U2320B-FLG3 [TEMIC]
VHF/UHF Tuner-IC; VHF / UHF调谐器IC
| 型号： | U2320B-FLG3 |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | VHF/UHF Tuner-IC |
| 文件： | 总7页 (文件大小：153K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
U2320B
VHF/UHF Tuner-IC
Description
This tuner IC requires a power supply of 12 V and mixers, SAW-filter driver and dual state band switch.
performs the function of two separate oscillators and
Features
Frequency range from 48 to 860 MHz
SAW filter driver with low impedance output
Band A: balanced high impedance mixer input and
amplitude controlled oscillator
Voltage regulator for stable operating characteristics
Band B: balanced low impedance mixer input and
symmetrical oscillator
ESD protection on all pins except oscillator pins and
RF-inputs
Block Diagram
1
3
4
6 5 7
15
2
Osc. A
Osc. B
Voltage stabiliser
Band switch
8
Mixer output
13
14
SAW–filter driver
10
9
RF
Band A
19 18
Band B
95 10713
16
12 11
20 17
Figure 1.
Ordering Information
Extended Type Number
U2320B-FLG3
Package
SO20 plastic package
Remarks
Taped and reeled
TELEFUNKEN Semiconductors
1 (7)
Rev. A1, 29-May-96
U2320B
Pin Description
Pin
1
2
Symbol
Function
20
19
18
17
16
15
14
13
12
11
Osc A, base
GND (RF) 1
Osc A, base Oscillator band A, base
GND
(common)
Ground, common
GND (common)
RF in, A
2
3
Osc A, coll. Oscillator band A, collector
RF in, A
RF in, B
RF in, B
3
4
4, 7 Osc B, base Oscillator band B, bases
5, 6 Osc B, coll. Oscillator band B, collectors
8
9, 10 SAWF, out SAW filter driver outputs
11, 12 SAWF, inp. SAW filter driver input
13, 14
15
16, 17
18, 19
20
Osc A, coll.
Osc B, base
Osc B, coll.
Osc B, coll.
Osc B, base
Band sw.
Band sw. Dual-state band switch
5
Mix, out Mixer outputs, open collector
Supply voltage V
V
S
V
S
6
s
RF in, B RF inputs, band B
RF in, A RF inputs, band A
GND (RF) Ground, RF part
Mix.out
7
8
Mix. out
9
SAWF, out
SAWF, out
SAWF, inp.
10
SAWF, inp.
9612044
Absolute Maximum Ratings
All voltages are referred to GND, Pin 2
Parameters
Supply voltage
RF inputs
Test Conditions / Pins
Pin 15
Symbol
Min.
–40
Typ.
Max.
13,.5
5.0
13. 5
13. 5
150
Unit
V
V
V
V
V
S
Pin 16-19
Pin 13-14
Pin 8
IF outputs
Dual-state switch voltage
Junction temperature
Storage temperature
ViDSW
T
j
T
stg
150
Operating Range
All voltages are referred to GND, Pin 2
Parameters Test Conditions / Pins
Supply voltage
Symbol
V
S
Min.
10.8
–25
Typ.
12
Max.
13.2
75
Unit
V
C
Pin 13-15
Ambient temperature
With heat conductive glue
T
amb
Thermal Resistance
Parameters
Junction ambient
Test Conditions / Pins
Test conditions page 4
Symbol
R
thJA
Min.
Typ.
90
Max.
Unit
K/W
Package soldered to PCB
2 (7)
TELEFUNKEN Semiconductors
Rev. A1, 29-May-96
U2320B
Electrical Characteristics
Test conditions (unless otherwise specified): Vs = 12 V, T
= 25 C,
amb
reference point Pin 2, referred to test circuit page 5.
Parameters Test Conditions / Pins
Supply voltage
Symbol
V
S
Min.
10.8
Typ.
12.0
42
Max.
13.2
50
Unit
V
mA
Pin 13-15
Pin 13-15
Supply current
I
S
Band switch
Voltage band A
Voltage band B
Pin 8
Pin 8
Pin 8
VSWA
VSWB
ISW
0
3.4
0
4.0
1.0
5.0
100
V
V
A
Switching current
SAW filter driver
Input impedance
Output impedance
Voltage gain
Band A (note 1)
Input frequency range
Input impedance
Gain (note 4)
VSW = 5 V
fi = 36 MHz
Pin 11, 12 ZiSAW
Pin 9, 10
450
70
19
ZoSAW
GvSAW
11, 12 → 9, 10
dB
MHz
dB
Pin18
Pin18
I/P to O/P
I/P to O/P
fiA
S11A
GA
48
470
Figure 4
30
11.5
12
Noise figure DSB (note 2)
fiA = 50 MHz
fiA = 150 MHz
NF
dB
dB
Input level for (note 3):
IM3 (Interm. of 3rd order)
IM2 (Interm. of 2nd order)
Band B (note 1)
Each carrier
fiA = 71 MHz I/P
fiA = 71 MHz I/P
ViA
ViA
–22
–22
dBm
dBm
Input frequency range
Input impedance
Gain (note 4)
Pin 16, 17
Pin 16, 17
I/P to O/P
fiB
S11B
GB
470
860
MHz
dB
Figure 4
34
Noise figure DSB (note 2)
fiB = 500 MHz I/P to O/P
fiB = 800 MHz
NF
10.5
11.5
dB
dB
Input level for IM3
Each carrier
(Interm. of 3rd order, note 3)
fiB = 600 MHz I/P
ViB
–27
dBm
Notes
1)
The RF input B is symmetrical driven by means of a hybrid for 180 phase shifting, consequently the source
impedance is 100 . All other impedance for RF tests is 50
The noise figure (NF) is the value for double-side-band measurement.
The intermodulation test (2-carrier-method) which is made on IF-centre
is in reference to a signal-to-IM ratio of 60 dB.
.
2)
3)
4
)
Gain is the ratio of the voltage at the primary coil of L5 to the available voltage at the input.
TELEFUNKEN Semiconductors
3 (7)
Rev. A1, 29-May-96
U2320B
Test and Principle Application Circuit
Hybrid 0 / 180 degree
with 50 ohms Z(in)
and 100 ohms (2x50) Z(out)
I/P
I/P
Band B
UHF
o
VS
180
Band A
VHF
10n
L6
1n 1n
15p
1n 1n 1n 1n
Air Coils 0.6 mm
enamelled copper wire
IF : PC 38.9 MHz
SC 33.4 MHz
L1 2 turns 2.5 mm dia
L2 8 turns 3.5 mm dia
L3 3 turns 2.5 mm dia
L4 3 turns 2.5 mm dia
The output voltage of the
IF is calculated back to the
primary coil of L5
17
13
TOKO–Coils
L5 12+2 turns
L6 6+6 turns
1
5
9
L5
1n
IF–Out
O/P
2p2
2p2
1p0
1p0
15p
1n
Bd. I/III
1k5
BB515
1p0
1p0
L3
L1
18k
USW
2k2
L4
BB619
BA282
1n
100p
18k
L2
820p
68p
18k
8p2
18k
BB515
96 11674
VT
Figure 2. Test and principle application circuit
Note: All component values must be determined application specific. For more detailed information pls. request the
application note “Semiconductors for TV-Tuners and The New EasyLink Concept”.
PCB for the RthJA-Measurement
35 m one-sided Cu-coated PCB,
40 mm x 40 mm x 1.5 mm.
95 10715
Figure 3. PCB for the RthJA-measurement
4 (7)
TELEFUNKEN Semiconductors
Rev. A1, 29-May-96
U2320B
Input Impedance Mixer Band A (S11A) and B (S11B)
j
0.5j
2j
1045 MHz
845 MHz
1)
0.2j
5j
645 MHz
445 MHz
245 MHz
45 MHz
0
0.2
0.5
1
2
5
45 MHz
250 MHz
–5j
–0.2j
500 MHz
750 MHz
–2j
2)
–0.5j
95 9928
Z0 = 50
–j
Figure 4. Input impedance mixer band A (S11A), and B (S11B)
1)
2)
VHF-Low
Normalized to 50 , measuring range 45 MHz to 750 MHz.
VHF-High and UHF
Normalized to 50 , measuring range 45 MHz to 1045 MHz. Both inputs are driven symmetrical.
The output impedance of the hybrid is 100 , the measured levels are then calculated in reference
to 50
.
TELEFUNKEN Semiconductors
5 (7)
Rev. A1, 29-May-96
U2320B
Package Dimensions
Small outline plastic package, 20 pin-SO20
Dimensions in mm
95 10712
6 (7)
TELEFUNKEN Semiconductors
Rev. A1, 29-May-96
U2320B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
TELEFUNKEN Semiconductors
7 (7)
Rev. A1, 29-May-96
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