MAAPGM0080-DIE [TE]

Amplifier, Power, 1 W 2-18 GHz; 放大器,电源, 1 W 2-18 GHz的
MAAPGM0080-DIE
型号: MAAPGM0080-DIE
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Amplifier, Power, 1 W 2-18 GHz
放大器,电源, 1 W 2-18 GHz的

放大器
文件: 总7页 (文件大小:331K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Amplifier, Power, 1 W  
2-18 GHz  
MAAPGM0080-DIE  
Rev -  
Preliminary Datasheet  
Features  
1 Watt Saturated Output Power Level  
Variable Drain Voltage (6-10V) Operation  
MSAG® Process  
Description  
The MAAPGM0080-DIE is a 2-stage 1 W distributed power amplifier with  
on-chip bias networks. This product is fully matched to 50 ohms on both  
the input and output. It can be used as a power amplifier stage or as a  
driver stage in high power applications.  
Fabricated using M/A-COM’s repeatable, high performance and highly  
reliable GaAs Multifunction Self-Aligned Gate (MSAG™)Process, each  
device is 100% RF tested on wafer to ensure performance compliance.  
M/A-COM’s MSAG™ process features robust silicon-like manufacturing  
processes, planar processing of ion implanted transistors, multiple im-  
plant capability enabling power, low-noise, switch and digital FETs on a  
single chip, and polyimide scratch protection for ease of use with auto-  
mated manufacturing processes. The use of refractory metals and the  
absence of platinum in the gate metal formulation prevents hydrogen  
poisoning when employed in hermetic packaging.  
Primary Applications  
Electronic Warfare  
Ultra Wideband (UWB)  
Test Instrumentation  
Also Available in:  
SAMPLES  
Description  
Plastic  
Sample Board (Die)  
Mechanical Sample (Die)  
Part Number  
MAAP-000080-PKG003  
MAAP-000080-SMB004  
MAAP-000080-MCH000  
Electrical Characteristics: TB = 10°C1, Z0 = 50Ω, VDD = 10V, IDQ = 750mA2, Pin = 22 dBm, RG = 130Ω  
Parameter  
Symbol  
Typical  
2.0-18.0  
30  
Units  
GHz  
dBm  
dBm  
dB  
Bandwidth  
f
Output Power  
POUT  
P1dB  
G
1-dB Compression Point  
Small Signal Gain  
Power Added Efficiency  
29.5  
11.5  
11  
%
PAE  
VSWR  
Input VSWR  
Output VSWR  
1.5:1  
1.8:1  
5
VSWR  
IGG  
Gate Current  
mA  
mA  
Drain Current  
800  
IDD  
1. TB = MMIC Base Temperature  
2. Adjust VGG between –2.6 and –1.2V to achieve specified Idq.  
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
Amplifier, Power, 1 W  
2-18 GHz  
MAAPGM0080-DIE  
Rev -  
Preliminary Datasheet  
Maximum Ratings3  
Parameter  
Absolute Maximum  
Units  
Symbol  
PIN  
Input Power  
27.0  
+12.0  
-3.0  
dBm  
V
Drain Supply Voltage  
VDD  
Gate Supply Voltage  
V
VGG  
IDQ  
PDISS  
TJ  
Quiescent Drain Current (No RF)  
Quiescent DC Power Dissipated (No RF)  
Junction Temperature  
0.78  
A
7.8  
W
°C  
°C  
170  
Storage Temperature  
TSTG  
-55 to +150  
3. Operation beyond these limits may result in permanent damage to the part.  
Recommended Operating Conditions4  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Drain Voltage  
Gate Voltage  
VDD  
VGG  
6.0  
10.0  
-2.0  
10.0  
-1.2  
V
V
-2.6  
Input Power  
PIN  
ΘJC  
TB  
22.0  
13.1  
25.0  
dBm  
°C/W  
°C  
Thermal Resistance  
MMIC Base Temperature  
Note 5  
4. Operation outside of these ranges may reduce product reliability.  
5. MMIC Base Temperature = 170°C — ΘJC* VDD * IDQ  
Power Derating Curve, Quiescent (No RF)  
9
8
7
6
5
4
3
2
1
0
Operating Instructions  
This device is static sensitive. Please handle with  
care. To operate the device, follow these steps.  
1. Apply VGG = -2.7 V, VDD= 0 V.  
2. Ramp VDD to desired voltage, typically 10.0 V.  
3. Adjust VGG to set IDQ, (approximately @ –2.0 V).  
4. Set RF input.  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
MMIC Base Temperature (ºC)  
5. Power down sequence in reverse. Turn VGG off  
last.  
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
Amplifier, Power, 1 W  
2-18 GHz  
MAAPGM0080-DIE  
Rev -  
Preliminary Datasheet  
All Data is at 10ºC MMIC base temperature, CW stimulus, unless otherwise noted.  
35  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
35  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
6V  
6V  
8V  
8V  
10V  
10V  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
Frequency (GHz)  
Frequency (GHz)  
Figure 1. Output Power and Power Added Efficiency  
at Pin = 22dBm, and IDSQ=740mA  
Figure 2. 1dB Compression Point and Drain Voltage at IDSQ=750mA  
35  
35  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
-20ºC  
50ºC  
6V  
8V  
120ºC  
10V  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
Frequency (GHz)  
Frequency (GHz)  
Figure 3. Saturated Output Power vs. Frequency and Drain Voltage  
Figure 4. Saturated Output Power vs. Frequency and Temperature  
at VD=10V and IDSQ=750mA.  
35  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
20  
18  
16  
14  
12  
10  
8
6
5
4
3
2
1
6V  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
13  
11  
9
8V  
10V  
Input VSWR  
Output VSWR  
Pout  
SSG  
PAE  
IDS  
6
4
2
7
0
5
2
3
4
5
6
7
8
9
10  
Frequency (GHz)  
Figure 5. Small Signal Gain and Input and Output VSWR at  
DSQ=750mA.  
11  
12  
13  
14  
15  
16  
17  
18  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
110  
120  
Junction Temperature (ºC)  
Figure 6. Output Power, Small Signal Gain, Power Added Efficiency, and  
Drain Current vs. Junction Temperature at 10V, 10GHz, and 750mA.  
I
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
Visit www.macom.com for additional data sheets and product information.  
Amplifier, Power, 1 W  
2-18 GHz  
MAAPGM0080-DIE  
Rev -  
Preliminary Datasheet  
All Data is at 10ºC MMIC base temperature, CW stimulus, unless otherwise noted.  
40  
38  
36  
34  
32  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
20  
18  
16  
14  
12  
10  
8
2 GHz  
8 GHz  
12 GHz  
18 GHz  
6
2 GHz  
4
12 GHz  
18 GHz  
2
0
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
22  
24  
Output Power (dBm)  
Input Power (dBm)  
Figure 7. Output Power vs. Input Power and Frequency at 10V and 750mA  
Figure 8. Gain vs. Output Power and Frequency at 10V and 750mA.  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
20  
18  
16  
14  
12  
10  
8
2 GHz  
8 GHz  
12 GHz  
18 GHz  
6
2 GHz  
8 GHz  
12 GHz  
18 GHz  
4
2
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
22  
24  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
22  
24  
Input Power (dBm)  
Input Power (dBm)  
Figure 9. Power Added Efficiency vs. Input Power and Frequency at 10V and  
IDSQ=750mA.  
Figure 10. Drain Current vs. Input Power and Frequency at 10V and 750mA.  
40  
38  
36  
34  
32  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
20  
18  
16  
14  
12  
10  
8
2 GHz  
8 GHz  
12 GHz  
18 GHz  
6
4
2 GHz  
12 GHz  
18 GHz  
2
0
0
2
4
6
8
10  
Input Power (dBm)  
Figure 11. Output Power vs. Input Power and Frequency at 8V and 750mA.  
12  
14  
16  
18  
20  
22  
24  
10  
12  
14  
16  
18  
Output Power (dBm)  
Figure 12. Gain vs. Output Power and Frequency at 8V and 750mA.  
20  
22  
24  
26  
28  
30  
32  
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
Visit www.macom.com for additional data sheets and product information.  
Amplifier, Power, 1 W  
2-18 GHz  
MAAPGM0080-DIE  
Rev -  
Preliminary Datasheet  
All Data is at 10ºC MMIC base temperature, CW stimulus, unless otherwise noted.  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
20  
18  
16  
14  
12  
10  
8
2 GHz  
8 GHz  
12 GHz  
18 GHz  
6
2 GHz  
8 GHz  
12 GHz  
18 GHz  
4
2
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
22  
24  
0
2
4
6
8
10  
Input Power (dBm)  
Figure 14. Drain Current vs. Input Power and Frequency at 8V and 750mA  
12  
14  
16  
18  
20  
22  
24  
Input Power (dBm)  
Figure 13. Power Added Efficiency vs. Input Power and Frequency at 8V and  
IDSQ=750mA.  
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
Visit www.macom.com for additional data sheets and product information.  
Amplifier, Power, 1 W  
2-18 GHz  
MAAPGM0080-DIE  
Rev -  
Preliminary Datasheet  
Mechanical Information  
Chip Size: 3.150 x 3.150 x 0.075 mm (124 x 124 x 3 mils)  
124.02  
84.96  
OUT  
24.63  
IN  
0.00  
Chip edge to bond pad dimensions are shown to the center of the bond pad (mils).  
Figure 1. Die Layout  
Bond Pad Dimensions  
Pad  
Size (mils)  
Size (μm)  
RF In and Out  
100 x 200  
200 x 150  
4 x 8  
8 x 6  
DC Drain Supply Voltage VDD  
DC Gate Supply Voltage VGG  
150 x 150  
6 x 6  
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
Amplifier, Power, 1 W  
2-18 GHz  
MAAPGM0080-DIE  
Rev -  
Preliminary Datasheet  
Assembly and Bonding Diagram  
VDD  
0.1 μF  
100 pF  
RFOUT  
RFIN  
100 pF  
VGG  
130 Ω  
0.1 μF  
Figure 2. Recommended operational configuration. Wire bond as shown.  
Assembly Instructions:  
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C  
to less than 5 minutes.  
Wirebonding: Bond @ 160 °C using standard ball or thermal compres-  
sion wedge bond techniques. For DC pad connections, use either ball or  
wedge bonds. For best RF performance, use wedge bonds of shortest  
length, although ball bonds are also acceptable.  
Biasing Note: Must apply negative bias to VGG before applying posi-  
tive bias to VDD to prevent  
7
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  

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