MASW-004103-001SMB [TE]
Silicon SP4T Surface Mount HMIC PIN Diode Switch;
| 型号： | MASW-004103-001SMB |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Silicon SP4T Surface Mount HMIC PIN Diode Switch |
| 文件： | 总8页 (文件大小：1321K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Features
Operates 50 MHz to 20 GHz
Usable up to 26 GHz
Low Insertion Loss
High Isolation
Low Parasitic Capacitance and Inductance
RoHS Compliant Surmount Package
Rugged, Fully Monolithic
Glass Encapsulated Construction
Up to +38 dBm C.W. Power Handling @ +25°C
Silicon Nitride Passivation
Polymer Scratch Protection
Solderable
Functional Schematic
Description
J4
J3
The MASW-004103-1365 is a SP4T, surmount,
broadband, monolithic switch using four sets of
series and shunt connected PIN diodes. This device
is designed for use in broadband, low to moderate
signal, high performance, switch applications up to
20 GHz. It is a surface mountable switch configured
for optimized performance and offers a distinct
advantage over MMIC, beamlead and chip and wire
hybrid designs. Because the PIN diodes of the
MASW-004103-1365 are integrated into the chip
and kept within close proximity, the parasitics
typically associated with other designs that use
individual components are kept to a minimum.
J2
J5
J1
Pin Configuration
To minimize the parasitics and achieve high
performance the MASW-004103-1365 is fabricated
using MACOMs’ patented HMIC™ (Heterolithic
Microwave Integrated Circuit) process. This process
allows the silicon pedestals, which form the series
and shunt diodes or vias, to be imbeded in low loss,
low dispersion glass. The combination of low loss
glass and using tight spacing between elements
results in an HMIC device with low loss and high
isolation through low millimeter wave frequencies.
Pin
Function
J1
J2
J3
J4
J5
RFC
RF1
RF2
RF3
RF4
The topside is fully encapsulated with silicon nitride
and also has an additional layer of polymer for
scratch and impact protection. The protective
coating guards against damage to the junction and
the anode airbridges during handling and assembly.
Ordering Information
Part Number
Package
MASW-004103-13650G
50 piece gel pack
500 piece reel
MASW-004103-13655P
MASW-004103-13650P
MASW-004103-001SMB
On the backside of the chip gold metalized pads
have been added to produce a solderable surmount
device.
3000 piece reel
Sample Test Board
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Electrical Specifications: TA = 25°C, PIN = 0 dBm, Z0 = 50 Ω, 20 mA / -10 V
Parameter
Conditions
Units
Min.
Typ.
Max.
6 GHz
13 GHz
20 GHz
0.5
0.8
1.2
0.6
1.0
1.5
Insertion Loss
dB
—
6 GHz
13 GHz
20 GHz
48
38
29
51
39
32
Isolation
dB
dB
dB
—
—
—
6 GHz
13 GHz
20 GHz
17
13
12
21
17
16
Input Return Loss
6 GHz
13 GHz
20 GHz
53.5
41.5
31.5
Output to Output Isolation
—
Input 0.1dB Compression Point
IIP3
2 GHz
dB
—
—
36
—
—
0.5 GHz, 5 MHz Spacing, 20 dBm
1 GHz, 10 MHz Spacing, 20 dBm
2 GHz, 10 MHz Spacing, 20 dBm
60
63
64
dBm
Switching Speed1
Voltage Rating2
—
—
ns
V
—
—
20
—
—
80
1. Typical Switching Speed measured from 10% to 90 % of detected RF signal driven by TTL compatible drivers.
2. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 µA maximum @ -80 volts.
Absolute Maximum Ratings3,4
Static Sensitivity
Parameter
Absolute Maximum
-65 °C to +125 °C
-65 °C to +150 °C
+175 °C
These devices are rated at Class 1A Human Body
Model. Proper ESD control techniques should be
used when handling these devices.
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
|-80 V|
RF CW Incident Power
2 GHz
38 dBm
33 dBm
20 GHz
Bias Current +25°C
± 50 mA
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. MACOM does not recommend sustained operation near
these survivability limits.
Combined maximum operating conditions for RF
power, DC bias, & temperature: 33 dBm CW, 20 mA
per diode, +85ºC
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Typical Performance Curves
Insertion Loss @ 20mA -10V
RF Input to RF Outputs (J1 to J2, J3, J4, J5)
Isolation @ 20mA -10V
RF Input to RF Outputs (J1 to J2, J3, J4, J5)
0.0
-0.5
-1.0
-1.5
-2.0
0
-20
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J5
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J5
-40
-60
-80
-100
0
0
0
5
10
15
20
25
30
30
30
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (GHz)
Input Return Loss @ 20mA -10V
RF Input to RF Outputs (J1 to J2, J3, J4, J5)
Output Return Loss @ 20mA -10V
RF Input to RF Outputs (J1 to J2, J3, J4, J5)
0
-10
-20
-30
-40
0
-10
-20
-30
-40
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J5
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J5
5
10
15
20
25
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (GHz)
MASW-004103-1365 Maximum Input Power Curve
Baseplate Temperature fixed @ 25degC
Output to Output Isolation @ 20mA, -10V
J2 to J3 and J4 to J5
12
10
8
0
-20
-40
-60
-80
J2 TO J3
J4 TO J5
2GHz, 6.4W
6
10GHz, 3.1W
4
2
20GHz, 2W
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
5
10
15
20
25
Insertion Loss (dB)
Frequency (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Bias Control
Optimal operation of the MASW-004103-1365 is achieved by simultaneous application of negative DC voltage
and current to the low loss switching arm and positive DC voltage and current to the remaining switching arms
as shown in the applications circuit below. DC return is achieved via R2 on the RFC path. In the low loss state,
the series diode must be forward biased with current and the shunt diode reverse biased with voltage. In the
isolated arm, the shunt diode is forward biased with current and the series diode is reverse biased with voltage.
Driver Connections
Control Level (DC Currents and Voltages)
B3 B4
-15 V at -20 mA5 +6 V at +20 mA +6 V at +20 mA +6 V at +20 mA Low Loss
Condition of RF Output
B2
B5
J1-J2
J1-J3
J1-J4
J1-J5
Isolation
Isolation
Isolation
+6 V at +20 mA -15 V at -20 mA5 +6 V at +20 mA +6 V at +20 mA
+6 V at +20 mA +6 V at +20 mA -15 V at -20 mA5 +6 V at +20 mA
Isolation
Isolation
Low Loss
Isolation
Isolation
Isolation
Low Loss
Isolation
Isolation
Isolation
Low Loss
+6 V at +20 mA +6 V at +20 mA +6 V at +20 mA -15 V at -20 mA5 Isolation
5. The voltage applied to the off arm is allowed to vary provided a constant current is applied through the shunt diode on the off arm.
Application Circuit6,7,8,9,10
Example:
J1 to J2→ Low Loss
R1 = 250Ω
R2 = 450Ω
B2 = -15V
B3, B4, B5 = 6V
6. Assume Vf ~ 1 V at 20 mA
7. R1 = 5 V / 0.02 A = 250 Ω; R2 = 9 V / 0.02 A = 450 Ω
8. PR1 = 0.02 A x 0.02 A x 250 = 0.1 W
9. PR2 = 0.02 A x 0.02 A x 450 = 0.18 W
10. Inductors shown in the above schematic are RF bias chokes. The operating bandwidth of a broad-band PIN diode switch is often
dependent on the bias components, particularly the RF bias chokes. It is suggested that the response at the frequencies of interest be
measured with all the bias components in place prior to installing of MASW-004103-1365.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Outline Drawing and Footprint (All dimensions in µm)
DC & RF GND
1) Bottom view shows the back metal foot print and mounting pads.
2) All dimension are +/-0.5 µm.
3) Ground radius is 200 µm and centered on the I/O Pad.
4) The center pad shown on the chip bottom view must be connected to RF and DC ground
MASW-004103-1365
Inches
mm
DIM
MIN
MAX
MIN
MAX
1.630
2.270
0.150
Width
Length
0.06220
0.08740
0.00394
0.06417
0.08937
0.00591
1.580
2.220
0.100
Thickness
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Sample Board
Samples test boards are available upon request
Handling Procedures
Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting
pads are conveniently located on the bottom of the chip and are removed from the active junction locations
making it well suited for solder attachment. Connections may be made onto hard or soft substrates via the use of
80Au/20Sn, or RoHS compliant solders. Typical re-flow profiles for provided in Application Note M538 , “Surface
Mounting Instructions“ and can viewed in the Customer Support, Technical Resources section of the MA-COM
Technology Solutions website at www.macomtech.com.
For applications where the average power is ≤ 1W, a thermally conductive silver epoxy may also be used. Cure
per manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum pick up tool
with a soft tip is recommended while placing the chip . When soldering to soft substrates, such as Duroid, a soft
solder is recommended at the circuit board to chip mounting pad interface to minimize stress due to any TCE mis-
matches that may exist. Position the die so that its mounting pads are aligned with the circuit board land pads.
Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back.
Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die
after attachment is completed.
PCB Land Pattern (All dims. in µm)
DC & RF GND
6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Pocket Tape Information
Carrier Tape Dimensions
.157 ± .004
4.00 ± 0.10
.157 ± .004
4.00 ± 0.10
.079 ± .002
2.00 ± 0.05
.069 ± .004
Ф .059 ± .004 THRU
1.75 ± 0.10
1.5 ±
+.012
+0.30
.138
3.5 ± 0.05
8.00 - 0.10
.093 ± .002
2.36 ± 0.05
Ф 0.035
Ф 0.89
.012 ± .001
0.30 ± 0.03
THRU TYP.
5° MAX.
.012 ± .002
0.30 ± 0.05
POCKET DEPTH
.066 ± .002
1.80 ± 0.05
Chip Orientation in Tape
7
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
50 MHZ - 20 GHz
Rev. V5
Reel Information
A
INCHES
DIM
MM
MIN.
MAX.
MIN.
MAX.
A
6.980
7.019
177.3
178.3
B
C
D
.059
.504
.795
.098
.520
.815
1.5
2.5
12.8
20.2
13.2
20.7
N
2.146
.331
—-
2.185
.337
54.5
8.4
55.5
8.55
14.4
W1
W2
.567
—-
8
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
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