MADP-042308-13060G [TE]
SURMOUNTTM 8μM PIN Diodes; SURMOUNTTM 8μM PIN二极管
| 型号： | MADP-042308-13060G |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | SURMOUNTTM 8μM PIN Diodes |
| 文件： | 总4页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
M/A-COM Products
Rev. V1
Features
•
•
•
•
•
•
•
•
Surface Mount
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
RoHS Compliant
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM’s patented HMICTM process.
This device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed on the
top of one pedestal and connections to the backside of the
device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
G
D
E
F
Applications
INCHES
MM
These packageless devices are suitable for moderate
incident power applications, ≤ 10W/C.W. or where the
peak power is ≤ 52W, pulse width is ≤ 1μS, and duty cycle
is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
DIM
MIN
MAX
MIN
1.025
0.525
0.102
0.325
0.275
0.325
0.475
MAX
1.075
0.575
0.203
0.375
0.325
0.375
0.525
A
B
C
D
E
F
0.040
0.021
0.004
0.013
0.011
0.013
0.019
0.042
0.023
0.008
0.015
0.013
0.015
0.021
Absolute Maximum Ratings1@ TAMB = +25°C
(unless otherwise specified)
G
Parameter
Absolute Maximum
Notes:
MADP-042…-13060
C.W. Incident Power dBm
Forward Current
308
408
508
908
1. Backside metal: 0.1 μM thick.
+42
+44
+43
+39
2. Yellow hatched areas indicate backside ohmic gold contacts.
3. All devices have the same outline dimensions ( A to G).
250 mA
Reverse Voltage
-100 V
-55°C to +125°C
-55°C to +150°C
+175°C
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
+280°C for 10 seconds
1. Exceeding these limits may cause permanent damage.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
M/A-COM Products
Rev. V1
Electrical Specifications @ TAMB = + 25 °C
MADP-042308-13060 MADP-042508-13060
Parameter
Symbol
Conditions
Units
Typ
Max
Typ
Max
- 10V, 1 MHz 1
- 10 V, 1 GHz 1,3
- 40 V, 1 MHz 1
- 40 V, 1 GHz 1,3
+ 20 mA, 1 GHz 2,3
+ 50 mA, 1 GHz 2,3
+ 10 mA
pF
pF
pF
pF
W
W
V
0.10
0.10
0.09
0.10
1.38
1.18
0.85
0.20
0.18
0.19
0.18
0.18
0.97
0.87
0.82
0.30
1,3
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
CT
1,3
CT
1,3
CT
0.20
0.30
1,3
CT
2,3
RS
2,3
Resistance
RS
Forward Voltage
VF
IR
1.00
10
1.00
10
Reverse Leakage
Current
-100V
µA
F 1= 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
I bias = + 20 mA
Input Third Order
Intercept Point
IIP3
dBm
73
77
C.W. Thermal Resistance
Lifetime
θ
°C/W
nS
145
280
115
310
+10 mA / -6 mA
( 50% - 90% V )
TL
MADP-042408-13060 MADP-042908-13060
Parameter
Symbol
Conditions
Units
Typ.
Max
Typ
Max
1,3
Capacitance
Capacitance
CT
- 10 V, 1 MHz 1
- 10 V, 1 GHz 1,3
- 40 V, 1 MHz 1
- 40 V, 1 GHz 1,3
+ 20 mA, 1 GHz 2,3
+ 50 mA, 1 GHz 2,3
+ 10 mA
pF
pF
pF
pF
W
0.38
0.39
0.36
0.37
0.67
0.61
0.80
0.50
0.05
0.05
0.04
0.05
3.63
3.02
0.91
0.15
1,3
CT
1,3
Capacitance
CT
0.50
0.15
1,3
Capacitance
CT
2,3
Resistance
RS
2,3
Resistance
RS
W
Forward Voltage
Reverse Leakage Current
VF
IR
V
1.00
10
1.00
10
-100V
µA
F 1= 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
I bias = + 20 mA
Input Third Order
Intercept Point
IIP3
dBm
81
66
C.W. Thermal Resistance
Lifetime
θ4
°C/W
nS
100
380
185
230
+10 mA / -6 mA
( 50% - 90% V )
TL
1. Total capacitance, CT, is equivalent to the sum of junction capacitance ,CJ , and parasitic capacitance, Cpar.
2. Series resistance RS is equivalent to the total diode resistance : RS = RJ ( Junction Resistance) + RC ( Ohmic Resistance)
3. RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package.
4. Theta (θ) is measured with the die mounted in an ODS-1134 package.
Specifications Subject to Change Without Notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
• North America Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
M/A-COM Products
Rev. V1
Typical Performance @ TAMB = +25 °C
Ct @ 10V
Ct @ 40V
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
042408
042408
042508
042308
042508
042308
042908
1.4
042908
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.6
1.8
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.100
1.8
Freq (GHz)
Freq (GHz)
Ct @ 1GHz
Rs @ 1GHz
10.000
1.000
0.100
0.60
0.50
0.40
0.30
0.20
0.10
0.00
042908
042408
042308
042508
042508
042408
042308
042908
0.001
0.010
0
5
10
15
20
25
30
35
40
Bias (A)
Bias (V)
Rs @ 20mA
Rs @ 10mA
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
042908
042908
042308
042508
042308
042508
042408
1.4
042408
1.4
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.6
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.6
1.8
Freq (GHz)
Freq (GHz)
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
MADP-042XX8-13060 Series
SURMOUNTTM 8µM PIN Diodes
RoHS Compliant
M/A-COM Products
Rev. V1
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , “Surface Mounting
Instructions“ and can viewed on the MA-COM website @ www.macom.com
Ordering Information
The MADP-042XX8-13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the
appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the
M/A-COM website @ www.macom.com.
Part Number
Gel Pack
Tape and Reel (Surf Tape)
Tape and Reel (Pocket Tape)
MADP-042308-13060G
MADP-042408-13060G
MADP-042508-13060G
MADP-042908-13060G
MADP-042308-13060T
MADP-042408-13060T
MADP-042508-13060T
MADP-042908-13060T
MADP-042308-13060P
MADP-042408-13060P
MADP-042508-13060P
MADP-042908-13060P
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
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