MASW-002103-1363_14 [TE]

Silicon SPDT Surface Mount HMIC PIN Diode Switch;


型号：	MASW-002103-1363_14
厂家：	TE CONNECTIVITY
描述：	Silicon SPDT Surface Mount HMIC PIN Diode Switch 光电二极管
文件：	总10页 (文件大小：1163K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Features



Usable up to 26 GHz

Low Insertion Loss

High Isolation

Low Parasitic Capacitance and Inductance

RoHS Compliant Surmount Package

Rugged, Fully Monolithic

Glass Encapsulated Construction

Up to +38 dBm CW Power Handling @ +25°C

Silicon Nitride Passivation

Polymer Scratch Protection

Solderable

Functional Schematic

Description

The MASW-002103-1363 is a SPDT, surmount,

broadband, monolithic switch using two sets of

series and shunt connected PIN diodes. This device

is designed for use in broadband, low to moderate

signal, high performance, switch applications up to

20 GHz. It is a surface mountable switch configured

for optimized performance and offers a distinct

advantage over MMIC, beamlead and chip and wire

hybrid designs. Because the PIN diodes of the

MASW-002103-1363 are integrated into the chip

and kept within close proximity, the parasitics

typically associated with other designs that use

individual components are kept to a minimum.

To minimize the parasitics and achieve high

performance the MASW-002103-1363 is fabricated

using MACOM’s HMIC (Heterolithic Microwave

Integrated Circuit) process. This process allows the

silicon pedestals, which form the series and shunt

diodes or vias, to be imbeded in low loss, low

dispersion glass. The combination of low loss glass

and using tight spacing between elements results in

an HMIC device with low loss and high isolation

through low millimeter wave frequencies.

Pin Configuration

Function

RFC

RF1

RF2

The topside is fully encapsulated with silicon nitride

and also has an additional layer of polymer for

scratch and impact protection. The protective

coating guards against damage to the junction and

the anode airbridges during handling and assembly.

Ordering Information

Part Number

Package

MASW-002103-13630G

MASW-002103-13635P

MASW-002103-13630P

MASW-002103-001SMB

MASW-002103-002SMB

50 piece gel pack

500 piece reel

On the backside of the chip gold metalized pads

have been added to produce a solderable surmount

device.

3000 piece reel

Sample Test Board

Demo Board

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Electrical Specifications: T_A= 25°C, P_IN= 0 dBm, Z₀= 50 Ω, 20 mA/-10 V

Parameter

Frequency

Units

Min.

Typ.

Max.

6 GHz

13 GHz

20 GHz

0.55

0.80

1.05

0.65

0.95

1.25

Insertion Loss

—

6 GHz

13 GHz

20 GHz

Input to Output Isolation

—

6 GHz

13 GHz

20 GHz

17.3

16.5

Return Loss

Input 0.1dB Compression Point

IIP3

—

2 GHz

dBm

—

0.05 GHz, 5 MHz Spacing, 10 dBm

0.5 GHz, 5 MHz Spacing ,20 dBm

1 GHz, 10 MHz Spacing, 20 dBm

2 GHz, 10 MHz Spacing, 20 dBm

Switching Speed¹

Voltage Rating²

—

1. Typical Switching Speed measured from 10% to 90 % of detected RF signal driven by TTL compatible drivers.

2. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 µA maximum @ -80 volts.

Absolute Maximum Ratings^3,4,5

Handling Procedures

Parameter

Absolute Maximum

Please observe the following precautions to avoid

damage:

38 dBm CW @ 2 GHz

33 dBm CW @ 20 GHz

RF CW Incident Power

Static Sensitivity

Applied Reverse Voltage

Bias Current

|-80 V|

± 50 mA

These electronic devices are sensitive to

electrostatic discharge (ESD) and can be damaged

by static electricity. Proper ESD control techniques

should be used when handling these HBM class 1A

devices.

Junction Temperature7,8

Operating Temperature

Storage Temperature

+175°C

-65°C to +125°C

-65°C to +150°C

3. Exceeding any one or combination of these limits may cause

permanent damage to this device.

4. MACOM does not recommend sustained operation near these

survivability limits.

5. Maximum operating conditions for a combination of RF power,

DC bias and temperature: +33 dBm CW @ 20 mA (per diode)

@ +85°C.

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Typical Small Signal Performance @ +25°C (Probed On-Wafer RF Test)

Insertion Loss (20 mA Bias)

Isolation (20 mA Bias)

0.0

-0.5

-1.0

-1.5

-2.0

-20

-40

-60

-80

Frequency (GHz)

Input Return Loss (20 mA Bias)

Maximum Input Power

Input J1 to J2

Input J1 to J3

Output J2

Output J3

-10

-20

-30

-40

2 GHz, 6.7 W

10 GHz, 3.5 W

20 GHz, 2.0 W

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Frequency (GHz)

Insertion Loss (dB)

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Operation of the MASW-002103-1363 PIN Switch

Optimal operation of the MASW-002103-1363 is achieved by simultaneous application of negative DC voltage

and current to the low loss switching arm and positive DC voltage and current to the remaining switching arm as

shown in the circuit diagram below. DC return is achieved via R2 on the RFC path. In the low loss state, the

series diode must be forward biased with current and the shunt diode reverse biased with voltage. In the isolated

arm, the shunt diode is forward biased with current and the series diode is reverse biased with voltage.

Typical Bias Network

Example:

J1 to J2→ Low Loss

R1 = 250 Ω

R2 = 450 Ω

B2 = -15 V

B3 = +6 V

Notes:

6. Assume Vf ~ 1 V @ 20 mA

7. R1 = 5 V / 0.02 A = 250 Ω; R2 = 9 V / 0.02 A = 450 Ω

8. P_R1= 0.02 A x 0.02 A x 250 = 0.1 W

9. P_R2= 0.02 A x 0.02 A x 450 = 0.18 W

10. Inductors shown in the above schematic are RF bias chokes. The operating bandwidth of a broad-band PIN diode switch is often de-

pendent on the bias components, particularly the RF bias chokes. It is suggested that the response at the frequencies of interest be

measured with all the bias components in place prior to installing of MASW-002103-1363.

Typical Driver Connections

DC Control Current (mA)

RF Output States

J1-J2

J1-J3

-15 V @ -20 mA¹¹

+6 V @ +20 mA

-15 V @ 20 mA¹¹

low loss

Isolation

low loss

+6 V @ +20 mA

11. The voltage applied to the off arm is allowed to vary provided a constant current is applied through the shunt diode on the off arm.

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Outline Drawing (all dimensions in µm)

125

1545

2225

DC & RF GND

Top View

Side View

Bottom View

12. Bottom view shows the back metal foot print and mounting pads.

13. All dimension are +/-0.5 µm.

14. The center pad shown on the chip bottom view must be connected to RF and DC ground.

Inches

DIM

Min.

0.060

0.087

0.004

Max.

0.062

0.089

0.006

Min.

1.52

2.20

0.10

Max.

1.57

2.25

0.15

Width

Length

Thickness

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Sample Board

Samples test boards are available upon request

Handling Procedures

Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting

pads are conveniently located on the bottom of the chip and are removed from the active junction locations

making it well suited for solder attachment. Connections may be made onto hard or soft substrates via the use of

80Au/20Sn, or RoHS compliant solders. Typical re-flow profiles for provided in Application Note M538 , “Surface

Mounting Instructions“ and can viewed in the Customer Support, Technical Resources section of the MACOM

website at www.macom.com.

For applications where the average power is ≤ 1 W, a thermally conductive silver epoxy may also be used. Cure

per manufacturers recommended time and temperature. Typically 1 hour at 150°C.

When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum pick up tool

with a soft tip is recommended while placing the chip . When soldering to soft substrates, such as Duroid, a soft

solder is recommended at the circuit board to chip mounting pad interface to minimize stress due to any TCE mis-

matches that may exist. Position the die so that its mounting pads are aligned with the circuit board land pads.

Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back.

Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die

after attachment is completed.

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Pocket Tape Dimensions

.157 ± .004

4.00 ± 0.10

.157 ± .004

4.00 ± 0.10

.079 ± .002

2.00 ± 0.05

.069 ± .004

1.75 ± 0.10

Ф .059 ± .004 THRU

1.5 ±

+.012

.138

.315 -.004

3.5 ± 0.05

+0.30

8.00 - 0.10

.093 ± .002

2.36 ± 0.05

Ф 0.035

Ф 0.89

.012 ± .001

0.30 ± 0.03

THRU TYP.

5° MAX.

.012 ± .002

0.30 ± 0.05

POCKET DEPTH

.066 ± .002

1.80 ± 0.05

Chip Orientation in Pocket

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Reel Information

W₁

W₁& W₂measured at hub

W₂

INCHES

DIM

Min.

Max.

Min.

Max.

6.98

7.02

177.3

178.3

.059

.504

.795

.098

.520

.815

1.5

2.5

12.8

20.2

13.2

20.7

2.14

.331

—

2.19

.337

.567

54.5

8.4

—

55.5

8.55

14.4

W₁

W₂

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Demonstration Board Switch with Bias

Networks (MASW-002103-002SMB)

Demonstration Board

This board demonstrates the use and performance

of the MASW-002103 surface mount switch with a

MABT-011000 surface mount bias network on each

RF line. It is set up with the option to measure the

devices with SMA connectors¹⁵or to probe the de-

vices directly at the RF ports (Indicates Actual Per-

formance).¹⁶The MABT-011000 alone can be

probed directly as well. There are calibration THRU

lines included for each measurement.

15. The microstrip RF lines used to measure the devices with

SMA connectors are only good up to 15 GHz. Actual

performance is indicated by “Probed” data shown.

16. 450 μm pitch GSG RF Probes.

SMA Connectorized

Recommended Bias Set-Up^17,18

B1/PB1

B2/PB2

250 Ω

DC Source

B3/PB3

250 Ω

DC Source

450 Ω

GSG Probe Sites

17. B1, B2, and B3 refer to SMA connectorized section bias pins

while PB1, PB2, and PB3 refer to probed section bias pins.

18. Resistors not included on demonstration board.

Typical Driver Connections

SMA THRU

DC Control Current (mA)

B2 B3

RF Output States

J1-J2 J1-J3

GSG THRU

-15 V @ -20 mA¹⁹+6 V @ +20 mA low loss Isolation

+6 V @ +20 mA -15 V @ 20 mA¹⁹Isolation low loss

Included parts

1 LCP printed circuit board (4 mil thick RO3850)

1 support plate

5 Southwest 292-07A-5 SMA end launch connectors

2 MASW-002103 switches

7 MABT-011000 bias networks

1 Molex 6-Pin header

19. The voltage applied to the off arm is allowed to vary provided

a constant current is applied through the shunt diode on the

off arm.

2 Molex single pin right angle headers

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363

Silicon SPDT Surface Mount HMIC PIN Diode Switch

50 MHz - 20 GHz

Rev. V11

Performance Curves

Demonstration Board Switch with Bias Networks (MASW-002103-002SMB)

Insertion Loss (20 mA Bias)

Isolation (20 mA Bias)

0.0

-20

-30

-40

-50

-60

-70

-0.5

-1.0

SMA (SW1)

-1.5

SMA (SW1)

Probed (SW2)

Bias Tee (BN7)

Probed (SW2)

-2.0

Frequency (GHz)

Input Return Loss (20 mA Bias)

SMA (SW1)

Probed (SW2)

Bias Tee (BN7)

-10

-20

-30

-40

Frequency (GHz)

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MASW-002103-1363_14 [TE]

相关型号：

MASW-002103-1363_V7

MASW-003100-1192

MASW-003100-11920G

MASW-003100-11920W

MASW-003102-1359

MASW-003102-13590

MASW-003102-13590G

MASW-003102-13590W

MASW-003103-001SMB

MASW-003103-1364

MASW-003103-13640G

MASW-003103-13640P