MASW-003103-1364 [TE]
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz; HMICTM硅PIN二极管开关SP3T 50兆赫 - 20 GHz的
| 型号： | MASW-003103-1364 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz |
| 文件： | 总8页 (文件大小：415K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V6P
Features
•
•
•
•
•
•
•
•
•
•
•
Specified from 50 MHz to 20 GHz
Usable up to 26 GHz
Low Insertion Loss
High Isolation
Low Parasitic Capacitance and Inductance
RoHS Compliant Surmount™ Package
Rugged, Fully Monolithic
Glass Encapsulated Construction
Up to +38 dBm C.W. Power Handling1 @ +25°C
Silicon Nitride Passivation
Polymer Scratch Protection
Functional Schematic
J3
Description
MA-COM’s MASW-003103-1364 is a Surmount™
broadband monolithic SP3T switch using series and
shunt connected silicon PIN diodes. This part is
designed for use as a moderate signal, high
performance switch in applications up to 20 GHz.
J2
J4
This Surface Mount
chipscale configuration is
optimized for broadband performance with minimal
associated parasitics usually associated with hybrid
MIC designs incorporating beam lead and PIN
diodes that require chip and wire assembly.
J1
The MASW-003103-1364 is fabricated using M/A-
COM’s patented HMIC™ (Heterolithic Microwave
Integrated Circuit) process, US Patent 5,268,310.
This process allows the incorporation of silicon
pedestals that form series and shunt diodes or vias
by imbedding them in low loss, low dispersion glass.
By using small spacing between elements, this
combination of silicon and glass gives HMIC devices
low loss and high isolation performance through low
millimeter frequencies.
Pin Configuration 2
Pin
Function
J1
J2
J3
J4
RFC
RF1
RF2
RF3
Selective backside metalization is applied producing
a Surface Mount device. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
2. The exposed pad centered on the chip bottom must be con-
nected to RF and DC ground.
Ordering Information 3
protection.
These protective coatings prevent
damage to the junction and the anode airbridge
during handling and assembly.
Part Number
Package
GEL PACK
MASW-003103-13640G
MASW-003103-13640P
POCKET TAPE
1. Power Handling Testing performed @ 2GHz
3. Reference Application Note M513 for reel size information.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V6P
Electrical Specifications: TA = 25°C, PIN = 0 dBm, Z0 = 50 Ω, 20mA/-10V
Parameter
Frequency
Units Min.
Typ.
Max.
6 GHz
13 GHz
20 GHz
—
—
—
0.50
0.8
1.2
0.6
1.1
1.4
Insertion Loss
dB
dB
dB
6 GHz
13 GHz
20 GHz
50
37
25
54
40
31
—
—
—
Isolation
6 GHz
13 GHz
20 GHz
19
14
14
25
22
21
—
—
—
Input Return Loss
6 GHz
13 GHz
20 GHz
—
—
—
57
42
30
—
—
—
Output to Output Isolation
dB
Switching Speed4
Voltage Rating5
—
—
ns
V
—
—
20
—
—
80
Input 0.1dB Compression Point
2 GHz
dBm
—
36
—
4. Typical Switching Speed measured fro 10% to 90 % of detected RF signal driven by TTL compatible drivers.
5. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 uA maximum @ -80 volts.
Absolute Maximum Ratings 6,7
Functional Schematic
Parameter
Absolute Maximum
J3
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
-65 °C to +125 °C
-65 °C to +150 °C
+175 °C
|-80 V|
38dBm CW @ 2GHz, 25°C
33dBm CW @ 20GHz, 25°C
RF CW Incident Power
Bias Current +25°C
J2
± 50 mA
Max Operating Conditions for combination RF
Pwr, DC Bias, & Temp: 33dBm CW @ 20mA per
Diode @ 85ºC
J4
6. Exceeding any one or combination of these limits may cause
permanent damage to this device.
7. M/A-COM does not recommend sustained operation near
these survivability limits.
J1
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These devices are rated at Class 1A Human Body.
Proper ESD control techniques should be used
when handling these devices.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V6P
Typical Performance Curves
Insertion Loss @ 20m A, -10V
Isolation @ 20m A, -10V
RF Input to R F O utputs (J1 to J2, J3, J4)
RF Input to RF O utputs (J1 to J2, J3, J4)
0.0
0
-20
-40
-60
-80
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J2
J1 TO J3
J1 TO J4
-0.5
-1.0
-1.5
-2.0
0
0
0
5
10
15
20
25
30
30
30
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (GHz)
Input Return Loss @ 20m A, -10V
Output Return Loss @ 20m A, -10V
RF Input to R F O utputs (J1 to J2, J3, J4)
RF Input to RF O utputs (J1 to J2, J3, J4)
0
-10
-20
-30
-40
0
-10
-20
-30
-40
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J2
J1 TO J3
J1 TO J4
5
10
15
20
25
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (GHz)
MASW-003103-1364 MaximumInput Power Curve
Baseplate Temperature fixed @25degC
O utput to Output Isolation @ 20m A, -10V
J2 to J3 and J3 to J4
12
10
8
0
-20
-40
-60
-80
J2 TO J3
J3 TO J4
2GHz, 5.8W
6
4
10GHz, 2.75W
2
22GHz, 2W
0
5
10
15
20
25
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6
InsertionLoss (dB)
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V6P
Bias Control
Optimal operation of the MASW-003103-1364 is achieved by simultaneous application of negative DC voltage
and current to the low loss switching arm J2, J3, or J4, and positive DC voltage and current to the remaining
switching arms as shown in the applications circuit below. DC return is achieved via R2 on the J1/RF Com Path.
In the low loss state, the series diode must be forward biased with current and the shunt diode reverse biased
with voltage. In the isolation arms, the shunt diode is forward biased with current and the series diode is reverse
biased with voltage.
Driver Connections
Condition of Condition of Condition of
Control Level (DC Currents and Voltages)
RF Output
J1-J2
RF Output
J1-J3
RF Output
J1-J4
J2
-10V 8 at -20mA
+20mA
J3
+20mA
-10V 8 at -20mA
J4
+20mA
Low Loss
Isolation
Isolation
Isolation
Low Loss
Isolation
Isolation
Isolation
Low Loss
+20mA
-10V 8 at -20mA
+20mA
+20mA
8. The voltage applied to the off arm can vary as long as 20mA is applied through the shunt diode on the off arm.
Applications Circuit
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V6P
Outline Drawing Footprint
Top View
Side View
Backside View
125
2065
1960
200
680
J3
J3
200
200
J2
J4
J4
J2
200 285
285 200
J1
J1
200 200 200
680
Units in µm
Ground radius is 200um centered
on the I/O Pad.
MASW-003103-1364
Inches
DIM
mm
MIN
MAX
MIN
MAX
Width
Length
0.06417
0.08031
0.06614
0.08228
1.630
2.040
1.680
2.090
Thickness
0.00394
0.00591
0.100
0.150
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V6P
Handling Procedures
Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting
pads are conveniently located on the bottom surface of these devices and are removed from the active junction
locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of
80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ≤ 1W,
conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typi-
cally 1 hour at 150°C.
When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum tip pick-up
tool and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recom-
mended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit
board to mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die
so that its mounting pads are aligned with the circuit board mounting pads. Solder reflow should not be per-
formed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transpar-
ent, the edges of the mounting pads can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 ,
“Surface Mounting Instructions“ and can viewed on the MA-COM Technology Solutions website @
www.macomtech.com
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V6P
Pocket Tape Information
Carrier Tape Dimensions
.157 ± .004
4.00 ± 0.10
.157 ± .004
4.00 ± 0.10
.079 ± .002
2.00 ± 0.05
.069 ± .004
Ф .059 ± .004 THRU
1.75 ± 0.10
1.5 ±
+.012
+0.30
.138
3.5 ± 0.05
8.00 - 0.10
.093 ± .002
2.36 ± 0.05
Ф 0.035
Ф 0.89
.012 ± .001
0.30 ± 0.03
THRU TYP.
5° MAX.
.012 ± .002
0.30 ± 0.05
POCKET DEPTH
.071 ± .002
1.80 ± 0.05
Chip Orientation in Tape
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V6P
Reel Information
A
INCHES
MM
DIM
MIN.
MAX.
MIN.
MAX.
A
6.980
7.019
177.3
178.3
B
C
D
.059
.504
.795
.098
.520
.815
1.5
2.5
12.8
20.2
13.2
20.7
N
2.146
.331
—-
2.185
.337
54.5
8.4
55.5
8.55
14.4
W1
W2
.567
—-
8
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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