TYN810RG [STMICROELECTRONICS]
10A SCR; 可控硅10A型号: | TYN810RG |
厂家: | ST |
描述: | 10A SCR |
文件: | 总6页 (文件大小:64K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TYNx10 Series
®
10A SCR
STANDARD
Table 1: Main Features
Symbol
A
Value
Unit
IT(RMS)
10
A
G
K
VDRM/VRRM
IGT
400, 600 and 800
15
V
A
mA
DESCRIPTION
The TYNx10 Silicon Controlled Rectifiers is a high
K
A
G
performance glass passivated technology.
TO-220AB
Table 2: Order Codes
This general purpose Silicon Controlled Rectifiers
is designed for power supply up to 400Hz on resis-
tive or inductive load.
Part Numbers
TYN410RG
TYN610RG
TYN810RG
Marking
TYN410
TYN610
TYN810
Table 3: Absolute Ratings (limiting values)
Symbol
Parameter
Value
Unit
A
IT(RMS)
Tc = 100°C
RMS on-state current (180° conduction angle)
Average on-state current (180° conduction angle)
10
6.4
105
100
50
IT(AV)
Tc = 100°C
A
tp = 8.3 ms
tp = 10 ms
Non repetitive surge peak on-state
current
ITSM
Tj = 25°C
A
²
²
A2S
tp = 10 ms Tj = 25°C
Tj = 125°C
I t
I t Value for fusing
Critical rate of rise of on-state current
IG = 100 mA , dIG/dt = 0.1 A/µs
dI/dt
50
A/µs
IGM
PG(AV)
PGM
tp = 20 µs
Tj = 125°C
Tj = 125°C
Peak gate current
4
1
A
Average gate power dissipation
Maximum gate power
W
W
tp = 20 µs Tj = 125°C
10
TYN410
400
600
800
VDRM
VRRM
Tj = 125°C
Repetitive peak off-state voltage
TYN610
TYN810
V
Tstg
Tj
- 40 to + 150
- 40 to + 125
Storage junction temperature range
Operating junction temperature range
°C
°C
TL
Maximum lead temperature for soldering during 10s at 2mm from case
260
February 2006
REV. 2
1/6
TYNx10 Series
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
Symbol
Test Conditions
RL = 33 Ω
VD = VDRM RL = 3.3 kΩ
Value
15
Unit
mA
V
IGT
MAX.
MAX.
MIN.
TYP.
MAX.
TYP.
VD = 12 V (D.C.)
VGT
VGD
tgt
1.5
0.2
2
Tj = 110°C
Tj = 110°C
V
VD = VDRM IG = 40 mA dIG/dt = 0.5 A/µs
IT = 100 mA Gate open
IG = 1.2 x IGT
µs
IH
30
mA
mA
IL
50
Linear slope up to:
VD = 67 % VDRM Gate open
dV/dt
VTM
MIN.
200
V/µs
ITM = 20 A tp = 380 µs
MAX.
1.6
10
2
V
Tj = 25°C
µA
mA
IDRM
IRRM
VDRM = VRRM
MAX.
TYP.
Tj = 110°C
tq
VD = 67 % VDRM ITM = 20 A VR = 25 V
dITM/dt = 30 A/µs dVD/dt = 50 V/µs
Tj = 110°C
70
µs
Table 5: Thermal Resistance
Symbol
Parameter
Value Unit
Rth(j-c)
Rth(j-a)
Junction to case (D.C.)
Junction to ambient
2.5
60
°C/W
°C/W
Figure 1: Maximum average power dissipation
versus average on-state current
Figure 2: Correlation between maximum
average power dissipation and maximum
allowable temperature (Tamb and Tlead
)
P(W)
P(W)
T
(°C)
case
Rth = 0°C/W
12
12
10
8
Rth = 6°C/W
Rth = 4°C/W Rth = 2°C/W
α = 180°
DC
10
8
100
105
110
115
α = 180°
α = 120°
α = 90°
α = 60°
6
6
α = 30°
4
4
360°
120
125
2
0
2
0
I
(A)
α
T
(°C)
T(AV)
amb
0
20
40
60
80
100
120
140
0
1
2
3
4
5
6
7
8
9
2/6
TYNx10 Series
Figure 3: Average on-state current versus case
temperature
Figure 4: Relative variation of thermal
impedance versus pulse duration
I (A)
T(AV)
K=[Z
/R
]
th(j-c) th(j-c)
12
10
8
1
Zth(j-c)
D.C.
α = 180°
Zth(j-a)
0.1
6
4
2
t (s)
p
T (°C)
case
0.01
0
0
10
20
30
40
50
60
70 80
90 100 110 120 130
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Figure 5: Relative variation of gate trigger
current versus junction temperature
Figure 6: Surge peak on-state current versus
number of cycles
I
,I ,I [T ] / I ,I ,I [T =25°C]
H L j GT H L j
GT
I (A)
TSM
2.5
2
120
100
80
tp=10ms
One cycle
IGT
1.5
Tj initial=25°C
60
40
20
0
IH & IL
1
0.5
0
T (°C)
Number of cycles
j
1
10
100
1000
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90 100 110
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding values of I²t
Figure 8: On-state characteristics (maximum
values)
I
(A), I2t (A2s)
I
(A)
TM
TSM
1000
100
10
Tj initial = 25°C
Tj=max
ITSM
I2t
100
10
Tj=25°C
Tj max.:
Vt0=0.82V
Rd=24mΩ
t (ms)
p
V
(V)
TM
1
0
1
2
3
4
5
1
2
5
10
3/6
TYNx10 Series
Figure 9: Ordering Information Scheme
TYN
4
10 RG
Standard SCR series
Voltage
4 = 400V
Current
10 = 10A
Packing mode
RG = Tube
Table 6: Product Selector
Voltage (xxx)
Part Numbers
Sensitivity
Package
400 V
600 V
800V
TYN410RG
TYN610RG
TYN810RG
X
X
15 mA
TO-220AB
X
4/6
TYNx10 Series
Figure 10: TO-220AB Package Mechanical Data
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
REF.
C
B
A
a1
15.20
15.90 0.598
0.625
Ø I
b2
3.75
0.147
L
a2 13.00
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
F
B
b1
b2
C
c1
c2
e
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
A
I4
l3
l2
c2
a1
a2
F
ØI
M
c1
I4 15.80 16.40 16.80 0.622 0.646 0.661
b1
e
L
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
l2
l3
M
2.60
0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 7: Ordering Information
Ordering type
TYN410RG
TYN610RG
TYN810RG
Marking
TYN410
TYN610
TYN810
Package
Weight Base qty Delivery mode
2.3 g 50 Tube
TO-220AB
Table 8: Revision History
Date
Revision
Description of Changes
Sep-2001
1A
First issue.
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
13-Feb-2006
2
5/6
TYNx10 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
6/6
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