MADP-000504-10720T_15 [TE]
Non Magnetic MELF PIN Diode;
| 型号： | MADP-000504-10720T_15 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Non Magnetic MELF PIN Diode |
| 文件： | 总6页 (文件大小：303K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MADP-000504-10720T
Non Magnetic MELF PIN Diode
V1
Features
Package Style 1072
•
•
•
•
•
•
•
High Power Handling
Low Loss / Low Distortion
Leadless Low Inductance MELF Package
Non-Magnetic
Surface Mountable
RoHS Compliant
Dot Denotes Cathode
MSL 1
Description
M/A-COM Technology Solutions product line of
MELF, PIN diodes, encompass a comprehensive
range of electrical characteristics. The chip used in
the MADP-000504-10720T is manufactured using
a unique, CERMACHIP, passivation process which
provides for a hard glass encapsulation that
protects and hermetically seals the active area of
the chip. This packaged, CERMACHIP, PIN diode
is ideally suited for use in applications where high
RF and DC voltages are present.
Absolute Maximum Ratings @ 25°C
The chip is enclosed in a rugged, ceramic, Metal
Electrode Leadless Faced (MELF), surface mount
package that is full face bonded to refractory metal
plugs on both the anode and cathode. The result is
a low loss PIN diode with low thermal resistance
due to its symmetrical thermal paths. MELF PIN
diodes are designed specifically for high volume
tape and reel assembly. Their user friendly design
provides for extremely easy, automatic, pick and
place, indexing and assembly. All solderable
surfaces are tin plated and are compatible with all
industry standard reflow and vapor phase soldering
processes.
Parameter
Forward Voltage1,2
Reverse Voltage1,2
Operating Temperature
Storage Temperature
Mounting Temperature
Absolute Maximum
1.0 V
500V
-65°C to +175°C
-65°C to +200°C
+260°C for 30 seconds
1. Exceeding these limits may cause permanent damage
to the device.
2. Values will de-rate linearly over temperature.
Applications
The MADP-000504-10720T MELF is well suited for
use in low loss, low distortion, UHF and VHF high
power switching circuits. It is specifically designed to
operate in high magnetic fields and to tune or protect
RF coils in MRI circuits. This device is designed to
meet the most demanding electrical and mechanical
environments.
Ordering Information
Part Number
Packaging
Quantity
MADP-000504-10720T Tape and reel 1500 pcs
Tape and reel information can be found in Application
Note M513 on the M/A-COM website
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
V1
Electrical Specifications @ TA = +25°C
Parameters
Symbols
Conditions
Units
Min.
Typ.
Max.
Total Capacitance1
Package Capacitance
Series Resistance
CT100V
Cp
RS
TL
-100 V @ 1 MHz
pF
pF
—
—
0.16
—
0.50
—
+100 mA @ 100 MHz
Ω
—
—
—
—
—
0.60
—
Minority Carrier Lifetime
Forward Voltage
IF = +10 mA / IR = -6 mA
µS
V
1.0
—
VF
-IR
θ
+ 50 mA
-500 V
—
1.0
Reverse Leakage Current
Thermal Resistance2
Power Dissipation2,3
Thermal Resistance4
Power Dissipation4,5
I Region Thickness
nA
°C/W
W
—
| -100 |
20
16
—
Pd
θ
—
7.5
—
°C/W
W
—
—
48
—
51
Pd
—
—
2.9
—
µm
44
Power In = +10dBm
Freq. = 1000 MHz
Spacing = 1 MHz
3rd Order
Input Intermodulation Distortion
IIP3
dBm
—
>54
—
1. Total capacitance Ct = Cj (Chip Junction Capacitance) + Cp (Parasitic Package Capacitance)
2. Diode attached to an infinite heatsink.
3. De-rate linearly by -50 mw/°C to 0W @ +125 °C .
4. Diode in air.
5. De-rate linearly by -19.3 mw/°C to 0W @ +125 °C
Typical DC Performance Curves
Series Resistance vs. Forward Current
Capacitance vs. Reverse Voltage
0.54
0.53
0.52
0.51
0.5
7
6
5
100 MHz
100 MHz
4
3
2
1
0
0.49
0.48
0.47
0.46
0
20
40
60
80
100
0
20
40
60
80
100
Forward Bias (mA)
Reverse Bias (V)
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
V1
Typical RF Performance Curves (50 – 4000 MHz)
MOUNTED IN A SERIES CONFIGURATION
Input Return Loss
Output Return Loss
0
-10
-20
-30
-40
-50
0
-10
-20
-30
-40
-50
0
1
2
3
4
0
1
2
3
4
Frequency (GHz)
Frequency (GHz)
Insertion Loss
Isolation
0
-10
-20
-30
-40
-50
0
-0.1
-0.2
-0.3
-0.4
-0.5
IL (10mA)
IL (50mA)
IL (100mA)
-10V
-25V
0
1
2
3
4
0
1
2
3
4
Frequency (GHz)
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
V1
Typical RF Performance Curves (50 – 4000 MHz)
MOUNTED IN A SHUNT CONFIGURATION
Input Return Loss
Output Return Loss
0
-10
-20
-30
-40
-50
0
-10
-20
-30
-40
-50
0
1
2
3
4
0
1
2
3
4
Frequency (GHz)
Frequency (GHz)
Insertion Loss
Isolation
0
-5
0
-0.2
-0.4
-0.6
-0.8
-1
-10
-15
-20
-25
-30
-35
10mA
50mA
100mA
IL (10V)
-1.2
-1.4
-1.6
0
1
2
3
4
0
1
2
3
4
Frequency (GHz)
Frequency (GHz)
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
V1
Circuit Pad Layout
Package Outline (1072 MELF )
Cathode
B
A
Package Style
Solderable
Surfaces
1072
Dimension
A
inches
mm
C
A
B
C
0.093
0.050
0.060
2.36
1.27
1.52
INCHES
MM
MIN.
MAX.
MIN.
MAX.
A
B
C
0.080
0.095
0.125
0.023
2.032
2.413
0.115
0.008
2.921
0.203
3.175
0.584
A
C
B
B
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
V1
Assembly Recommendations
• Devices may be soldered using standard Sn63/Pb37 or any RoHS compliant solder. Leads are bright tin
plated to a minimum thickness of 50μm to ensure an optimum connection.
• For recommended Sn/Pb and RoHS soldering time/temperature profiles. See Application Note M538 on the
M/A-COM Technology Solutions website.
Handling Procedures
RoHS
The following precautions should be observed to
avoid damaging these devices.
The MADP-000504-10720T is fully RoHS compliant
meaning it contains less than the maximum allowable
concentration of 0.1%, by weight, in homogenous
materials for lead, hex chrome, mercury, PBB, PBDE,
and 0.01% for cadmium.
Cleanliness and Storage
MELF devices should be handled and stored in a
clean environment. The metalized ends of the
device are tin plated for greater solderability and
any continuous exposure to high humidity (>80%)
for extended periods of time may cause the surface
to oxidize. Caution should be taken when storing
devices for extended intervals.
Mounting Techniques
Solder Attach
Typical wave soldering or reflow techniques may be
used to mount MELF packages to circuit boards. Alloys
such as Sn63/Pb37 or any RoHS compliant solder may
be used. For more information visit the M/A-COM Tech
website and refer to application note M538.
ESD
These devices are susceptible to ESD and are
rated Class 1C.
General Handling
Note: Click links below to view datasheets of other
MELF and packaged PIN diodes.
Device can be handled with tweezers or vacuum
pickups and are suitable for use with automatic
pick-and-place equipment.
PACKAGED_PIN_DIODES
and/or
MA4P MELF & HIPAX Series
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
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