MPU-6050_技术文档

InvenSense Inc.

Document Number: PS-MPU-6000A-00

Revision: 3.4

1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.

Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104

Website: www.invensense.com

Release Date: 08/19/2013

MPU-6000 and MPU-6050

Product Specification

Revision 3.4

1 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

CONTENTS

1

2

3

REVISION HISTORY ...................................................................................................................................5

PURPOSE AND SCOPE .............................................................................................................................6

PRODUCT OVERVIEW ...............................................................................................................................7

3.1

MPU-60X0 OVERVIEW........................................................................................................................7

APPLICATIONS...........................................................................................................................................9

FEATURES................................................................................................................................................10

4

5

5.1

GYROSCOPE FEATURES.....................................................................................................................10

ACCELEROMETER FEATURES .............................................................................................................10

ADDITIONAL FEATURES ......................................................................................................................10

MOTIONPROCESSING.........................................................................................................................11

CLOCKING.........................................................................................................................................11

5.2

5.3

5.4

5.5

6

ELECTRICAL CHARACTERISTICS.........................................................................................................12

6.1

GYROSCOPE SPECIFICATIONS............................................................................................................12

ACCELEROMETER SPECIFICATIONS.....................................................................................................13

ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................14

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................15

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................16

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................17

I²C TIMING CHARACTERIZATION..........................................................................................................18

SPI TIMING CHARACTERIZATION (MPU-6000 ONLY) ...........................................................................19

ABSOLUTE MAXIMUM RATINGS ...........................................................................................................20

6.2

6.3

6.4

6.5

6.6

6.7

6.8

6.9

7

APPLICATIONS INFORMATION..............................................................................................................21

7.1

PIN OUT AND SIGNAL DESCRIPTION....................................................................................................21

TYPICAL OPERATING CIRCUIT.............................................................................................................22

BILL OF MATERIALS FOR EXTERNAL COMPONENTS..............................................................................22

RECOMMENDED POWER-ON PROCEDURE ...........................................................................................23

BLOCK DIAGRAM ...............................................................................................................................24

OVERVIEW ........................................................................................................................................24

THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................25

THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................25

DIGITAL MOTION PROCESSOR ............................................................................................................25

PRIMARY I²C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................25

AUXILIARY I²C SERIAL INTERFACE ......................................................................................................26

7.2

7.3

7.4

7.5

7.6

7.7

7.8

7.9

7.10

7.11

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.12

7.13

7.14

7.15

7.16

7.17

7.18

7.19

7.20

7.21

SELF-TEST........................................................................................................................................27

MPU-60X0 SOLUTION FOR 9-AXIS SENSOR FUSION USING I²C INTERFACE..........................................28

MPU-6000 USING SPI INTERFACE.....................................................................................................29

INTERNAL CLOCK GENERATION ..........................................................................................................30

SENSOR DATA REGISTERS.................................................................................................................30

FIFO ................................................................................................................................................30

INTERRUPTS......................................................................................................................................30

DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................31

BIAS AND LDO ..................................................................................................................................31

CHARGE PUMP ..................................................................................................................................31

8

9

PROGRAMMABLE INTERRUPTS............................................................................................................32

DIGITAL INTERFACE ...............................................................................................................................33

9.1

I²C AND SPI (MPU-6000 ONLY) SERIAL INTERFACES..........................................................................33

I²C INTERFACE ..................................................................................................................................33

I²C COMMUNICATIONS PROTOCOL......................................................................................................33

I²C TERMS ........................................................................................................................................36

SPI INTERFACE (MPU-6000 ONLY) ....................................................................................................37

9.2

9.3

9.4

9.5

10 SERIAL INTERFACE CONSIDERATIONS (MPU-6050)..........................................................................38

10.1

10.2

10.3

MPU-6050 SUPPORTED INTERFACES.................................................................................................38

LOGIC LEVELS ...................................................................................................................................38

LOGIC LEVELS DIAGRAM FOR AUX_VDDIO = 0..................................................................................39

11 ASSEMBLY ...............................................................................................................................................40

11.1

11.2

11.3

11.4

11.5

11.6

11.7

11.8

11.9

11.10

ORIENTATION OF AXES ......................................................................................................................40

PACKAGE DIMENSIONS ......................................................................................................................41

PCB DESIGN GUIDELINES..................................................................................................................42

ASSEMBLY PRECAUTIONS ..................................................................................................................43

STORAGE SPECIFICATIONS.................................................................................................................46

PACKAGE MARKING SPECIFICATION....................................................................................................46

TAPE & REEL SPECIFICATION.............................................................................................................47

LABEL ...............................................................................................................................................48

PACKAGING.......................................................................................................................................49

REPRESENTATIVE SHIPPING CARTON LABEL...................................................................................50

12 RELIABILITY .............................................................................................................................................51

12.1 QUALIFICATION TEST POLICY .............................................................................................................51

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

12.2

QUALIFICATION TEST PLAN ................................................................................................................51

13 ENVIRONMENTAL COMPLIANCE...........................................................................................................52

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

1

Revision History

Revision

Date

Revision Description

11/24/2010

05/19/2011

1.0

2.0

Initial Release

For Rev C parts. Clarified wording in sections (3.2, 5.1, 5.2, 6.1-6.4, 6.6, 6.9, 7,

7.1-7.6, 7.11, 7.12, 7.14, 8, 8.2-8.4, 10.3, 10.4, 11, 12.2)

07/28/2011

08/05/2011

2.1

2.2

Edited supply current numbers for different modes (section 6.4)

Unit of measure for accelerometer sensitivity changed from LSB/mg to LSB/g

Updated accelerometer self test specifications in Table 6.2. Updated package

dimensions (section 11.2). Updated PCB design guidelines (section 11.3)

10/12/2011

10/18/2011

2.3

3.0

For Rev D parts. Updated accelerometer specifications in Table 6.2. Updated

accelerometer specification note (sections 8.2, 8.3, & 8.4). Updated qualification

test plan (section 12.2).

Edits for clarity

Changed operating voltage range to 2.375V-3.46V

Added accelerometer Intelligence Function increment value of 1mg/LSB

(Section 6.2)

10/24/2011

3.1

Updated absolute maximum rating for acceleration (any axis, unpowered) from

0.3ms to 0.2ms (Section 6.9)

Modified absolute maximum rating for Latch-up to Level A and ±100mA (Section

6.9, 12.2)

Updated self-test response specifications for Revision D parts dated with

date code 1147 (YYWW) or later.

Edits for clarity

Added Gyro self-test (sections 5.1, 6.1, 7.6, 7.12)

Added Min/Max limits to Accel self-test response (section 6.2)

Updated Accelerometer low power mode operating currents (Section 6.3)

Added gyro self test to block diagram (section 7.5)

Updated packaging labels and descriptions (sections 11.8 & 11.9)

11/16/2011

3.2

Updated Gyro and Accelerometer self test information (sections 6.1, 6.2, 7.12)

Updated latch-up information (Section 6.9)

Updated programmable interrupts information (Section 8)

Changed shipment information from maximum of 3 reels (15K units) per shipper

box to 5 reels (25K units) per shipper box (Section 11.7)

Updated packing shipping and label information (Sections 11.8, 11.9)

Updated reliability references (Section 12.2)

5/16/2012

8/19/2013

3.3

3.4

Updates section 4

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

2

Purpose and Scope

This product specification provides advanced information regarding the electrical specification and design

related information for the MPU-6000™ and MPU-6050™ MotionTracking™ devices, collectively called the

MPU-60X0™ or MPU™.

Electrical characteristics are based upon design analysis and simulation results only. Specifications are

subject to change without notice. Final specifications will be updated based upon characterization of

production silicon. For references to register map and descriptions of individual registers, please refer to the

MPU-6000/MPU-6050 Register Map and Register Descriptions document.

The self-test response specifications provided in this document pertain to Revision D parts with date

codes of 1147 (YYWW) or later. Please see Section 11.6 for package marking description details.

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

3

Product Overview

3.1 MPU-60X0 Overview

MotionInterface™ is becoming a “must-have” function being adopted by smartphone and tablet

manufacturers due to the enormous value it adds to the end user experience. In smartphones, it finds use in

applications such as gesture commands for applications and phone control, enhanced gaming, augmented

reality, panoramic photo capture and viewing, and pedestrian and vehicle navigation. With its ability to

precisely and accurately track user motions, MotionTracking technology can convert handsets and tablets

into powerful 3D intelligent devices that can be used in applications ranging from health and fitness

monitoring to location-based services. Key requirements for MotionInterface enabled devices are small

package size, low power consumption, high accuracy and repeatability, high shock tolerance, and application

specific performance programmability – all at a low consumer price point.

The MPU-60X0 is the world’s first integrated 6-axis MotionTracking device that combines a 3-axis

gyroscope, 3-axis accelerometer, and a Digital Motion Processor™ (DMP) all in a small 4x4x0.9mm

package. With its dedicated I²C sensor bus, it directly accepts inputs from an external 3-axis compass to

provide a complete 9-axis MotionFusion™ output. The MPU-60X0 MotionTracking device, with its 6-axis

integration, on-board MotionFusion™, and run-time calibration firmware, enables manufacturers to eliminate

the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing

optimal motion performance for consumers. The MPU-60X0 is also designed to interface with multiple non-

inertial digital sensors, such as pressure sensors, on its auxiliary I²C port. The MPU-60X0 is footprint

compatible with the MPU-30X0 family.

The MPU-60X0 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs

and three 16-bit ADCs for digitizing the accelerometer outputs. For precision tracking of both fast and slow

motions, the parts feature a user-programmable gyroscope full-scale range of ±250, ±500, ±1000, and

±2000°/sec (dps) and a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g.

An on-chip 1024 Byte FIFO buffer helps lower system power consumption by allowing the system processor

to read the sensor data in bursts and then enter a low-power mode as the MPU collects more data. With all

the necessary on-chip processing and sensor components required to support many motion-based use

cases, the MPU-60X0 uniquely enables low-power MotionInterface applications in portable applications with

reduced processing requirements for the system processor. By providing an integrated MotionFusion output,

the DMP in the MPU-60X0 offloads the intensive MotionProcessing computation requirements from the

system processor, minimizing the need for frequent polling of the motion sensor output.

Communication with all registers of the device is performed using either I²C at 400kHz or SPI at 1MHz

(MPU-6000 only). For applications requiring faster communications, the sensor and interrupt registers may

be read using SPI at 20MHz (MPU-6000 only). Additional features include an embedded temperature sensor

and an on-chip oscillator with ±1% variation over the operating temperature range.

By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers

with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-60X0

package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest

performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer

electronic devices. The part features a robust 10,000g shock tolerance, and has programmable low-pass

filters for the gyroscopes, accelerometers, and the on-chip temperature sensor.

For power supply flexibility, the MPU-60X0 operates from VDD power supply voltage range of 2.375V-3.46V.

Additionally, the MPU-6050 provides a VLOGIC reference pin (in addition to its analog supply pin: VDD),

which sets the logic levels of its I²C interface. The VLOGIC voltage may be 1.8V±5% or VDD.

The MPU-6000 and MPU-6050 are identical, except that the MPU-6050 supports the I²C serial interface only,

and has a separate VLOGIC reference pin. The MPU-6000 supports both I²C and SPI interfaces and has a

single supply pin, VDD, which is both the device’s logic reference supply and the analog supply for the part.

The table below outlines these differences:

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

Primary Differences between MPU-6000 and MPU-6050

Part / Item

MPU-6000

2.375V-3.46V

n/a

MPU-6050

2.375V-3.46V

1.71V to VDD

I²C

VDD

VLOGIC

Serial Interfaces Supported

I²C, SPI

Pin 8

/CS

VLOGIC

AD0

Pin 9

AD0/SDO

SCL/SCLK

SDA/SDI

Pin 23

Pin 24

SCL

SDA

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

4

Applications



BlurFree™ technology (for Video/Still Image Stabilization)

AirSign™ technology (for Security/Authentication)

TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)

MotionCommand™ technology (for Gesture Short-cuts)

Motion-enabled game and application framework

InstantGesture™ iG™ gesture recognition

Location based services, points of interest, and dead reckoning

Handset and portable gaming

Motion-based game controllers

3D remote controls for Internet connected DTVs and set top boxes, 3D mice

Wearable sensors for health, fitness and sports

Toys

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

5

Features

5.1 Gyroscope Features

The triple-axis MEMS gyroscope in the MPU-60X0 includes a wide range of features:



Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable full-

scale range of ±250, ±500, ±1000, and ±2000°/sec

External sync signal connected to the FSYNC pin supports image, video and GPS synchronization

Integrated 16-bit ADCs enable simultaneous sampling of gyros

Enhanced bias and sensitivity temperature stability reduces the need for user calibration

Improved low-frequency noise performance

Digitally-programmable low-pass filter

Gyroscope operating current: 3.6mA

Standby current: 5µA

Factory calibrated sensitivity scale factor



User self-test

5.2 Accelerometer Features

The triple-axis MEMS accelerometer in MPU-60X0 includes a wide range of features:



Digital-output triple-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and

±16g

Integrated 16-bit ADCs enable simultaneous sampling of accelerometers while requiring no external

multiplexer



Accelerometer normal operating current: 500µA

Low power accelerometer mode current: 10µA at 1.25Hz, 20µA at 5Hz, 60µA at 20Hz, 110µA at

40Hz



Orientation detection and signaling

Tap detection

User-programmable interrupts

High-G interrupt

User self-test

5.3 Additional Features

The MPU-60X0 includes the following additional features:



9-Axis MotionFusion by the on-chip Digital Motion Processor (DMP)

Auxiliary master I²C bus for reading data from external sensors (e.g., magnetometer)

3.9mA operating current when all 6 motion sensing axes and the DMP are enabled

VDD supply voltage range of 2.375V-3.46V

Flexible VLOGIC reference voltage supports multiple I²C interface voltages (MPU-6050 only)

Smallest and thinnest QFN package for portable devices: 4x4x0.9mm

Minimal cross-axis sensitivity between the accelerometer and gyroscope axes

1024 byte FIFO buffer reduces power consumption by allowing host processor to read the data in

bursts and then go into a low-power mode as the MPU collects more data

Digital-output temperature sensor



User-programmable digital filters for gyroscope, accelerometer, and temp sensor

10,000 g shock tolerant

400kHz Fast Mode I²C for communicating with all registers

1MHz SPI serial interface for communicating with all registers (MPU-6000 only)

20MHz SPI serial interface for reading sensor and interrupt registers (MPU-6000 only)

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MPU-6000/MPU-6050 Product Specification



MEMS structure hermetically sealed and bonded at wafer level

RoHS and Green compliant

5.4 MotionProcessing



Internal Digital Motion Processing™ (DMP™) engine supports 3D MotionProcessing and gesture

recognition algorithms



The MPU-60X0 collects gyroscope and accelerometer data while synchronizing data sampling at a

user defined rate. The total dataset obtained by the MPU-60X0 includes 3-Axis gyroscope data, 3-

Axis accelerometer data, and temperature data. The MPU’s calculated output to the system

processor can also include heading data from a digital 3-axis third party magnetometer.

The FIFO buffers the complete data set, reducing timing requirements on the system processor by

allowing the processor burst read the FIFO data. After burst reading the FIFO data, the system

processor can save power by entering a low-power sleep mode while the MPU collects more data.

Programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling,

tap detection, and shake detection



Digitally-programmable low-pass filters

Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the

step count.

5.5 Clocking



On-chip timing generator ±1% frequency variation over full temperature range

Optional external clock inputs of 32.768kHz or 19.2MHz

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6

Electrical Characteristics

6.1 Gyroscope Specifications

VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, T_A= 25°C

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

GYROSCOPE SENSITIVITY

Full-Scale Range

FS_SEL=0

FS_SEL=1

FS_SEL=2

FS_SEL=3

±250

±500

±1000

±2000

16

º/s

Gyroscope ADC Word Length

Sensitivity Scale Factor

bits

FS_SEL=0

FS_SEL=1

FS_SEL=2

FS_SEL=3

25°C

131

LSB/(º/s)

%

65.5

32.8

16.4

Sensitivity Scale Factor Tolerance

-3

+3

Sensitivity Scale Factor Variation Over

Temperature

±2

%

Nonlinearity

Best fit straight line; 25°C

0.2

±2

%

Cross-Axis Sensitivity

GYROSCOPE ZERO-RATE OUTPUT (ZRO)

Initial ZRO Tolerance

25°C

±20

0.2

4

º/s

ZRO Variation Over Temperature

Power-Supply Sensitivity (1-10Hz)

Power-Supply Sensitivity (10 - 250Hz)

Power-Supply Sensitivity (250Hz - 100kHz)

Linear Acceleration Sensitivity

-40°C to +85°C

Sine wave, 100mVpp; VDD=2.5V

Static

º/s

0.1

º/s/g

SELF-TEST RESPONSE

Relative

Change from factory trim

-14

14

%

1

GYROSCOPE NOISE PERFORMANCE

Total RMS Noise

FS_SEL=0

DLPFCFG=2 (100Hz)

Bandwidth 1Hz to10Hz

At 10Hz

0.05

0.033

0.005

º/s-rms

º/s/√Hz

Low-frequency RMS noise

Rate Noise Spectral Density

GYROSCOPE MECHANICAL

FREQUENCIES

X-Axis

30

27

24

33

30

27

36

33

30

kHz

Y-Axis

Z-Axis

LOW PASS FILTER RESPONSE

Programmable Range

5

4

256

Hz

ms

OUTPUT DATA RATE

Programmable

DLPFCFG=0

to ±1º/s of Final

8,000

GYROSCOPE START-UP TIME

ZRO Settling (from power-on)

30

1. Please refer to the following document for further information on Self-Test: MPU-6000/MPU-6050 Register Map

and Descriptions

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6.2 Accelerometer Specifications

VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, T_A= 25°C

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

ACCELEROMETER SENSITIVITY

Full-Scale Range

AFS_SEL=0

±2

±4

g

AFS_SEL=1

g

AFS_SEL=2

±8

g

AFS_SEL=3

±16

16

g

ADC Word Length

Output in two’s complement format

AFS_SEL=0

bits

LSB/g

%

Sensitivity Scale Factor

16,384

8,192

4,096

2,048

±3

AFS_SEL=1

AFS_SEL=2

AFS_SEL=3

Initial Calibration Tolerance

Sensitivity Change vs. Temperature

Nonlinearity

AFS_SEL=0, -40°C to +85°C

Best Fit Straight Line

±0.02

0.5

%/°C

%

Cross-Axis Sensitivity

ZERO-G OUTPUT

±2

%

Initial Calibration Tolerance

X and Y axes

±50

±80

±35

±60

mg

1

2

Z axis

Zero-G Level Change vs. Temperature

X and Y axes, 0°C to +70°C

Z axis, 0°C to +70°C

mg

SELF TEST RESPONSE

Relative

Change from factory trim

@10Hz, AFS_SEL=0 & ODR=1kHz

Programmable Range

-14

14

%

NOISE PERFORMANCE

Power Spectral Density

LOW PASS FILTER RESPONSE

400

g/√Hz

Hz

5

4

260

OUTPUT DATA RATE

Programmable Range

1,000

Hz

INTELLIGENCE FUNCTION

INCREMENT

32

mg/LSB

1. Typical zero-g initial calibration tolerance value after MSL3 preconditioning

2. Please refer to the following document for further information on Self-Test: MPU-6000/MPU-6050 Register Map

and Descriptions

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6.3 Electrical and Other Common Specifications

VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, T_A= 25°C

PARAMETER

TEMPERATURE SENSOR

Range

CONDITIONS

MIN

TYP

MAX

Units

Notes

-40 to +85

340

°C

Sensitivity

Untrimmed

35^oC

LSB/ºC

LSB

Temperature Offset

Linearity

-521

Best fit straight line (-40°C to

+85°C)

±1

°C

VDD POWER SUPPLY

Operating Voltages

2.375

3.46

V

Normal Operating Current

Gyroscope + Accelerometer + DMP

3.9

3.8

3.7

3.6

mA

Gyroscope + Accelerometer

(DMP disabled)

mA

Gyroscope + DMP

(Accelerometer disabled)

Gyroscope only

(DMP & Accelerometer disabled)

Accelerometer only

(DMP & Gyroscope disabled)

500

10

µA

Accelerometer Low Power Mode

Current

1.25 Hz update rate

5 Hz update rate

20 Hz update rate

40 Hz update rate

20

70

140

5

µA

Full-Chip Idle Mode Supply Current

Power Supply Ramp Rate

Monotonic ramp. Ramp rate is 10%

to 90% of the final value

100

ms

VLOGIC REFERENCE VOLTAGE

Voltage Range

MPU-6050 only

1.71

-40

VLOGIC must be ≤VDD at all times

VDD

3

V

Power Supply Ramp Rate

Monotonic ramp. Ramp rate is 10%

to 90% of the final value

ms

µA

Normal Operating Current

TEMPERATURE RANGE

Specified Temperature Range

100

Performance parameters are not

applicable beyond Specified

Temperature Range

+85

°C

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Document Number: PS-MPU-6000A-00

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Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6.4 Electrical Specifications, Continued

VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, T_A= 25°C

PARAMETER

CONDITIONS

MIN

TYP

MAX

Units

Notes

SERIAL INTERFACE

SPI Operating Frequency, All

Registers Read/Write

MPU-6000 only, Low Speed

Characterization

100 ±10%

1 ±10%

kHz

MHz

MPU-6000 only, High Speed

Characterization

SPI Operating Frequency, Sensor

and Interrupt Registers Read Only

I²C Operating Frequency

MPU-6000 only

20 ±10%

All registers, Fast-mode

All registers, Standard-mode

AD0 = 0

400

100

kHz

I²C ADDRESS

1101000

1101001

AD0 = 1

DIGITAL INPUTS (SDI/SDA, AD0,

SCLK/SCL, FSYNC, /CS, CLKIN)

V_IH, High Level Input Voltage

V_IL, Low Level Input Voltage

MPU-6000

MPU-6050

MPU-6000

0.7*VDD

V

0.7*VLOGIC

0.3*VDD

MPU-6050

0.3*VLOGIC

V

C_I, Input Capacitance

< 5

pF

DIGITAL OUTPUT (SDO, INT)

V_OH, High Level Output Voltage

R_LOAD=1MΩ; MPU-6000

R_LOAD=1MΩ; MPU-6050

R_LOAD=1MΩ; MPU-6000

R_LOAD=1MΩ; MPU-6050

0.9*VDD

V

0.9*VLOGIC

V_OL1, LOW-Level Output Voltage

0.1*VDD

0.1*VLOGIC

0.1

V_OL.INT1, INT Low-Level Output

Voltage

OPEN=1, 0.3mA sink

Current

Output Leakage Current

t_INT, INT Pulse Width

OPEN=1

100

50

nA

µs

LATCH_INT_EN=0

15 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6.5 Electrical Specifications, Continued

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or

VDD, T_A= 25°C

Parameters

Conditions

Typical

Units

Notes

Primary I²C I/O (SCL, SDA)

V_IL, LOW-Level Input Voltage

V_IH, HIGH-Level Input Voltage

V_hys, Hysteresis

MPU-6000

MPU-6050

3mA sink current

V_OL= 0.4V

V_OL= 0.6V

-0.5 to 0.3*VDD

V

0.7*VDD to VDD + 0.5V

0.1*VDD

V

VIL, LOW Level Input Voltage

VIH, HIGH-Level Input Voltage

Vhys, Hysteresis

-0.5V to 0.3*VLOGIC

V

0.7*VLOGIC to VLOGIC + 0.5V

V

0.1*VLOGIC

V

V_OL1, LOW-Level Output Voltage

I_OL, LOW-Level Output Current

0 to 0.4

V

3

mA

nA

ns

pF

5

100

Output Leakage Current

t_of, Output Fall Time from V_IHmaxto V_ILmax

C_I, Capacitance for Each I/O pin

Auxiliary I²C I/O (AUX_CL, AUX_DA)

V_IL, LOW-Level Input Voltage

C_bbus capacitance in pF

20+0.1C_bto 250

< 10

MPU-6050: AUX_VDDIO=0

-0.5V to 0.3*VLOGIC

V

V_IH, HIGH-Level Input Voltage

0.7*VLOGIC to

VLOGIC + 0.5V

V_hys, Hysteresis

0.1*VLOGIC

0 to 0.4

V

V_OL1, LOW-Level Output Voltage

V_OL3, LOW-Level Output Voltage

I_OL, LOW-Level Output Current

VLOGIC > 2V; 1mA sink current

VLOGIC < 2V; 1mA sink current

0 to 0.2*VLOGIC

V_OL= 0.4V

V_OL= 0.6V

1

mA

Output Leakage Current

100

20+0.1C_bto 250

< 10

nA

ns

pF

t_of, Output Fall Time from V_IHmaxto V_ILmax

C_I, Capacitance for Each I/O pin

C_bbus capacitance in pF

16 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6.6 Electrical Specifications, Continued

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or

VDD, T_A= 25°C

Parameters

Conditions

Min

Typical

Max

Units Notes

INTERNAL CLOCK SOURCE

CLK_SEL=0,1,2,3

Gyroscope Sample Rate, Fast

DLPFCFG=0

SAMPLERATEDIV = 0

8

1

kHz

Gyroscope Sample Rate, Slow

Accelerometer Sample Rate

Clock Frequency Initial Tolerance

Frequency Variation over Temperature

PLL Settling Time

DLPFCFG=1,2,3,4,5, or 6

SAMPLERATEDIV = 0

CLK_SEL=0, 25°C

CLK_SEL=1,2,3; 25°C

CLK_SEL=0

-5

-1

+5

+1

%

-15 to +10

%

CLK_SEL=1,2,3

±1

1

%

10

ms

EXTERNAL 32.768kHz CLOCK

External Clock Frequency

CLK_SEL=4

32.768

1 to 2

8.192

kHz

µs

External Clock Allowable Jitter

Gyroscope Sample Rate, Fast

Cycle-to-cycle rms

DLPFCFG=0

kHz

SAMPLERATEDIV = 0

Gyroscope Sample Rate, Slow

Accelerometer Sample Rate

PLL Settling Time

DLPFCFG=1,2,3,4,5, or 6

SAMPLERATEDIV = 0

1.024

1

kHz

ms

10

EXTERNAL 19.2MHz CLOCK

External Clock Frequency

CLK_SEL=5

19.2

MHz

Hz

Gyroscope Sample Rate

Full programmable range

3.9

8000

Gyroscope Sample Rate, Fast Mode

DLPFCFG=0

SAMPLERATEDIV = 0

8

1

kHz

Gyroscope Sample Rate, Slow Mode

Accelerometer Sample Rate

PLL Settling Time

DLPFCFG=1,2,3,4,5, or 6

SAMPLERATEDIV = 0

kHz

ms

10

17 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6.7 I²C Timing Characterization

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or

VDD, T_A= 25°C

Parameters

I²C TIMING

Conditions

I²C FAST-MODE

Min

Typical

Max

Units

Notes

f_SCL, SCL Clock Frequency

400

kHz

µs

t_HD.STA, (Repeated) START Condition Hold

Time

0.6

t_LOW, SCL Low Period

t_HIGH, SCL High Period

1.3

0.6

µs

t_SU.STA, Repeated START Condition Setup

Time

t_HD.DAT, SDA Data Hold Time

t_SU.DAT, SDA Data Setup Time

t_r, SDA and SCL Rise Time

t_f, SDA and SCL Fall Time

0

µs

ns

µs

100

C_bbus cap. from 10 to 400pF

20+0.1C_b

0.6

300

t_SU.STO, STOP Condition Setup Time

t_BUF, Bus Free Time Between STOP and

START Condition

1.3

µs

C_b, Capacitive Load for each Bus Line

t_VD.DAT, Data Valid Time

< 400

pF

µs

0.9

t_VD.ACK, Data Valid Acknowledge Time

Note: Timing Characteristics apply to both Primary and Auxiliary I²C Bus

I²C Bus Timing Diagram

18 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6.8 SPI Timing Characterization (MPU-6000 only)

Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or

VDD,T_A= 25°C, unless otherwise noted.

Notes

Parameters

Conditions

Min

Typical

Max

Units

SPI TIMING

f_SCLK, SCLK Clock Frequency

t_LOW, SCLK Low Period

t_HIGH, SCLK High Period

t_SU.CS, CS Setup Time

t_HD.CS, CS Hold Time

t_SU.SDI, SDI Setup Time

t_HD.SDI, SDI Hold Time

t_VD.SDO, SDO Valid Time

1

MHz

ns

400

8

ns

500

11

7

ns

C_load= 20pF

100

10

ns

t_HD.SDO, SDO Hold Time

4

ns

t_DIS.SDO, SDO Output Disable Time

SPI Bus Timing Diagram

19 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

6.9 Absolute Maximum Ratings

Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only and functional operation of the device at these conditions is not implied.

Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.

Parameter

Rating

-0.5V to +6V

Supply Voltage, VDD

VLOGIC Input Voltage Level (MPU-6050)

REGOUT

-0.5V to VDD + 0.5V

-0.5V to 2V

Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC, INT,

SCL, SDA)

-0.5V to VDD + 0.5V

CPOUT (2.5V ≤ VDD ≤ 3.6V )

Acceleration (Any Axis, unpowered)

Operating Temperature Range

Storage Temperature Range

-0.5V to 30V

10,000g for 0.2ms

-40°C to +105°C

-40°C to +125°C

2kV (HBM);

250V (MM)

Electrostatic Discharge (ESD) Protection

Latch-up

JEDEC Class II (2),125°C

±100mA

20 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7

Applications Information

7.1 Pin Out and Signal Description

MPU-

6000

MPU-

6050

Pin Number

Pin Name

Pin Description

1

6

Y

CLKIN

AUX_DA

AUX_CL

/CS

Optional external reference clock input. Connect to GND if unused.

I²C master serial data, for connecting to external sensors

I²C Master serial clock, for connecting to external sensors

SPI chip select (0=SPI mode)

7

8

Y

VLOGIC

AD0 / SDO

AD0

Digital I/O supply voltage

9

Y

I²C Slave Address LSB (AD0); SPI serial data output (SDO)

I²C Slave Address LSB (AD0)

9

Y

10

11

12

13

18

19, 21

20

22

23

24

Y

REGOUT

FSYNC

INT

Regulator filter capacitor connection

Frame synchronization digital input. Connect to GND if unused.

Interrupt digital output (totem pole or open-drain)

Power supply voltage and Digital I/O supply voltage

Power supply ground

VDD

GND

RESV

Reserved. Do not connect.

CPOUT

RESV

Charge pump capacitor connection

Reserved. Do not connect.

SCL / SCLK

SCL

I²C serial clock (SCL); SPI serial clock (SCLK)

I²C serial clock (SCL)

Y

SDA / SDI

SDA

I²C serial data (SDA); SPI serial data input (SDI)

I²C serial data (SDA)

Y

2, 3, 4, 5, 14,

15, 16, 17

NC

Not internally connected. May be used for PCB trace routing.

Top View

24 23 22 21 20 19

+Z

CLKIN

NC

1

2

3

4

5

6

18 GND

17 NC

16 NC

15 NC

14 NC

13 VDD

CLKIN

NC

1

2

3

4

5

6

18 GND

17 NC

16 NC

15 NC

14 NC

13 VDD

+Y

+Z

M

U

P

NC

+Y

M

U

P

-

6

0

-

MPU-6000

6

MPU-6050

0

5

NC

+X

AUX_DA

7

8

9

10 11 12

7

8

9

10 11 12

QFN Package

24-pin, 4mm x 4mm x 0.9mm

QFN Package

24-pin, 4mm x 4mm x 0.9mm

Orientation of Axes of Sensitivity and

Polarity of Rotation

21 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.2 Typical Operating Circuit

GND

C3

2.2nF

24 23 22 21 20 19

1

2

3

4

5

6

18

17

16

15

14

13

1

2

3

4

5

6

18

17

16

15

14

13

CLKIN

GND

MPU-6000

MPU-6050

VDD

AUX_DA

AUX_CL

AUX_DA

AUX_CL

7

8

9

10 11 12

7

8

9

10 11 12

C2

0.1µF

C2

0.1µF

GND

C1

VLOGIC

0.1µF

C4

10nF

GND

Typical Operating Circuits

7.3 Bill of Materials for External Components

Component

Label

C1

Specification

Quantity

Regulator Filter Capacitor (Pin 10)

VDD Bypass Capacitor (Pin 13)

Charge Pump Capacitor (Pin 20)

VLOGIC Bypass Capacitor (Pin 8)

* MPU-6050 Only.

Ceramic, X7R, 0.1µF ±10%, 2V

Ceramic, X7R, 0.1µF ±10%, 4V

Ceramic, X7R, 2.2nF ±10%, 50V

Ceramic, X7R, 10nF ±10%, 4V

1

C2

C3

C4*

22 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.4 Recommended Power-on Procedure

Power-Up Sequencing

1. VLOGIC amplitude must always be ≤VDD

amplitude

T_VDDR

2. T_VDDRis VDD rise time: Time for VDD to rise

from 10% to 90% of its final value

90%

3. T_VDDRis ≤100ms

10%

VDD

4. T_VLGRis VLOGIC rise time: Time for

VLOGIC to rise from 10% to 90% of its final

value

T_VLGR

90%

5. T_VLGRis ≤3ms

10%

6. T_VLG-VDDis the delay from the start of VDD

ramp to the start of VLOGIC rise

VLOGIC

7. T_VLG-VDDis ≥0

T_{VLG - VDD}

8. VDD and VLOGIC must be monotonic

ramps

23 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.5 Block Diagram

1

CLKIN

CLOCK

Clock

MPU-60X0

22

CLKOUT

Self

test

12

X Accel

ADC

INT

Interrupt

Status

Register

8

(/CS)

Self

test

9

Y Accel

Slave I2C and

SPI Serial

Interface

AD0 / (SDO)

SCL / (SCLK)

SDA / (SDI)

23

24

FIFO

Self

test

Z Accel

X Gyro

ADC

Config

Registers

7

6

Serial

Interface

Bypass

Mux

Master I2C

Serial

Interface

AUX_CL

AUX_DA

Self

test

Sensor

Registers

11

FSYNC

Self

test

Y Gyro

Z Gyro

ADC

Factory

Calibration

Digital Motion

Processor

(DMP)

Self

test

Temp Sensor

ADC

Charge

Pump

Bias & LDO

18

20

13

VDD

10

8

[VLOGIC]

REGOUT

CPOUT

GND

Note: Pin names in round brackets ( ) apply only to MPU-6000

Pin names in square brackets [ ] apply only to MPU-6050

7.6 Overview

The MPU-60X0 is comprised of the following key blocks and functions:



Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning

Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning

Digital Motion Processor (DMP) engine

Primary I²C and SPI (MPU-6000 only) serial communications interfaces

Auxiliary I²C serial interface for 3^rdparty magnetometer & other sensors

Clocking

Sensor Data Registers

FIFO

Interrupts

Digital-Output Temperature Sensor

Gyroscope & Accelerometer Self-test

Bias and LDO

Charge Pump

24 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.7 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning

The MPU-60X0 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about

the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes

a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered

to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip

16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors

may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample

rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable

low-pass filters enable a wide range of cut-off frequencies.

7.8 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning

The MPU-60X0’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a

particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the

displacement differentially. The MPU-60X0’s architecture reduces the accelerometers’ susceptibility to

fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure

0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the factory

and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing

digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.

7.9 Digital Motion Processor

The embedded Digital Motion Processor (DMP) is located within the MPU-60X0 and offloads computation of

motion processing algorithms from the host processor. The DMP acquires data from accelerometers,

gyroscopes, and additional 3^rdparty sensors such as magnetometers, and processes the data. The resulting

data can be read from the DMP’s registers, or can be buffered in a FIFO. The DMP has access to one of the

MPU’s external pins, which can be used for generating interrupts.

The purpose of the DMP is to offload both timing requirements and processing power from the host

processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order

to provide accurate results with low latency. This is required even if the application updates at a much lower

rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should

still run at 200Hz. The DMP can be used as a tool in order to minimize power, simplify timing, simplify the

software architecture, and save valuable MIPS on the host processor for use in the application.

7.10 Primary I²C and SPI Serial Communications Interfaces

The MPU-60X0 communicates to a system processor using either a SPI (MPU-6000 only) or an I²C serial

interface. The MPU-60X0 always acts as a slave when communicating to the system processor. The LSB of

the of the I²C slave address is set by pin 9 (AD0).

The logic levels for communications between the MPU-60X0 and its master are as follows:



MPU-6000: The logic level for communications with the master is set by the voltage on VDD

MPU-6050: The logic level for communications with the master is set by the voltage on VLOGIC

For further information regarding the logic levels of the MPU-6050, please refer to Section 10.

25 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.11 Auxiliary I²C Serial Interface

The MPU-60X0 has an auxiliary I²C bus for communicating to an off-chip 3-Axis digital output magnetometer

or other sensors. This bus has two operating modes:



I²C Master Mode: The MPU-60X0 acts as a master to any external sensors connected to the

auxiliary I²C bus

Pass-Through Mode: The MPU-60X0 directly connects the primary and auxiliary I²C buses together,

allowing the system processor to directly communicate with any external sensors.

Auxiliary I²C Bus Modes of Operation:



I²C Master Mode: Allows the MPU-60X0 to directly access the data registers of external digital

sensors, such as a magnetometer. In this mode, the MPU-60X0 directly obtains data from auxiliary

sensors, allowing the on-chip DMP to generate sensor fusion data without intervention from the

system applications processor.

For example, In I²C Master mode, the MPU-60X0 can be configured to perform burst reads,

returning the following data from a magnetometer:

.

X magnetometer data (2 bytes)

Y magnetometer data (2 bytes)

Z magnetometer data (2 bytes)

The I²C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor

can be configured to work single byte read/write mode.



Pass-Through Mode: Allows an external system processor to act as master and directly

communicate to the external sensors connected to the auxiliary I²C bus pins (AUX_DA and

AUX_CL). In this mode, the auxiliary I²C bus control logic (3^rdparty sensor interface block) of the

MPU-60X0 is disabled, and the auxiliary I²C pins AUX_DA and AUX_CL (Pins 6 and 7) are

connected to the main I²C bus (Pins 23 and 24) through analog switches.

Pass-Through Mode is useful for configuring the external sensors, or for keeping the MPU-60X0 in a

low-power mode when only the external sensors are used.

In Pass-Through Mode the system processor can still access MPU-60X0 data through the I²C

interface.

Auxiliary I²C Bus IO Logic Levels



MPU-6000: The logic level of the auxiliary I²C bus is VDD

MPU-6050: The logic level of the auxiliary I²C bus can be programmed to be either VDD or VLOGIC

For further information regarding the MPU-6050’s logic levels, please refer to Section 10.2.

26 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.12 Self-Test

Please refer to the MPU-6000/MPU-6050 Register Map and Register Descriptions document for more details

on self test.

Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each

measurement axis can be activated by means of the gyroscope and accelerometer self-test registers

(registers 13 to 16).

When self-test is activated, the electronics cause the sensors to be actuated and produce an output signal.

The output signal is used to observe the self-test response.

The self-test response is defined as follows:

Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled

The self-test response for each accelerometer axis is defined in the accelerometer specification table

(Section 6.2), while that for each gyroscope axis is defined in the gyroscope specification table (Section 6.1).

When the value of the self-test response is within the min/max limits of the product specification, the part has

passed self test. When the self-test response exceeds the min/max values, the part is deemed to have failed

self-test. Code for operating self test code is included within the MotionApps software provided by

InvenSense.

27 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.13 MPU-60X0 Solution for 9-axis Sensor Fusion Using I²C Interface

In the figure below, the system processor is an I²C master to the MPU-60X0. In addition, the MPU-60X0 is an

I²C master to the optional external compass sensor. The MPU-60X0 has limited capabilities as an I²C

Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.

The MPU-60X0 has an interface bypass multiplexer, which connects the system processor I²C bus pins 23

and 24 (SDA and SCL) directly to the auxiliary sensor I²C bus pins 6 and 7 (AUX_DA and AUX_CL).

Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer

should be disabled so that the MPU-60X0 auxiliary I²C master can take control of the sensor I²C bus and

gather data from the auxiliary sensors.

For further information regarding I²C master control, please refer to Section 10.

I²C Processor Bus: for reading all

Interrupt

12

sensor data from MPU and for

configuring external sensors (i.e.

compass in this example)

INT

Status

Register

8

9

/CS

VDD

VDD or GND

MPU-60X0

AD0/SDO

Slave I²C

or SPI

Serial

Interface

23

SCL/SCLK

SDA/SDI

SCL

SDA

System

Processor

24

FIFO

Sensor I²C Bus: for

configuring and reading

from external sensors

Config

Register

Optional

Sensor

Master I²C

Serial

7

6

AUX_CL

AUX_DA

SCL

SDA

Sensor

Register

Interface

Bypass

Mux

Compass

Interface

Factory

Calibration

Digital

Motion

Processor

(DMP)

Interface bypass mux allows

direct configuration of

compass by system processor

Bias & LDO

18

13

VDD

10

REGOUT

GND

28 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

7.14 MPU-6000 Using SPI Interface

In the figure below, the system processor is an SPI master to the MPU-6000. Pins 8, 9, 23, and 24 are used

to support the /CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are

shared with the I²C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I²C bus

through the interface bypass multiplexer, which connects the processor I²C interface pins to the sensor I²C

interface pins.

Since the MPU-6000 has limited capabilities as an I²C Master, and depends on the system processor to

manage the initial configuration of any auxiliary sensors, another method must be used for programming the

sensors on the auxiliary sensor I²C bus pins 6 and 7 (AUX_DA and AUX_CL).

When using SPI communications between the MPU-6000 and the system processor, configuration of

devices on the auxiliary I²C sensor bus can be achieved by using I²C Slaves 0-4 to perform read and write

transactions on any device and register on the auxiliary I²C bus. The I²C Slave 4 interface can be used to

perform only single byte read and write transactions.

Once the external sensors have been configured, the MPU-6000 can perform single or multi-byte reads

using the sensor I²C bus. The read results from the Slave 0-3 controllers can be written to the FIFO buffer as

well as to the external sensor registers.

For further information regarding the control of the MPU-60X0’s auxiliary I²C interface, please refer to the

MPU-6000/MPU-6050 Register Map and Register Descriptions document.

Processor SPI Bus: for reading all

data from MPU and for configuring

MPU and external sensors

Interrupt

12

INT

Status

Register

/CS

8

9

/CS

MPU-6000

AD0/SDO

SDI

Slave I²C

or SPI

Serial

Interface

System

Processor

23

SCL/SCLK

SDA/SDI

SCLK

24

SDO

FIFO

Sensor I²C Bus: for

configuring and

reading data from

external sensors

Config

Register

Optional

Sensor

Master I²C

Serial

7

6

AUX_CL

AUX_DA

SCL

SDA

Sensor

Register

Interface

Bypass

Mux

Compass

Interface

Factory

Calibration

Digital

Motion

Processor

(DMP)

I²C Master performs

read and write

transactions on

Sensor I²C bus.

Bias & LDO

18

13

VDD

10

REGOUT

GND

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7.15 Internal Clock Generation

The MPU-60X0 has a flexible clocking scheme, allowing a variety of internal or external clock sources to be

used for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and

ADCs, the DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the

allowable inputs for generating this clock.

Allowable internal sources for generating the internal clock are:



An internal relaxation oscillator

Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

Allowable external clocking sources are:



32.768kHz square wave

19.2MHz square wave

Selection of the source for generating the internal synchronous clock depends on the availability of external

sources and the requirements for power consumption and clock accuracy. These requirements will most

likely vary by mode of operation. For example, in one mode, where the biggest concern is power

consumption, the user may wish to operate the Digital Motion Processor of the MPU-60X0 to process

accelerometer data, while keeping the gyros off. In this case, the internal relaxation oscillator is a good clock

choice. However, in another mode, where the gyros are active, selecting the gyros as the clock source

provides for a more accurate clock source.

Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed

by the Digital Motion Processor (and by extension, by any processor).

There are also start-up conditions to consider. When the MPU-60X0 first starts up, the device uses its

internal clock until programmed to operate from another source. This allows the user, for example, to wait

for the MEMS oscillators to stabilize before they are selected as the clock source.

7.16 Sensor Data Registers

The sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature

measurement data. They are read-only registers, and are accessed via the serial interface. Data from these

registers may be read anytime. However, the interrupt function may be used to determine when new data is

available.

For a table of interrupt sources please refer to Section 8.

7.17 FIFO

The MPU-60X0 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO

configuration register determines which data is written into the FIFO. Possible choices include gyro data,

accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter

keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst

reads. The interrupt function may be used to determine when new data is available.

For further information regarding the FIFO, please refer to the MPU-6000/MPU-6050 Register Map and

Register Descriptions document.

7.18 Interrupts

Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include

the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that

can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock

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sources); (2) new data is available to be read (from the FIFO and Data registers); (3) accelerometer event

interrupts; and (4) the MPU-60X0 did not receive an acknowledge from an auxiliary sensor on the secondary

I²C bus. The interrupt status can be read from the Interrupt Status register.

For further information regarding interrupts, please refer to the MPU-60X0 Register Map and Register

Descriptions document.

For information regarding the MPU-60X0’s accelerometer event interrupts, please refer to Section 8.

7.19 Digital-Output Temperature Sensor

An on-chip temperature sensor and ADC are used to measure the MPU-60X0 die temperature. The

readings from the ADC can be read from the FIFO or the Sensor Data registers.

7.20 Bias and LDO

The bias and LDO section generates the internal supply and the reference voltages and currents required by

the MPU-60X0. Its two inputs are an unregulated VDD of 2.375 to 3.46V and a VLOGIC logic reference

supply voltage of 1.71V to VDD (MPU-6050 only). The LDO output is bypassed by a capacitor at REGOUT.

For further details on the capacitor, please refer to the Bill of Materials for External Components (Section

7.3).

7.21 Charge Pump

An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is

bypassed by a capacitor at CPOUT. For further details on the capacitor, please refer to the Bill of Materials

for External Components (Section 7.3).

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8

Programmable Interrupts

The MPU-60X0 has a programmable interrupt system which can generate an interrupt signal on the INT pin.

Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.

Table of Interrupt Sources

Interrupt Name

Module

FIFO Overflow

FIFO

Data Ready

Sensor Registers

I²C Master

I²C Master errors: Lost Arbitration, NACKs

I²C Slave 4

For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU-

6000/MPU-6050 Register Map and Register Descriptions document. Some interrupt sources are explained

below.

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9

Digital Interface

9.1 I²C and SPI (MPU-6000 only) Serial Interfaces

The internal registers and memory of the MPU-6000/MPU-6050 can be accessed using either I²C at 400 kHz

or SPI at 1MHz (MPU-6000 only). SPI operates in four-wire mode.

Serial Interface

Pin Number

MPU-6000

MPU-6050

Pin Name

/CS

Pin Description

8

Y

SPI chip select (0=SPI enable)

Y

VLOGIC

AD0 / SDO

AD0

Digital I/O supply voltage. VLOGIC must be ≤ VDD at all times.

I²C Slave Address LSB (AD0); SPI serial data output (SDO)

I²C Slave Address LSB

I²C serial clock (SCL); SPI serial clock (SCLK)

I²C serial clock

I²C serial data (SDA); SPI serial data input (SDI)

I²C serial data

9

Y

9

23

24

SCL / SCLK

SCL

SDA / SDI

SDA

Note:

To prevent switching into I²C mode when using SPI (MPU-6000), the I²C interface should be disabled by

setting the I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the

time specified by the “Start-Up Time for Register Read/Write” in Section 6.3.

For further information regarding the I2C_IF_DIS bit, please refer to the MPU-6000/MPU-6050 Register Map

and Register Descriptions document.

9.2 I²C Interface

I²C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the

lines are open-drain and bi-directional. In a generalized I²C interface implementation, attached devices can

be a master or a slave. The master device puts the slave address on the bus, and the slave device with the

matching address acknowledges the master.

The MPU-60X0 always operates as a slave device when communicating to the system processor, which thus

acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is

400 kHz.

The slave address of the MPU-60X0 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is

determined by the logic level on pin AD0. This allows two MPU-60X0s to be connected to the same I²C bus.

When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic

low) and the address of the other should be b1101001 (pin AD0 is logic high).

9.3 I²C Communications Protocol

START (S) and STOP (P) Conditions

Communication on the I²C bus starts when the master puts the START condition (S) on the bus, which is

defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is

considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to

HIGH transition on the SDA line while SCL is HIGH (see figure below).

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Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

SDA

SCL

S

P

START condition

STOP condition

START and STOP Conditions

Data Format / Acknowledge

I²C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per

data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the

acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal

by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.

If a slave is busy and cannot transmit or receive another byte of data until some other task has been

performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes

when the slave is ready, and releases the clock line (refer to the following figure).

DATA OUTPUT BY

TRANSMITTER (SDA)

not acknowledge

DATA OUTPUT BY

RECEIVER (SDA)

acknowledge

SCL FROM

MASTER

1

2

8

9

clock pulse for

acknowledgement

START

condition

Acknowledge on the I²C Bus

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Communications

After beginning communications with the START condition (S), the master sends a 7-bit slave address

followed by an 8^thbit, the read/write bit. The read/write bit indicates whether the master is receiving data from

or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge

signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To

acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.

Data transmission is always terminated by the master with a STOP condition (P), thus freeing the

communications line. However, the master can generate a repeated START condition (Sr), and address

another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while

SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the

exception of start and stop conditions.

SDA

SCL

1 – 7

8

9

1 – 7

8

9

1 – 7

8

9

S

P

START

STOP

ADDRESS

R/W

ACK

DATA

ACK

DATA

ACK

condition

Complete I²C Data Transfer

To write the internal MPU-60X0 registers, the master transmits the start condition (S), followed by the I²C

address and the write bit (0). At the 9^thclock cycle (when the clock is high), the MPU-60X0 acknowledges the

transfer. Then the master puts the register address (RA) on the bus. After the MPU-60X0 acknowledges the

reception of the register address, the master puts the register data onto the bus. This is followed by the ACK

signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last

ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the

MPU-60X0 automatically increments the register address and loads the data to the appropriate register. The

following figures show single and two-byte write sequences.

Single-Byte Write Sequence

Master

Slave

S

AD+W

RA

DATA

P

ACK

Burst Write Sequence

Master

Slave

S

AD+W

DATA

P

ACK

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To read the internal MPU-60X0 registers, the master sends a start condition, followed by the I²C address and

a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the

MPU-60X0, the master transmits a start signal followed by the slave address and read bit. As a result, the

MPU-60X0 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)

signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the

9^thclock cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence

Master

Slave

S

AD+W

RA

S

AD+R

NACK

ACK

P

ACK

ACK DATA

Burst Read Sequence

Master

Slave

S

AD+W

NACK

P

DATA

9.4 I²C Terms

Signal Description

S

AD

W

Start Condition: SDA goes from high to low while SCL is high

Slave I²C address

Write bit (0)

R

Read bit (1)

ACK

Acknowledge: SDA line is low while the SCL line is high at the

9^thclock cycle

NACK Not-Acknowledge: SDA line stays high at the 9^thclock cycle

RA

DATA

P

MPU-60X0 internal register address

Transmit or received data

Stop condition: SDA going from low to high while SCL is high

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9.5 SPI Interface (MPU-6000 only)

SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-6000

always operates as a Slave device during standard Master-Slave SPI operation.

With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial

Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select

(/CS) line from the master.

/CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one /CS line

is active at a time, ensuring that only one slave is selected at any given time. The /CS lines of the non-

selected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state

so that they do not interfere with any active devices.

SPI Operational Features

1. Data is delivered MSB first and LSB last

2. Data is latched on the rising edge of SCLK

3. Data should be transitioned on the falling edge of SCLK

4. The maximum frequency of SCLK is 1MHz

5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The

first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first

bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.

The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is

two or more bytes:

SPI Address format

MSB

LSB

R/W A6 A5 A4 A3 A2 A1

A0

SPI Data format

MSB

LSB

D7

D6 D5 D4 D3 D2 D1

D0

6. Supports Single or Burst Read/Writes.

SCLK

SDI

SPI Master

/CS1

SPI Slave 1

SDO

/CS

/CS2

SCLK

SDI

SDO

/CS

SPI Slave 2

Typical SPI Master / Slave Configuration

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MPU-6000/MPU-6050 Product Specification

10 Serial Interface Considerations (MPU-6050)

10.1 MPU-6050 Supported Interfaces

The MPU-6050 supports I²C communications on both its primary (microprocessor) serial interface and its

auxiliary interface.

10.2 Logic Levels

The MPU-6050’s I/O logic levels are set to be VLOGIC, as shown in the table below. AUX_VDDIO must be

set to 0.

I/O Logic Levels vs. AUX_VDDIO

MICROPROCESSOR LOGIC LEVELS

AUXILLARY LOGIC LEVELS

AUX_VDDIO

(Pins: SDA, SCL, AD0, CLKIN, INT)

(Pins: AUX_DA, AUX_CL)

0

VLOGIC

Note: The power-on-reset value for AUX_VDDIO is 0.

When AUX_VDDIO is set to 0 (its power-on-reset value), VLOGIC is the power supply voltage for both the

microprocessor system bus and the auxiliary I²C bus, as shown in the figure of Section 10.3.

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10.3 Logic Levels Diagram for AUX_VDDIO = 0

The figure below depicts a sample circuit with a third party magnetometer attached to the auxiliary I²C bus. It

shows logic levels and voltage connections for AUX_VDDIO = 0. Note: Actual configuration will depend on

the auxiliary sensors used.

VLOGIC

VDD_IO

(0V - VLOGIC)

SYSTEM BUS

System

Processor IO

VDD

VLOGIC

(0V - VLOGIC)

VDD

INT

VLOGIC

(0V - VLOGIC)

SDA

SCL

(0V - VLOGIC)

CLKIN

FSYNC

(0V - VLOGIC)

VLOGIC

MPU-6050

VDD_IO

3^rdParty

VLOGIC

AD0

(0V, VLOGIC)

CS

INT 1

INT 2

Magnetometer

(0V - VLOGIC)

AUX_DA

AUX_CL

SDA

SCL

(0V, VLOGIC)

(0V - VLOGIC)

(0V, VLOGIC)

SA0

I/O Levels and Connections for AUX_VDDIO = 0

Notes:

1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL

(0 = set output levels relative to VLOGIC)

2. All other MPU-6050 logic IOs are referenced to VLOGIC.

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11 Assembly

This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems

(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.

11.1 Orientation of Axes

The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1

identifier (•) in the figure.

+Y

+Z

M

U

P

+Y

M

U

P

-

6

0

-

6

0

5

0

+X

Orientation of Axes of Sensitivity and

Polarity of Rotation

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11.2 Package Dimensions

24 Lead QFN (4x4x0.9) mm NiPdAu Lead-frame finish

L

c

24

19

1

18

PIN 1 IDENTIFIER IS A LASER

MARKED FEATURE ON TOP

CO.3

f

E

E2

e

b

13

L1

6

A1

7

12

D

D2

A

On 4 corners -

lead dimensions

s

SYMBOLS DIMENSIONS IN MILLIMETERS

MIN

0.85

0.00

0.18

---

3.90

2.65

3.90

2.55

---

NOM

0.90

0.02

0.25

0.20 REF

4.00

2.70

4.00

2.60

0.50

0.25

0.30

0.35

0.40

---

MAX

0.95

0.05

0.30

---

4.10

2.75

4.10

2.65

---

A

A1

b

c

D

D2

E

E2

e

f (e-b)

K

L

---

0.25

0.30

0.35

0.05

0.35

0.40

0.45

0.15

L1

s

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11.3 PCB Design Guidelines

The Pad Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The

Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-60X0 product.

JEDEC type extension with solder rising on outer edge

PCB Layout Diagram

SYMBOLS

DIMENSIONS IN MILLIMETERS

NOM

Nominal Package I/O Pad Dimensions

e

b

L

L1

D

E

Pad Pitch

Pad Width

Pad Length

0.50

0.25

0.35

0.40

4.00

2.70

2.60

Package Width

Package Length

Exposed Pad Width

Exposed Pad Length

I/O Land Design Dimensions (Guidelines )

I/O Pad Extent Width

I/O Pad Extent Length

Land Width

Outward Extension

Inward Extension

Land Length

D2

E2

D3

E3

c

Tout

Tin

L2

4.80

0.35

0.40

0.05

0.80

0.85

L3

Land Length

PCB Dimensions Table (for PCB Lay-out Diagram)

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11.4 Assembly Precautions

11.4.1 Gyroscope Surface Mount Guidelines

InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress coming

from the printed circuit board (PCB). This PCB stress can be minimized by adhering to certain design rules:

When using MEMS gyroscope components in plastic packages, PCB mounting and assembly can cause

package stress. This package stress in turn can affect the output offset and its value over a wide range of

temperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion

(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.

Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad

connection will help component self alignment and will lead to better control of solder paste reduction after

reflow.

Any material used in the surface mount assembly process of the MEMS gyroscope should be free of

restricted RoHS elements or compounds. Pb-free solders should be used for assembly.

11.4.2 Exposed Die Pad Precautions

The MPU-60X0 has very low active and standby current consumption. The exposed die pad is not required

for heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce

performance changes due to package thermo-mechanical stress. There is no electrical connection between

the pad and the CMOS.

11.4.3 Trace Routing

Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.

Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.

These devices are designed with the drive frequencies as follows: X = 33±3Khz, Y = 30±3Khz, and

Z=27±3Khz. To avoid harmonic coupling don’t route active signals in non-shielded signal planes directly

below, or above the gyro package. Note: For best performance, design a ground plane under the e-pad to

reduce PCB signal noise from the board on which the gyro device is mounted. If the gyro device is stacked

under an adjacent PCB board, design a ground plane directly above the gyro device to shield active signals

from the adjacent PCB board.

11.4.4 Component Placement

Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes

at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices

for component placement near the MPU-60X0 to prevent noise coupling and thermo-mechanical stress.

11.4.5 PCB Mounting and Cross-Axis Sensitivity

Orientation errors of the gyroscope and accelerometer mounted to the printed circuit board can cause cross-

axis sensitivity in which one gyro or accel responds to rotation or acceleration about another axis,

respectively. For example, the X-axis gyroscope may respond to rotation about the Y or Z axes. The

orientation mounting errors are illustrated in the figure below.

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Z

Φ

Y

M

P

M

U

-

P

6

U

0

-

6

0

5

X

Θ

Package Gyro & Accel Axes (

) Relative to PCB Axes (

) with Orientation Errors (Θ and Φ)

The table below shows the cross-axis sensitivity as a percentage of the gyroscope or accelerometer’s

sensitivity for a given orientation error, respectively.

Cross-Axis Sensitivity vs. Orientation Error

Orientation Error

Cross-Axis Sensitivity

(θ or Φ)

(sinθ or sinΦ)

0º

0.5º

1º

0%

0.87%

1.75%

The specifications for cross-axis sensitivity in Section 6.1 and Section 6.2 include the effect of the die

orientation error with respect to the package.

11.4.6 MEMS Handling Instructions

MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of

millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving

mechanical structures. They differ from conventional IC products, even though they can be found in similar

packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to

mounting onto printed circuit boards (PCBs).

The MPU-60X0 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as

it deems proper for protection against normal handling and shipping. It recommends the following handling

precautions to prevent potential damage.



Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components

placed in trays could be subject to g-forces in excess of 10,000g if dropped.



Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually

snapping apart. This could also create g-forces in excess of 10,000g.



Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if the

bath energy causes excessive drive motion through resonant frequency coupling.

11.4.7 ESD Considerations

Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.

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

Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisture-

sealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisture

sealed bags until ready for assembly.

Restrict all device handling to ESD protected work areas that measure less than 200V static charge. Ensure

that all workstations and personnel are properly grounded to prevent ESD.

11.4.8 Reflow Specification

Qualification Reflow: The MPU-60X0 was qualified in accordance with IPC/JEDEC J-STD-020D.1. This

standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and

mechanical damage during the solder reflow attachment phase of PCB assembly.

The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak

cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional

device testing.

The peak solder reflow classification temperature requirement for package qualification is (260 +5/-0°C) for

lead-free soldering of components measuring less than 1.6 mm in thickness. The qualification profile and a

table explaining the set-points are shown below:

SOLDER REFLOW PROFILE FOR QUALIFICATION

LEAD-FREE IR/CONVECTION

F

T_Pmax

T_Pmin

E

G

10-30sec

H

D

T_Liquidus

T_smax

C

Liquidus

60-120sec

T_ramp-up

( < 3 C/sec)

B

I

T_ramp-down

( < 4 C/sec)

T_smin

Preheat

60-120sec

T_room-Pmax

(< 480sec)

A

Time [Seconds]

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

Temperature Set Points Corresponding to Reflow Profile Above

CONSTRAINTS

Step Setting

Temp (°C)

Time (sec)

Max. Rate (°C/sec)

A

B

C

D

T_room

T_Smin

T_Smax

T_Liquidus

25

150

200

217

60 < t_BC< 120

r_{(TLiquidus-TPmax)}< 3

r_{(TPmax-TLiquidus)}< 4

E

T_Pmin

255

[255°C, 260°C]

F

G

T_Pmax

T_Pmin

260

255

t_AF< 480

10< t_EG< 30

[ 260°C, 265°C]

[255°C, 260°C]

H

I

T_Liquidus

T_room

217

25

60 < t_DH< 120

Notes: Customers must never exceed the Classification temperature (T_Pmax= 260°C).

All temperatures refer to the topside of the QFN package, as measured on the package body surface.

Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use

lead-free solders that have lower specified temperature profiles (Tp_max~ 235°C). Also use lower ramp-up and

ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we

used for qualification, as these represent the maximum tolerable ratings for the device.

11.5 Storage Specifications

The storage specification of the MPU-60X0 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity

Level (MSL) 3.

Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH

After opening moisture-sealed bag

168hours -- Storage conditions: ambient ≤30°C at 60%RH

11.6 Package Marking Specification

TOP VIEW

INVENSENSE

MPU6000

INVENSENSE

MPU6050

Part number

Lot traceability code

XXXXXX-XX

XX YYWW X

XXXXXX-XX

XX YYWW X

Foundry code

Rev Code

YY = Year Code

WW = Work Week

Package Vendor Code

Package Marking Specification

46 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

11.7 Tape & Reel Specification

Tape Dimensions

Reel Outline Drawing

Reel Dimensions and Package Size

PACKAGE

REEL (mm)

V

SIZE

4x4

L

W

Z

330

102

12.8

2.3

47 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

Package Orientation

User Direction

of Feed

Pin 1

INVENSENSE

Cover Tape

(Anti-Static)

Carrier Tape

(Anti-Static)

Reel

Terminal Tape

Label

Tape and Reel Specification

Reel Specifications

Quantity Per Reel

Reels per Box

5,000

1

5

Boxes Per Carton (max)

Pcs/Carton (max)

25,000

11.8 Label

Barcode Label

Location of Label on Reel

48 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

11.9 Packaging

REEL – with Barcode &

Vacuum-Sealed Moisture

Barrier Bag with ESD, MSL3,

Caution, and Barcode Labels

MSL3 Label

Caution labels

Caution Label

ESD Label

Inner Bubble Wrap

Pizza Box

Pizza Boxes Placed in Foam-

Lined Shipper Box

Outer Shipper Label

49 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

11.10 Representative Shipping Carton Label

50 of 52

Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

12 Reliability

12.1 Qualification Test Policy

InvenSense’s products complete a Qualification Test Plan before being released to production. The

Qualification Test Plan for the MPU-60X0 followed the JESD47I Standards, “Stress-Test-Driven Qualification

of Integrated Circuits,” with the individual tests described below.

12.2 Qualification Test Plan

Accelerated Life Tests

TEST

Method/Condition

Lot

Quantity

Sample /

Lot

Acc /

Reject

Criteria

(HTOL/LFR)

High Temperature Operating Life

JEDEC JESD22-A108D, Dynamic, 3.63V biased,

Tj>125°C [read-points 168, 500, 1000 hours]

3

77

(0/1)

(HAST)

JEDEC JESD22-A118A

Condition A, 130°C, 85%RH, 33.3 psia. unbiased, [read-

point 96 hours]

(0/1)

Highly Accelerated Stress Test ⁽¹⁾

(HTS)

JEDEC JESD22-A103D, Cond. A, 125°C Non-Bias Bake

[read-points 168, 500, 1000 hours]

3

77

(0/1)

High Temperature Storage Life

Device Component Level Tests

Method/Condition

TEST

Lot

Quantity

Sample /

Lot

Acc /

Reject

Criteria

(ESD-HBM)

JEDEC JS-001-2012, (2KV)

1

3

(0/1)

ESD-Human Body Model

(ESD-MM)

ESD-Machine Model

JEDEC JESD22-A115C, (250V)

1

3

6

5

(0/1)

(LU)

Latch Up

JEDEC JESD-78D Class II (2), 125°C; ±100mA

(MS)

Mechanical Shock

JEDEC JESD22-B104C, Mil-Std-883,

Method 2002.5, Cond. E, 10,000g’s, 0.2ms,

±X, Y, Z – 6 directions, 5 times/direction

(VIB)

Vibration

JEDEC JESD22-B103B, Variable Frequency (random),

Cond. B, 5-500Hz,

X, Y, Z – 4 times/direction

3

5

(0/1)

(TC)

JEDEC JESD22-A104D

Condition G [-40°C to +125°C],

Soak Mode 2 [5’], 1000 cycles

77

Temperature Cycling ⁽¹⁾

Board Level Tests

Method/Condition

TEST

Lot

Quantity

Sample /

Lot

Acc /

Reject

Criteria

(BMS)

Board Mechanical Shock

JEDEC JESD22-B104C,Mil-Std-883,

Method 2002.5, Cond. E, 10000g’s, 0.2ms,

+-X, Y, Z – 6 directions, 5 times/direction

1

5

(0/1)

(BTC)

JEDEC JESD22-A104D

40

(0/1)

Board

Condition G [ -40°C to +125°C],

Soak mode 2 [5’], 1000 cycles

Temperature Cycling ⁽¹⁾

(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

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Document Number: PS-MPU-6000A-00

Revision: 3.4

Release Date: 08/19/2013

MPU-6000/MPU-6050 Product Specification

13 Environmental Compliance

The MPU-6000/MPU-6050 is RoHS and Green compliant.

The MPU-6000/MPU-6050 is in full environmental compliance as evidenced in report HS-MPU-6000,

Materials Declaration Data Sheet.

Environmental Declaration Disclaimer:

InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity

documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained

herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.

This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense

for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to

change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to

improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding

the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising

from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited

to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by

implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information

previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors

should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for

any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,

transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime

prevention equipment.

InvenSense® is a registered trademark of InvenSense, Inc. MPU^TM, MPU-6000^TM, MPU-6050^TM, MPU-60X0^TM, Digital Motion

Processor^™, DMP ^™, Motion Processing Unit™, MotionFusion™, MotionInterface™, MotionTracking™, and MotionApps™ are

trademarks of InvenSense, Inc.

52 of 52


型号：	MPU-6050
厂家：	TDK ELECTRONICS
描述：	IMU (惯性测量设备)
文件：	总52页 (文件大小：1598K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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