MADP-000907-13050P [TE]
GaAs Flip Chip PIN Diode; 砷化镓倒装芯片PIN二极管
| 型号： | MADP-000907-13050P |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | GaAs Flip Chip PIN Diode |
| 文件： | 总5页 (文件大小：97K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MA4GP907
GaAs
Flip Chip PIN Diode
M/A-COM Products
Rev. V6
RoHS Compliant
Features
Chip Dimensions
♦
♦
♦
♦
♦
♦
♦
♦
Low Series Resistance
Ultra Low Capacitance
Millimeter Wave Switching & Cutoff Frequency
2 Nanosecond Switching Speed
Can be Driven by a Buffered TTL
Silicon Nitride Passivation
Polyimide Scratch Protection
RoHS Compliant
Description
M/A-COM's MA4GP907 is Gallium Arsenide (GaAs)
flip-chip PIN diode. It is fabricated using an OMCVD
epitaxial wafer with a process designed for high
device uniformity and extremely low parasitics. The
diode exhibits an extremely low RC product, (0.1ps)
and 2-3nS switching characteristics. They are fully
passivated with silicon nitride and have an added
polymer layer for scratch protection. The protective
coating prevents damage to the junction and the
anode air-bridge during handling and assembly.
Applications
The ultra low capacitance of the MA4GP907 allows
for operation up to millimeter frequencies for RF
switches and switched phase shifter applications.
The diode is designed for use in pulsed or CW
applications, where single digit nS switching speed
is required. The low capacitance of the MA4GP907
makes it for use in microwave multi-throw switch
assemblies, where the series capacitance of each
“off” port adversely loads the input and affects
VSWR.
Notes:
1. Gold Pads 14µM thick.
2. Yellow areas indicate ohmic gold mounting pads.
Inches
Millimeters
DIM
MIN.
MAX.
MIN.
MAX.
A
0.026
0.027
0.6604
0.6858
B
C
D
0.0135
0.0065
0.0043
0.0145
0.0075
0.0053
0.3429
0.1651
0.1092
0.3683
0.1905
0.1346
Absolute Maximum Ratings TAMB = +25°C
(unless otherwise specified)
Parameter
Reverse Voltage
Absolute Maximum
50V
E
F
0.0068
0.0182
0.0073
0.0192
0.1727
0.4623
0.1854
0.4877
Operating Temperature
Storage Temperature
-55°C to +125°C
-55°C to +150°C
+175°C
Junction Temperature
Dissipated Power
( RF & DC )
50mW
C.W. Incident Power
+23 dBm
Mounting Temperature +280°C for 10 seconds
ADVANCED: Data Sheets contain information regarding a product M/A-COM is
considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not
guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has
under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may
be available. Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4GP907
GaAs
Flip Chip PIN Diode
M/A-COM Products
Rev. V6
RoHS Compliant
Electrical Specifications @ TAMB = +25°C
Typ.
Max.
Parameter
Symbol
Conditions
Units
Total Capacitance
CT
-10V,1MHz
pF
0.025
0.030
Total Capacitance 1
Series Resistance
CT
RS
-10V,10GHz
pF
0.025
5.2
——
7.0
+10mA, 1MHz
Ω
Series Resistance 2
Forward Voltage
RS
VF
IR
+10mA, 10GHz
+10mA
Ω
4.2
——
1.45
V
1.33
Reverse Voltage Current 3
Switching Speed 4
VR = -50V
10GHz
μA
——
2
10
TRISE
TFALL
nS
——
Notes:
1) Capacitance is determined by measuring the isolation of a single series diode in a 50Ω transmission
line at 10GHz.
2) Series resistance is determined by measuring the insertion loss of a single series diode in a 50Ω
transmission line at 10GHz.
3) The max rated VR( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is
measured to be <10μA
4) Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series
mounted diode. Driver delay is not included.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is
considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not
guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has
under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may
be available. Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4GP907
GaAs
Flip Chip PIN Diode
M/A-COM Products
Rev. V6
RoHS Compliant
Typical RF Performance @ TAMB = +25°C
Insertion Loss vs. Frequency
I. Loss @5mA
I. Loss @15mA
I. Loss @50mA
0.0
-0.2
-0.4
-0.6
-0.8
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
)
Frequency (GHz
Return Loss vs. Frequency
R. Loss @5mA
R. Loss @15mA
R. Loss @50mA
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
Frequency (GHz)
ADVANCED: Data Sheets contain information regarding a product M/A-COM is
considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not
guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has
under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may
be available. Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4GP907
GaAs
Flip Chip PIN Diode
M/A-COM Products
Rev. V6
RoHS Compliant
Typical RF Performance @ TAMB = +25°C
Isolation vs. Frequency
Isolation @ -10V
Isolation @ 0V
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
Frequency ( GHz )
ADVANCED: Data Sheets contain information regarding a product M/A-COM is
considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not
guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
Frequency (Hz)
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has
under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may
be available. Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4GP907
GaAs
Flip Chip PIN Diode
M/A-COM Products
Rev. V6
RoHS Compliant
Device Installation Guidelines
Cleanliness
This device should be handled in a clean environment. The chip is resistant to solvents and may cleaned using
approved industry standard practices.
Static Sensitivity
Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD handling
techniques should be used. These devices are rated Class 0, ( 0-199V )per HBM MIL-STD-883, method 3015.7
should be handled in a static-free environment.
General Handling
The die has a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die
can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Silver Epoxy and Solder
The MA4GP907 is designed to be inserted onto hard or soft substrates with the junction/pad side down. It may
be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately 1-2 mils in
thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times,
> 30 minutes, temperatures must be kept below 200°C.
Eutectic Die Attached
Tin rich solders ( >30% Sn by weight ) are not recommended as they will scavenge gold from the contact pads
exposing the tungsten metallization beneath and creating a poor solder connection. Indalloy or 80Au/20Sn type
solders are acceptable. Maximum soldering temperature must be kept below 280°C for less than 10 seconds.
Circuit Pad Layout
0.013”
Ordering Information
Part Number
MA4GP907
MADP-000907-13050P
Packaging
Waffle Pack
Pocket Tape
0.012”
(2) PL
0.008”
(2) PL
ADVANCED: Data Sheets contain information regarding a product M/A-COM is
considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not
guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has
under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may
be available. Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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