TMPA1005S-R47MN-D [TAI-TECH]
SMD Power Inductor;
| 型号： | TMPA1005S-R47MN-D |
| 厂家： | 
TAI-TECH |
| 描述： | SMD Power Inductor |
| 文件： | 总3页 (文件大小：782K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TAI-TECH
SMD Power Inductor
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
Halogen
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
Halogen-free
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
C
A
A`
D
2R2
1916
leadframe
C
A
D
Recommend PC Board Pattern
A`
1R0
L
1916
non-leadframe
G
Series
A
A`
B
C
D
E
L(mm) G(mm) H(mm)
12.5
5.4
3.5
See Spec
table
TMPA1005 11.0±0.5 10.0±0.5 10.0±0.3 4.8±0.2 2.0±0.3
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
Unit:mm
4. Part Numbering
TMPA
1005
S
-
1R0
MN
-
D
A
B
C
D
E
F
A: Series
B: Dimension
C: Type
BxC
Standard.
D: Inductance
E: Inductance Tolerance
F: Code
R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.
K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
Marking: Black.1R0 and 1916(19YY, 16 WW,follow production date).
TAI-TECH
5. Specification
Heat Rating
Current DC
I rms ( A )
Saturation
Current DC
I sat ( A )
Inductance
L0 A(uH)
±20%
DCR
(mΩ)Typ
DCR
(mΩ)Max
E(mm)
±0.3
Part Number
Type
Typ
Max
Typ
Max
TMPA1005S-R30MN-D
TMPA1005S-R36MN-D
TMPA1005S-R47MN-D
TMPA1005S-R68MN-D
TMPA1005S-1R0MN-D
TMPA1005S-1R5MN-D
TMPA1005S-2R2MN-D
TMPA1005S-3R3MN-D
TMPA1005S-4R7MN-D
TMPA1005S-5R6MN-D
TMPA1005S-6R8MN-D
TMPA1005S-8R2MN-D
TMPA1005S-100MN-D
TMPA1005S-150MN-D
TMPA1005S-220MN-D
TMPA1005S-330MN-D
TMPA1005S-470MN-D
TMPA1005S-101MN-D
Note:
0.30
0.36
0.47
0.68
1.00
1.50
2.20
3.30
4.70
5.60
6.80
8.20
10.0
15.0
22.0
33.0
47.0
100
36.0
32.0
55.0
49.0
0.67
0.82
1.15
1.60
2.60
3.40
5.10
8.10
9.30
12.8
15.0
16.1
18.9
32.0
44.0
74.0
106.0
242.0
0.80
0.92
1.32
1.90
3.00
3.80
5.60
9.10
10.5
14.4
17.3
18.8
21.8
39.0
54.0
86.0
127.0
290.0
3.0
3.0
3.0
2.5
2.5
2.5
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
leadframe
34.0
33.0
28.0
25.0
23.0
19.5
17.0
15.0
13.0
12.0
10.0
7.6
30.0
29.0
25.0
23.0
21.0
17.5
15.0
13.0
11.0
10.0
8.50
7.2
52.0
46.0
35.0
33.0
27.0
20.0
17.5
16.0
15.0
14.0
13.5
13.0
8.5
46.0
40.0
32.0
30.0
24.0
18.0
15.5
14.0
12.5
12.0
11.5
11.0
7.5
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
6.5
6.0
leadframe
6.0
5.5
6.0
5.5
leadframe
5.5
5.0
5.8
5.2
leadframe
4.5
4.0
4.0
3.5
leadframe
2.2
2.0
2.8
2.4
leadframe
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
6. Typical Performance Curves
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