
1.6  
4.2  
Tamb = +25 °C  
10  
100  
IIO  
Input offset current(4)  
Input bias current(4)  
pA  
pA  
-40 °C < Tamb < +125 °C  
Tamb = +25 °C  
1
10  
100  
IIB  
-40 °C < Tamb < +125 °C  
No load, output low, VID = -0.1 V  
-40 °C < Tamb < +125 °C  
310  
450  
350  
ICC  
Supply current per operator  
nA  
No load, output high, VID = +0.1 V  
-40 °C < Tamb < +125 °C  
220  
Source  
Sink  
10  
13  
ISC  
Short-circuit current  
Output voltage high  
mA  
V
Isource = 2 mA  
-40 °C < Tamb < +85 °C  
-40 °C < Tamb < +125 °C  
2.48  
2.40  
2.10  
2.51  
130  
74  
VOH  
Isink = 2 mA  
-40 °C < Tamb < +85 °C  
-40 °C < Tamb < +125 °C  
210  
230  
310  
VOL  
Output voltage low  
mV  
dB  
0 < VICM < VCC  
-40 °C < Tamb < +125 °C  
CMRR Common mode rejection ratio  
55  
f = 1 kHz, CL = 30 pF, RL = 1 MΩ  
Overdrive = 10 mV  
-40 °C < Tamb < +125 °C  
6.4  
2.3  
12  
14  
Propagation delay  
TPLH  
µs  
µs  
(low to high)  
Overdrive = 100 mV  
-40 °C < Tamb < +125 °C  
3.0  
3.7  
f = 1 kHz, CL = 30 pF, RL = 1 MΩ  
Overdrive = 10 mV  
-40 °C < Tamb < +125 °C  
6.4  
2.2  
12  
14  
Propagation delay  
TPHL  
(high to low)  
Overdrive = 100 mV  
-40 °C < Tamb < +125 °C  
3.0  
3.7  
TR  
TF  
Rise time (10% to 90%)  
Fall time (90% to 10%)  
Power-up time  
CL = 30 pF, RL = 1 MΩ  
CL = 30 pF, RL = 1 MΩ  
120  
130  
1.1  
ns  
ns  
TON  
1.7  
ms  
1. All values over the temperature range are guaranteed through correlation and simulation. No production test is performed  
at the temperature range limits.  
2. The offset is defined as the average value of positive and negative trip points (input voltage differences requested to  
change the output state in each direction).  
3. The hysteresis is a built-in feature of the TS882. It is defined as the voltage difference between the trip points.  
4. Maximum values include unavoidable inaccuracies of the industrial tests.  
DocID024119 Rev 3  
7/26  
26  
Electrical characteristics  
TS882, TS884  
Table 6. VCC = +5 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1)  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
Tamb = +25 °C  
1
VIO  
Input offset voltage(2)  
mV  
µV/°C  
mV  
-40 °C < Tamb < +125 °C  
-40 °C < Tamb < +125 °C  
-6  
6
VIO Input offset voltage drift  
3
Tamb = +25 °C  
3.1  
VHYST Input hysteresis voltage(3)  
-40 °C < Tamb < +125 °C  
1.6  
4.2  
Tamb = +25 °C  
10  
100  
IIO  
Input offset current(4)  
Input bias current(4)  
pA  
pA  
-40 °C < Tamb < +125 °C  
Tamb = +25 °C  
1
10  
100  
IIB  
-40 °C < Tamb < +125 °C  
No load, output low, VID = -0.1 V  
-40 °C < Tamb < +125 °C  
350  
500  
400  
ICC  
Supply current per operator  
nA  
No load, output high, VID = +0.1 V  
-40 °C < Tamb < +125 °C  
250  
Source  
Sink  
32  
32  
ISC  
Short-circuit current  
Output voltage high  
mA  
V
Isource = 2 mA  
-40 °C < Tamb < +85 °C  
-40 °C < Tamb < +125 °C  
4.86  
4.75  
4.60  
4.88  
VOH  
Isink = 2 mA  
-40 °C < Tamb < +85 °C  
-40 °C < Tamb < +125 °C  
90  
130  
170  
280  
VOL  
Output voltage low  
mV  
0 < VICM < VCC  
-40 °C < Tamb < +125 °C  
78  
80  
CMRR Common mode rejection ratio  
dB  
dB  
55  
65  
VCC = 1.2 V to 5 V  
-40 °C < Tamb < +125 °C  
SVR  
Supply voltage rejection  
f = 1 kHz, CL = 30 pF, RL = 1 MΩ  
Overdrive = 10 mV  
-40 °C < Tamb < +125 °C  
8.3  
2.5  
13  
22  
Propagation delay  
(low to high)  
TPLH  
µs  
Overdrive = 100 mV  
-40 °C < Tamb < +125 °C  
3.4  
4.1  
f = 1 kHz, CL = 30 pF, RL = 1 MΩ  
Overdrive = 10 mV  
-40 °C < Tamb < +125 °C  
9.0  
16  
19  
Propagation delay  
(high to low)  
TPHL  
µs  
ns  
Overdrive = 100 mV  
-40 °C < Tamb < +125 °C  
2.6  
3.5  
4.2  
TR  
Rise time (10% to 90%)  
CL = 30 pF, RL = 1 MΩ  
160  
8/26  
DocID024119 Rev 3  
TS882, TS884  
Electrical characteristics  
Table 6. VCC = +5 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1) (continued)  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
TF  
Fall time (90% to 10%)  
Power-up time  
CL = 30 pF, RL = 1 MΩ  
150  
1.1  
ns  
TON  
1.7  
ms  
1. All values over the temperature range are guaranteed through correlation and simulation. No production test is performed  
at the temperature range limits.  
2. The offset is defined as the average value of positive and negative trip points (input voltage differences requested to  
change the output state in each direction).  
3. The hysteresis is a built-in feature of the TS882 device. It is defined as the voltage difference between the trip points.  
4. Maximum values include unavoidable inaccuracies of the industrial tests.  
DocID024119 Rev 3  
9/26  
26  
Electrical characteristics  
TS882, TS884  
Figure 3. Current consumption per operator vs. Figure 4. Current consumption per operator  
supply voltage - output low vs. supply voltage - output high  
Figure 5. Current consumption per operator Figure 6. Current consumption per operator  
vs. input common mode voltage at  
VCC = 1.2 V  
vs. input common mode voltage at  
VCC = 5 V  
Figure 7. Current consumption per operator Figure 8. Current consumption per operator  
vs. temperature vs. toggle frequency  
10/26  
DocID024119 Rev 3  
TS882, TS884  
Electrical characteristics  
Figure 9. Input offset voltage vs. input  
common mode voltage at  
VCC = 1.2 V  
Figure 10. Input hysteresis voltage vs. input  
common mode voltage at  
VCC = 1.2 V  
Figure 11. Input offset voltage vs. input  
common mode voltage at VCC = 5 V  
Figure 12. Input hysteresis voltage vs. input  
common mode voltage at VCC = 5 V  
Figure 13. Input offset voltage vs. temperature Figure 14. Input hysteresis voltage vs.  
temperature  
DocID024119 Rev 3  
11/26  
26  
Electrical characteristics  
TS882, TS884  
Figure 15. Output voltage drop vs. sink current Figure 16. Output voltage drop vs. source  
at VCC = 1.2 V current at VCC = 1.2 V  
Figure 17. Output voltage drop vs. sink current Figure 18. Output voltage drop vs. source  
at VCC = 2.7 V current at VCC = 2.7 V  
Figure 19. Output voltage drop vs. sink current Figure 20. Output voltage drop vs. source  
at VCC = 5 V current at VCC = 5 V  
12/26  
DocID024119 Rev 3  
TS882, TS884  
Electrical characteristics  
Figure 21. Propagation delay TPLH vs. input  
common mode voltage at VCC = 1.2 V  
Figure 22. Propagation delay TPHL vs. input  
common mode voltage at VCC = 1.2 V  
Figure 23. Propagation delay TPLH vs. input  
common mode voltage at VCC = 5 V  
Figure 24. Propagation delay TPHL vs. input  
common mode voltage at VCC = 5 V  
Figure 25. Propagation delay TPLH vs. input  
signal overdrive at VCC = 1.2 V  
Figure 26. Propagation delay TPHL vs. input  
signal overdrive at VCC = 1.2 V  
DocID024119 Rev 3  
13/26  
26  
Electrical characteristics  
TS882, TS884  
Figure 27. Propagation delay TPLH vs. input  
signal overdrive at VCC = 5 V  
Figure 28. Propagation delay TPHL vs. input  
signal overdrive at VCC = 5 V  
Figure 29. Propagation delay TPLH vs. supply Figure 30. Propagation delay TPHL vs. supply  
voltage for signal overdrive 10 mV voltage for signal overdrive 10 mV  
Figure 31. Propagation delay TPLH vs. supply Figure 32. Propagation delay TPHL vs. supply  
voltage for signal overdrive 100 mV  
voltage for signal overdrive 100 mV  
14/26  
DocID024119 Rev 3  
TS882, TS884  
Electrical characteristics  
Figure 33. Propagation delay vs. temperature Figure 34. Propagation delay vs. temperature  
for signal overdrive 10 mV for signal overdrive 100 mV  
DocID024119 Rev 3  
15/26  
26  
Package information  
TS882, TS884  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK  
specifications, grade definitions and product status are available at: www.st.com.  
ECOPACK is an ST trademark.  
16/26  
DocID024119 Rev 3  
 
TS882, TS884  
Package information  
4.1  
DFN8 2 x 2 mm package mechanical data  
Figure 35. DFN8 2 x 2 mm package outline  
4&"5*/(ꢀꢀ  
$
1-"/&  
EEE  
$
"ꢁ  
"ꢂ  
"
%
F
1*/ꢀꢂꢀ*%  
&
&ꢃ  
-
C
%ꢃ  
Table 7. DFN8 2 x 2 mm package mechanical data (pitch 0.5 mm)  
Dimensions  
Symbol  
Millimeters  
Inches  
Min.  
Typ.  
Max.  
Min.  
Typ.  
Max.  
A
A1  
A3  
b
0.51  
0.55  
0.60  
0.05  
0.020  
0.022  
0.024  
0.002  
0.15  
0.25  
2.00  
1.60  
2.00  
0.90  
0.50  
0.006  
0.010  
0.079  
0.063  
0.079  
0.035  
0.020  
0.18  
1.85  
1.45  
1.85  
0.75  
0.30  
2.15  
1.70  
2.15  
1.00  
0.007  
0.073  
0.057  
0.073  
0.030  
0.012  
0.085  
0.067  
0.085  
0.039  
D
D2  
E
E2  
e
L
0.50  
0.08  
0.020  
0.003  
ddd  
DocID024119 Rev 3  
17/26  
26  
Package information  
TS882, TS884  
Figure 36. DFN8 2 x 2 mm footprint recommendation  
ꢀꢁꢂꢃꢄPP  
ꢉꢁꢊꢃꢄPP  
ꢃꢁꢅꢆꢄPP  
ꢃꢁꢈꢆꢄPP  
ꢃꢁꢆꢃꢄPP  
ꢃꢁꢇꢃꢄPP  
18/26  
DocID024119 Rev 3  
TS882, TS884  
Package information  
4.2  
MiniSO8 package information  
Figure 37. MiniSO8 package outline  
Table 8. MiniSO8 package mechanical data  
Dimensions  
Symbol  
Millimeters  
Inches  
Min.  
Typ.  
Max.  
Min.  
Typ.  
Max.  
A
A1  
A2  
b
1.10  
0.15  
0.95  
0.40  
0.23  
3.20  
5.15  
3.10  
0.043  
0.006  
0.037  
0.016  
0.009  
0.126  
0.203  
0.122  
0
0
0.75  
0.22  
0.08  
2.80  
4.65  
2.80  
0.85  
0.030  
0.009  
0.003  
0.11  
0.033  
c
D
3.00  
4.90  
3.00  
0.65  
0.60  
0.95  
0.25  
0.118  
0.193  
0.118  
0.026  
0.024  
0.037  
0.010  
E
0.183  
0.11  
E1  
e
L
0.40  
0°  
0.80  
0.016  
0°  
0.031  
L1  
L2  
k
8°  
8°  
ccc  
0.10  
0.004  
DocID024119 Rev 3  
19/26  
26  
Package information  
TS882, TS884  
4.3  
SO14 package information  
Figure 38. SO14 package outline  
Table 9. SO14 package mechanical data  
Dimensions(1)  
Millimeters  
Typ.  
Inches  
Typ.  
Symbol  
Note  
Min.  
Max.  
Min.  
Max.  
A
A1  
A2  
B
1.35  
0.10  
1.10  
0.33  
0.19  
8.55  
3.80  
1.75  
0.25  
1.65  
0.51  
0.25  
8.75  
4.0  
0.05  
0.004  
0.04  
0.068  
0.009  
0.06  
0.01  
0.02  
C
0.007  
0.33  
0.009  
0.34  
(2)  
D
E
0.15  
0.15  
e
1.27  
0.05  
H
5.80  
0.40  
0°  
6.20  
1.27  
8°  
0.22  
0.015  
0°  
0.24  
0.05  
8°  
L
k
ddd  
0.10  
0.004  
1. Drawing dimensions include “Single” and “Matrix” versions.  
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs  
shall not exceed 0.15 mm per side.  
20/26  
DocID024119 Rev 3  
TS882, TS884  
Package information  
4.4  
QFN16 3 x 3 package information  
Figure 39. QFN16 3 x 3 mm (pitch 0.5 mm) package outline  
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DocID024119 Rev 3  
21/26  
26  
Package information  
TS882, TS884  
Table 10. QFN16 3 x 3 mm (pitch 0.5 mm) package mechanical data  
Dimensions  
Symbol  
Millimeters  
Typ.  
Inches  
Typ.  
Min.  
Max.  
Min.  
Max.  
A
A1  
A3  
b
0.80  
0.90  
0.02  
0.20  
0.25  
3.00  
1.50  
1.00  
0.05  
0.031  
0.035  
0.001  
0.008  
0.010  
0.118  
0.059  
0.039  
0.002  
0.18  
2.85  
0.30  
3.15  
0.007  
0.112  
0.012  
0.124  
D
D1  
D2  
E
See exposed pad variation  
See exposed pad variation  
2.85  
3.00  
1.50  
3.15  
0.112  
0.118  
0.059  
0.124  
E1  
E2  
e
See exposed pad variation  
See exposed pad variation  
0.45  
0.30  
0.50  
0.40  
0.55  
0.018  
0.012  
0.020  
0.016  
0.022  
L
0.50  
0.08  
0.020  
0.003  
ddd  
22/26  
DocID024119 Rev 3  
TS882, TS884  
Package information  
Figure 40. QFN16 3 x 3 mm (pitch 0.5 mm) footprint recommendation  
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DocID024119 Rev 3  
23/26  
26  
Package information  
TS882, TS884  
4.5  
TSSOP14 package information  
Figure 41. TSSOP14 package outline  
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Table 11. TSSOP14 package mechanical data  
Dimensions  
Symbol  
Millimeters  
Typ.  
Inches  
Typ.  
Min.  
Max.  
Min.  
Max.  
A
1.20  
0.15  
1.05  
0.30  
0.20  
5.10  
6.60  
4.50  
0.047  
0.006  
0.041  
0.012  
A1  
A2  
b
0.05  
0.80  
0.19  
0.09  
4.90  
6.20  
4.30  
0.002  
0.031  
0.007  
0.004  
0.193  
0.244  
0.169  
0.004  
0.039  
1.00  
c
0.0089  
0.201  
0.260  
0.176  
D
5.00  
6.40  
4.40  
0.65  
0.60  
1.00  
0.197  
0.252  
0.173  
0.0256  
0.024  
0.039  
E
E1  
e
L
0.45  
0°  
0.75  
0.018  
0°  
0.030  
L1  
k
8°  
8°  
aaa  
0.10  
0.004  
24/26  
DocID024119 Rev 3  
TS882, TS884  
Revision history  
5
Revision history  
Table 12. Document revision history  
Changes  
Date  
Revision  
18-Jan-2013  
1
Initial release.  
Added TS884 device to header, Description, and Table 1: Device  
summary.  
Updated title (added “quad” comparator).  
Updated Features and Table 2 (ESD tolerance: “6 kV” HBM replaced  
by “8 kV” HBM).  
Updated Description in accordance with added TS884 device.  
Added SO14, TSSOP14 and QFN16 3 x 3 mm package to Features,  
figure on page 1, Section 4: Package information. and Table 1:  
Device summary.  
02-May-2013  
2
Moved Figure 1: Pin connections TS882 (top view) to page 3.  
Added Figure 2: Pin connections TS884 (top view).  
Updated Table 2: Absolute maximum ratings (added TS884 device  
RTHJA values).  
Minor corrections throughout document.  
14-Jul-2014  
3
Updated Table 1: Device summary on page 1  
DocID024119 Rev 3  
25/26  
26  
TS882, TS884  
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26/26  
DocID024119 Rev 3  

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