U2309B-FLG3 [TEMIC]
Video Tuner, 3-Band, PDSO28, SO-28;
| 型号： | U2309B-FLG3 |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | Video Tuner, 3-Band, PDSO28, SO-28 光电二极管 |
| 文件： | 总8页 (文件大小：189K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
U2309B
VHF/ UHF-Tuner-IC
Description
This tuner IC requires a power supply of 9 V and performs Additional to TV-tuner application this IC is usable for
the function of three separate oscillators an mixers, DAB (Digital Audio Broadcast) tuners.
SAWF-driver, L.O.-output and tri-state band switch.
Features
9 V supply voltage
Balanced L. O.-outputs for prescalers or PLL
SAW filter driver with low impedance output
Voltage regulator for stable operating characteristics
Frequency range from 48 to 860 MHz
Band A: balanced high impedance mixer input and
amplitude controlled oscillator
Band B + C: balanced low impedance mixer input and
symmetrical oscillator
ESD protection on all pins except oscillator pins and
RF-inputs
Benefits
The integration of 3 bands and the small SSO28
package allows to design very small and economical
3-band tuners with high performance.
Block Diagram
8
10 9 11
1
3
4
6 5
7
19
2
Osc. A
Osc. B
Osc. C
Voltage stabiliser
12
Band switch
L.O.
27
28
17
18
Mixer output
SAW–filter driver
14
13
RF
Band B
Band C
Band A
95 10717
22 26 21
16 15
25
24
23
20
Figure 1. Block diagram
TELEFUNKEN Semiconductors
1 (8)
Rev. A2, 29-May-96
U2309B
Pin Description
Pin
1
Symbol
Function
L.O. out
L.O. out
Osc A, base
1
2
3
4
5
6
7
8
9
28
Osc A, base Oscillator band A, base
2
GND
(common)
Ground, common
GND (common)
27
26
3
Osc A, coll. Oscillator band A, collector
Osc B, base Oscillator band B, bases
Osc B, coll. Oscillator band B, collectors
Osc C, base Oscillator band C, bases
Osc C, coll. Oscillator band C, collectors
Band sw. Tri-state band switch
GND (RF)
RF in, A
RF in, A
RF in, B
RF in, B
RF in, C
RF in, C
Osc A, coll.
Osc B, base
Osc B, coll.
Osc B, coll.
Osc B, base
Osc C, base
Osc C, coll.
Osc C, coll.
Osc C, base
Band sw.
4, 7
5, 6
25
24
8, 11
9, 10
12
13, 14
15, 16
17, 18
SAWF, out SAW filter driver outputs
SAWF, inp. SAW filter driver inputs
23
22
21
Mix out
Mixer outputs, open collec-
tor
19
V
S
Supply voltage V
s
20, 21
22, 23
24, 25
26
RF in, C RF inputs, band C
RF in, B RF inputs, band B
RF in, A RF inputs, band A
GND (RF) Ground, RF part
20
19
V
S
10
11
12
27, 28
L.O. out
L.O.-outputs
18
17
16
15
Mix out
Mix out
SAWF, inp.
SAWF, inp.
13
14
SAWF, out
SAWF, out
95 10886
Ordering Information
Extended Type Number
U2309B-FLG3
Package
SO28
SSO28
Remarks
Taped and reeled
Taped and reeled
U2309B-FSG3
2 (8)
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
U2309B
Absolute Maximum Ratings
All voltages are referred to GND, Pin 2
Parameters
Symbol
V
S
Min.
–40
Typ.
Max.
10.5
5.0
10.5
10.5
125
Unit
V
V
V
V
Supply voltage
Pin 19
RF inputs
IF outputs
Tri-state switch voltage
Junction temperature
Storage temperature
Pin (20-25)
Pin 17-18
Pin 12
ViTRI
T
°C
°C
j
T
stg
125
Operating Range
All voltages are referred to GND, Pin 2
Parameters Test Conditions / Pins
Supply voltage Pin 17-19
Symbol
Min
8.1
–25
Typ
9
Max
9.9
75
Unit
V
°C
V
S
Ambient temperature
T
amb
Thermal Resistance
Parameters
Junction ambient
Package SO28 soldered to PCB
Symbol
Typ
Unit
K/W
R
thJA
70
Package SSO28 soldered to PCB (see layout page 5)
128
Electrical Characteristics
Test conditions (unless otherwise specified): V = 9 V. T
= 25 °C. Reference point Pin 2
s
amb
Parameters
Supply voltage
Supply current
Band switch
Test Conditions / Pins
Symbol
Min
8.1
Typ
9.0
42
Max
9.9
50
Unit
Pin 17-19
Pin 17-19
V
S
V
mA
I
S
Voltage band A
Voltage band B
Voltage band C
Switching current
L. O .-output
Pin 12 VSWA
Pin 12 VSWB
Pin 12 VSWC
0
1.6
3.4
0
2.0
4.0
1.0
2.4
5.0
100
V
V
V
A
VSW = 5 V
Pin 12
ISW
L. O. level each output
RL = 50 Ohm Pin 27, 28
PLO
–25
–17
dBm
SAW filter driver fi = 36 MHz
Input impedance
Output impedance
Voltage gain
Pin 15, 16
Pin 13, 14
Pin 15, 16 → 13, 14 GvSAW
ZiSAW
ZoSAW
450
70
17
Ohm
Ohm
dB
TELEFUNKEN Semiconductors
3 (8)
Rev. A2, 29-May-96
U2309B
Electrical Characteristics (continued)
Parameters
Test Conditions / Pins
Symbol
Min
48
Typ
28
Max
170
Unit
MHz
dB
Band A
Input frequency range
Input impedance
Gain (note 4)
Pin 24
fiA
S11A
GA
Figure 3
Pin 24
Pin I/P to O/P
Pin I/P to O/P
Noise figure DSB (note 2)
fiA = 50 MHz
fiA = 150 MHz
NF
NF
11.5
12
dB
dB
Input level for (note 3):
IM3 (interm. of 3rd order
IM2 (interm. of 2nd order)
Band B (note 1)
Each carrier
fiA = 71 MHz
fiA = 71 MHz
Pin I/P
Pin I/P
ViA
ViA
–23
–22
dBm
dBm
Input frequency range
Input impedance
Gain (note 4)
Pin 22, 23
Pin 22, 23
Pin I/P to O/P
Pin I/P to O/P
fiA
S11B
GB
170
470
MHz
dB
see Fig. 3
32
Noise figure DSB (note 2)
fiB = 200 MHz
fiB = 450 MHz
NF
NF
9.5
10
dB
dB
Input level for (note 3):
IM3 (interm. of 3rd order)
Band C (note 1)
Input frequency range
Input impedance
Each carrier
fiB = 300 MHz
Pin I/P
ViB
–28
dBm
MHz
dB
Pin 20, 21
Pin 20, 21
Pin I/P to O/P
fiC
S11C
GC
470
860
Figure 3
Gain
32
Noise figure DSB (note 2)
Pin I/P to O/P
fiC = 500 MHZ
fiC = 800 MHz
NF
NF
10.5
11.5
dB
dB
Input level for IM3
Each carrier
ViC
–28
dBm
(interm. of 3rd order, note 3) fiC = 600 MHz
Pin I/P
Notes
1)
The RF inputs B and C are symmetrical driven by means of a hybrid for 180° phase shifting, consequently the
source impedance is 100 . All other impedance for RF tests is 50
The noise figure (NF) is the value for double-side-band measurement.
The intermodulation test (2-carrier-method) which is made on IF-centre is in reference to a signal-to-IM ratio
of 60 dB.
.
2)
3)
4)
Gain is the ratio of the voltage at the primary coil of L5 to the available voltage at the input.
4 (8)
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
U2309B
Test and Principle Application Circuit
Hybrids 0 / 180 degree
with 50 ohms Z(in)
I/P
I/P
I/P
Band C
UHF
o
o
180
180
and 100 ohms (2x50) Z(out)
Band B
VHFH
VS
L6
10n
Band A
VHFL
15p
IF : PC 38.9 MHz
SC 33.4 MHz
1n
1n 1n 1n 1n 1n
100p
L.O.
L.O.
1n
1n
100p
The output–voltage of the
IF is calculated back to the
primary coil of L5
25
21
17
U2309B
1
5
9
13
Air Coils 0.6 mm
1n
1n
15p
enamelled copper wire
L5
IF–Out
O/P
2p7
L1 8 turns 3.0 mm dia.
L2 3 turns 2.5 mm dia.
L3 3 turns 2.5 mm dia.
L4 3 turns 2.5 mm dia.
1p
1p
2p2
1p
18
2p7
2p2
1p
1p
2p
L3
2k2
L2
68p
TOKO–Coils
BB620
VSW
L1
L5 12+2 turns
100p
L4
18k
1n
BB619
18k
L6 6+6 turns
1k
82p
8p2
BB515
18k
18k
95 10718
10n
VT
Figure 2. Test and principle application circuit
PCB for the RthJA-Measurement
Material: 35 m one-sided Cu-coated epoxy PCB,
40 mm 40 mm 1.5 mm
R(th) SO28 U2300B
95 10719
Figure 3. PCB for the R -measurement
thJA
TELEFUNKEN Semiconductors
5 (8)
Rev. A2, 29-May-96
U2309B
Input Impedance Mixer Band A (S11A), B and C (S11B/C)
j
0.5j
2j
1045 MHz
845 MHz
2
0.2j
5j
645 MHz
445 MHz
245 MHz
45 MHz
0
0.2
0.5
1
2
5
45 MHz
250 MHz
–5j
–0.2j
500 MHz
750 MHz
–2j
1
–0.5j
95 9928
Z0 = 50
–j
Figure 4. Input impedance mixer band A (S11A), B and C (S11B/C)
1)
2)
VHF-low
Normalised to 50 , measuring range 45 MHz to 750 MHz.
VHF-high and UHF
Normalised to 50 , measuring range 45 MHz to 1045 MHz. Both inputs are driven symmetrical.
The output impedance of hybrid is 100 ,the measured levels are then calculated in reference to 50
.
6 (8)
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
U2309B
Dimensions in mm:
Package: SO28
95 9932
Package: SSO28
95 10721
TELEFUNKEN Semiconductors
7 (8)
Rev. A2, 29-May-96
U2309B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
8 (8)
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
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