MADP-000208-13180W [TE]
SURMOUNT TM 8μm PIN Diode Pair RoHS Compliant; 众志成城TM 8μm的PIN二极管对符合RoHS
| 型号： | MADP-000208-13180W |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | SURMOUNT TM 8μm PIN Diode Pair RoHS Compliant |
| 文件： | 总4页 (文件大小：108K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MADP-000208-13180W
SURMOUNT TM 8μm PIN Diode Pair
RoHS Compliant
Rev. V1
Outline Drawing
Features
• Surface Mount Device
• 8 µm I-Region Length Devices
• Two PIN diodes in Flexible Configuration
• No Wire bonds Required
• Rugged Silicon-Glass Construction
• Silicon Nitride Passivation
• Polymer Scratch Protection
• Low Parasitic Capacitance and Inductance
Description
The MADP-000208-13180W is a pair of silicon
glass PIN diodes incorporated onto one chip and
is fabricated using M/A-COM’s patented HMICTM
process. The device features three silicon pedestals
embedded in low loss, low dispersion glass (k=4.1,
Tanδ=0.002). The diodes are formed on the top of
pedestals and connections to the backside of the
device
are made via electrically conductive
sidewalls. Selective backside metallization is applied
to produce a surface mount device. This vertical
topology provides for exceptional heat transfer and
also allows the topside to be fully encapsulated with
silicon nitride. An additional polymer layer is also
added to provide scratch and impact protection.
These protective coatings prevent damage to the
junction and the anode air-bridge during handling
and assembly.
Bottom Side Contacts (Circuit Side)
Inches
Millimeter
Dim.
min
max
min
max
1.168
0.406
0.140
0.318
0.165
0.165
0.318
A
B
C
D
E
F
0.0440
0.0140
0.0045
0.0115
0.0055
0.0055
0.0115
0.0460
0.0160
0.0055
0.0125
0.0065
0.0065
0.0125
1.118
0.355
0.114
0.292
0.140
0.140
0.292
Applications
The MADP-000208-13180W packageless devices
are suitable for usage in high incident power, 44.8
dBm C.W at 2 GHz., series, shunt, or series-shunt
switches. The low parasitic inductance, < 0.12 nH,
and excellent RC constant, make these devices an
attractive alternative for high frequency switch
elements when compared to their plastic device
counterparts.
G
Ordering Information
Part Number
Package
MADP-000208-13180W
390 pieces per tray
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT TM 8μm PIN Diode Pair
RoHS Compliant
Rev. V1
Electrical Specifications1,2,3: TA = +25°C
D1 - J1 to J3 & D2 - J3 to J4
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Capacitance (CT)4
-10 V, 1 MHz
pF
—
0.81
0.90
+10 mA, 1 GHz
+100 mA, 1 GHz
—
—
0.40
0.30
0.62
0.52
Resistance (RS)
Ω
+5 mA
+100 mA
—
—
0.78
1.00
0.90
1.1
Forward Voltage (VF)4
V
Reverse Leakage Current (IR)4
| -90V |
µA
°C/W
µS
—
—
—
—
58
10
—
—
C.W. Thermal Resistance (RθJL
Lifetime (TL)
)
+10 mA / -6 mA ( 50% - 90% V )
0.5
1. Total capacitance (CT), is equivalent to the sum of Junction Capacitance (CJ) and Parasitic Capacitance (CPAR
)
2. Series resistance (RS) is equivalent to the total diode resistance: RS = RJ (Junction Resistance) + RC (Ohmic Resistance)
3. RS is measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package using Sn60/Pb40 solder.
4. On wafer measurement.
Application Schematic
Absolute Maximum Ratings
Parameter
Absolute Maximum
Forward Current
500 mA
- 90 V
Reverse Voltage
D2
D1
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
-55 °C to +125°C
-55 °C to +150°C
+175°C
J4
J3
J1
44.8 dBm @ 2 GHz
Mounting Temperature
for RoHS Solders
+260 °C for 10 seconds
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT TM 8μm PIN Diode Pair
RoHS Compliant
Rev. V1
Typical Performance Curves @ 25°C
Resistance vs. Frequency @ 5, 10 & 20 mA
Resistance vs. Forward Current @ 30, 500, 1000 MHz
0.8
0.7
5 mA
10 mA
20 mA
0.7
30 MHz
500 MHz
1000 MHz
0.6
0.6
0.5
0.4
0.3
0.2
0.5
0.4
0.3
0.2
0.0
0.5
1.0
1.5
2.0
0.0
20.0
40.0
60.0
80.0
100.0
Frequency (GHz)
Current (mA)
Capacitance vs. Frequency @ 10 & 40 V
Capacitance vs. Voltage @ 30, 500, 1000 MHz
0.90
0.90
0.85
0.85
0.80
0.80
10 Volts
40 Volts
30 MHz
500 MHz
0.75
0.70
0.75
1000 MHz
0.70
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0
8
16
24
32
40
Frequency (GHz)
Voltage (V)
Series Inductance vs. Forward Current @ 500 & 1000 MHz
Series Inductance vs. Frequency @ 5, 10 & 20 mA
0.12
0.12
0.10
0.08
0.11
0.10
0.06
5 mA
10 mA
20 mA
500 MHz
1000 MHz
0.04
0.09
0.08
0.02
0.00
0
20
40
60
80
100
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
I (mA)
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT TM 8μm PIN Diode Pair
RoHS Compliant
Rev. V1
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk handling should ensure that abrasion and
mechanical shock are minimized.
Electro-Static Sensitivity: The MADP-000208-13108W Diode Pair are ESD, Class 1A sensitive
(HBM). Proper ESD precautions should be taken.
Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS
compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is
recommended. When hot forming gas is applied, the temperature should be approximately 290oC.
The chip should not be exposed to temperatures greater than 320oC for more than 10 seconds.
Eutectic Die Attachment Using Reflow Oven: Please visit the M/A-COM website and see
Application Note M538, “Surface Mounting Instructions” for the recommended time-temperature
profile.
Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the bond pad after placement
to ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C
for 1 hour.
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
相关型号：
©2020 ICPDF网 联系我们和版权申明