NPT2019 [TE]

Gallium Nitride 48V, 25W, DC-6 GHz HEMT;
NPT2019
型号: NPT2019
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Gallium Nitride 48V, 25W, DC-6 GHz HEMT

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中文:  中文翻译
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NPT2019  
Preliminary  
Gallium Nitride 48V, 25W, DC-6 GHz HEMT  
Built using the SIGANTIC® process - A proprietary GaN-on-Silicon technology  
Features  
Suitable for linear and pulsed applications  
Tunable from DC-6 GHz  
48V Operation  
Industry Standard Plastic Package  
High Drain Efficiency (>60%)  
Applications  
Defense Communications  
Land Mobile Radio  
Avionics  
DC-6 GHz  
25W  
GaN HEMT  
Wireless Infrastructure  
ISM Applications  
VHF/UHF/L/S-Band Radar  
Product Description  
The NPT2019 GaN HEMT is a wideband transistor optimized for DC-6 GHz operation. This  
device has been designed for CW, pulsed, and linear operation with pulsed output power levels  
to 25W (44 dBm) in an industry standard surface mount plastic package.  
RF Specifications (Pulsed*, 2.5 GHz): VDS = 48V, IDQ = 150mA, TC= 25°C  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
GSS  
Small-signal Gain  
-
16.2  
-
-
-
-
-
-
dB  
PSAT  
Saturated Output Power  
-
-
-
-
-
44.8  
60  
dBm  
%
Efficiency at Saturated Output Power  
Gain at POUT = 25W*  
SAT  
GP  
16  
dB  
%
Drain Efficiency at POUT = 25W*  
Drain Voltage  
55  
VDS  
48  
V
Ruggedness: Output Mismatch, all phase angles  
VSWR = TBD:1, No Device Damage  
* Pulse Conditions: 100µS pulse width, 10% duty cycle  
Preliminary Datasheet  
NDS-043 Rev. 2, 012414  
Page 1  
NPT2019  
DC Specifications: TC = 25°C  
Preliminary  
Symbol  
Off Characteristics  
IDLK Drain-Source Leakage Current  
Parameter  
Min  
Typ  
Max  
Units  
-
-
-
-
6
3
mA  
mA  
(VGS=-8V, VDS=160V)  
IGLK  
Gate-Source Leakage Current  
(VGS=-8V, VDS=0V)  
On Characteristics  
VT  
Gate Threshold Voltage  
(VDS=48V, ID=6mA)  
-2.5  
-1.5  
-1.2  
0.75  
3.5  
-0.5  
V
V
VGSQ  
RON  
Gate Quiescent Voltage  
(VDS=48V, ID=150mA)  
-2.1  
-0.3  
On Resistance  
(VDS=2V, ID=45mA)  
-
-
-
-
ID, MAX  
Maximum Drain Current  
(VDS=7V pulsed, 300µS pulse width,  
0.2% Duty Cycle)  
A
Thermal Resistance Specification:  
Symbol  
Parameter  
Typ  
Units  
Thermal Resistance (Junction-to-Case),  
TJ = 200 °C  
3.8  
°C/W  
RJC  
Junction Temperature (TJ) measured using IR Microscopy, Case Temperature (TC) measured using a thermocouple embedded in  
heatsink.  
Absolute Maximum Ratings: Not simultaneous, TC = 25°C unless otherwise noted  
Symbol  
Parameter  
Max  
Units  
VDS  
VGS  
IG  
Drain-Source Voltage  
160  
-10 to 3  
12  
V
V
Gate-Source Voltage  
Gate Current  
mA  
W
PT  
Total Device Power Dissipation (Derated above 25°C)  
Storage Temperature Range  
46  
TSTG  
TJ  
-65 to 150  
200  
°C  
°C  
Operating Junction Temperature  
Human Body Model ESD Rating (per JESD22-A114)  
Moisture sensitivity level (per IPC/JEDEC J-STD-020)  
HBM  
MSL  
Class 1B  
TBD  
Preliminary Datasheet  
NDS-043 Rev. 2, 012414  
Page 2  
NPT2019  
Preliminary  
Load-Pull Data, Reference Plane at Device Leads  
VDS=48V, IDQ=150mA, TC=25C unless otherwise noted  
Optimum Source and Load Impedances:  
(Pulsed CW* Drain Efficiency and Output Power Tradeoff Impedance)  
Frequency  
(MHz)  
PSAT (W)  
GSS (dB)  
Drain Efficiency  
@ PSAT (%)  
ZS ()  
ZL ()  
900  
4.0 + j4.5  
2.7 - j3.9  
2.5 - j10.9  
3.1 - j13.5  
9.8 + j17.3  
5.7 + j9.0  
4.9 + j4.0  
2.8 - j2.8  
36  
35  
34  
30  
26.0  
17.0  
13.5  
12.5  
63  
58  
55  
52  
2500  
4000  
5800  
* Pulse Conditions: 100µS pulse width, 10% duty cycle  
Figure 1: CW Power/Drain Efficiency  
Tradeoff Impedances, ZO=20  
30  
25  
70  
60  
50  
40  
30  
20  
10  
0
900MHz  
2500MHz  
4000MHz  
5800MHz  
900MHz  
2500MHz  
4000MHz  
5800MHz  
20  
15  
10  
25  
30  
35  
40  
45  
50  
25  
30  
35  
40  
45  
50  
POUT (dBm)  
POUT (dBm)  
Figure 3: Efficiency vs. POUT  
Figure 2: Gain vs. POUT  
Preliminary Datasheet  
NDS-043 Rev. 2, 012414  
Page 3  
NPT2019  
Preliminary  
Figure 1 - DFN3X6-14 Plastic Package Dimensions (all dimensions in inches [millimeters])  
Pin  
Function  
10, 11, 12  
2-6  
Gate — RF Input  
Drain — RF Output  
Source — Ground  
Exposed Pad  
1, 7, 8, 9, 13, 14 No Connect*  
* All No Connect pins may be left floating or grounded  
Preliminary Datasheet  
NDS-043 Rev. 2, 012414  
Page 4  
NPT2019  
Preliminary  
Nitronex, LLC  
523 Davis Drive, Suite 500  
Morrisville, NC 27560 USA  
+1.919.807.9100 (telephone)  
+1.919.472.0692 (fax)  
info@nitronex.com  
www.nitronex.com  
Additional Information  
This part is lead-free and is compliant with the RoHS directive  
(Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment).  
Important Notice  
Nitronex, LLC reserves the right to make corrections, modifications, enhancements, improvements and other changes to its products and  
services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information  
before placing orders and should verify that such information is current and complete. All products are sold subject to Nitronex terms and  
conditions of sale supplied at the time of order acknowledgment. The latest information from Nitronex can be found either by calling  
Nitronex at 1-919-807-9100 or visiting our website at www.nitronex.com.  
Nitronex warrants performance of its packaged semiconductor or die to the specifications applicable at the time of sale in accordance  
with Nitronex standard warranty. Testing and other quality control techniques are used to the extent Nitronex deems necessary to sup-  
port the warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
Nitronex assumes no liability for applications assistance or customer product design. Customers are responsible for their product and  
applications using Nitronex semiconductor products or services. To minimize the risks associated with customer products and applica-  
tions, customers should provide adequate design and operating safeguards.  
Nitronex does not warrant or represent that any license, either express or implied, is granted under any Nitronex patent right, copyright,  
mask work right, or other Nitronex intellectual property right relating to any combination, machine or process in which Nitronex products  
or services are used.  
Reproduction of information in Nitronex data sheets is permitted if and only if said reproduction does not alter any of the information  
and is accompanied by all associated warranties, conditions, limitations and notices. Any alteration of the contained information  
invalidates all warranties and Nitronex is not responsible or liable for any such statements.  
Nitronex products are not intended or authorized for use in life support systems, including but not limited to surgical implants into the  
body or any other application intended to support or sustain life. Should Buyer purchase or use Nitronex, LLC products for any such  
unintended or unauthorized application, Buyer shall indemnify and hold Nitronex, LLC, its officers, employees, subsidiaries, affiliates,  
distributors, and its successors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out  
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, notwithstanding if  
such claim alleges that Nitronex was negligent regarding the design or manufacture of said products.  
Nitronex and the Nitronex logo are registered trademarks of Nitronex, LLC.  
All other product or service names are the property of their respective owners.  
©Nitronex, LLC 2014 All rights reserved.  
Preliminary Datasheet  
NDS-043 Rev. 2, 012414  
Page 5  

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