ICP-10100 [TDK]
气压传感器;
| 型号： | ICP-10100 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | 气压传感器 传感器 |
| 文件： | 总34页 (文件大小：1229K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICP-10100, ICP-10101, ICP-10110, ICP-10111
High Accuracy, Low Power, Waterproof Barometric Pressure
and Temperature Sensor IC
GENERAL INFORMATION
FEATURES
•
•
Pressure operating range: 30 to 110 kPa
Noise and current consumption
The ICP-101xx pressure sensor family is based on MEMS
capacitive technology which provides ultra-low noise at the
lowest power, enabling industry leading relative accuracy,
sensor throughput, and temperature stability. The pressure
sensor can measure pressure differences with an accuracy of
±1 Pa, an accuracy enabling altitude measurement
differentials as small as 8.5 cm, less than the height of a single
stair step.
o
o
o
0.4 Pa @ 10.4 µA (ULN mode)
0.8 Pa @ 5.2 µA (LN mode)
3.2 Pa @ 1.3 µA (LP mode)
•
•
•
Pressure Sensor Relative Accuracy: ±1 Pa for any
10 hPa change over 950 hPa-1050 hPa at 25°C
Pressure Sensor Absolute Accuracy: ±1 hPa over
950 hPa-1050 hPa, 0°C to 65°C
Pressure Sensor Temperature Coefficient Offset:
±0.5 Pa/°C over 25°C to 45°C at 100 kPa
Temperature Sensor Absolute Accuracy: ±0.4°C
IPx8: Waterproof to 1.5m depth (ICP-10100 & ICP-
10110)
Consuming only 1.3 µA @1 Hz, available in a small footprint
2 mm x 2 mm x 0.72 mm waterproof to 1.5m depth 10-pin
LGA package (ICP-10100), the ICP-101xx is ideally suited for
mobile phones, wearable fitness monitoring, drones, and
battery powered IoT.
•
•
The ICP-101xx offers an industry leading temperature
coefficient offset of ±0.5 Pa/°C. The combination of high
accuracy, low power, temperature stability, waterproofing in
a small footprint enables higher performance barometric
pressure sensing for sports activity identification, mobile
indoor/outdoor navigation, and altitude-hold in drones.
•
•
•
•
Temperature operating range: -40 °C to 85 °C
Host Interface: I2C at up to 400 kHz
Single Supply voltage: 1.8V ±5%
RoHS and Green compliant
DEVICE INFORMATION
PART
NUMBER
PACKAGE
LID OPENING
3-Hole IPx8 Lid Opening
ICP-10100 & ICP-10110
1-Hole Lid Opening
ICP-10100
2x2x0.72mm LGA-10L
2x2x0.72mm LGA-10L
3-Hole, IPx8: 1.5m Waterproof
1-Hole
ICP-10101 & ICP-10111
ICP-10101
ICP-10110 2x2.5x0.92mm LGA-8L 3-Hole, IPx8: 1.5m Waterproof
ICP-10111
TYPICAL OPERATING CIRCUIT
2x2.5x0.92mm LGA-8L
1-Hole
Denotes RoHS and Green-Compliant Package
BLOCK DIAGRAMS
I2C
ICP-101xx
APPLICATIONS
•
•
•
•
Altitude Control of Drones and Flying Toys
Mobile Phones
Virtual Reality and Gaming Equipment
Indoor/Outdoor Navigation (dead-reckoning,
floor/elevator/step detection)
Vertical velocity monitoring
Leisure, Sports, and Fitness Activity Identification
Weather Forecasting
•
•
•
TDK Corporation
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
Document Number: DS-000186
Revision: 1.2
Release Date: 05/06/2019
www.invensense.com
ICP-10100, ICP-10101, ICP-10110, ICP-10111
TABLE OF CONTENTS
GENERAL INFORMATION...............................................................................................................................................................................1
DEVICE INFORMATION .................................................................................................................................................................................1
APPLICATIONS ............................................................................................................................................................................................1
FEATURES..................................................................................................................................................................................................1
TYPICAL OPERATING CIRCUIT.........................................................................................................................................................................1
1
2
INTRODUCTION .........................................................................................................................................................................5
1.1
1.2
PURPOSE AND SCOPE.......................................................................................................................................................................5
PRODUCT OVERVIEW.......................................................................................................................................................................5
PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS..........................................................................................................6
2.1
OPERATION RANGES........................................................................................................................................................................6
OPERATION MODES ........................................................................................................................................................................6
PRESSURE SENSOR SPECIFICATIONS ....................................................................................................................................................7
TEMPERATURE SENSOR SPECIFICATIONS ..............................................................................................................................................7
RECOMMENDED OPERATION CONDITIONS ...........................................................................................................................................7
2.2
2.3
2.4
2.5
3
4
ELECTRICAL SPECIFICATIONS......................................................................................................................................................8
3.1
ELECTRICAL CHARACTERISTICS ...........................................................................................................................................................8
ABSOLUTE MAXIMUM RATINGS.........................................................................................................................................................9
SENSOR SYSTEM TIMING ..................................................................................................................................................................9
I2C TIMING CHARACTERIZATION.......................................................................................................................................................10
3.2
3.3
3.4
APPLICATIONS INFORMATION.................................................................................................................................................11
4.1
4.2
INTERFACE SPECIFICATIONS .............................................................................................................................................................11
PIN OUT DIAGRAM AND SIGNAL DESCRIPTION....................................................................................................................................11
ICP-10100 and ICP-10101: 2x2x0.72mm 10-pin LGA ............................................................................................................................................. 11
ICP-10110 and ICP-10111: 2x2.5x0.92 mm 8-pin LGA ........................................................................................................................................... 12
4.3
4.4
TYPICAL OPERATING CIRCUIT...........................................................................................................................................................13
BILL OF MATERIALS FOR EXTERNAL COMPONENTS...............................................................................................................................15
5
OPERATION AND COMMUNICATION .......................................................................................................................................16
5.1
POWER-UP AND COMMUNICATION START.........................................................................................................................................16
MEASUREMENT COMMANDS ..........................................................................................................................................................16
STARTING A MEASUREMENT ...........................................................................................................................................................16
SENSOR BEHAVIOR DURING MEASUREMENT ......................................................................................................................................16
READOUT OF MEASUREMENT RESULTS..............................................................................................................................................16
SOFT RESET .................................................................................................................................................................................17
READ-OUT OF ID REGISTER .............................................................................................................................................................17
CHECKSUM CALCULATION...............................................................................................................................................................17
CONVERSION OF SIGNAL OUTPUT.....................................................................................................................................................18
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10 READ-OUT OF CALIBRATION PARAMETERS .........................................................................................................................................19
5.11 SAMPLE CODE: EXAMPLE C SYNTAX..................................................................................................................................................19
5.12 SAMPLE CODE: CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX)......................................................................................................21
5.13 SAMPLE CODE: USING CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX).............................................................................................22
5.14 COMMUNICATION DATA SEQUENCES................................................................................................................................................22
6
ASSEMBLY................................................................................................................................................................................24
6.1
IMPLEMENTATION AND USAGE RECOMMENDATIONS ...........................................................................................................................24
Soldering................................................................................................................................................................................................................ 24
Chemical Exposure and Sensor Protection ............................................................................................................................................................ 24
Document Number: DS-000186
Revision: 1.2
Page 2 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
7
PACKAGE DIMENSIONS............................................................................................................................................................25
PART NUMBER PART MARKINGS .............................................................................................................................................30
ORDERING GUIDE ....................................................................................................................................................................30
REFERENCES.........................................................................................................................................................................32
REVISION HISTORY...............................................................................................................................................................33
8
9
10
11
Document Number: DS-000186
Revision: 1.2
Page 3 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
LIST OF FIGURES
Figure 1. Digital I/O Pads Timing..................................................................................................................................................................................... 10
Figure 2. Pin Out Diagram for ICP-10100 & ICP10101, 2 mm x 2 mm x 0.72 mm LGA ................................................................................................... 11
Figure 3. Pin Out Diagram for ICP-10110 & ICP-10111 2 mm x 2.5 mm x 0.92 mm LGA ................................................................................................ 12
Figure 4. ICP-10100 & ICP-10101 Application Schematic ............................................................................................................................................... 13
Figure 5. Example: Typical application circuit, including pull-up resistor Rp and decoupling of VDD and VSS by capacitor (2 x 2.5 mm package)........14
Figure 6. ICP-10110 & ICP-10111 Application Schematic ............................................................................................................................................... 14
Figure 7. Example: Typical application circuit, including pull-up resistor Rp and decoupling of VDD and VSS by capacitor (2 x 2.5 mm package)........15
Figure 8. Communication Data Sequences ..................................................................................................................................................................... 23
Figure 9. ICP-10100 & ICP-1010 Package Diagrams........................................................................................................................................................ 25
Figure 10. ICP-10100 & ICP-10101 recommended PCB land pattern ............................................................................................................................. 26
Figure 11. ICP-10110 & ICP-10111 Package Diagrams.................................................................................................................................................... 28
Figure 12. ICP-10110 & ICP-10111 recommended PCB land pattern ............................................................................................................................. 29
Figure 13. Part Number Part Markings ........................................................................................................................................................................... 30
LIST OF TABLES
Table 1. Operation Ranges................................................................................................................................................................................................ 6
Table 2. Operation Modes................................................................................................................................................................................................ 6
Table 3. Pressure Sensor Specifications............................................................................................................................................................................ 7
Table 4. Temperature Sensor Specifications .................................................................................................................................................................... 7
Table 5. Electrical Specifications....................................................................................................................................................................................... 8
Table 6. Absolute Maximum Ratings ................................................................................................................................................................................ 9
Table 7. System Timing Specifications.............................................................................................................................................................................. 9
Table 8. I2C Parameters Specification............................................................................................................................................................................. 10
Table 9. Signal Descriptions............................................................................................................................................................................................ 11
Table 10. Signal Descriptions.......................................................................................................................................................................................... 12
Table 11. Bill of Materials ............................................................................................................................................................................................... 15
Table 12. ICP-101xx I2C Device Address.......................................................................................................................................................................... 16
Table 13. Measurement Commands............................................................................................................................................................................... 16
Table 14. Soft Reset Command....................................................................................................................................................................................... 17
Table 15. Read-Out Command of ID Register ................................................................................................................................................................. 17
Table 16. 16-bit ID Structure .......................................................................................................................................................................................... 17
Table 17. ICP-101xx I2C CRC Properties .......................................................................................................................................................................... 18
Table 18. ICP-10100 & ICP-10101 Package Dimensions ................................................................................................................................................. 26
Table 19. ICP-10110 & ICP-10111 Package Dimensions ................................................................................................................................................. 28
Table 20. Part Number Part Markings ............................................................................................................................................................................ 30
Document Number: DS-000186
Revision: 1.2
Page 4 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
1 INTRODUCTION
1.1 PURPOSE AND SCOPE
This document is a preliminary product specification, providing a description, specifications, and design related information for the
ICP-101xx Pressure Sensor.
Specifications are subject to change without notice. Final specifications will be updated based upon characterization of production
silicon.
1.2 PRODUCT OVERVIEW
The ICP-101xx is an ultra-low power, low noise, digital output barometric pressure and temperature sensor IC. It is based on an
innovative MEMS capacitive pressure sensor technology that can measure pressure differences with an accuracy of ±1 Pa at the
industry’s lowest power. The high accuracy MEMS capacitive pressure sensor is capable of measuring altitude differentials down to
8.5 cm without the penalty of increased power consumption or reduced sensor throughput.
The capacitive pressure sensor has a ±1 hPa absolute accuracy over its full range of 300 hPa -1100 hPa. The pressure sensor has an
embedded temperature sensor and 400 kHz I2C bus for communication. For power-critical applications, the ICP-101xx features a low
power mode of 1.3 µA at a noise of 3.2 Pa or for high performance applications, it features a low noise mode of 0.8 Pa while only
consuming 5.2 µA.
The ICP-10100 and ICP-10110 has three 0.025 mm package openings, making waterproof to 1.5m for 30 minutes providing many
mobile applications improved water resistance with no additional waterproofing costs.
The ICP-101xx also offers industry leading temperature stability of the pressure sensor with a temperature coefficient offset of
±0.5 Pa/°C. The high accuracy, temperature stability, and market leading low power consumption of 1.3 µA @1 Hz offered by ICP-
101xx makes it ideally suited for applications such as mobile phones, drone flight control and stabilization, indoor/outdoor
navigation (elevator, floor, and stair step detection), sports and fitness activity monitoring, and battery-powered IoT.
Document Number: DS-000186
Revision: 1.2
Page 5 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
2 PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS
2.1 OPERATION RANGES
The sensor shows best performance when operated within the recommended temperature and pressure range (hereafter called
normal conditions) of 0°C – 45°C and 95 kPa – 105 kPa, respectively. The following ranges are defined for the device:
OPERATION RANGE
Normal
PRESSURE (KPA)
TEMPERATURE (°C)
95 to 105
0 to 45
Extended
Maximum
30 to 110
25 to 115
-20 to 65
-40 to 85
Table 1. Operation Ranges
2.2 OPERATION MODES
The sensor can be operated in up to four different measurement modes to satisfy different requirements for power consumption vs.
noise, accuracy and measurement frequency. An overview of the operation modes is given in Table 2.
PARAMETER
CONDITIONS
SENSOR MODE
TYP
MAX
UNITS
NOTES
Low Power (LP)
Normal (N)
1.6
5.6
1.8
6.3
1
1
1
Time between sending last bit of
measurement command, and
sensor data ready for
Conversion Time
ms
Low Noise (LN)
Ultra Low Noise
(ULN)
20.8
23.8
measurement
83.2
94.5
1
Low Power (LP)
Normal (N)
Low Noise (LN)
Ultra Low Noise
(ULN)
Low Power (LP)
Normal
Low Noise (LN)
Ultra Low Noise
(ULN)
1.3
2.6
5.2
Current
Consumption
1 Hz ODR
µA
Pa
10.4
3.2
1.6
0.8
Valid for P = 100 kPa, T = 25°C,
and U = 1.8V
Pressure RMS Noise
0.4
Table 2. Operation Modes
Notes:
1. Guaranteed by design.
Low Power modes supports ODR greater than 500 Hz while the Low Noise mode provides industry leading RMS noise at a fast 40 Hz
ODR. Further decrease in noise may be achieved by software oversampling and filtering through customer’s software
implementation or custom TDK-InvenSense operation modes available upon request.
Document Number: DS-000186
Revision: 1.2
Page 6 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
2.3 PRESSURE SENSOR SPECIFICATIONS
Pressure sensor specifications are given in Table 3. Default conditions of 25 °C and 1.8V supply voltage apply, unless otherwise stated.
PARAMETER
Absolute Accuracy
CONDITIONS
Normal range
TYP
±1
UNITS
hPa
NOTES
1
Extended range
±1.5
Relative Accuracy
Any step ≤ 1 kPa, 25 °C
Any step ≤ 10 kPa, 25 °C
±1
±3
Pa
Long-term drift
During 1 year
Solder drift
Extended range
±1
hPa/y
hPa
1.5
1, 2
Temperature coefficient offset
P = 100 kPa
25°C … 45°C
Maximum range
±0.5
0.01
Pa/°C
Pa
Resolution
Table 3. Pressure Sensor Specifications
Notes:
1. Absolute accuracy may be improved through One Point Calibration
2. Sensor accuracy post Solder reflow may be improved through One Point Calibration
2.4 TEMPERATURE SENSOR SPECIFICATIONS
Specifications of the temperature sensor are shown in Table 4.
PARAMETER
Absolute Accuracy
Repeatability
Resolution
CONDITIONS
Extended range
Extended range
Maximum range
Normal range
TYP
±0.4
±0.1
0.01
<0.04
UNITS
°C
°C
°C
°C/y
Long-term drift
Table 4. Temperature Sensor Specifications
2.5 RECOMMENDED OPERATION CONDITIONS
The pressure sensor exhibits best performance when operated within the normal pressure and temperature range 0°C < T < 45°C
and 95 kPa < P < 105 kPa.
Injected photo current due to strong light sources can influence the sensor performance and should be avoided to guarantee best
operation.
The sensor should not be exposed to high mechanical stress, the resulting deformation of the package can alter internal dimensions
and therefore falsify the sensor signal. Solder reflow may affect device performance. One-point calibration can improve the sensor
accuracy post solder reflow.
Document Number: DS-000186
Revision: 1.2
Page 7 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
3 ELECTRICAL SPECIFICATIONS
3.1 ELECTRICAL CHARACTERISTICS
Default conditions of 25 °C and 1.8V supply voltage apply to values in Table 5, unless otherwise stated.
PARAMETER
Supply voltage
SYMBOL
VDD
CONDITIONS
MIN
1.71
1.0
TYP
1.8
MAX
1.89
1.5
UNITS
COMMENTS
V
V
Power-up/down level
Supply Ramp Time
VPOR
Static power supply
1.25
Monotonic ramp. Ramp rate
is 10% to 90% of the final
value
TRAMP
0.01
100
ms
Idle state
-
-
1.0
2.5
µA
µA
Current consumption while
sensor is measuring.
Measurement
210
300
Current consumption in
µA continuous operation @ 1 Hz
ODR in LP Mode
Supply current
IDD
-
-
1.3
5.2
-
-
Average
Current consumption in
µA continuous operation @1 Hz
ODR in LN Mode
Low level input voltage
High level input voltage
Low level output voltage
VIL
VIH
VOL
0
0.7 VDD
-
-
-
0.3 VDD
V
V
VDD
0 < IOL < 3 mA
VOL = 0.4V
-
0.2 VDD
V
3.1
4.1
4.5
-
-
mA
mA
Output Sink Current
IOL
VOL = 0.6V
3.5
Table 5. Electrical Specifications
Document Number: DS-000186
Revision: 1.2
Page 8 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
3.2 ABSOLUTE MAXIMUM RATINGS
Stress levels beyond those listed in Table 6 may cause permanent damage to the device. These are stress ratings only and functional
operation of the device at these conditions cannot be guaranteed. Exposure to the absolute maximum rating conditions for
extended periods may affect the reliability of the device.
PARAMETER
Supply voltage, VDD
RATING
-0.3V to 2.16V
-0.3V to VDD 0.3V
-40°C to 85°C
-40°C to 125°C
2.0 kV
Supply Voltage, SCL & SDA
Operating temperature range
Storage temperature range
ESD HBM
ESD CDM
250V
Latch up, JESD78 Class II, 85°C
Overpressure
100 mA
>600kPa
Table 6. Absolute Maximum Ratings
3.3 SENSOR SYSTEM TIMING
Default conditions of 25°C and 1.8V supply voltage apply to typ. values listed in Table 7, unless otherwise stated. Max. values apply
over the specified operating range of VDD and over the operating temperature range.
PARAMETER
Power-up time
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS
COMMENTS
Time between VDD reaching VPU
and sensor entering idle state
tPU
After hard reset, VDD ≥ VPOR
-
170
-
-
µs
µs
Time between ACK of soft reset
command and sensor entering
idle state
Soft reset time
tSR
After soft reset
-
-
170
Duration for a pressure and
temperature measurement
Measurement duration
tMEAS LN Mode
20.8
23.8
ms
Table 7. System Timing Specifications
Document Number: DS-000186
Revision: 1.2
Page 9 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
3.4 I2C TIMING CHARACTERIZATION
Default conditions of 25°C and 1.8V supply voltage apply to values in Table 8, unless otherwise stated.
PARAMETER
SCL clock frequency
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
fSCL
0
-
400
kHz
After this period, the first clock
pulse is generated
Hold time (repeated) START condition
tHD;STA
0.6
-
-
µs
LOW period of the SCL clock
HIGH period of the SCL clock
Set-up time for a repeated START condition
SDA hold time
tLOW
tHIGH
tSU;STA
tHD;DAT
tSU;DAT
tR
1.3
0.6
0.6
0
-
-
-
-
-
-
-
-
-
µs
µs
µs
µs
ns
ns
ns
µs
-
-
-
SDA set-up time
100
20
-
-
SCL/SDA rise time
300
300
0.9
SCL/SDA fall time
tF
SDA valid time
tVD;DAT
-
Set-up time for STOP condition
Capacitive load on bus line
tSU;STO
CB
0.6
-
-
-
-
µs
pF
400
Table 8. I2C Parameters Specification
1/fSC
tHIGH
tR
tF
tLOW
70
30
SCL
tSU;D
tHD;DA
DATA IN
70
30
SDA
tR
tVD;DAT
tF
DATA OUT
70
30
SDA
Figure 1. Digital I/O Pads Timing
Document Number: DS-000186
Revision: 1.2
Page 10 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
4 APPLICATIONS INFORMATION
4.1 INTERFACE SPECIFICATIONS
The ICP-101xx supports I2C fast mode, SCL clock frequency from 0 to 400 kHz.
4.2 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION
ICP-10100 and ICP-10101: 2x2x0.72mm 10-pin LGA
PIN NUMBER
PIN NAME
RESV
SCL
DESCRIPTION
No Internal Connection: Can connect to VDD/VDDIO/GND/NC
I2C Serial Clock
1
2
3
4
RESV
SDA
Connect to Ground
I2C Serial Data
5
6
7
8
RESV
RESV
RESV
GND
Connect to VDD
Connect to VDD
No Internal Connection: Can connect to VDD/VDDIO/GND/NC
Connect to Ground
9
GND
Connect to Ground
10
VDD
Power Supply VDD
Table 9. Signal Descriptions
3
4
5
RESV
SDA
RESV
2
6
SCL
RESV
BOTTOM VIEW
1
7
RESV
RESV
10
9
8
VDD
GND
GND
Figure 2. Pin Out Diagram for ICP-10100 & ICP10101, 2 mm x 2 mm x 0.72 mm LGA
Document Number: DS-000186
Revision: 1.2
Page 11 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
ICP-10110 and ICP-10111: 2x2.5x0.92 mm 8-pin LGA
PIN NUMBER
PIN NAME
DESCRIPTION
1
2
3
4
5
6
7
8
GND
RESV
SDA
Connect to Ground
No Internal Connection: Can connect to VDD/VDDIO/GND/NC
I2C Serial Data
SCL
I2C Serial Clock
RESV
RESV
GND
VDD
Connect to Ground
No Internal Connection: Can connect to VDD/VDDIO/GND/NC
Connect to Ground
Power Supply VDD
Table 10. Signal Descriptions
1
8
GND
VDD
2
7
RESV
GND
BOTTOM VIEW
3
6
SDA
RESV
4
5
SCL
RESV
Figure 3. Pin Out Diagram for ICP-10110 & ICP-10111 2 mm x 2.5 mm x 0.92 mm LGA
Document Number: DS-000186
Revision: 1.2
Page 12 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
4.3 TYPICAL OPERATING CIRCUIT
GND
GND
VDD
1.71-1.89V
C1, 100nF
GND
10
9
8
VDD
GND
GND
No Internal Connection
Can connect to: VDD/VDDIO/GND/NC
No Internal Connection
Can connect to: VDD/VDDIO/GND/NC
1
7
RESV
RESV
TOP VIEW
2
6
SCL
VDD
SCL
RESV
3
4
5
RESV
SDA
RESV
GND
SDA
VDD
Figure 4. ICP-10100 & ICP-10101 Application Schematic
Power supply pins supply voltage (Vdd) and ground (Vss) must be decoupled with a 100 nF capacitor that shall be placed as close to
the sensor as possible (see Figure 5).
Document Number: DS-000186
Revision: 1.2
Page 13 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
Figure 5. Example: Typical application circuit, including pull-up resistor Rp and decoupling of VDD and VSS by capacitor (2 x 2.5 mm package)
SCL is used to synchronize the communication between the microcontroller and the sensor. The master must keep the clock
frequency within 0 to 400 kHz as specified in Table 8.
The SDA pin is used to transfer data in and out of the sensor. For safe communication, the timing specifications defined in the I2C
manual must be met.
To avoid signal contention, the microcontroller must only drive SDA and SCL low. External pull-up resistors (i.e. 10 kΩ) are required
to pull the signal high. For dimensioning resistor sizes, user should also consider bus capacity requirements. It should be noted that
pull-up resistors may be included in I/O circuits of microcontrollers.
1
8
VDD
1.71-1.89V
GND
GND
VDD
C1, 100nF
No Internal Connection
Can connect to: VDD/VDDIO/GND/NC
2
7
GND
RESV
GND
GND
TOP
No Internal Connection
3
6
SDA
SCL
SDA
RESV
Can connect to: VDD/VDDIO/GND/NC
4
5
GND
SCL
RESV
Figure 6. ICP-10110 & ICP-10111 Application Schematic
Document Number: DS-000186
Revision: 1.2
Page 14 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
Power supply pins supply voltage (Vdd) and ground (Vss) must be decoupled with a 100 nF capacitor that shall be placed as close to
the sensor as possible (see Figure 7).
The linked image cannot be displayed. The file may have been moved, renamed, or deleted. Verify that the link points to the correct file and location.
Figure 7. Example: Typical application circuit, including pull-up resistor Rp and decoupling of VDD and VSS by capacitor (2 x 2.5 mm package)
4.4 BILL OF MATERIALS FOR EXTERNAL COMPONENTS
COMPONENT
VDD Bypass Capacitor
LABEL
SPECIFICATION
QUANTITY
C1
Ceramic, X7R, 100 nF ±10%
1
Table 11. Bill of Materials
Document Number: DS-000186
Revision: 1.2
Page 15 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
5 OPERATION AND COMMUNICATION
All commands and memory locations of the ICP-101xx are mapped to a 16-bit address space which can be accessed via the I2C protocol.
ICP-101XX
BINARY
DECIMAL
HEXADECIMAL
I2C address
110’0011
99
0x63
Table 12. ICP-101xx I2C Device Address
5.1 POWER-UP AND COMMUNICATION START
Upon VDD reaching the power-up voltage level VPOR, the ICP-101xx enters idle state after a duration of tPU. In idle state, the ICP-
101xx is ready to receive commands from the master (microcontroller).
Each transmission sequence begins with START condition (S) and ends with an (optional) STOP condition (P) as described in the
I2C-bus specification. Whenever the sensor is powered up, but not performing a measurement or communicating, it automatically
enters idle state for energy saving.
5.2 MEASUREMENT COMMANDS
The ICP-101xx provides the possibility to define the sensor behavior during measurement as well as the transmission sequence of
measurement results. These characteristics are defined by the appropriate measurement command.
Each measurement command triggers both a temperature and a pressure measurement.
OPERATION MODE
Low Power (LP)
Normal (N)
Low Noise (LN)
Ultra-Low Noise (ULN)
TRANSMIT T FIRST TRANSMIT P FIRST
0x609C
0x6825
0x70DF
0x7866
0x401A
0x48A3
0x5059
0x58E0
Table 13. Measurement Commands
5.3 STARTING A MEASUREMENT
A measurement communication sequence consists of a START condition followed by the I2C header with the 7-bit I2C device address
and a write bit (write W: ‘0’, 8-bit word including I2C header: 0xC6). The sensor indicates the proper reception of a byte by pulling
the SDA pin low (ACK bit) after the falling edge of the 8th SCL clock. Then the sensor is ready to receive a 16-bit measurement
command. Again, the ICP-101xx acknowledges the proper reception of each byte with ACK condition. A complete measurement
cycle is presented in Figure 8.
With the acknowledgement of the measurement command, the ICP-101xx starts measuring pressure and temperature.
5.4 SENSOR BEHAVIOR DURING MEASUREMENT
In general, the sensor does not respond to any I2C activity during measurement, i.e. I2C read and write headers are not
acknowledged (NACK).
5.5 READOUT OF MEASUREMENT RESULTS
After a measurement command has been issued and the sensor has completed the measurement, the master can read the
measurement results by sending a START condition followed by an I2C read header (8-bit word including I2C header: 0xC7). The
sensor will acknowledge the reception of the read header and send the measured data in the specified order to the master. The MSB
of the corresponding data is always transmitted first. Temperature data is transmitted in two 8-bit words and pressure data is
transmitted in four 8-bit words. Regarding the pressure data, only the first three words MMSB, MLSB and LMSB contain information
about the ADC pressure value p_dout. Therefore, for retrieving the ADC pressure value, LLSB must be disregarded:
p_dout = MMSB ≪ 16 | MLSB ≪ 8| LMSB.
Document Number: DS-000186
Revision: 1.2
Page 16 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
Two bytes of data are always followed by one byte CRC checksum, for calculation see section 5.8. Each byte must be acknowledged
by the microcontroller with an ACK condition for the sensor to continue sending data. If the ICP-101xx does not receive an ACK from
the master after any byte of data, it will not continue sending data.
Whether the sensor sends out pressure or temperature data first depends on the measurement command that was sent to the
sensor to initiate the measurement (see Table 13).
The I2C master can abort the read transfer with a NACK condition after any data byte if it is not interested in subsequent data, e.g.
the CRC byte or the second measurement result, to save time.
5.6 SOFT RESET
The ICP-101xx provides a soft reset mechanism that forces the system into a well-defined state without removing the power supply.
If the system is in idle state (i.e. if no measurement is in progress) the soft reset command will be accepted by ICP-101xx. This
triggers the sensor to reset all internal state machines and reload calibration data from the memory.
COMMAND
HEXADECIMAL CODE
BINARY CODE
Soft reset
0x805D
1000’0000’0101’1101
Table 14. Soft Reset Command
5.7 READ-OUT OF ID REGISTER
The ICP-101xx has an ID register which contains a specific product code. The read-out of the ID register can be used to verify the
presence of the sensor and proper communication. The command to read the ID register is shown in Table 15.
COMMAND
HEXADECIMAL CODE
BINARY CODE
Read ID register
0xEFC8
1110’1111’1100’1000
Table 15. Read-Out Command of ID Register
It needs to be sent to the ICP-101xx after an I2C write header. After the ICP-101xx has acknowledged the proper reception of the
command, the master can send an I2C read header and the ICP-101xx will submit the 16-bit ID followed by 8 bits of CRC. The
structure of the ID is described in Table 16. Bits 15:6 of the ID contain unspecified information (marked as “x”), which may vary from
sensor to sensor, while bits 5:0 contain the ICP-101xx specific product code.
16-bit ID
xxxx'xxxx’xx 00’1000
bits 5 to 0: ICP-101xx-specific product code
bits 15 to 6: unspecified information
Table 16. 16-bit ID Structure
5.8 CHECKSUM CALCULATION
The 8-bit CRC checksum transmitted after each data word is generated by a CRC algorithm with the properties displayed in Table 17.
The CRC covers the contents of the two previously transmitted data bytes.
Document Number: DS-000186
Revision: 1.2
Page 17 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
PROPERTY
VALUE
Name
CRC-8
Width
8 bits
Polynomial
Initialization
Reflect input
Reflect output
Final XOR
0x31 (x8 + x5 + x4 + 1)
0xFF
false
false
0x00
CRC(0x00) = 0xAC
CRC(0xBEEF) = 0x92
Examples
Table 17. ICP-101xx I2C CRC Properties
5.9 CONVERSION OF SIGNAL OUTPUT
Pressure measurement data is always transferred as 4 8-bit words; temperature measurement data is always transferred as two 8-
bit words. Please see section 5.5 for more details.
Temperature measurement values t_dout are linearized by the ICP-101xx and must be calculated to °C by the user via the following
formula:
175°C
T = - 45°C +
× t_dout.
16
2
For retrieving physical pressure values in Pa the following conversion formula has to be used:
B
P = A +
,
C + pdout
where p_dout is the sensor’s raw pressure output. The converted output is compensated for temperature effects via the
temperature dependent functions A, B and C. Besides the raw temperature output t_dout, the calculation of A, B and C requires to
access calibration parameters OTP0, OTP1, OTP2, OTP3 stored in the OTP of the sensor. Read-out of OTP parameters is described in
section 5.10.
Full sample code for calculating physical pressure values is given in section 5.11. The general workflow of the conversion is done by:
1) Import class Invensense_pressure_conversion
2) Read out values OTP0, …, OTP3 and save to c1, …, c4
3) Create object name for an individual sensor with parameter values c1, …, c4
name = Invensense_pressure_conversion
([c1,c2,c3,c4])
4) Get raw pressure p_dout and temperature t_dout data from the sensor as described in chapter 5.5.
5) Call function get_pressure:
name.get_pressure(p_dout, t_dout)
The sample code from section 5.13 gives an example of this workflow.
Document Number: DS-000186
Revision: 1.2
Page 18 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
5.10 READ-OUT OF CALIBRATION PARAMETERS
For converting raw pressure data to physical values, four calibration parameters have to be retrieved from the OTP of the sensor.
Set up of OTP read:
1) Send I2C write header 0xC6
2) Send command 0xC595 (move pointer in address register)
3) Send address parameter together with its CRC 0x00669C
Steps 1) – 3) can be executed on many platforms by a single I2C write of the value 0xC59500669C.
Read out parameters:
Repeat the following procedure 4 times:
a) Send I2C write header 0xC6
b) Send command 0xC7F7 (incremental read-out of OTP)
c) Send I2C read header 0xC7
d) Read 3B (2B of data and 1B of CRC)
e) Decode data as 16bit big endian signed integer and store result into n-th calibration parameter cn.
Steps a) to d) can be executed on many platforms by a single write 0xC7F7 to the chip address followed by a single read of 3 B from
the chip address.
5.11 SAMPLE CODE: EXAMPLE C SYNTAX
/* data structure to hold pressure sensor related parameters */
typedef struct inv_invpres
{
struct inv_invpres_serif serif;
uint32_t min_delay_us;
uint8_t pressure_en;
uint8_t temperature_en;
float sensor_constants[4]; // OTP values
float p_Pa_calib[3];
float LUT_lower;
float LUT_upper;
float quadr_factor;
float offst_factor;
} inv_invpres_t;
int inv_invpres_init(struct inv_invpres * s)
{
short otp[4];
read_otp_from_i2c(s, otp);
init_base(s, otp);
return 0;
}
int read_otp_from_i2c(struct inv_invpres * s, short *out)
{
unsigned char data_write[10];
unsigned char data_read[10] = {0};
int status;
int i;
// OTP Read mode
data_write[0] = 0xC5;
data_write[1] = 0x95;
data_write[2] = 0x00;
data_write[3] = 0x66;
data_write[4] = 0x9C;
Document Number: DS-000186
Revision: 1.2
Page 19 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
status = inv_invpres_serif_write_reg(&s->serif, ICC_ADDR_PRS, data_write, 5);
if (status)
return status;
// Read OTP values
for (i = 0; i < 4; i++) {
data_write[0] = 0xC7;
data_write[1] = 0xF7;
status = inv_invpres_serif_write_reg(&s->serif, ICC_ADDR_PRS, data_write, 2);
if (status)
return status;
status = inv_invpres_serif_read_reg(&s->serif, ICC_ADDR_PRS, data_read, 3);
if (status)
return status;
out[i] = data_read[0]<<8 | data_read[1];
}
return 0;
}
void init_base(struct inv_invpres * s, short *otp)
{
int i;
for(i = 0; i < 4; i++)
s->sensor_constants[i] = (float)otp[i];
s->p_Pa_calib[0] = 45000.0;
s->p_Pa_calib[1] = 80000.0;
s->p_Pa_calib[2] = 105000.0;
s->LUT_lower = 3.5 * (1<<20);
s->LUT_upper = 11.5 * (1<<20);
s->quadr_factor = 1 / 16777216.0;
s->offst_factor = 2048.0;
}
// p_LSB -- Raw pressure data from sensor
// T_LSB -- Raw temperature data from sensor
int inv_invpres_process_data(struct inv_invpres * s, int p_LSB, int T_LSB,
float * pressure, float * temperature)
{
float t;
float s1,s2,s3;
float in[3];
float out[3];
float A,B,C;
t = (float)(T_LSB - 32768);
s1 = s->LUT_lower + (float)(s->sensor_constants[0] * t * t) * s->quadr_factor;
s2 = s->offst_factor * s->sensor_constants[3] + (float)(s->sensor_constants[1] * t * t) * s->quadr_factor;
s3 = s->LUT_upper + (float)(s->sensor_constants[2] * t * t) * s->quadr_factor;
in[0] = s1;
in[1] = s2;
in[2] = s3;
calculate_conversion_constants(s, s->p_Pa_calib, in, out);
A = out[0];
B = out[1];
C = out[2];
*pressure = A + B / (C + p_LSB);
*temperature = -45.f + 175.f/65536.f * T_LSB;
return 0;
}
// p_Pa -- List of 3 values corresponding to applied pressure in Pa
// p_LUT -- List of 3 values corresponding to the measured p_LUT values at the applied pressures.
void calculate_conversion_constants(struct inv_invpres * s, float *p_Pa,
float *p_LUT, float *out)
{
float A,B,C;
C = (p_LUT[0] * p_LUT[1] * (p_Pa[0] - p_Pa[1]) +
p_LUT[1] * p_LUT[2] * (p_Pa[1] - p_Pa[2]) +
p_LUT[2] * p_LUT[0] * (p_Pa[2] - p_Pa[0])) /
Document Number: DS-000186
Revision: 1.2
Page 20 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
(p_LUT[2] * (p_Pa[0] - p_Pa[1]) +
p_LUT[0] * (p_Pa[1] - p_Pa[2]) +
p_LUT[1] * (p_Pa[2] - p_Pa[0]));
A = (p_Pa[0] * p_LUT[0] - p_Pa[1] * p_LUT[1] - (p_Pa[1] - p_Pa[0]) * C) / (p_LUT[0] - p_LUT[1]);
B = (p_Pa[0] - A) * (p_LUT[0] + C);
out[0] = A;
out[1] = B;
out[2] = C;
}
5.12 SAMPLE CODE: CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX)
class InvensensePressureConversion:
""" Class for conversion of the pressure and temperature output of the Invensense sensor"""
def __init__(self, sensor_constants):
""" Initialize customer formula
Arguments:
sensor_constants -- list of 4 integers: [c1, c2, c3, c4]
"""
self.sensor_constants = sensor_constants
# configuration for ICP-101xx Samples
self.p_Pa_calib = [45000.0, 80000.0, 105000.0]
self.LUT_lower = 3.5 * (2**20)
self.LUT_upper = 11.5 * (2**20)
self.quadr_factor = 1 / 16777216.0
self.offst_factor = 2048.0
def calculate_conversion_constants(self, p_Pa, p_LUT):
""" calculate temperature dependent constants
Arguments:
p_Pa -- List of 3 values corresponding to applied pressure in Pa
p_LUT -- List of 3 values corresponding to the measured p_LUT values at the applied pressures.
"""
C = (p_LUT[0] * p_LUT[1] * (p_Pa[0] - p_Pa[1]) +
p_LUT[1] * p_LUT[2] * (p_Pa[1] - p_Pa[2]) +
p_LUT[2] * p_LUT[0] * (p_Pa[2] - p_Pa[0])) / \
(p_LUT[2] * (p_Pa[0] - p_Pa[1]) +
p_LUT[0] * (p_Pa[1] - p_Pa[2]) +
p_LUT[1] * (p_Pa[2] - p_Pa[0]))
A = (p_Pa[0] * p_LUT[0] - p_Pa[1] * p_LUT[1] - (p_Pa[1] - p_Pa[0]) * C) / (p_LUT[0] - p_LUT[1])
B = (p_Pa[0] - A) * (p_LUT[0] + C)
return [A, B, C]
def get_pressure(self, p_LSB, T_LSB):
Document Number: DS-000186
Revision: 1.2
Page 21 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
""" Convert an output from a calibrated sensor to a pressure in Pa.
Arguments:
p_LSB -- Raw pressure data from sensor
T_LSB -- Raw temperature data from sensor
"""
t = T_LSB - 32768.0
s1 = self.LUT_lower + float(self.sensor_constants[0] * t * t) * self.quadr_factor
s2 = self.offst_factor * self.sensor_constants[3] + float(self.sensor_constants[1] * t * t) * self.quadr_factor
s3 = self.LUT_upper + float(self.sensor_constants[2] * t * t) * self.quadr_factor
A, B, C = self.calculate_conversion_constants(self.p_Pa_calib, [s1, s2, s3])
return A + B / (C + p_LSB)
[end of the pseudocode]
5.13 SAMPLE CODE: USING CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX)
def read_otp_from_i2c():
# TODO: implement read from I2C
# refer to data sheet for I2C commands to read OTP
return 1000, 2000, 3000, 4000
def read_raw_pressure_temp_from_i2c():
# TODO: implement read from I2C
# refer to data sheet for I2C commands to read pressure and temperature
return 8000000, 32000
# Sample code to read
from Invensense_pressure_conversion import Invensense_pressure_conversion
# -- initialization
c1, c2, c3, c4 = read_otp_from_i2c()
conversion = Invensense_pressure_conversion([c1, c2, c3, c4])
# -- read raw pressure and temp data, calculate pressure
p, T = read_raw_pressure_temp_from_i2c()
pressure = conversion.get_pressure(p, T)
print 'Pressure: %f' % pressure
[end of the pseudocode]
5.14 COMMUNICATION DATA SEQUENCES
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
P
ICP-101xx measuring
S
1 1 0 0 0 1 1 0
0 1 0 1 0 0 0 0
0 1 0 1 1 0 0 1
Measurement command
MSB
Measurement command
LSB
I2C address + write
Measurement in progress
Document Number: DS-000186
Revision: 1.2
Page 22 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
29 30 31 32 33 34 35 36 37 38 39
40 41 42 43 44 45 46 47 48 49
ICP-101xx
measuring
ICP-101xx in
idle state
S
P
S
1 1 0 0 0 1 1 1
1 1 0 0 0 1 1 1
repeated I2C address +
read while meas. is in
prog. (polling)
measurement
completed
measurement
cont’d
I2C address + read
50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76
1 0 1 0 0 0 0 1
0 0 1 1 0 0 1 1
0 0 0 1 1 1 0 0
Pressure CRC
checksum
Pressure MMSB
Pressure MLSB
77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103
1 0 1 0 0 0 0 1
0 0 1 1 0 0 1 1
0 0 0 1 1 1 0 0
Pressure CRC
checksum
Pressure LMSB
Pressure LLSB
104 105106 107108 109 110111 112 113 114 115 116 117118 119 120 121 122 123 124 125 126 127 128 129 130131
P
0 1 1 0 0 1 0 0
1 0 0 0 1 0 1 1
1 1 0 0 0 1 1 1
Temperature CRC
checksum
Temperature MSB
Temperature LSB
Figure 8. Communication Data Sequences
Document Number: DS-000186
Revision: 1.2
Page 23 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
6 ASSEMBLY
This section provides general guidelines for assembling TDK-InvenSense Micro Electro-Mechanical Systems (MEMS) pressure sensors.
6.1 IMPLEMENTATION AND USAGE RECOMMENDATIONS
Soldering
When soldering, use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures of 260°C. ICP-101xx may exhibit a
pressure offset after soldering, some settling time may be required depending on soldering properties, PCB properties, and ambient
conditions.
The ICP-101xx is an open cavity package, it is mandatory to use no-clean solder paste and no board wash should be applied.
Chemical Exposure and Sensor Protection
The ICP-101xx is an open cavity package, the ICP-101x0 is waterproof to 1.5m for 30 minutes (IPx8), however the ICP-101x1 should
not be exposed to particulates or liquids. If any type of protective coating must be applied to the circuit board, the sensor must be
protected during the coating process.
Document Number: DS-000186
Revision: 1.2
Page 24 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
7 PACKAGE DIMENSIONS
Package dimensions for the ICP-10100 & ICP-10101:
Top View: ICP-10100
Top View: ICP-10101
Bottom View: ICP-10100 & ICP-10101
Figure 9. ICP-10100 & ICP-1010 Package Diagrams
Document Number: DS-000186
Revision: 1.2
Page 25 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
DIMENSIONS IN MILLIMETERS
SYMBOLS
MIN.
0.64
---
NOM.
0.72
0.595 REF.
0.25
MAX.
0.800
---
A
A3
b
---
---
c
D
D1
E
E1
e
---
1.90
---
1.90
---
---
0.125 REF.
2.00
---
2.10
---
2.10
---
---
1.85
2.00
1.85
0.50
L
L1
L3
0.275
0.025
0.250
0.375
0.075
0.300
0.400
0.100
0.325
Table 18. ICP-10100 & ICP-10101 Package Dimensions
Recommended PCB land pattern for the ICP-10100 & ICP-10101:
Figure 10. ICP-10100 & ICP-10101 recommended PCB land pattern
Document Number: DS-000186
Revision: 1.2
Page 26 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
Product artwork for the ICP-10100 & ICP-10101:
Package Artwork: ICP-10100
Package Artwork: ICP-10101
Package dimensions for the ICP-10110 & ICP-10111:
Top View: ICP-10110
Top View: ICP-10111
Document Number: DS-000186
Revision: 1.2
Page 27 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
Bottom View: ICP-10110 & ICP-10111
Figure 11. ICP-10110 & ICP-10111 Package Diagrams
DIMENSIONS IN MILLIMETERS
SYMBOLS
MIN.
0.84
---
NOM.
0.92
0.79 REF.
0.35
MAX.
1.00
---
A
A3
b
---
---
c
E
E1
D
D1
e
---
1.90
---
2.40
---
---
0.13 REF.
2.00
1.85
2.50
2.35
---
2.10
---
2.60
---
---
0.65
L
0.35
0.05
0.30
---
0.45
0.10
0.35
0.10
0.55
0.15
0.40
---
L1
L3
S
Table 19. ICP-10110 & ICP-10111 Package Dimensions
Recommended PCB land pattern for the ICP-10110 & ICP-10111:
Document Number: DS-000186
Revision: 1.2
Page 28 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
Figure 12. ICP-10110 & ICP-10111 recommended PCB land pattern
Product artwork for the ICP-10110 & ICP-10111:
Package Artwork: ICP-10110
Package Artwork: ICP-10111
Document Number: DS-000186
Revision: 1.2
Page 29 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
8 PART NUMBER PART MARKINGS
The part number part markings for ICP-101xx devices are summarized below:
PART NUMBER
ICP-10100
ICP-10101
ICP-10110
ICP-10111
PART MARKING
P1
P2
P5
P6
Table 20. Part Number Part Markings
TOP VIEW
Px
Part Number
Lot Traceability Code
Date Code: (Y)Year(W)WorkWeek
XXXX
YW
1-Hole (ICP-10101) or
3-Hole (ICP-10100)
Figure 13. Part Number Part Markings for 2x2mm (ICP-10101 & ICP-10100)
TOP VIEW
1-Hole (ICP-10111) or
Px
3-Hole (ICP-10110)
Part Number
Lot Traceability Code
Date Code: (Y)Year(W)WorkWeek
XXXX
YW
Figure 144. Part Number Part Markings for 2x2.5mm (ICP-10111 & ICP-10110)
Document Number: DS-000186
Revision: 1.2
Page 30 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
9 ORDERING GUIDE
PACKAGE LID
3-Hole: 1.5m Waterproof
1-Hole
QUANTITY
10,000
PACKAGING
PART
TEMP RANGE
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
PACKAGE BODY
2x2x0.72mm LGA-10L
2x2x0.72mm LGA-10L
2x2.5x0.92mm LGA-8L
2x2.5x0.92mm LGA-8L
13” Tape and Reel
13” Tape and Reel
13” Tape and Reel
13” Tape and Reel
ICP-10100†
ICP-10101†
ICP-10110†
ICP-10111†
10,000
3-Hole: 1.5m Waterproof
1-Hole
10,000
10,000
†Denotes RoHS and Green-Compliant Package
Document Number: DS-000186
Revision: 1.2
Page 31 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
10 REFERENCES
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:
• Manufacturing Recommendations
o
o
o
o
Assembly Guidelines and Recommendations
PCB Design Guidelines and Recommendations
MEMS Handling Instructions
ESD Considerations
o
Reflow Specification
o
Storage Specifications
o
o
o
Package Marking Specification
Tape & Reel Specification
Reel & Pizza Box Label
o
Packaging
o
Representative Shipping Carton Label
• Compliance
o
o
o
Environmental Compliance
DRC Compliance
Compliance Declaration Disclaimer
Document Number: DS-000186
Revision: 1.2
Page 32 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
11 REVISION HISTORY
Revision Date
Revision
Description
01/02/2017
02/04/2019
05/06/2019
1.0
1.1
1.2
Initial Release
Updated package drawing information to include additional details
Updated package drawing information to clarify dimensions
Document Number: DS-000186
Revision: 1.2
Page 33 of 34
ICP-10100, ICP-10101, ICP-10110, ICP-10111
This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use,
or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves
the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes
no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any
claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to,
claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any
patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the
property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or
mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2016—2017 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the
InvenSense logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the
respective companies with which they are associated.
©2016—2019 InvenSense. All rights reserved.
Document Number: DS-000186
Revision: 1.2
Page 34 of 34
相关型号：
©2020 ICPDF网 联系我们和版权申明