74AVC4T774RSVR-NT [TI]
4-Bit Dual-Supply Bus Transceiver With Configurable Voltage-Level Shifting and 3-State Outputs With Independent Direction Control Inputs;型号: | 74AVC4T774RSVR-NT |
厂家: | TEXAS INSTRUMENTS |
描述: | 4-Bit Dual-Supply Bus Transceiver With Configurable Voltage-Level Shifting and 3-State Outputs With Independent Direction Control Inputs |
文件: | 总19页 (文件大小:838K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74AVC4T774
www.ti.com..................................................................................................................................................... SCES693B–FEBRUARY 2008–REVISED MAY 2008
4-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
1
FEATURES
•
•
•
Each Channel Has an Independent DIR Control
Input
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Control Inputs VIH/VIL Levels Are Referenced to
VCCA Voltage
ESD Protection Exceeds the Following Levels
(tested per JESD 22)
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
–
–
–
8000-V Human-Body Model (A114-A)
250-V Machine Model (A115-A)
1500-V Charged-Device Model (C101)
•
•
I/Os Are 4.6-V Tolerant
Ioff Supports Partial Power-Down-Mode
Operation
•
Typical Data Rates
–
–
–
–
–
380 Mbps (1.8-V to 3.3-V Translation)
200 Mbps (<1.8-V to 3.3-V Translation)
200 Mbps (Translate to 2.5 V or 1.8 V)
150 Mbps (Translate to 1.5 V)
100 Mbps (Translate to 1.2 V)
PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
RSV PACKAGE
(TOP VIEW)
DIR1
DIR2
A1
V
V
1
2
3
4
5
6
7
8
16
15
14
13
CCA
CCB
1
16
16 15 14 13
B1
B2
V
15
14
13
12
11
10
DIR2
A1
2
3
4
5
6
7
CCB
1
2
3
4
12
11
10
9
A1
A2
A3
A4
B1
B2
B3
B4
A2
B1
A3
12 B3
A2
B2
11
10
9
A4
B4
A3
B3
DIR3
DIR4
GND
OE
A4
B4
5
6
7
8
DIR3
GND
8
9
DESCRIPTION/ORDERING INFORMATION
This 4-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed
to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.2 V to 3.6 V. The SN74AVC4T774 is optimized to operate with VCCA/VCCB set
at 1.4 V to 3.6 V. It is operational with VCCA/VCCB as low as 1.2 V. This allows for universal low-voltage
bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74AVC4T774
SCES693B–FEBRUARY 2008–REVISED MAY 2008..................................................................................................................................................... www.ti.com
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The SN74AVC4T774 is designed for asynchronous communication between data buses. The logic levels of the
direction-control (DIR) input and the output-enable (OE) input activate either the B-port outputs or the A-port
outputs or place both output ports in the high-impedance mode. The device transmits data from the A bus to the
B bus when the B outputs are activated, and from the B bus to the A bus when the A outputs are activated. The
input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to
prevent excess ICC and ICCZ
.
The SN74AVC4T774 is designed so that the control pins (DIR1, DIR2, DIR3, DIR4, and OE) are supplied by
VCCA
.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
The VCC isolation feature ensures that if either VCC input is at GND, then both ports are in the high-impedance
state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCCA through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Since this device has CMOS inputs, it is very important to not allow them to float. If the inputs are not driven to
either a high VCC state, or a low GND state, an undesirable larger than expected ICC current may result. Since
the input voltage settlement is governed by many factors (e.g. capacitance, board-layout, package inductance,
surrounding conditions, etc.), ensuring that they these inputs are kept out of erroneous switching states and tying
them to either a high or a low level minimizes the leakage-current.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
SN74AVC4T774RGYR
SN74AVC4T774RSVR
SN74AVC4T774PW
TOP-SIDE MARKING
QFN – RGY
QFN – RSV
Tape and reel
WT774
ZVK
Tape and reel
Tube
–40°C to 85°C
TSSOP – PW
WT774
Tape and reel
SN74AVC4T774PWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLE
(Each Bit)
CONTROL INPUTS
OUTPUT CIRCUITS
OPERATION
OE
L
DIR
L
A PORT
Enabled
Hi-Z
B PORT
Hi-Z
B data to A data
A data to B data
Isolation
L
H
Enabled
Hi-Z
H
X
Hi-Z
LOGIC DIAGRAM (POSITIVE LOGIC)(1)
DIR1
OE
A1
B1
(1) Shown for a single channel
2
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SN74AVC4T774
www.ti.com..................................................................................................................................................... SCES693B–FEBRUARY 2008–REVISED MAY 2008
TYPICAL APPLICATION
3.0 V
1.8 V
0.1 µF
0.1 µF
V
V
CCA
CCB
B1
MOSI
MISO
CLK
CS
A1
A2
A3
A4
OE
SPI
Port
SPI
Peripheral
B2
Processor
B3
B4
SN74AVC4T774
GND
DIR1 = HIGH
DIR2 = LOW
DIR3 = HIGH
DIR4 = HIGH
Figure 1. Typical Application of the SN74AVC4T774
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCCA
Supply voltage range
VCCB
–0.5
4.6
V
I/O ports (A port)
I/O ports (B port)
Control inputs
A port
–0.5
–0.5
–0.5
–0.5
–0.5
4.6
4.6
4.6
4.6
4.6
VI
Input voltage range(2)
V
Voltage range applied to any output in the high-impedance or
power-off state(2)
VO
VO
V
V
B port
A port
–0.5 VCCA + 0.5
Voltage range applied to any output in the high or low state(2)(3)
B port
–0.5 VCCB + 0.5
IIK
IOK
IO
Input clamp current
VI < 0
–50
–50
mA
mA
mA
mA
°C
Output clamp current
VO < 0
Continuous output current
Continuous current through VCCA, VCCB, or GND
Storage temperature range.
±50
±100
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.
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SN74AVC4T774
SCES693B–FEBRUARY 2008–REVISED MAY 2008..................................................................................................................................................... www.ti.com
PACKAGE THERMAL IMPEDANCE
UNIT
PW package(1)
RGY package(2)
RSV package(1)
108
39
θJA
Package thermal impedance
°C/W
184
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
(2) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS(1)(2)(3)
VCCI
VCCO
MIN
MAX UNIT
VCCA
VCCB
Supply voltage
Supply voltage
1.2
3.6
3.6
V
V
1.2
CCI × 0.65
1.6
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
V
High-level
input voltage
VIH
VIL
VIH
VIL
Data inputs(4)
Data inputs(4)
V
V
V
V
2
V
CCI × 0.35
Low-level
input voltage
0.7
0.8
V
CCA × 0.65
DIR
High-level
input voltage
(5)
(5)
(referenced to VCCA
(DIRx, OE)
)
)
1.6
2
V
CCA × 0.35
DIR
Low-level
input voltage
(referenced to VCCA
(DIRx, OE)
0.7
0.8
3.6
VCCO
3.6
–3
–6
–8
–9
–12
3
VI
Input voltage
0
0
0
V
V
Active state
3-state
VO
Output voltage
1.1 V to 1.2 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
IOH
High-level output current
Low-level output current
mA
mA
1.1 V to 1.2 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
6
IOL
8
9
12
5
Δt/Δv Input transition rise or fall rate
TA Operating free-air temperature
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
ns/V
–40
85
°C
(3) All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(4) For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V
(5) For VCCA values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V
4
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SN74AVC4T774
www.ti.com..................................................................................................................................................... SCES693B–FEBRUARY 2008–REVISED MAY 2008
ELECTRICAL CHARACTERISTICS(1)(2)(3)
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
–40°C to 85°C
PARAMETER
TEST CONDITIONS
IOH = –100 µA
VCCA
VCCB
UNIT
MIN
TYP
MAX
MIN
MAX
1.2 V to 3.6 V 1.2 V to 3.6 V
VCCO – 0.2
IOH = –3 mA
IOH = –6 mA
IOH = –8 mA
IOH = –9 mA
IOH = –12 mA
IOL = 100 µA
IOL = 3 mA
IOL = 6 mA
IOL = 8 mA
IOL = 9 mA
IOL = 12 mA
1.2 V
1.4 V
1.65 V
2.3 V
3 V
1.2 V
1.4 V
1.65 V
2.3 V
3 V
0.95
1.05
1.2
VOH
VI = VIH
V
1.75
2.3
1.2 V to 3.6 V 1.2 V to 3.6 V
0.2
1.2 V
1.4 V
1.65 V
2.3 V
3 V
1.2 V
1.4 V
1.65 V
2.3 V
3 V
0.25
0.35
0.45
0.55
0.7
VOL
VI = VIL
V
Control
inputs
II
VI = VCCA or GND
1.2 V to 3.6 V 1.2 V to 3.6 V
±0.025 ±0.25
±1
µA
µA
µA
0 V
0 V to 3.6 V
0 V
±0.1
±0.1
±1
±1
±5
±5
Ioff
IOZ
A or B port VI or VO = 0 to 3.6 V
0 V to 3.6 V
VO = VCCO or GND,
A or B port
3.6 V
3.6 V
±0.5
±2.5
±5
VI = VCCI or GND, OE = VIH
1.2 V to 3.6 V 1.2 V to 3.6 V
8
–2
8
ICCA
VI = VCCI or GND, IO = 0
VI = VCCI or GND, IO = 0
0 V
0 V to 3.6 V
0 V
µA
µA
0 V to 3.6 V
1.2 V to 3.6 V 1.2 V to 3.6 V
8
ICCB
0 V
0 V to 3.6 V
0 V
8
0 V to 3.6 V
–2
16
ICCA + ICCB
VI = VCCI or GND, IO = 0
VI = 3.3 V or GND
1.2 V to 3.6 V 1.2 V to 3.6 V
µA
pF
pF
Control
inputs
Ci
3.3 V
3.3 V
3.3 V
3.3 V
2.5
5
3
6
Cio
A or B port VO = 3.3 V or GND
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application
report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(2) VCCO is the VCC associated with the output port.
(3) VCCI is the VCC associated with the input port.
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SCES693B–FEBRUARY 2008–REVISED MAY 2008..................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.2 V (unless otherwise noted) (see Figure 2)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.1 V
TYP
2.8
± 0.15 V
TYP
2.7
± 0.2 V
TYP
2.7
2.7
3
± 0.3 V
TYP
3.1
3.1
2.9
2.9
9.3
9.3
6.6
6.6
4
PARAMETER
UNIT
TYP
3.5
3.5
3.8
3.8
6
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
2.8
2.7
3.4
3.2
B
3.4
3.2
3
4.8
4.4
5.3
5.3
6.7
6.7
3.3
3.3
4.4
4.4
OE
OE
OE
OE
6
4.8
4.4
6.7
6.7
4.3
4.3
4.4
4.4
6.7
6.6
6.7
6.6
3.6
3.7
3.6
3.7
4
4.4
4.4
4.4
4.4
4.4
4.4
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (see Figure 2)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V VCCB = 3.3 V
± 0.2 V ± 0.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
3.1
3.1
2.9
2.9
5.3
5.3
4.4
4.4
3.6
3.6
3.1
3.1
MIN
0.3
0.3
0.6
0.6
1.1
1.1
1.1
1.1
1.2
1.2
0.3
0.3
MAX
4.4
4.4
5.1
5.1
7.1
7.1
8.2
8.2
4.8
4.8
5.6
5.6
MIN
0.2
0.2
0.4
0.4
0.9
0.9
1.1
1.1
0.8
0.8
0.2
0.2
MAX
3.9
3.9
4.9
4.9
6.2
6.2
8.2
8.2
5.4
5.4
5.7
5.7
MIN MAX MIN MAX
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
0.1
0.1
0.2
0.2
0.7
0.7
1.1
1.1
0.4
0.4
0.3
0.3
3.6
3.6
4.6
4.6
5.5
5.5
8.2
8.2
5.1
5.1
5.6
5.6
0.1
0.1
0.1
0.1
0.1
0.1
1.1
1.1
1
3.9
3.9
4.5
4.5
6.4
6.4
8.2
8.2
5.4
5.4
56
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
B
OE
OE
OE
OE
1
0.3
0.3
5.6
6
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SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (see Figure 2)
VCCB = 1.5 V VCCB = 1.8 V
± 0.1 V ± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
2.8
2.8
2.6
2.6
5
MIN MAX MIN MAX
MIN
0.1
0.1
0.1
0.1
0.4
0.4
0.2
0.2
0.1
0.1
0.1
0.1
MAX
3.1
3.1
3.8
3.8
4.8
4.8
6.7
6.7
4.5
4.5
5.8
5.8
MIN
0.1
0.1
0.1
0.1
0.3
0.3
0.2
0.2
0.8
0.8
0.1
0.1
MAX
3.3
3.3
3.7
3.7
4.6
4.6
6.7
6.7
5
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
0.1
0.1
0.4
0.4
0.8
0.8
0.2
0.2
0.7
0.7
0.1
0.1
4.1
4.1
4.3
4.3
6.7
6.7
6.7
6.7
4.7
4.7
5.7
5.7
0.1
0.1
0.1
0.1
0.6
0.6
0.2
0.2
0.3
0.3
0.1
0.1
3.6
3.6
4.1
4.1
5.8
5.8
6.6
6.6
5.1
5.1
5.8
5.8
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
B
OE
OE
OE
OE
5
3.3
3.3
3.4
3.4
2.9
2.9
5
5.8
5.8
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (see Figure 2)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
2.6
2.6
2.5
2.5
4.7
4.7
2.3
2.3
3
MIN
0.1
0.1
0.5
0.5
0.7
0.7
0.4
0.4
0.2
0.2
01
MAX
3.8
3.8
3.4
3.4
6.2
6.2
4.5
4.5
4.3
4.3
4.7
4.7
MIN
0.1
0.1
0.2
0.2
0.5
0.5
0.4
0.4
0.1
0.1
0.1
0.1
MAX
3.2
3.2
3.1
3.1
5.2
5.2
4.5
4.5
4.9
4.9
4.6
4.6
MIN
0.1
0.1
0.1
0.1
0.3
0.3
0.4
0.4
0.1
0.1
0.1
0.1
MAX
2.7
2.7
2.8
2.8
4.1
4.1
4.5
4.5
4
MIN
0.1
0.1
0.1
0.1
0.3
0.3
0.4
0.4
0.7
0.7
0.1
0.1
MAX
2.6
2.6
2.6
2.6
3.6
3.6
4.5
4.5
4.3
4.3
4.7
4.7
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
B
OE
OE
OE
OE
3
4
1.9
1.9
4.7
4.7
01
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SCES693B–FEBRUARY 2008–REVISED MAY 2008..................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (see Figure 2)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
2.5
2.5
2.6
2.6
4.5
3.8
1.9
1.9
2.7
2.7
2.3
2.3
MIN
0.1
0.1
0.5
0.5
0.9
0.9
0.4
0.4
0.1
0.1
0.1
0.1
MAX
3.6
3.6
3.4
3.4
5.9
5.9
3.6
3.6
4.2
4.2
4.5
4.5
MIN
0.1
0.1
0.2
0.2
0.5
0.5
0.4
0.4
0.1
0.1
0.1
0.1
MAX
3
MIN
0.1
0.1
0.1
0.1
0.3
0.3
0.4
0.4
0.3
0.3
0.1
0.1
MAX
2.6
2.6
2.5
2.5
3.8
3.8
3.6
3.6
3.8
3.8
4.6
4.6
MIN
0.1
0.1
0.1
0.1
0.3
0.3
0.4
0.4
0.7
0.7
0.1
0.1
MAX
2.4
2.4
2.3
2.3
3.3
3.3
3.6
3.6
3.9
3.9
4.6
4.6
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
3
2.9
2.9
5
B
OE
OE
OE
OE
5
3.6
3.6
4.6
4.6
4.5
4.5
OPERATING CHARACTERISTICS
TA = 25°C
VCCA
=
VCCA
=
VCCA
=
VCCA
=
VCCA =
TEST
PARAMETER
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
UNIT
CONDITIONS
TYP
TYP
TYP
TYP
TYP
Outputs
enabled
3
3
3
3
4
A to B
Outputs
1
12
2
1
13
2
1
14
2
2
15
2
2
17
2
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
disabled
(1)
CpdA
pF
Outputs
enabled
B to A
A to B
B to A
Outputs
disabled
Outputs
enabled
12
2
13
2
14
2
16
2
17
2
Outputs
disabled
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdB
pF
Outputs
enabled
3
3
3
3
4
Outputs
disabled
1
1
1
2
2
(1) Power dissipation capacitance per transceiver
8
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74AVC4T774
SN74AVC4T774
www.ti.com..................................................................................................................................................... SCES693B–FEBRUARY 2008–REVISED MAY 2008
PARAMETER MEASUREMENT INFORMATION
2 × V
CCO
TEST
S1
S1
R
L
Open
GND
t
Open
pd
From Output
Under Test
t
t
/t
/t
2 × V
CCO
GND
PLZ PZL
PHZ PZH
C
L
R
L
(see Note A)
t
w
LOAD CIRCUIT
V
CCI
V
CCI
/2
V
CCI
/2
Input
C
L
V
TP
R
L
V
CCO
0 V
1.2 V
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
0.1 V
0.1 V
0.15 V
0.15 V
0.3 V
15 pF
15 pF
15 pF
15 pF
15 pF
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
V
CCA
Output
Control
(low-level
enabling)
V /2
CCA
V
CCA
/2
t
0 V
t
PZL
PLZ
V
V
CCO
Output
Waveform 1
V
CCI
V
/2
/2
CCO
Input
V
CCI
/2
V
CCI
/2
V
+ V
OL
TP
S1 at 2 × V
CCO
OL
0 V
(see Note B)
t
t
PZH
PHZ
t
t
PHL
PLH
Output
Waveform 2
S1 at GND
V
OH
V
OH
V
OH
− V
TP
V
CCO
Output
V /2
CCO
V
CCO
/2
(see Note B)
0 V
V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
H.
I.
t
t
t
V
V
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
pd
PHL
is the V associated with the input port.
CC
CCI
is the V associated with the output port.
CCO
CC
Figure 2. Load and Circuit and Voltage Waveforms
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): SN74AVC4T774
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2008
PACKAGING INFORMATION
Orderable Device
74AVC4T774RGYRG4
74AVC4T774RSVRG4
SN74AVC4T774PW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
QFN
RGY
16
16
16
16
16
16
16
16
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
QFN
TSSOP
TSSOP
TSSOP
TSSOP
QFN
RSV
PW
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AVC4T774PWG4
SN74AVC4T774PWR
SN74AVC4T774PWRG4
SN74AVC4T774RGYR
SN74AVC4T774RSVR
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RGY
RSV
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
QFN
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-May-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74AVC4T774PWR
SN74AVC4T774RGYR
TSSOP
QFN
PW
16
16
2000
1000
330.0
180.0
12.4
12.4
7.0
3.8
5.6
4.3
1.6
1.5
8.0
8.0
12.0
12.0
Q1
Q1
RGY
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-May-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AVC4T774PWR
SN74AVC4T774RGYR
TSSOP
QFN
PW
16
16
2000
1000
346.0
190.5
346.0
212.7
29.0
31.8
RGY
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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